Wafer chip measuring device and semiconductor equipment

Abstract

The utility model discloses a wafer chip measuring device and semiconductor equipment. The device comprises a base; the moving unit is provided with a movable bearing platform; an adsorption unit; a measuring unit; the air foot unit is fixedly connected with the bearing platform, keeps non-contact with the base and generates air buoyancy force F1; the magnetic unit is mounted on one side of the bearing platform and generates magnetic acting force F2; the air buoyancy force F1, the magnetic acting force F2, the bearing platform and the total gravity G loaded on the bearing platform are mutually balanced in the first direction, so that the bearing platform is suspended in the first direction. According to the application, the air foot unit and the magnetic force unit are arranged and act on the bearing platform in a synergistic manner, so that force balance of the bearing platform is realized in the first direction, the bearing platform and a load on the bearing platform are ensured to be at a preset working position, and meanwhile, the bearing platform is in a non-contact suspension state in the first direction, so that mechanical contact and friction are avoided; the motion repetition precision and the position stability of the measurement unit are improved, so that the measurement precision of wafers and chips is improved.

Description

Technical Field

[0001] This application relates to the field of precision measurement technology, and in particular to wafer chip measurement devices and semiconductor equipment. Background Technology

[0002] Existing wafer or chip metrology equipment typically uses separate, dedicated devices for each measurement, making it difficult to accommodate different types and sizes of workpieces on a single platform. This results in complex production line configurations and low changeover efficiency. Furthermore, the vision units often rely on low-precision guideways for movement, limiting motion repeatability and positioning accuracy, which fails to meet the stringent requirements of high-precision measurement. These shortcomings not only limit the overall accuracy of the metrology equipment but also hinder the integration and automation of wafer-level and chip-level inspection processes. Therefore, there is an urgent need for a new type of metrology equipment that can simultaneously support high-precision, non-contact measurement of wafers and chips while ensuring high motion accuracy of the vision units. Utility Model Content

[0003] This application provides a wafer chip measurement device and semiconductor equipment. In the wafer chip measurement device of this application, an air-support unit and a magnetic unit are arranged to work together on a support platform to achieve force balance in a first direction. While ensuring that the support platform and all its loads are stably positioned in a predetermined working position, the support platform maintains a stable non-contact suspension state in the first direction. This ensures the stability of the gas film thickness while avoiding mechanical contact and friction, thereby improving the motion repeatability and positional stability of the support platform and the supported measurement unit during dynamic measurement, and ultimately improving the measurement accuracy of wafers and chips.

[0004] To achieve the above objectives, according to a first aspect of this application, a wafer chip measurement apparatus is provided, comprising:

[0005] Base;

[0006] The motion unit, mounted on the base, includes a movable support platform;

[0007] An adsorption unit, mounted on a base via a support unit, is used to adsorb chips and / or wafers;

[0008] The measurement unit, mounted on and moving along with the carrier platform, is used for positioning and measuring chips and / or wafers;

[0009] The air foot unit is fixedly connected to the support platform and keeps it in non-contact with the base. The air foot unit is configured to generate an upward air buoyancy force F1.

[0010] A magnetic unit, mounted on the side of the support platform away from the measuring unit, is configured to generate a downward magnetic force F2;

[0011] In this process, the buoyancy force F1, the magnetic force F2, and the total weight G of the bearing platform and its load are balanced in the first direction, so that the bearing platform is in a suspended state in the first direction.

[0012] According to a second aspect of this application, a semiconductor device is provided, comprising: a wafer chip measurement device as described in the above technical solution.

