Gripping device and semiconductor wafer automatic detection equipment

Abstract

The utility model provides a gripping device and semiconductor wafer automatic detection equipment, and relates to the field of semiconductor wafer detection, and the gripping device comprises a telescopic base station, a gripping assembly and two telescopic assemblies. The grabbing assembly comprises two manipulators, the two manipulators are provided with a first grabbing position and a second grabbing position correspondingly, and at least parts of the two manipulators are overlapped in the vertical direction when the two manipulators are both located at the corresponding grabbing positions. The first manipulator is connected to the telescopic base table through a first telescopic assembly, the first telescopic assembly can drive the first manipulator to stretch out in the first direction based on the first grabbing position and retract in the reverse direction of the first direction, and the first direction is parallel to the horizontal plane; the second manipulator is connected to the telescopic base table through a second telescopic assembly, and the second telescopic assembly can drive the second manipulator to stretch out in the first direction based on the first grabbing position and retract in the reverse direction of the first direction. According to the grabbing device and the semiconductor wafer automatic detection equipment provided by the embodiment of the utility model, the horizontal movement process of the grabbing device is simpler.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer inspection, specifically to a gripping device and an automatic semiconductor wafer inspection equipment. Background Technology

[0002] In related technologies, when using automated semiconductor wafer inspection equipment, a gripping device is required to handle the wafers. The gripping device includes a motorized stage and a telescopic robotic arm connected to the stage. After the extended robotic arm clamps a wafer located in the loading / unloading area and retracts, the motorized stage moves the robotic arm horizontally to the wafer inspection stage. The robotic arm then extends and places the wafer on the inspection stage for inspection. The robotic arm retracts and waits for the inspection to complete. After inspection, the robotic arm extends again, clamps the wafer on the inspection stage, and retracts. The motorized stage then moves the robotic arm horizontally back to the loading / unloading area, where the robotic arm extends and places the wafer.

[0003] To further increase efficiency, some technologies employ a gripping device comprising a horizontally arranged first and second robotic arm. After the first robotic arm grips a wafer on the wafer inspection stage, the second robotic arm, already holding a wafer, can directly place the wafer to be inspected onto the wafer inspection stage, enabling continuous operation of the wafer inspection stage. However, this approach requires the motorized stage to move horizontally during wafer handling by the two robotic arms, further complicating the horizontal movement process of the gripping device. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a gripping device that simplifies the horizontal movement process of the gripping device.

[0005] This invention also proposes an automatic semiconductor wafer inspection device with the above-mentioned gripping device.

[0006] The gripping device according to a first aspect embodiment of the present invention includes:

[0007] Telescopic base;

[0008] The gripping component includes a first robotic arm and a second robotic arm, the first robotic arm having a first gripping position and the second robotic arm having a second gripping position, wherein when the first robotic arm is in the first gripping position and the second robotic arm is in the second gripping position, at least a portion of the first robotic arm and at least a portion of the second robotic arm overlap vertically.

[0009] The first telescopic component connects the first robotic arm to the telescopic base. The first telescopic component can extend the first robotic arm along a first direction based on the first grasping position, and can also retract the first robotic arm back to the first grasping position along the opposite direction of the first direction. The first direction is parallel to the horizontal plane.

[0010] The second telescopic component connects the second robotic arm to the telescopic base. The second telescopic component can extend the second robotic arm along the first direction based on the first gripping position, and can also retract the second robotic arm in the opposite direction to the second gripping position.

[0011] The gripping device according to the embodiments of the present utility model has at least the following beneficial effects:

[0012] Since at least a portion of the first robotic arm overlaps at least a portion of the second robotic arm vertically, when the first robotic arm is driven by the first telescopic component to move along the first direction and grasp a wafer on the wafer inspection stage, the second robotic arm can be driven by the second telescopic component to move along the first direction and place the wafer to be inspected on the wafer inspection stage. Similarly, when the second robotic arm is driven by the second telescopic component to grasp a wafer on the wafer inspection stage along the first direction, the first robotic arm can be driven by the second telescopic component to move along the first direction and place the wafer to be inspected on the wafer inspection stage. This process allows the telescopic base to remain stationary during wafer handling by both the first and second robotic arms, simplifying the horizontal movement of the gripping device.

[0013] According to some embodiments of the present invention, the first robotic arm located at the first grasping position and the second robotic arm located at the second grasping position are both located between the first telescopic component and the second telescopic component in a second direction, wherein the second direction is perpendicular to the first direction and parallel to the horizontal plane.

[0014] According to some embodiments of the present invention, the gripping assembly has a loading / unloading position, a wafer detection position, and a pre-alignment position; the gripping device further includes a driving member, which is connected to the telescopic base and is used to drive the telescopic base to rotate around a vertical axis when the first manipulator is in the first gripping position and the second manipulator is in the second gripping position, so that the gripping assembly moves to the loading / unloading position, the wafer detection position, or the pre-alignment position.

[0015] According to some embodiments of the present invention, the first telescopic assembly includes a first main telescopic member and a first auxiliary telescopic member; the first main telescopic member is connected to the telescopic base, the first auxiliary telescopic member is connected to the first main telescopic member, and the first robotic arm is connected to the first auxiliary telescopic member; when the first main telescopic member moves relative to the telescopic base along the first direction, it can drive the first auxiliary telescopic member to move relative to the first main telescopic member along the first direction; when the first main telescopic member moves in the opposite direction relative to the telescopic base along the first direction, it can drive the first auxiliary telescopic member to move in the opposite direction relative to the first main telescopic member along the first direction.

