Anti-drop positioning carrier for semiconductor device

Abstract

The utility model discloses a semiconductor device anti-drop positioning carrier, which comprises a bottom plate, a cushion block, fixed baffle plates, movable baffle plates and a baffle plate driving assembly, the cushion block is arranged on the bottom plate and extends along the length direction of the bottom plate, the fixed baffle plates are arranged on the cushion block at intervals along the length direction of the cushion block, the movable baffle plates are arranged on two sides of the cushion block in a lifting manner, and the baffle plate driving assembly is arranged on the cushion block. A guide rod extending upwards into the movable baffle is arranged on the bottom plate, the baffle driving assembly comprises a sliding block, a driving plate and a driven plate, sliding grooves located in the two sides of the cushion block and corresponding to the sliding block are formed in the bottom plate, the sliding block is arranged in the sliding grooves and points to the cushion block, and the driving plate is arranged on the sliding block. The driven plates are arranged on the outer side of the movable baffle and correspond to the driving plates in a one-to-one mode, and first slopes obliquely extending towards the lower portions of the outer sides are arranged at the ends, adjacent to the driving plates, of the driven plates. According to the anti-drop positioning carrier for the semiconductor device, the semiconductor device can be taken out and placed in conveniently, and the semiconductor device is prevented from dropping in the carrying process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device transportation technology, and in particular to a semiconductor device anti-detachment positioning carrier. Background Technology

[0002] In the process of semiconductor device processing and testing, in order to improve work efficiency, it is necessary to use carriers to position and transport multiple semiconductor devices.

[0003] Because semiconductor devices are small in size and light in weight, they are easily detached from the carrier due to vibration during transportation and transfer. Therefore, the carrier needs to be positioned around the semiconductor device to prevent it from falling off. However, this also makes it difficult to remove and place the semiconductor device from the carrier, affecting normal operation, and improvements are needed. Utility Model Content

[0004] The purpose of this utility model is to provide a semiconductor device anti-detachment positioning carrier to position semiconductor devices, prevent them from falling off during transportation, and improve the ease of removal and placement operations.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A semiconductor device anti-detachment positioning carrier includes: a base plate, pads, fixed baffles, movable baffles, and a baffle driving assembly. The pads are disposed on the base plate and extend along the length of the base plate. The fixed baffles are spaced apart on the pads along the length of the pads. The movable baffles are vertically and vertically disposed on both sides of the pads. The base plate is provided with guide rods extending upward into the movable baffles. The baffle driving assembly includes sliders, a driving plate, and a passive plate. The base plate is provided with grooves located on both sides of the pads and corresponding to the sliders. The sliders are disposed in the grooves and point towards the pads. The driving plate is disposed on the sliders. The passive plates are disposed outside the movable baffles and correspond one-to-one with the driving plates. One end of the passive plate adjacent to the driving plate is provided with a first inclined surface extending obliquely outward and downward. The end of the driving plate is provided with a second inclined surface that fits against the first inclined surface.

[0007] The movable baffle is provided with a guide hole corresponding to the guide rod.

[0008] The guide rod is equipped with a spring located below the movable baffle.

[0009] In this configuration, a positioning groove corresponding to a semiconductor device is formed between two adjacent fixed baffles.

[0010] The groove is a T-shaped groove.

[0011] The base plate is provided with a waist hole on one side of the slide groove, and a stop pin connected to the slider in the slide groove is provided in the waist hole.

[0012] The length direction of the waist hole points perpendicularly to the pad block.

[0013] The base plate has at least two grooves on one side of the pad.

[0014] The beneficial effects of this utility model are as follows: A semiconductor device anti-detachment positioning carrier, after the base plate is transferred into place, can push the two drive plates inward by hand or cylinder on the workstation, so that the passive plate and the movable baffle move down, exposing the two ends of the positioning groove, which facilitates the removal and placement of semiconductor devices. During the transportation process, the movable baffle is kept in an upward state under the action of the spring, sealing the two ends of the positioning groove, realizing the precise positioning of the semiconductor device, which is simple to operate and avoids the problem of semiconductor devices falling off. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 yes Figure 1 A schematic diagram of the structure after the movable baffle in the middle has descended;

[0017] Figure 3 yes Figure 2 Top view. Detailed Implementation

[0018] The following is combined with Figures 1-3 The technical solution of this utility model will be further illustrated through specific embodiments.

[0019] like Figure 1 The semiconductor device anti-detachment positioning carrier shown is used for positioning the semiconductor device 13 during transportation. It includes: a base plate 1, a pad 2, a fixed baffle 12, a movable baffle 3, and a baffle driving assembly. The pad 2 is set on the base plate 1 and extends along the length of the base plate 1. The pad 2 can be fixed to the base plate 1 with screws, and the structure is stable.

[0020] like Figure 2 and Figure 3 As shown, the fixing baffles 12 are spaced apart on the pad 2 along its length. In this embodiment, a positioning groove 15 corresponding to the semiconductor device 13 is formed between two adjacent fixing baffles 12, which can be used to position the semiconductor device 13 on both the front and rear sides. The fixing baffles 12 can be fixed to the pad 2 by screws or welding, resulting in a robust structure.