[0013] The wafer chip measurement device of this application, through the above technical solution, has at least the following beneficial effects: By setting up an air foot unit and a magnetic force unit to work together on the support platform, force balance of the wafer chip measurement device is achieved in the first direction. While ensuring that the support platform and all the loads it supports are stably in the predetermined working position, the support platform maintains a stable non-contact suspension state in the first direction, ensuring the stability of the gas film thickness while avoiding mechanical contact and friction. This improves the motion repeatability and positional stability of the support platform and the measurement unit it supports during dynamic measurement, thereby improving the measurement accuracy of wafers and chips. Furthermore, as a common platform for measuring wafer-level and chip-level workpieces, the wafer chip measurement device of this application not only improves the versatility and efficiency of the equipment but also avoids calibration errors and time costs caused by switching to dedicated equipment.

[0014] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0017] Figure 1 This is one of the overall structural schematic diagrams of the wafer chip measurement device provided in the embodiments of this disclosure;

[0018] Figure 2 This is a schematic diagram of the force analysis of the support platform of the wafer chip measurement device provided in the embodiments of this disclosure;

[0019] Figure 3 This is a schematic diagram showing the distribution of the air supply unit and magnetic force unit of the wafer chip measurement device provided in this embodiment of the present disclosure;

[0020] Figure 4 This is a schematic diagram of the decoupling unit of the wafer chip measurement device provided in the embodiments of this disclosure;

[0021] Figure 5 This is the second schematic diagram of the overall structure of the wafer chip measurement device provided in this embodiment of the disclosure;

[0022] Figure 6 This is the third schematic diagram of the overall structure of the wafer chip measurement device provided in this embodiment;

[0023] Figure 7 This is one of the schematic diagrams of the adsorption unit of the wafer chip measurement device provided in the embodiments of this disclosure;

[0024] Figure 8 This is a second schematic diagram of the adsorption unit of the wafer chip measurement device provided in the embodiments of this disclosure.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1-Wafer chip measurement device;

[0027] 2-Base;

[0028] 3-Motion unit; 31-Supporting platform; 32-Baseboard; 33-First motion mechanism; 34-Second motion mechanism;

[0029] 4-Adsorption unit; 41-Wafer adsorption area; 42-Chip adsorption area; 411-Wafer; 412-First adsorption hole; 413-Second adsorption hole; 414-Third adsorption hole; 421-Fourth adsorption hole; 422-Chip support plate; 423-Support arm;

[0030] 5-Support unit;

[0031] 6-Measuring unit; 61-Measuring unit base; 62-First sensor; 63-Second sensor; 64-Vision camera; 65-Third motion mechanism; 66-Guide rail;

[0032] 7-Air supply unit; 71-First air supply mechanism; 72-Second air supply mechanism; 73-Third air supply mechanism; 711-First air inlet; 721-Second air inlet;

[0033] 8-Magnetic unit; 81-First magnetic mechanism; 82-Second magnetic mechanism; 811-Permanent magnet; 812-Mounting plate; 813-Magnetic guide plate;

[0034] 9-Decoupling unit; 91-First decoupling mechanism; 911-Reed; 912-First fixed seat; 913-Second fixed seat; 92-Second decoupling mechanism; 93-Third decoupling mechanism; 94-Fourth decoupling mechanism;

[0035] Z - First direction; X - Second direction; Y - Third direction. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship according to the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] This application provides a wafer chip measurement device and semiconductor equipment, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0041] like Figure 1 , Figure 2 and Figure 3As shown, a wafer chip measurement device 1 according to this application includes: a base 2; a motion unit 3 disposed on the base 2, including a movable support platform 31; an adsorption unit 4 mounted on the base 2 via a support unit 5 for adsorbing chips and / or wafers; a measurement unit 6 mounted on the support platform 31 and moving with the support platform 31 for positioning and measuring chips and / or wafers; an air foot unit 7 fixedly connected to the support platform 31 and kept in non-contact with the base, the air foot unit 7 being configured to generate an upward air buoyancy force F1; and a magnetic unit 8 installed on the side of the support platform 31 opposite to the measurement unit 6, the magnetic unit 8 being configured to generate a downward magnetic force F2. The air buoyancy force F1 and the magnetic force F2, along with the total weight G of the support platform 31 and its load, are balanced in a first direction, so that the support platform 31 is suspended in the first direction.