[0016] The second telescopic assembly includes a second main telescopic member and a second auxiliary telescopic member; the second main telescopic member is connected to the telescopic base, the second auxiliary telescopic member is connected to the second main telescopic member, and the second robotic arm is connected to the second auxiliary telescopic member; when the second main telescopic member moves relative to the telescopic base along the first direction, it can drive the second auxiliary telescopic member to move relative to the second main telescopic member along the first direction; when the second main telescopic member moves in the opposite direction relative to the telescopic base along the first direction, it can drive the second auxiliary telescopic member to move in the opposite direction relative to the second main telescopic member along the first direction.

[0017] According to some embodiments of the present invention, the first telescopic assembly further includes a first conveyor belt and two first rotating members. The two first rotating members are arranged along the first direction and are rotatably connected to the first main telescopic member. The rotation axes of the first rotating members are parallel to the second direction. The first conveyor belt is wrapped around the outside of the two first rotating members and can move with the rotation of the first rotating members. In the third direction, the first auxiliary telescopic member and the telescopic base are respectively connected to the first conveyor belt on both sides of the line connecting the centers of adjacent first rotating members. The first direction, the second direction and the third direction are perpendicular to each other.

[0018] The second telescopic assembly further includes a second conveyor belt and two second rotating members. The two second rotating members are arranged along the first direction and are rotatably connected to the second main telescopic member. The rotation axes of the second rotating members are parallel to the fourth direction. The second conveyor belt is wrapped around the outside of the two second rotating members and can move with the rotation of the second rotating members. In the fifth direction, the second auxiliary telescopic member and the telescopic base are respectively connected to the second conveyor belt on both sides of the line connecting the centers of adjacent second rotating members. The first direction, the fourth direction and the fifth direction are perpendicular to each other.

[0019] According to some embodiments of the present invention, the first conveyor belt is a synchronous belt and is engaged with two of the first rotating members;

[0020] And / or, the second conveyor belt is a synchronous belt and engages with two of the second rotating members.

[0021] According to some embodiments of the present invention, the first telescopic component includes a first gear, a first rack, and a second rack. The first gear is rotatably connected to the first main telescopic member, and the rotation axis of the first gear is perpendicular to the first direction. The first rack and the second rack both extend along the first direction. The first rack meshes with one side of the first gear in a second direction and is connected to the first auxiliary telescopic member. The second rack meshes with the other side of the first gear in the second direction and is connected to the telescopic base. The second direction is perpendicular to the first direction and the rotation axis of the first gear.

[0022] And / or, the second telescopic assembly includes a second gear, a third rack, and a fourth rack. The second gear is rotatably connected to the second main telescopic member, and the axis of rotation of the second gear is perpendicular to the first direction. The third rack and the fourth rack both extend along the first direction. The third rack meshes with the second gear on one side of the third direction and is connected to the second auxiliary telescopic member. The fourth rack meshes with the second gear on the other side of the third direction and is connected to the telescopic base. The third direction is perpendicular to the first direction and the axis of rotation of the second gear.

[0023] According to some embodiments of the present invention, the first telescopic component includes a third gear, a fourth gear, a fifth rack, and a sixth rack. The third gear and the fourth gear are rotatably connected to the first main telescopic member and mesh with each other. The rotation axes of the third gear and the fourth gear are parallel to the fourth direction. The fifth rack and the sixth rack extend along the first direction. The fifth rack is connected to the first auxiliary telescopic member and meshes with one side of the third gear in the fifth direction. The sixth rack is connected to the telescopic base and meshes with one side of the fourth gear in the fifth direction. The first direction, the fourth direction, and the fifth direction are perpendicular to each other.

[0024] And / or, the second telescopic assembly includes a fifth gear, a sixth gear, a seventh rack, and an eighth rack. The fifth gear and the sixth gear are rotatably connected to the second main telescopic member and mesh with each other. The rotation axes of the fifth gear and the sixth gear are parallel to the sixth direction. The seventh rack and the eighth rack extend along the first direction. The seventh rack is connected to the first auxiliary telescopic member and meshes with one side of the fifth gear in the seventh direction. The eighth rack is connected to the telescopic base and meshes with one side of the sixth gear in the seventh direction. The first direction, the sixth direction, and the seventh direction are perpendicular to each other.

[0025] The automatic semiconductor wafer inspection device according to a second aspect embodiment of the present invention includes:

[0026] Wafer inspection station, used to inspect wafers;

[0027] The loading and unloading device is used to provide wafers to be inspected and to receive wafers that have completed inspection;

[0028] A pre-alignment device used to calibrate the position of the wafer;

[0029] The gripping device as described in any of the above embodiments; the gripping device is capable of placing a wafer onto the wafer inspection station, the loading / unloading device and the pre-alignment device, and removing the wafer from the wafer inspection station, the loading / unloading device and the pre-alignment device.

[0030] The automatic semiconductor wafer inspection equipment according to the embodiments of the present invention has at least the following beneficial effects:

[0031] Since at least a portion of the first robotic arm overlaps at least a portion of the second robotic arm vertically, when the first robotic arm is driven by the first telescopic component to move along the first direction and grasp a wafer on the wafer inspection stage, the second robotic arm can be driven by the second telescopic component to move along the first direction and place the wafer to be inspected on the wafer inspection stage. Similarly, when the second robotic arm is driven by the second telescopic component to grasp a wafer on the wafer inspection stage along the first direction, the first robotic arm can be driven by the second telescopic component to move along the first direction and place the wafer to be inspected on the wafer inspection stage. Furthermore, when the first robotic arm is driven by the first telescopic component to move along the first direction and grasp a wafer on the loading / unloading device, the second robotic arm can be driven by the second telescopic component to move along the first direction and place the wafer to be inspected on the wafer inspection stage. After the tested wafers are placed on the loading / unloading device, the second robotic arm, driven by the second telescopic component, grips the wafers on the loading / unloading device along the first direction. Then, the first robotic arm, driven by the second telescopic component, moves along the first direction and places the tested wafers on the loading / unloading device. Similarly, after the first robotic arm, driven by the first telescopic component, moves along the first direction and grips the wafers on the pre-alignment device, the second robotic arm, driven by the second telescopic component, moves along the first direction and places the wafers to be aligned on the pre-alignment device. The telescopic platform remains stationary throughout all three processes, simplifying the horizontal movement of the gripping device.