[0021] The movable baffle 3 is raised and lowered on both sides of the pad 2. After the movable baffle 3 rises, it seals the two ends of the positioning groove 15, so as to achieve precise positioning of the left and right ends of the semiconductor device 3 and avoid the problem of the semiconductor device falling off during transportation.

[0022] A guide rod 6 extending upward into the movable baffle 3 is provided on the base plate 1. In this embodiment, the movable baffle 3 is provided with a guide hole corresponding to the guide rod 6. The movable baffle 3 is guided to rise and fall by the cooperation of the guide rod 6 and the guide hole. (See Figure 1 and...) Figure 2 As shown, a spring 7 is provided on the guide rod 6 below the movable baffle 3. The spring 7 provides elastic support for the movable baffle 3, which facilitates the upward reset of the movable baffle 3 after it has descended.

[0023] In this embodiment, the baffle driving assembly includes a slider 5, a driving plate 4, and a passive plate 9. The base plate 1 is provided with a sliding groove 16 located on both sides of the pad 2 and corresponding to the slider 5. The slider 5 is disposed in the sliding groove 16 and points towards the pad 2. The sliding groove 16 is a T-shaped groove, and the slider 5 is a T-shaped block. The slider 5 is guided by the sliding groove 16.

[0024] A waist hole 14 is provided on the base plate 1 on one side of the slide groove 16. A stop pin 8 is provided in the waist hole 14 and connected to the slider 5 in the slide groove 16. By moving the stop pin 8 in the waist hole 14, the movement stroke of the slider 5 is restricted, and the slider 5 is prevented from leaving the slide groove 16.

[0025] like Figure 3 As shown, the length direction of the waist hole 14 points perpendicularly to the pad 2, and does not affect the small left and right movement of the slider 5 perpendicular to the pad 2. The base plate 1 has at least two grooves 16 on one side of the pad 2; in this embodiment, there are two grooves 16 on one side of the pad 2, which can accommodate two sliders 5. The drive plate 4 is mounted on the slider 5; the drive plate 4 can be welded or fixed to the slider 5 with screws for synchronous left and right movement.

[0026] The passive plate 9 is set on the outside of the movable baffle 3 and corresponds one-to-one with the drive plate 4. The passive plate 9 can be welded or fixed to the outside of the movable baffle 3 by screws, so that the passive plate 9 and the movable baffle 3 rise and fall synchronously.

[0027] like Figure 1 As shown, the passive plate 9 has a first inclined surface 10 extending downward and outward at one end adjacent to the drive plate 4, and the drive plate 4 has a second inclined surface 11 that fits against the first inclined surface 10 at its end. Through the cooperation of the first inclined surface 10 and the second inclined surface 11, when a hand or a cylinder at the workstation pushes the drive plates 4 inward on both sides, the passive plate 9 and the movable baffle 3 move downward. Figure 2As shown, both ends of the positioning groove 15 are exposed, which facilitates the removal and insertion of the semiconductor device 13.

[0028] like Figure 1 As shown, during the transport process, the movable baffle 3 remains in an upward state under the action of the spring 7, sealing both ends of the positioning groove 15, thereby achieving precise positioning of the semiconductor device 13. The operation is simple and avoids the semiconductor device 13 from falling off.

[0029] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A semiconductor device anti-detachment positioning carrier, used for positioning semiconductor devices during transport, characterized in that, include: The system comprises a base plate, pads, fixed baffles, movable baffles, and a baffle driving assembly. The pads are disposed on the base plate and extend along its length. The fixed baffles are spaced along the length of the pads. The movable baffles are vertically and vertically disposed on both sides of the pads. The base plate has guide rods extending upward into the movable baffles. The baffle driving assembly includes a slider, a driving plate, and a passive plate. The base plate has grooves located on both sides of the pads and corresponding to the sliders. The sliders are disposed in the grooves and point towards the pads. The driving plate is disposed on the sliders. The passive plates are disposed outside the movable baffles and correspond one-to-one with the driving plates. The passive plate has a first inclined surface extending downward and outward at one end adjacent to the driving plate. The end of the driving plate has a second inclined surface that fits against the first inclined surface.

2. The semiconductor device anti-detachment positioning carrier according to claim 1, characterized in that, The movable baffle is provided with guide holes corresponding to the guide rod.

3. The semiconductor device anti-detachment positioning carrier according to claim 1, characterized in that, The guide rod is equipped with a spring located below the movable baffle.

4. The semiconductor device anti-detachment positioning carrier according to claim 1, characterized in that, A positioning groove corresponding to a semiconductor device is formed between two adjacent fixed baffles.

5. The semiconductor device anti-detachment positioning carrier according to claim 1, characterized in that, The chute is a T-shaped groove.

6. The semiconductor device anti-detachment positioning carrier according to claim 1, characterized in that, The base plate is provided with a waist hole on one side of the slide groove, and a stop pin connected to the slider in the slide groove is provided in the waist hole.

7. The semiconductor device anti-detachment positioning carrier according to claim 6, characterized in that, The length of the waist hole points perpendicularly to the pad block.

8. The semiconductor device anti-detachment positioning carrier according to claim 1, characterized in that, The base plate has at least two grooves on one side of the pad.

Images