[0042] In this technical solution, the base 2 serves as the base of the wafer chip measurement device 1, providing support for the overall structure. The adsorption unit 4 is mounted on the base 2 via the support unit 5, used to adsorb and fix the wafer or chip to be measured. The motion unit 3 is mounted on the base 2 and includes a movable support platform 31. This support platform 31 carries the measurement unit 6 and drives the measurement unit 6 to move synchronously, enabling high-precision measurement of the wafer and chip through the measurement unit 6.

[0043] An air foot unit 7 is provided between the support platform 31 and the base 2. The air foot unit 7 is connected to the bottom of the support platform 31. When compressed gas is introduced into the air foot unit 7, the compressed gas is ejected from the throttling orifice (micro-orifice) at the bottom of the air foot unit 7 (e.g., Figure 1 (As indicated by the arrow) A pressurized air film is formed in the gap between the air foot unit 7 and the base 2, thereby generating an upward buoyancy force F1 on the bearing platform 31, enabling the bearing platform 31 to achieve non-contact suspension in the first direction (the Z direction is defined as the first direction in this application), thus enabling the bearing platform 31 to achieve frictionless movement. Throttling holes are uniformly arranged at the bottom of the air foot unit 7 to regulate the gas flow rate, thereby maintaining the stability of the air film thickness.

[0044] A magnetic unit 8 is installed on the side of the support platform 31 facing the base 2 (i.e., the side away from the measuring unit 6). This magnetic unit 8 is configured to generate a downward magnetic force F2. This magnetic force F2 is used to balance the buoyancy force F1, preventing the support platform 31 and its entire load from moving out of the predetermined working position due to excessive buoyancy force F1 causing the air film thickness to change beyond a certain range. The support platform 31 includes the measuring unit 6 and other components such as a cable chain. Let the total weight of the support platform 31 and its entire load be denoted as G. Through the reasonable design of the air support unit 7 and the magnetic unit 8, the buoyancy force F1, the magnetic force F2, and the total weight G satisfy the following mechanical equilibrium relationship in the first direction: F1 = F2 + G (or F1 ≈ F2 + G). Thus, the bearing platform 31 can be stably maintained in a non-contact suspension state in the first direction. On the one hand, this ensures the stability of the air film thickness, and on the other hand, it eliminates mechanical contact and friction, ensuring that the bearing platform 31 and the supporting measuring unit 6 have excellent motion repeatability and positional stability during dynamic measurement, thereby improving measurement accuracy.

[0045] Therefore, this application adopts the above design, by setting up the air foot unit 7 and the magnetic force unit 8 to work together on the support platform 31 to achieve force balance of the support platform 31 in the first direction. Under the premise of ensuring that the support platform 31 and all the load it supports are stably in the predetermined working position, the support platform 31 maintains a stable non-contact suspension state in the first direction, which can ensure the stability of the air film thickness, avoid mechanical contact and friction, thereby improving the motion repeatability and positional stability of the support platform 31 and the measurement unit 6 it supports during dynamic measurement, and thus improving the measurement accuracy of wafers and chips.

[0046] like Figure 1 and Figure 5 As shown, in the wafer chip measurement device 1, the motion unit 3 further includes: a substrate 32, which is coupled to the support platform 31 through a magnetic unit 8; a first motion mechanism 33, located on the side of the substrate 32 away from the support platform 31, for driving the support platform 31 to move along a second direction (defined as the X direction in this application); and a second motion mechanism 34, disposed on the base 2 and located on the side of the first motion mechanism 33 away from the support platform 31, for driving the support platform 31 to move along a third direction (defined as the Y direction in this application).