[0032] According to some embodiments of this utility model, a lifting assembly is also included.

[0033] The lifting assembly is connected to the wafer inspection stage, the loading and unloading device, and the pre-alignment device, and can drive the wafer inspection stage, the loading and unloading device, and the pre-alignment device to move in the vertical direction;

[0034] Alternatively, the lifting assembly is connected to the gripping device and can drive the gripping device to move in the vertical direction.

[0035] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0037] Figure 1 This is an overall schematic diagram of the gripping device according to some embodiments of the first aspect of this utility model;

[0038] Figure 2 for Figure 1 The diagram of the explosion;

[0039] Figure 3 for Figure 2 Exploded view of the frame, drive components, and connectors;

[0040] Figure 4 for Figure 1 A schematic diagram of the rotation of the telescopic base;

[0041] Figure 5 for Figure 1 A partial schematic diagram of the first and second telescopic components;

[0042] Figure 6 for Figure 1 A partial schematic diagram of the first and second telescopic components;

[0043] Figure 7 for Figure 1 A schematic diagram showing the connection between the first robotic arm, the first telescopic component, and the telescopic base.

[0044] Figure 8 This is a schematic diagram showing the connection of the first robotic arm, the first telescopic component, and the telescopic base according to some embodiments of the second aspect of this utility model;

[0045] Figure 9 This is a schematic diagram showing the connection of the first robotic arm, the first telescopic component, and the telescopic base according to some embodiments of the third aspect of this utility model;

[0046] Figure 10This is a schematic diagram showing the relative positions of the gripping device, wafer inspection stage, loading and unloading device, and pre-alignment device according to some embodiments of the fourth aspect of this utility model.

[0047] Figure label:

[0048] Gripping device 10;

[0049] Telescopic base 100;

[0050] Grasping component 200, first robotic arm 210, second robotic arm 220;

[0051] First telescopic component 300, first main telescopic component 310, first auxiliary telescopic component 320, first conveyor belt 330, first rotating component 340, first gear 350, first rack 370, second rack 380, third gear 390, fourth gear 3100, fifth rack 3120, sixth rack 3130;

[0052] Second telescopic component 400, second main telescopic component 410, second auxiliary telescopic component 420;

[0053] Drive component 500;

[0054] Rack size 600;

[0055] Connector 700;

[0056] 20 wafer inspection stage, 30 loading and unloading device, 40 pre-alignment device. Detailed Implementation

[0057] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0058] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0059] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0060] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0061] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] Please refer to Figures 1 to 10 As shown, where Figure 10 Only the relative positions of the gripping device 10, the wafer inspection stage 20, the loading / unloading device 30, and the pre-alignment device 40 are shown. This invention proposes a gripping device 10, including a telescopic base 100, a gripping assembly 200, a first telescopic assembly 300, and a second telescopic assembly 400.

[0063] Please refer to Figure 1 , Figure 2 As shown, the gripping component 200 of this utility model includes a first robotic arm 210 and a second robotic arm 220. The first robotic arm 210 has a first gripping position, and the second robotic arm 220 has a second gripping position. When the first robotic arm 210 is in the first gripping position and the second robotic arm 220 is in the second gripping position, at least a portion of the first robotic arm 210 and at least a portion of the second robotic arm 220 overlap vertically.

[0064] This invention does not limit the specific method by which the robotic arm grasps the wafer. In some embodiments, the end of the robotic arm includes a suction cup capable of holding the wafer, thereby fixing the wafer to the end of the robotic arm. In some embodiments, the robotic arm includes an openable and closable gripping portion, which, when closed, can grip the wafer, thereby fixing the wafer to the robotic arm.

[0065] Please refer to Figures 1 to 4 As shown, the first robotic arm 210 of this invention is connected to the telescopic base 100 via a first telescopic component 300. The first telescopic component 300 can drive the first robotic arm 210 to extend along a first direction from a first gripping position, and can also drive the first robotic arm 210 to retract back to the first gripping position along the opposite direction of the first direction, where the first direction is parallel to the horizontal plane. The second robotic arm 220 of this invention is connected to the telescopic base 100 via a second telescopic component 400. The second telescopic component 400 can drive the second robotic arm 220 to extend along the first direction from a first gripping position, and can also drive the second robotic arm 220 to retract back to the second gripping position along the opposite direction of the first direction.

[0066] Since at least a portion of the first robotic arm 210 and at least a portion of the second robotic arm 220 overlap vertically, when the first robotic arm 210 is driven by the first telescopic component 300 to move along the first direction and grasp a wafer on the wafer inspection stage 20, the second robotic arm 220 can be driven by the second telescopic component 400 to move along the first direction and place the wafer to be inspected on the wafer inspection stage 20. Similarly, when the second robotic arm 220 is driven by the second telescopic component 400 to grasp a wafer on the wafer inspection stage 20 along the first direction, the first robotic arm 210 can be driven by the second telescopic component 400 to move along the first direction and place the wafer to be inspected on the wafer inspection stage 20. This process allows the telescopic base 100 to remain stationary during wafer handling by the first robotic arm 210 and the second robotic arm 220, simplifying the horizontal movement of the gripping device 10.

