Power semiconductor device packaging structure

Abstract

The utility model discloses a power semiconductor device packaging structure. The power semiconductor device packaging structure comprises a packaging shell; the substrate is arranged at the inner bottom of the packaging shell; the semiconductor chip is arranged on the upper part of the substrate; compared with the prior art, through the arrangement of the filling mechanism, when the heat conduction substrate is installed, the heat conduction glue can be automatically released, automation of the heat conduction glue smearing process is achieved, the production efficiency is greatly improved, the packaging time of the power semiconductor device is effectively shortened, the production cost is reduced, and the production efficiency is improved. The requirements of large-scale industrial production are met; after the heat-conducting glue is cured, a firm bonding force can be formed between the semiconductor chip and the heat-conducting substrate, so that the fixing effect between the heat-conducting substrate and the semiconductor chip is effectively improved, the semiconductor chip and the heat-conducting substrate are prevented from loosening under the influence of temperature change and mechanical vibration, and the stability of heat conduction is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a power semiconductor device packaging structure. Background Technology

[0002] Power semiconductor devices generate a significant amount of heat during operation. Therefore, effective heat dissipation is crucial to ensure normal operation and stable performance. During the packaging process of power semiconductor devices, thermal grease is typically applied between the chip and the thermally conductive substrate to enhance the thermal conductivity between them.

[0003] Currently, the application of thermal grease during chip and thermal substrate installation largely relies on manual operation. This manual application method suffers from low efficiency, making it difficult to meet the needs of large-scale production, resulting in longer production cycles and increased costs. Utility Model Content

[0004] The main objective of this invention is to propose a power semiconductor device packaging structure that can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a power semiconductor device packaging structure, comprising:

[0006] Encapsulation housing;

[0007] A substrate, wherein the substrate is disposed at the inner bottom of the packaging housing;

[0008] A semiconductor chip, wherein the semiconductor chip is disposed above a substrate;

[0009] An adapter frame is disposed above the semiconductor chip;

[0010] A thermally conductive substrate is disposed above the adapter frame;

[0011] A filling mechanism is disposed within the adapter frame and is used to fill thermally conductive adhesive between the semiconductor chip and the thermally conductive substrate.

[0012] As a further description of the above technical solution, the filling mechanism includes a plurality of receiving cavities, which are evenly opened on the adapter frame. The receiving cavities are L-shaped, with a sealing film at one end and a piston at the other end. A pressure rod is fixed on the upper side wall of the piston, and the upper end of the pressure rod extends to the top of the adapter frame.

[0013] As a further description of the above technical solution, the cavity is provided with thermally conductive adhesive.

[0014] As a further description of the above technical solution, the thermally conductive substrate is a ceramic substrate.

[0015] As a further description of the above technical solution, the upper surface of the thermally conductive substrate is in close contact with the packaging shell.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. By using a filling mechanism, thermally conductive adhesive can be automatically released during the installation of the thermally conductive substrate, thus automating the thermally conductive adhesive application process, significantly improving production efficiency, effectively shortening the packaging time of power semiconductor devices, reducing production costs, and meeting the needs of large-scale industrial production.

[0018] 2. After curing, the thermally conductive adhesive forms a strong bond between the semiconductor chip and the thermally conductive substrate, effectively improving the fixation between the thermally conductive substrate and the semiconductor chip. This prevents the semiconductor chip from loosening under the influence of temperature changes and mechanical vibrations, ensuring the stability of heat conduction. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a power semiconductor device packaging structure according to the present invention;

[0020] Figure 2 This is a schematic diagram of the adapter frame structure of a power semiconductor device packaging structure according to the present invention;

[0021] Figure 3 This is a cross-sectional view of the adapter frame of a power semiconductor device packaging structure according to the present invention.

[0022] Figure 4 This is a schematic diagram of the connection structure between the thermally conductive substrate and the adapter frame in a power semiconductor device packaging structure according to this utility model.

[0023] In the figure: 1. Package housing; 2. Substrate; 3. Semiconductor chip; 4. Adapter frame; 5. Thermally conductive substrate; 6. Filling mechanism; 61. Receiving cavity; 62. Sealing film; 63. Piston; 64. Pressure rod. Detailed Implementation

[0024] To make the technical means, creative features, and objectives of this utility model easier to understand, the following describes this utility model in conjunction with specific embodiments.