[0047] In this technical solution, the motion unit 3 is sequentially arranged along a first direction, comprising a support platform 31, a substrate 32, a first motion mechanism 33, and a second motion mechanism 34. The substrate 32, the first motion mechanism 33, and the second motion mechanism 34 are stacked along the first direction. Specifically, the first motion mechanism 33 is configured to drive the support platform 31 and the measurement unit 6 mounted thereon to move along a second direction, and the second motion mechanism 34 is configured to drive the support platform 31 and the measurement unit 6 to move along a third direction. Through the coordinated action of the first motion mechanism 33 and the second motion mechanism 34, the measurement unit 6 can perform image positioning and scanning measurement on the wafer or chip adsorbed by the adsorption unit 4 within the plane formed by the second direction and the third direction, thereby obtaining the wafer or chip's positional information and morphological parameter information. The aforementioned "morphological parameter information" includes, but is not limited to, the total thickness variation (TTV), warp, and local thickness variation (LTV) of the wafer or chip.

[0048] It is understood that the first motion mechanism 33 and the second motion mechanism 34 can operate independently, controlling the displacement in the second and third directions respectively; they can also operate synchronously to achieve composite trajectory motion. Furthermore, according to system layout requirements, the motion directions of the first motion mechanism 33 and the second motion mechanism 34 can be interchanged. That is, the first motion mechanism 33 is used to drive the support platform and the measuring unit 6 on it to perform third-direction motion, while the second motion mechanism 34 is used to drive second-direction motion, as long as the two can jointly achieve the two-dimensional positioning of the measuring unit 6 in the plane.

[0049] like Figure 1 , Figure 2 and Figure 3 As shown, the magnetic unit 8 includes multiple magnetic mechanisms; the resultant force of the magnetic forces generated by each magnetic mechanism constitutes the magnetic force F2; the magnetic force F2 acts on the center of mass of the bearing platform 31 and the load on it. The air foot unit 7 includes multiple air foot mechanisms; the resultant force of the air buoyancy generated by each air foot mechanism constitutes the air buoyancy force F1; the air buoyancy force F1 acts on the center of mass of the bearing platform 31 and the load on it.

[0050] In some embodiments, the magnetic unit 8 includes a first magnetic mechanism 81 and a second magnetic mechanism 82, which are centrally symmetrically distributed about the center of mass O of the supporting platform 31. The first magnetic mechanism 81 and the second magnetic mechanism 82 are configured to apply a downward magnetic attraction force to the supporting platform 31, and the resultant force of the magnetic attraction force generated by the two is defined as the magnetic force F2.

[0051] The air-support unit 7 includes a first air-support mechanism 71, a second air-support mechanism 72, and a third air-support mechanism 73, which are arranged in a triangular pattern to adapt to the structure of the support platform 31. The first air-support mechanism 71, the second air-support mechanism 72, and the third air-support mechanism 73 are configured to provide an upward air buoyancy force to the support platform 31, and the resultant force of the air buoyancy force provided by the three is defined as the air buoyancy force F1.

[0052] In this technical solution, through the arrangement of the aforementioned air-supported mechanisms and magnetic mechanisms, and the reasonable setting of their output magnitudes, the buoyancy force F1, the magnetic force F2, and the total weight G of the supporting platform 31 and its load satisfy the following in the first direction: F1 = F2 + G (or F1 ≈ F2 + G). Simultaneously, the resultant torque of all forces relative to the overall center of mass O of the supporting platform 31 and its load is zero (or approximately zero). Therefore, the supporting platform 31 essentially achieves static equilibrium in the first direction, stably maintaining a non-contact levitation state. It should be understood that... Figure 2 The location of the center of mass O of the supporting platform shown is only a schematic marker to illustrate the force relationship and to explain the existence and approximate location of the center of mass. It does not represent the precise physical location of the supporting platform 31 in the actual embodiment. The actual location of the center of mass needs to be determined based on specific structural parameters and load distribution. The attached drawings do not constitute a limitation on the specific coordinates of the center of mass.