[0067] On the other hand, the movement of the first robotic arm 210 along the first direction and in the opposite direction is driven solely by the first telescopic component 300, and the movement of the second robotic arm 220 along the first direction and in the opposite direction is driven solely by the second telescopic component 400. Thus, when the first robotic arm 210 extends along the first direction based on the first gripping position, the second robotic arm 220 can remain retracted to avoid the gripping and placing actions of the first robotic arm 210. When the second robotic arm 220 extends along the first direction based on the second gripping position, the first robotic arm 210 can remain retracted to avoid the gripping and placing actions of the second robotic arm 220. This helps to improve the stability of the robotic arm's gripping and placing of wafers process.

[0068] It should be noted that since the robotic arms are all connected to the telescopic base 100 via telescopic components, the actual direction of the first direction will change depending on the orientation of the telescopic base 100. For example, please refer to... Figure 1 As shown, Figure 1The first robotic arm 210 is located in the first grasping position, and the second robotic arm 220 is located in the second grasping position, with the first direction facing forward. Therefore, the first telescopic component 300 can drive the first robotic arm 210 to extend forward from the first grasping position, and the second telescopic component 400 can drive the second robotic arm 220 to extend forward from the second grasping position. Please refer to [reference needed]. Figure 4 As shown, Figure 4 The first robotic arm 210 is located in the first grasping position, and Figure 4 The telescopic base 100 in the middle is relative to Figure 1 If the first direction is rotated to the right front, the first telescopic component 300 can drive the first robotic arm 210 to extend along the right front.

[0069] Further, please refer to Figure 1 As shown, in some embodiments, the first robotic arm 210 located at the first gripping position and the second robotic arm 220 located at the second gripping position are both positioned between the first telescopic component 300 and the second telescopic component 400 in a second direction, which is perpendicular to the first direction and parallel to the horizontal plane. Through this design, the first robotic arm 210 and the second robotic arm 220 can utilize the horizontal space of the first telescopic component 300 and the second telescopic component 400, thereby reducing the vertical space occupied by the gripping device 10.

[0070] Further, please refer to Figure 1 , Figure 10 As shown, in some embodiments, the gripping component 200 has a loading / unloading position, a wafer detection position, and a pre-alignment position.

[0071] When the gripping component 200 moves to the loading / unloading position, the telescopic base 100 faces the loading / unloading device 30, with the first direction being from the telescopic base 100 to the loading / unloading device 30. The telescopic component can drive the robot arm to extend along the first direction based on the gripping position to remove the wafer located on the loading / unloading device 30 or place the wafer on the loading / unloading device 30. When the gripping component 200 moves to the wafer inspection position, the telescopic base 100 faces the wafer inspection table 20, with the first direction being from the telescopic base 100 to the wafer inspection table 20. The telescopic component can drive the robot arm to extend along the first direction based on the gripping position to remove the wafer located on the wafer inspection table 20 or place the wafer on the wafer inspection table 20. When the gripping component 200 moves to the pre-alignment position, the telescopic base 100 faces the pre-alignment device 40. The first direction is the direction from the telescopic base 100 to the pre-alignment device 40. The telescopic component can drive the robot arm to extend along the first direction based on the gripping position to take out the wafer located in the pre-alignment device 40 or place the wafer in the pre-alignment device 40.

[0072] The gripping device 10 in the above embodiment further includes a drive unit 500, which is connected to the telescopic base 100 and is used to drive the telescopic base 100 to rotate around the vertical axis when the first robotic arm 210 is in the first gripping position and the second robotic arm 220 is in the second gripping position, so that the gripping assembly 200 moves to the loading / unloading position, the wafer inspection position, or the pre-alignment position. During the process of the gripping assembly 200 moving to the loading / unloading position, the wafer inspection position, or the pre-alignment position, the first robotic arm 210 and the second robotic arm 220 can reduce the overall space occupied by the gripping assembly 200 by retracting, thereby reducing the space occupied by the gripping device 10 during the movement, which is beneficial to compressing the space occupied by the semiconductor wafer automatic inspection equipment.

[0073] In some embodiments, please refer to Figures 1 to 3 As shown, the gripping device 10 also includes a connector 700 and a frame 600. The drive unit 500 is mounted on the frame 600, and the telescopic base 100 is indirectly connected to the drive unit 500 through the connector 700. The drive unit 500 can drive the connector 700 to rotate relative to the frame 600, so that the telescopic base 100 rotates about the vertical axis.

[0074] In some technologies, automated semiconductor wafer inspection equipment uses single-stage or multi-stage telescopic robotic arms to pick up and place wafers. However, in the above-mentioned solutions, a single-stage telescopic robotic arm requires a significant amount of internal space to accommodate the movement of the first robotic arm 210, which is not conducive to the miniaturization of the equipment. On the other hand, a multi-stage telescopic robotic arm controls the telescopic process of different stages through electronic control components, making the movement process of the first robotic arm 210 more complex and difficult for operators to control.

[0075] In view of this, please refer to Figure 4 As shown, in some embodiments, the first telescopic assembly 300 includes a first main telescopic member 310 and a first auxiliary telescopic member 320; the first main telescopic member 310 is connected to the telescopic base 100, the first auxiliary telescopic member 320 is connected to the first main telescopic member 310, and the first robotic arm 210 is connected to the first auxiliary telescopic member 320; when the first main telescopic member 310 moves relative to the telescopic base 100 in a first direction, it can drive the first auxiliary telescopic member 320 to move relative to the first main telescopic member 310 in a first direction; when the first main telescopic member 310 moves in the opposite direction relative to the telescopic base 100 in the first direction, it can drive the first auxiliary telescopic member 320 to move in the opposite direction relative to the first main telescopic member 310 in the first direction.