[0025] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Please see Figure 1-4 This utility model provides a power semiconductor device packaging structure, including:

[0028] Encapsulation housing 1;

[0029] Substrate 2 is disposed at the inner bottom of the packaging housing 1;

[0030] Semiconductor chip 3 is disposed above substrate 2;

[0031] Adapter frame 4 is positioned above semiconductor chip 3;

[0032] Thermally conductive substrate 5 is disposed above the adapter frame 4;

[0033] The filling mechanism 6 is disposed within the adapter frame 4 and is used to fill the space between the semiconductor chip 3 and the thermally conductive substrate 5 with thermally conductive adhesive.

[0034] The above structure automates the thermal adhesive application process, significantly improving production efficiency and effectively shortening the packaging time of power semiconductor devices.

[0035] The filling mechanism 6 includes several accommodating cavities 61, which are evenly distributed on the adapter frame 4. Each accommodating cavity 61 is L-shaped. One end of each accommodating cavity 61 is provided with a sealing film 62 and the other end is provided with a piston 63. A pressure rod 64 is fixed on the upper side wall of the piston 63, and the upper end of the pressure rod 64 extends to the top of the adapter frame 4.

[0036] With the above structure, when the thermally conductive substrate 5 is installed, the thermally conductive adhesive can be automatically released to fill the gap between the thermally conductive substrate 5 and the semiconductor chip 3, so that the thermally conductive adhesive can conduct the heat generated by the semiconductor chip 3 to the thermally conductive substrate 5.

[0037] The cavity 61 is equipped with thermally conductive adhesive.

[0038] With the above-mentioned structure, the released thermally conductive adhesive can form a strong bond between the semiconductor chip 3 and the thermally conductive substrate 5 after curing, which effectively improves the fixing effect between the thermally conductive substrate 5 and the semiconductor chip 3, prevents the semiconductor chip 3 and the thermally conductive substrate 5 from loosening under the influence of temperature changes and mechanical vibration, and ensures the stability of heat conduction.

[0039] Among them, the thermally conductive substrate 5 is a ceramic substrate.

[0040] With the above-described structure, the ceramic has excellent thermal conductivity and insulation properties, which can quickly conduct the heat generated by the semiconductor chip 3 while ensuring electrical insulation performance.

[0041] The upper surface of the thermally conductive substrate 5 is in close contact with the package housing 1, so that the thermally conductive substrate 5 can conduct the heat generated by the semiconductor chip 3 to the package housing 1 for heat dissipation.

[0042] It should be noted that this utility model is a power semiconductor device packaging structure. When installing the thermally conductive substrate 5, the thermally conductive substrate 5 is inserted into the adapter frame 4. During insertion, the pressure rod 64 is squeezed. The pressure rod 64 is squeezed and pushes the piston 63 to move. The movement of the piston 63 will increase the pressure in the receiving cavity 61, thereby breaking open the sealing film 62. After the sealing film 62 is broken open, the sealant in the receiving cavity 61 will flow out and fill the gap between the semiconductor chip 3 and the thermally conductive substrate 5 in the adapter frame 4, thereby simplifying the packaging process and improving the packaging efficiency.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A power semiconductor device packaging structure, characterized in that, include: Encapsulation housing (1); Substrate (2), said substrate (2) is disposed at the inner bottom of the encapsulation housing (1); Semiconductor chip (3), said semiconductor chip (3) is disposed above substrate (2); A junction box (4) is disposed above the semiconductor chip (3); A thermally conductive substrate (5) is disposed above the adapter frame (4); A filling mechanism (6) is disposed within the adapter frame (4) and is used to fill thermally conductive adhesive between the semiconductor chip (3) and the thermally conductive substrate (5).

2. The power semiconductor device packaging structure according to claim 1, characterized in that, The filling mechanism (6) includes a plurality of receiving cavities (61), which are evenly opened on the adapter frame (4). The receiving cavity (61) is L-shaped. One end of the receiving cavity (61) is provided with a sealing film (62) and the other end is provided with a piston (63). A pressure rod (64) is fixed on the upper side wall of the piston (63), and the upper end of the pressure rod (64) extends to the top of the adapter frame (4).

3. The power semiconductor device packaging structure according to claim 2, characterized in that, The cavity (61) is provided with thermally conductive adhesive.

4. The power semiconductor device packaging structure according to claim 1, characterized in that, The thermally conductive substrate (5) is a ceramic substrate.

5. A power semiconductor device packaging structure according to claim 1, characterized in that, The upper surface of the thermally conductive substrate (5) is tightly attached to the packaging shell (1).

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