[0053] In some embodiments, the first magnetic mechanism 81 and the second magnetic mechanism 82 have the same configuration. Here, the configuration of the first magnetic mechanism 81 will be described as an example. The first magnetic mechanism 81 includes: a permanent magnet 811; a mounting plate 812, which is disposed on the side of the support platform 31 facing the substrate 32, and has a groove on the side facing the substrate 32, in which the permanent magnet 811 is embedded; and a magnetic conductive plate 813, which is disposed on the substrate 32 and is disposed opposite to the permanent magnet 811 to form a closed magnetic circuit.

[0054] In this technical solution, the first magnetic mechanism 81 includes a mounting plate 812, a plurality of permanent magnets 811, and a magnetic guide plate 813 arranged sequentially along a first direction. The plurality of permanent magnets 811 are fixed in grooves on one side of the mounting plate 812 and arranged at intervals along a preset direction (second direction); the magnetic guide plate 813 is positioned opposite the permanent magnets 811, forming a magnetic attraction gap between them. The magnetic field generated by the permanent magnets 811 forms a closed magnetic circuit via the magnetic guide plate 813, thereby applying a downward magnetic attraction force to the support platform 31. The magnitude of the magnetic attraction force can be adjusted by changing the number, arrangement density, and magnetization direction of the permanent magnets 811. Correspondingly, the number of permanent magnets and the number of grooves in the first magnetic mechanism 81 and the second magnetic mechanism 82 can be adaptively configured according to the required magnetic force and the load characteristics of the support platform 31, so as to achieve precise force balance control in conjunction with the air foot unit 7.

[0055] In some embodiments, the first air foot mechanism 71, the second air foot mechanism 72, and the third air foot mechanism 73 are arranged in an isosceles triangle.

[0056] In this technical solution, when the air foot mechanism is distributed in an isosceles triangle, the line of action of the resultant force F1 generated by the three air foot mechanisms passes through or is close to the center of mass O of the bearing platform 31, thereby reducing the overturning moment generated by the air foot mechanism on the bearing platform 31 and improving the attitude stability of the bearing platform 31 in the non-contact suspension state.

[0057] In some embodiments, compressed air is introduced into the first air supply mechanism 71 through the first air inlet 711, and compressed air is introduced into the second air supply mechanism 72 through the second air inlet 721.

[0058] like Figure 4 and Figure 5 As shown, the wafer chip measurement device also includes a decoupling unit 9. The decoupling unit 9 includes multiple decoupling mechanisms; the multiple decoupling mechanisms are centrally symmetrically distributed with the center O' of the substrate 32 as the center of symmetry.

[0059] In this technical solution, the decoupling unit 9 includes a first decoupling mechanism 91, a second decoupling mechanism 92, a third decoupling mechanism 93, and a fourth decoupling mechanism 94. All four are disposed between the substrate 32 and the support platform 31 to suppress undesirable coupling movements of the support platform 31. Specifically, these four decoupling mechanisms are distributed around the geometric center O' of the substrate 32 and are symmetrical about this geometric center O', forming a centrally symmetrical four-point layout. This symmetrical arrangement of the decoupling mechanisms allows each mechanism to provide a balanced constraint force when the support platform 31 moves along the second or third direction, suppressing the rotational movement of the support platform 31 around an axis parallel to the first direction (i.e., around the Z-axis), avoiding attitude disturbances caused by the motion unit drive, and thus improving positional stability and repeatability during the measurement process.

[0060] In some embodiments, the decoupling mechanisms have the same configuration; the first decoupling mechanism 91 is described here as an example. The first decoupling mechanism 91 includes: a spring 911 configured to restrict the rotational movement of the support platform 31 about an axis parallel to a first direction; a first fixing seat 912 mounted on the base plate 32 for fixing one end of the spring 911; and a second fixing seat 913 mounted on the support platform 31 for fixing the other end of the spring 911.