[0076] The second telescopic assembly 400 includes a second main telescopic member 410 and a second auxiliary telescopic member 420; the second main telescopic member 410 is connected to the telescopic base 100, the second auxiliary telescopic member 420 is connected to the second main telescopic member 410, and the second robotic arm 220 is connected to the second auxiliary telescopic member 420; when the second main telescopic member 410 moves relative to the telescopic base 100 in a first direction, it can drive the second auxiliary telescopic member 420 to move relative to the second main telescopic member 410 in the first direction; when the second main telescopic member 410 moves in the opposite direction relative to the telescopic base 100 in the first direction, it can drive the second auxiliary telescopic member 420 to move in the opposite direction relative to the second main telescopic member 410 in the first direction.

[0077] With the above scheme, when the first main telescopic member 310 moves relative to the telescopic assembly along the first direction, the first auxiliary telescopic member 320 will also move relative to the first main telescopic member 310 along the first direction. When the first main telescopic member 310 moves in the opposite direction relative to the telescopic assembly along the first direction, the first auxiliary telescopic member 320 will also move in the opposite direction relative to the first main telescopic member 310. Therefore, the distance the first robotic arm 210 moves relative to the telescopic base 100 is the sum of the relative movement distances of the first main telescopic member 310 and the first auxiliary telescopic member 320. When the first robotic arm 210 is in the first gripping position, the space occupied by the first main telescopic member 310 and the first auxiliary telescopic member 320 in the first direction is smaller. Similarly, when the second robotic arm 220 is in the second gripping position, the space occupied by the second main telescopic member 410 and the second auxiliary telescopic member 420 in the first direction is smaller. On the other hand, since the movement of the first auxiliary telescopic member 320 is synchronized with the movement of the first main telescopic member 310, and the movement of the second auxiliary telescopic member 420 is synchronized with the movement of the second main telescopic member 410, the gripping device 10 only needs to drive the movement of the main telescopic member to quickly adjust the position of the robot arm, which is easy to operate.

[0078] This utility model does not restrict the connection relationship between the main telescopic component and the telescopic base 100, nor does it restrict the connection relationship between the auxiliary telescopic component and the main telescopic component.

[0079] Please refer to Figure 5 As shown, in some embodiments, the gripping device 10 further includes multiple guide rails, a conveyor belt, and a drive motor. The first main telescopic member 310 is slidably connected to the telescopic base 100 via a guide rail extending in a first direction and is connected to the conveyor belt. The drive motor can drive the conveyor belt to rotate so that the first main telescopic member 310 moves along the guide rail. The second main telescopic member 410 is slidably connected to the telescopic base 100 via another guide rail extending in the first direction and is connected to another conveyor belt. Another drive motor can drive another conveyor belt to rotate so that the second main telescopic member 410 moves along another guide rail.

[0080] Without departing from the inventive concept of this utility model, those skilled in the art can adjust the structure of the first telescopic component 300 and the second telescopic component 400 based on the above embodiments.

[0081] As a preferred option, please refer to Figures 5 to 7 As shown, where Figures 5 to 7 The first direction shown is the forward direction. In some embodiments, the first telescopic assembly 300 further includes a first conveyor belt 330 and two first rotating members 340. The two first rotating members 340 are arranged along the first direction and are rotatably connected to the first main telescopic member 310. The rotation axes of the first rotating members 340 are parallel to the second direction (i.e., Figure 5 , Figure 6 (in the left and right directions); the first conveyor belt 330 is wrapped around the outside of the two first rotating members 340 and can move with the rotation of the first rotating members 340, in the third direction (that is... Figures 5 to 7 On the vertical direction, the first telescopic component 320 and the telescopic base 100 are respectively connected to the first conveyor belt 330 and located on both sides of the line connecting the centers of adjacent first rotating components 340 (i.e., in the vertical direction). Figures 5 to 7 The first telescopic component 320 is connected to the upper side of the first conveyor belt 330, and the telescopic base 100 is connected to the lower side of the first conveyor belt 330. The first direction, the second direction, and the third direction are perpendicular to each other.

[0082] With the above scheme, when the first main telescopic member 310 moves along the first direction, the two first rotating members 340 connected to the first main telescopic member 310 will also move synchronously along the first direction. The first conveyor belt 330 sleeved on the two first rotating members 340 will also move due to the movement of the first rotating members 340. Since the telescopic base 100 connected to the first conveyor belt 330 is located on one side of the line connecting the centers of the adjacent first rotating members 340 in the third direction, the first auxiliary telescopic member 320 located on the other side of the line connecting the centers of the adjacent first rotating members 340 can also move further along the first direction relative to the first main telescopic member 310 due to the rotation of the conveyor belt. Therefore, the distance that the first robot arm 210 moves relative to the telescopic base 100 is the sum of the relative movement distance of the first main telescopic member 310 and the relative movement distance of the first auxiliary telescopic member 320.

[0083] In some embodiments, the second telescopic assembly 400 further includes a second conveyor belt and two second rotating members. The two second rotating members are arranged along a first direction and are rotatably connected to the second main telescopic member 410. The rotation axes of the second rotating members are parallel to the fourth direction. The second conveyor belt is wrapped around the outside of the two second rotating members and can move with the rotation of the second rotating members. In the fifth direction, the second auxiliary telescopic member 420 and the telescopic base 100 are respectively connected to the second conveyor belt on both sides of the line connecting the centers of adjacent second rotating members. The first direction, the fourth direction, and the fifth direction are perpendicular to each other. The technical effects of the first telescopic assembly 300 being provided with two first rotating members 340 and a first conveyor belt 330 have been described above. Those skilled in the art can obtain the corresponding technical effects of the above solution based on the above description, and will not be repeated here.