[0061] In this technical solution, the reed 911 has high stiffness in the second and third directions, so it is difficult for it to deform in the horizontal plane formed by the second and third directions, thereby suppressing the rotational movement of the bearing platform 31 about an axis parallel to the first direction.

[0062] like Figure 6 , Figure 7 and Figure 8 As shown, the adsorption unit 4 includes a wafer adsorption area 41 and a chip adsorption area 42; both the wafer adsorption area 41 and the chip adsorption area 42 are provided with adsorption holes for adsorbing the wafer 411 and the chip respectively by point adsorption.

[0063] In this technical solution, by setting wafer adsorption area 41 and chip adsorption area 42 on adsorption unit 4 respectively, the common platform measurement of wafer-level and chip-level workpieces is realized, which not only improves the versatility and efficiency of the equipment, but also avoids calibration errors and time costs caused by switching to dedicated equipment.

[0064] Both the wafer adsorption area 41 and the chip adsorption area 42 employ a point adsorption structure, which uses micropores or micro-nozzles to create localized negative pressure, achieving localized adsorption and fixation of the wafer or chip. Compared to traditional continuous gas groove or large-area vacuum cavity adsorption methods, point adsorption significantly reduces the contact area with the wafer or chip, thus retaining a larger unobstructed area on the support surface. This unobstructed area allows the measurement unit 6 to perform optical topography scanning without obstruction, improving not only the comprehensiveness (coverage) and accuracy of the measurement but also avoiding localized stress deformation of the wafer caused by large-area adsorption, thereby improving measurement accuracy. Furthermore, the point adsorption layout can be flexibly adjusted according to different measurement tasks (such as central area detection, edge defect identification, etc.), enhancing the device's adaptability to diverse measurement parameters.

[0065] In some embodiments, the wafer adsorption region 41 includes a first adsorption hole 412, a second adsorption hole 413 and a third adsorption hole 414 arranged in a triangular pattern; the chip adsorption region 42 includes a chip support plate 422 and a fourth adsorption hole 421.

[0066] In this technical solution, the first adsorption hole 412, the second adsorption hole 413, and the third adsorption hole 414 in the wafer adsorption region 41 are located in the outer edge region of the wafer 411, and are used to perform three-point support adsorption of the wafer 411 through local negative pressure. Preferably, the three adsorption holes are distributed in an equilateral triangle, so that the point of application of the resultant adsorption force is close to the geometric center of the wafer, thereby providing a stable adsorption force while suppressing warping or deflection of the wafer due to gravity or motion inertia. Optionally, the radial position of the adsorption holes can be adjusted according to the diameter of the wafer 411. For example, multiple sets of adsorption hole positions can be provided in the wafer adsorption region 41, or an adsorption hole position adjustment module can be used to adapt to wafers of different sizes (such as 200mm, 300mm, etc.), improving the versatility of the device.

[0067] A cross-shaped chip support plate 422, consisting of two perpendicular support arms 423, is located at the center of the chip adsorption area 42, providing mechanical support for the central region of the chip. A fourth adsorption hole 421 is formed at the central intersection of the chip support plates 422, which uses negative pressure to adsorb and fix the chip onto the support plate. This cross-shaped structure ensures support rigidity while minimizing the contact area with the chip, providing an unobstructed detection path for the measurement unit below.

[0068] like Figure 1 , Figure 5 and Figure 6 As shown, the measurement unit 6 includes: a measurement unit base 61, mounted on the support platform 31; a first sensor 62, mounted on the measurement unit base 61, for acquiring parameter information of the first surface of the wafer and / or the first surface of the chip; a second sensor 63, coupled to the measurement unit base 61 via a third motion mechanism 65 and a guide rail 66, for acquiring parameter information of the second surface of the wafer and / or the second surface of the chip; and a vision camera 64, fixedly mounted with the second sensor 63, for acquiring position information of the wafer and / or the chip.