[0084] Based on the above scheme, in some embodiments, the first auxiliary telescopic member 320 is also slidably connected to the first main telescopic member 310 along the first direction via a guide rail, and the second auxiliary telescopic member 420 is also slidably connected to the second main telescopic member 410 along the first direction via a guide rail. The guide rail can limit the relative movement direction between the auxiliary telescopic member and the main telescopic member, thereby making the movement of the main telescopic member and the auxiliary telescopic member more stable.

[0085] Based on the above solution, in some embodiments, the first conveyor belt 330 is a synchronous belt and engages with two first rotating members 340. The above solution can reduce slippage between the first conveyor belt 330 and the first rotating members 340, making the movement of the first robot arm 210 along the first direction and in the opposite direction more stable.

[0086] In some embodiments, the second conveyor belt is a synchronous belt and engages with two second rotating members. This design reduces slippage between the second conveyor belt and the second rotating members, making the movement of the second robot 220 along the second direction and in the opposite direction more stable.

[0087] In other embodiments, please refer to Figure 8 As shown, the first telescopic assembly 300 includes a first gear 350, a first rack 370, and a second rack 380. The first gear 350 is rotatably connected to the first main telescopic member 310, and the rotation axis of the first gear 350 is perpendicular to the first direction. Both the first rack 370 and the second rack 380 extend along the first direction. The first rack 370 meshes with one side of the first gear 350 in the second direction and is connected to the first auxiliary telescopic member 320. The second rack 380 meshes with the other side of the first gear 350 in the second direction and is connected to the telescopic base 100. The second direction (i.e.,...) Figure 8 The vertical direction is perpendicular to the first direction and the rotation axis of the first gear 350.

[0088] With the above scheme, when the first main telescopic member 310 moves along the first direction, since the second rack 380 connected to the telescopic base 100 meshes with the first gear 350, the first gear 350 will roll relative to the second rack 380 along the first direction, thereby driving the first rack 370 meshing with the first gear 350 to move along the first direction. The first auxiliary telescopic member 320 connected to the first rack 370 moves relative to the first main telescopic member 310 along the first direction. Therefore, the distance that the first robot arm 210 moves relative to the telescopic base 100 is the sum of the relative movement distance of the first main telescopic member 310 and the relative movement distance of the first auxiliary telescopic member 320.

[0089] In some embodiments, the second telescopic assembly 400 includes a second gear 360, a third rack, and a fourth rack. The second gear 360 is rotatably connected to the second main telescopic member 410, and the rotation axis of the second gear 360 is perpendicular to the first direction. The third rack and the fourth rack both extend along the first direction. The third rack meshes with the second gear 360 on one side of the third direction and is connected to the second auxiliary telescopic member 420. The fourth rack meshes with the second gear 360 on the other side of the third direction and is connected to the telescopic base 100. The third direction is perpendicular to the first direction and the rotation axis of the second gear 360. The technical effects of the first telescopic assembly 300 being equipped with the first gear 350, the first rack 370, and the second rack 380 have been described above. Those skilled in the art can obtain the corresponding technical effects of the above solution based on the above description, and will not be repeated here.

[0090] In other embodiments, please refer to Figure 9 As shown, the first telescopic assembly 300 includes a third gear 390, a fourth gear 3100, a fifth rack 3120, and a sixth rack 3130. The third gear 390 and the fourth gear 3100 are rotatably connected to the first main telescopic member 310 and mesh with each other. The rotation axes of the third gear 390 and the fourth gear 3100 are both parallel to the fourth direction. The fifth rack 3120 and the sixth rack 3130 both extend along the first direction. The fifth rack 3120 is connected to the first auxiliary telescopic member 320 and meshes with the third gear 390 in the fifth direction (i.e.,...). Figure 9 On one side of the first direction (the lower direction), the sixth rack 3130 is connected to the telescopic base 100 and meshes with the fourth gear 3100 on one side of the fifth direction, and the first direction, the fourth direction and the fifth direction are perpendicular to each other.

[0091] With the above scheme, when the first main telescopic member 310 moves along the first direction, since the sixth rack 3130 connected to the telescopic base 100 meshes with the fourth gear 3100, the fourth gear 3100 will roll relative to the sixth rack 3130 along the first direction, thereby driving the third gear 390 meshing with the fourth gear 3100 to rotate. The third gear 390 then drives the first auxiliary telescopic member 320 connected to the fifth rack 3120 to move. Thus, the distance that the first robot arm 210 moves relative to the telescopic base 100 is the sum of the relative movement distance of the first main telescopic member 310 and the relative movement distance of the first auxiliary telescopic member 320.

[0092] In some embodiments, the second telescopic assembly 400 includes a fifth gear, a sixth gear, a seventh rack, and an eighth rack. The fifth and sixth gears are rotatably connected to the second main telescopic member 410 and mesh with each other. The rotation axes of the fifth and sixth gears are parallel to the sixth direction. The seventh and eighth racks extend along the first direction. The seventh rack is connected to the first auxiliary telescopic member 320 and meshes with one side of the fifth gear in the seventh direction. The eighth rack is connected to the telescopic base 100 and meshes with one side of the sixth gear in the seventh direction. The first, sixth, and seventh directions are perpendicular to each other. The technical effects of the first telescopic assembly 300 being equipped with the first gear 350, the second gear 360, the first rack 370, and the second rack 380 have been described above. Those skilled in the art can obtain the corresponding technical effects of the above solution based on the above description, and will not be repeated here.

[0093] Please refer to Figure 1 , Figure 10 As shown, this utility model also proposes an automatic semiconductor wafer inspection device, including a wafer inspection stage 20, a loading / unloading device 30, a pre-alignment device 40, and a gripping device 10 as described in any of the above embodiments. The wafer inspection stage 20 is used to inspect wafers. The loading / unloading device 30 is used to provide wafers to be inspected and to receive wafers that have completed inspection. The pre-alignment device 40 is used to calibrate the position of the wafers. The gripping device 10 is capable of placing wafers onto the wafer inspection stage 20, the loading / unloading device 30, and the pre-alignment device 40, and removing wafers from these devices. Through the above scheme, the gripping device 10 can transport wafers to the wafer inspection stage 20, the loading / unloading device 30, and the pre-alignment device 40.

[0094] Since at least a portion of the first robotic arm 210 and at least a portion of the second robotic arm 220 overlap vertically, when the first robotic arm 210 is driven by the first telescopic component 300 to move along the first direction and grasp a wafer on the wafer inspection stage 20, the second robotic arm 220 can be driven by the second telescopic component 400 to move along the first direction and place the wafer to be inspected on the wafer inspection stage 20. Similarly, when the second robotic arm 220 is driven by the second telescopic component 400 to grasp a wafer on the wafer inspection stage 20 along the first direction, the first robotic arm 210 can be driven by the second telescopic component 400 to move along the first direction and place the wafer to be inspected on the wafer inspection stage 20. Furthermore, when the first robotic arm 210 is driven by the first telescopic component 300 to move along the first direction and grasp a wafer on the loading / unloading device 30, the second robotic arm 220 can be driven by the second telescopic component 400 to move along the first direction and place the wafer to be inspected on the wafer inspection stage 20. After the inspected wafers are placed on the loading / unloading device 30, when the second robotic arm 220 is driven by the second telescopic component 400 to grasp the wafers on the loading / unloading device 30 along the first direction, the first robotic arm 210 can be driven by the second telescopic component 400 to move along the first direction and place the inspected wafers on the loading / unloading device 30. When the first robotic arm 210 is driven by the first telescopic component 300 to move along the first direction and grasp the wafers on the pre-alignment device 40, the second robotic arm 220 can be driven by the second telescopic component 400 to move along the first direction and place the wafers to be aligned on the pre-alignment device 40. When the second robotic arm 220 is driven by the second telescopic component 400 to grasp the wafers on the pre-alignment device 40 along the first direction, the first robotic arm 210 can be driven by the second telescopic component 400 to move along the first direction and place the wafers to be aligned on the pre-alignment device 40. The telescopic base 100 can remain stationary in all three processes, simplifying the horizontal movement of the gripping device 10.

[0095] Furthermore, in some embodiments, the automated semiconductor wafer inspection equipment also includes a lifting assembly connected to the wafer inspection stage 20, the loading / unloading device 30, and the pre-alignment device 40, and capable of moving the wafer inspection stage 20, the loading / unloading device 30, and the pre-alignment device 40 vertically. Since the first robotic arm 210 and the second robotic arm 220 at least partially overlap vertically, when different robotic arms extend to grasp or place wafers, the wafer inspection stage 20, the loading / unloading device 30, and the pre-alignment device 40 can adjust their own height according to the height difference between the first robotic arm 210 and the second robotic arm 220, thereby reducing the height difference between the robotic arm and its own wafer-bearing position and providing a more stable bearing effect.

[0096] In some embodiments, the lifting assembly is connected to the gripping device 10 and can drive the gripping device 10 to move vertically. With this solution, when different robotic arms extend to grip or place wafers, the gripping device 10 can adjust the height of the robotic arms via the lifting assembly, thereby reducing the height difference between the extended robotic arms and other devices, making the wafer gripping and placement process more stable.

[0097] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. Gripping device, characterized in that include: Telescopic base; The gripping component includes a first robotic arm and a second robotic arm, the first robotic arm having a first gripping position and the second robotic arm having a second gripping position, wherein when the first robotic arm is in the first gripping position and the second robotic arm is in the second gripping position, at least a portion of the first robotic arm and at least a portion of the second robotic arm overlap vertically. The first telescopic component connects the first robotic arm to the telescopic base. The first telescopic component can extend the first robotic arm along a first direction based on the first grasping position, and can also retract the first robotic arm back to the first grasping position along the opposite direction of the first direction. The first direction is parallel to the horizontal plane. The second telescopic component connects the second robotic arm to the telescopic base. The second telescopic component can extend the second robotic arm along the first direction based on the first gripping position, and can also retract the second robotic arm in the opposite direction to the second gripping position.

2. The gripping device according to claim 1, characterized in that The first robotic arm located at the first grasping position and the second robotic arm located at the second grasping position are both positioned between the first telescopic component and the second telescopic component in a second direction, which is perpendicular to the first direction and parallel to the horizontal plane.

3. The gripping device of claim 1, wherein The gripping assembly has a loading / unloading position, a wafer detection position, and a pre-alignment position; the gripping device further includes a driving component connected to the telescopic base, which is used to drive the telescopic base to rotate around a vertical axis when the first manipulator is in the first gripping position and the second manipulator is in the second gripping position, so that the gripping assembly moves to the loading / unloading position, the wafer detection position, or the pre-alignment position.