[0069] In this technical solution, the first sensor 62 and the second sensor 63 are arranged opposite each other along a first direction. During wafer measurement, the first sensor 62 scans the lower surface (first surface) of the wafer 411, while the second sensor 63 simultaneously scans the upper surface (second surface) of the wafer 411, acquiring three-dimensional topographic data of the upper and lower surfaces respectively. During chip measurement, the first sensor 62 and the second sensor 63 scan the four corner regions of the lower and upper surfaces of the chip respectively, acquiring surface parameters at the corresponding locations. The first sensor 62 and the second sensor 63 are sensors capable of acquiring surface topographic or distance information in a non-contact manner, such as spectral confocal sensors and laser displacement sensors. Based on the scanning data of the upper and lower surfaces, key parameters such as the total thickness variation (TTV), warp, and local thickness variation (LTV) of the wafer or chip can be calculated using algorithm software. In addition, the vision camera 64 is fixedly connected to the second sensor 63, which is used to acquire images of the flat edge, notch or preset mark of the wafer, or the four corner contours and alignment marks of the chip before scanning measurement, and to determine the actual position and orientation of the wafer or chip on the carrier platform through image recognition algorithm, thereby achieving high-precision positioning and coordinate calibration.

[0070] In some embodiments, the first sensor 62, the second sensor 63, and the vision camera 64 are configured to move synchronously with the support platform 31; wherein the second sensor 63 and the vision camera 64 move together along the guide rail 66 in a third direction under the drive of the third motion mechanism 65.

[0071] In this technical solution, the second sensor 63 and the vision camera 64 can move along a third direction to adjust their positions relative to the wafer or chip, so that their working distances are within their respective effective measurement ranges, thereby improving detection accuracy.

[0072] In some embodiments, the support unit 5 supports the adsorption unit 4 and is configured to drive the adsorption unit 4 to move along a third direction and to rotate about an axis parallel to the third direction.

[0073] In this technical solution, the support unit 5 can drive the adsorption unit 4 to move along a third direction to adjust the position of the adsorption unit 4, so that the wafer or chip is within the effective measurement range of the first sensor 62, the second sensor 63, and the vision camera 64. Simultaneously, the support unit 5 can also drive the adsorption unit 4 to rotate around an axis parallel to the third direction to adjust the azimuth angle of the wafer or chip (e.g., aligning with a flat edge or mark), thereby ensuring that the measurement coordinate system is aligned with the workpiece features and improving detection accuracy.

[0074] In some embodiments, during the operation of the measuring unit 6, compressed air is continuously supplied to the air supply unit 7, so that the bearing platform 31 remains in a non-contact suspending state in the first direction.

[0075] In some embodiments of this application, a semiconductor device is also provided, which includes a wafer chip measurement apparatus as described in any of the above technical solutions. Since the wafer chip measurement apparatus in this semiconductor device has the same technical features as the aforementioned wafer chip measurement apparatus, both can solve the same technical problems and achieve the same technical effects.

[0076] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0077] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0078] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. A wafer chip measurement device, characterized in that, include: Base; The motion unit, mounted on the base, includes a movable support platform; An adsorption unit, mounted on the base via a support unit, is used to adsorb chips and / or wafers; A measurement unit, mounted on and moving along with the support platform, is used for positioning and measuring chips and / or wafers; An air foot unit is fixedly connected to the support platform and keeps it in non-contact with the base. The air foot unit is configured to generate an upward air buoyancy force F1. A magnetic force unit is installed on the side of the support platform opposite to the measuring unit, and the magnetic force unit is configured to generate a downward magnetic force F2; The air buoyancy force F1 is balanced by the magnetic force F2 and the total weight G of the bearing platform and its load in the first direction, so that the bearing platform is in a suspended state in the first direction.

2. The wafer chip measurement device according to claim 1, characterized in that, The motion unit further includes: The substrate is coupled to the support platform via the magnetic unit; The first motion mechanism is located on the side of the substrate opposite to the support platform, and is used to drive the support platform to move in the second direction; The second motion mechanism is disposed on the base and located on the side of the first motion mechanism opposite to the support platform, and is used to drive the support platform to move in a third direction.