4. The gripping device of claim 1, wherein The first telescopic assembly includes a first main telescopic member and a first auxiliary telescopic member; the first main telescopic member is connected to the telescopic base, the first auxiliary telescopic member is connected to the first main telescopic member, and the first robotic arm is connected to the first auxiliary telescopic member; When the first main telescopic member moves relative to the telescopic base along the first direction, it can drive the first auxiliary telescopic member to move relative to the first main telescopic member along the first direction. When the first main telescopic member moves in the opposite direction relative to the telescopic base in the first direction, it can drive the first auxiliary telescopic member to move in the opposite direction relative to the first main telescopic member in the first direction. The second telescopic assembly includes a second main telescopic component and a second auxiliary telescopic component; The second main telescopic component is connected to the telescopic base, the second auxiliary telescopic component is connected to the second main telescopic component, and the second robotic arm is connected to the second auxiliary telescopic component; When the second main telescopic member moves relative to the telescopic base along the first direction, it can drive the second auxiliary telescopic member to move relative to the second main telescopic member along the first direction. When the second main telescopic member moves in the opposite direction relative to the telescopic base along the first direction, it can drive the second auxiliary telescopic member to move in the opposite direction relative to the second main telescopic member along the first direction.

5. The gripping device according to claim 4, characterized in that The first telescopic assembly further includes a first conveyor belt and two first rotating members. The two first rotating members are arranged along the first direction and are rotatably connected to the first main telescopic member. The rotation axes of the first rotating members are parallel to the second direction. The first conveyor belt is wrapped around the outside of the two first rotating members and can move with the rotation of the first rotating members. In the third direction, the first auxiliary telescopic member and the telescopic base are respectively connected to the first conveyor belt on both sides of the line connecting the centers of adjacent first rotating members. The first direction, the second direction and the third direction are perpendicular to each other. The second telescopic assembly further includes a second conveyor belt and two second rotating members. The two second rotating members are arranged along the first direction and are rotatably connected to the second main telescopic member. The rotation axes of the second rotating members are parallel to the fourth direction. The second conveyor belt is wrapped around the outside of the two second rotating members and can move with the rotation of the second rotating members. In the fifth direction, the second auxiliary telescopic member and the telescopic base are respectively connected to the second conveyor belt on both sides of the line connecting the centers of adjacent second rotating members. The first direction, the fourth direction and the fifth direction are perpendicular to each other.

6. The gripping device according to claim 5, characterized in that The first conveyor belt is a synchronous belt and is engaged with the two first rotating components; And / or, the second conveyor belt is a synchronous belt and engages with two of the second rotating members.

7. The gripping device of claim 4, wherein The first telescopic assembly includes a first gear, a first rack, and a second rack. The first gear is rotatably connected to the first main telescopic member, and the rotation axis of the first gear is perpendicular to the first direction. The first rack and the second rack both extend along the first direction. The first rack meshes with one side of the first gear in a second direction and is connected to the first auxiliary telescopic member. The second rack meshes with the other side of the first gear in the second direction and is connected to the telescopic base. The second direction is perpendicular to the first direction and the rotation axis of the first gear. And / or, the second telescopic assembly includes a second gear, a third rack, and a fourth rack. The second gear is rotatably connected to the second main telescopic member, and the axis of rotation of the second gear is perpendicular to the first direction. The third rack and the fourth rack both extend along the first direction. The third rack meshes with the second gear on one side of the third direction and is connected to the second auxiliary telescopic member. The fourth rack meshes with the second gear on the other side of the third direction and is connected to the telescopic base. The third direction is perpendicular to the first direction and the axis of rotation of the second gear.

8. The gripping device of claim 4, wherein The first telescopic assembly includes a third gear, a fourth gear, a fifth rack, and a sixth rack. The third gear and the fourth gear are rotatably connected to the first main telescopic member and mesh with each other. The rotation axes of the third gear and the fourth gear are parallel to the fourth direction. The fifth rack and the sixth rack extend along the first direction. The fifth rack is connected to the first auxiliary telescopic member and meshes with one side of the third gear in the fifth direction. The sixth rack is connected to the telescopic base and meshes with one side of the fourth gear in the fifth direction. The first direction, the fourth direction, and the fifth direction are perpendicular to each other. And / or, the second telescopic assembly includes a fifth gear, a sixth gear, a seventh rack, and an eighth rack. The fifth gear and the sixth gear are rotatably connected to the second main telescopic member and mesh with each other. The rotation axes of the fifth gear and the sixth gear are parallel to the sixth direction. The seventh rack and the eighth rack extend along the first direction. The seventh rack is connected to the first auxiliary telescopic member and meshes with one side of the fifth gear in the seventh direction. The eighth rack is connected to the telescopic base and meshes with one side of the sixth gear in the seventh direction. The first direction, the sixth direction, and the seventh direction are perpendicular to each other.

9. A semiconductor wafer automatic inspection apparatus, characterized by comprising: include: Wafer inspection station, used to inspect wafers; The loading and unloading device is used to provide wafers to be inspected and to receive wafers that have completed inspection; A pre-alignment device used to calibrate the position of the wafer; The gripping device as described in any one of claims 1 to 8; The gripping device is capable of placing the wafer onto the wafer inspection station, the loading / unloading device, and the pre-alignment device, and removing the wafer from the wafer inspection station, the loading / unloading device, and the pre-alignment device.

10. The automatic semiconductor wafer inspection equipment according to claim 9, characterized in that, It also includes lifting components, The lifting assembly is connected to the wafer inspection stage, the loading and unloading device, and the pre-alignment device, and can drive the wafer inspection stage, the loading and unloading device, and the pre-alignment device to move in the vertical direction; Alternatively, the lifting assembly is connected to the gripping device and can drive the gripping device to move in the vertical direction.

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