3. The wafer chip measurement device according to claim 2, characterized in that, The magnetic unit includes multiple magnetic mechanisms; The resultant force of the magnetic forces generated by each of the magnetic mechanisms constitutes the magnetic force F2; The magnetic force F2 acts on the center of mass of the bearing platform and the load on it.

4. The wafer chip measurement device according to claim 3, characterized in that, Each of the aforementioned magnetic mechanisms includes: permanent magnet; A mounting plate is disposed on the side of the support platform facing the substrate, and a groove is provided on the surface of the mounting plate facing the substrate, in which the permanent magnet is embedded; A magnetic guide plate is disposed on the substrate and is disposed opposite to the permanent magnet to form a closed magnetic circuit.

5. The wafer chip measurement device according to claim 1, characterized in that, The air foot unit includes multiple air foot mechanisms; The resultant force of the buoyancy generated by each of the aforementioned air-support mechanisms constitutes the buoyancy force F1; The buoyancy force F1 acts on the center of mass of the bearing platform and its load.

6. The wafer chip measurement device according to claim 5, characterized in that, The air foot unit includes a first air foot mechanism, a second air foot mechanism, and a third air foot mechanism; The first air foot mechanism, the second air foot mechanism, and the third air foot mechanism are arranged in a triangular pattern.

7. The wafer chip measurement device according to claim 6, characterized in that, The first, second, and third air foot mechanisms are arranged in an isosceles triangle.

8. The wafer chip measurement device according to claim 2, characterized in that, The wafer chip measurement device also includes a decoupling unit; The decoupling unit includes multiple decoupling mechanisms for suppressing undesirable coupling movements of the support platform; The multiple decoupling mechanisms are centrally symmetrically distributed with the center of the substrate as the center of symmetry.

9. The wafer chip measurement device according to claim 8, characterized in that, Each of the aforementioned decoupling mechanisms includes: A reed is configured to limit the rotational movement of the support platform about an axis parallel to a first direction; A first fixing seat is mounted on the base plate and is used to fix one end of the spring sheet; The second fixing seat is installed on the bearing platform and is used to fix the other end of the spring.

10. The wafer chip measurement device according to claim 1, characterized in that, The adsorption unit includes a wafer adsorption region and a chip adsorption region; Both the wafer adsorption area and the chip adsorption area are provided with adsorption holes for adsorbing the wafer and the chip respectively by point adsorption.

11. The wafer chip measurement device according to claim 10, characterized in that, The wafer adsorption region includes a first adsorption pore, a second adsorption pore, and a third adsorption pore distributed in a triangular pattern. The chip adsorption area includes a fourth adsorption hole and a chip support plate.

12. The wafer chip measurement device according to claim 1, characterized in that, The measurement unit includes: The measuring unit base is mounted on the support platform; A first sensor is mounted on the base of the measurement unit to acquire parameter information of the first surface of the wafer and / or the first surface of the chip. The second sensor is coupled to the base of the measurement unit via a third motion mechanism and a guide rail, and is used to acquire parameter information of the second surface of the wafer and / or the second surface of the chip; A vision camera, fixedly mounted to the second sensor, is used to acquire position information of the wafer and / or chip.

13. The wafer chip measurement device according to claim 12, characterized in that, The first sensor, the second sensor, and the vision camera are configured to move synchronously with the support platform; The second sensor and the vision camera move together along the guide rail in a third direction under the drive of the third motion mechanism.

14. The wafer chip measurement device according to claim 1, characterized in that, The support unit supports the adsorption unit and is configured to drive the adsorption unit to move along a third direction and to rotate about an axis parallel to the third direction.

15. A semiconductor device, characterized in that, include: The wafer chip measurement device according to any one of claims 1 to 14.

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