Processing equipment for semiconductor packaging

Abstract

The utility model discloses processing equipment for semiconductor packaging, which comprises a conveying frame, a conveying belt is arranged in the conveying frame, a first belt roller is arranged on one side in the conveying belt, a second belt roller is arranged on the other side in the conveying belt, and the first belt roller and the second belt roller are both rotatably connected with the conveying frame. A plurality of supporting rollers are arranged in the conveying belt along the position between the first belt roller and the second belt roller, the supporting rollers are rotationally connected with the conveying frame, positioning clamping plates are symmetrically arranged in the conveying frame along the front end and the rear end above the conveying belt, and a second lead screw box is arranged in the conveying belt. According to the wafer dispensing device, the capacity of facilitating continuous dispensing of wafers is achieved, practicability is improved, and therefore the problems that during wafer dispensing processing for semiconductor packaging, feeding and discharging need to be operated manually, and continuous dispensing work of the wafers is not convenient are solved.

Description

Technical Field

[0001] This utility model relates to the field of processing equipment technology, specifically to a semiconductor packaging processing equipment. Background Technology

[0002] Semiconductor packaging is a process in chip manufacturing that aims to transform tiny circuits on a wafer into functional devices with electrical connections, physical protection, and heat dissipation capabilities. The process includes wafer dicing, chip mounting, wire bonding, molding, and lead trimming. Among these, dispensing is a processing step for fixing the chip and affects the reliability, heat dissipation efficiency, and long-term stability of the package.

[0003] For example, the patent with publication number CN 219483214 U (a dispensing device for semiconductor packaging) includes a dispensing base, a gantry dispensing unit fixedly installed on the periphery of the dispensing base, a directional slide rail fixedly installed in the middle of the top of the dispensing base, a movable dispensing stage slidably connected in the middle of the directional slide rail, a suction cavity opened inside the movable dispensing stage, a card slot opened in the middle of the top of the movable dispensing stage, and a plurality of evenly distributed adsorption holes opened at the bottom of the inner wall of the card slot.

[0004] While the aforementioned existing technologies facilitate dispensing using air pressure adsorption on a moving dispensing stage, they require manual loading and unloading during semiconductor packaging wafer dispensing, making continuous wafer dispensing inconvenient and impractical. Therefore, there is an urgent market need to develop a semiconductor packaging processing equipment to help solve these existing problems. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor packaging processing equipment to solve the problem mentioned in the background art that manual loading and unloading is required during the wafer dispensing process for semiconductor packaging, which is inconvenient for continuous wafer dispensing and has poor practicality.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging processing equipment, including a conveyor frame, a conveyor belt inside the conveyor frame, a first roller inside the conveyor belt on one side, and a second roller inside the conveyor belt on the other side, both the first and second rollers being rotatably connected to the conveyor frame, a plurality of support rollers being arranged inside the conveyor belt between the first and second rollers, the support rollers being rotatably connected to the conveyor frame, and positioning clamps being symmetrically arranged inside the conveyor frame along the front and rear ends above the conveyor belt.

[0007] Preferably, the conveyor belt is provided with a screw box II, the front end and the rear end of the screw box II extend to the outside of the conveyor frame, a ball screw II is rotatably installed inside the screw box II, the threads at both ends of the outer side of the ball screw II are arranged in opposite directions, and sliding blocks II are symmetrically slidably installed at both ends of the outer side of the ball screw II.

[0008] Preferably, a transmission vertical plate is fixedly installed above the second sliding block, the upper end of the transmission vertical plate extends to the upper part of the second screw box, and a transmission horizontal plate is fixedly installed on the side of the transmission vertical plate facing the conveyor frame. One end of the transmission horizontal plate slides into the interior of the conveyor frame and is fixedly connected to the positioning clamp.

[0009] Preferably, a mounting frame is fixedly installed above the conveyor frame, a lead screw box is fixedly installed above the mounting frame, a transmission baffle is provided on one side of the lead screw box, a mounting platform is fixedly installed on one side of the transmission baffle, a mounting seat is provided below the mounting platform, a dotting head is fixedly installed below the mounting seat, and a vision camera is fixedly installed below the transmission baffle.

[0010] Preferably, an electric cylinder is fixedly installed above the mounting platform, and the push rod end of the electric cylinder slides through the mounting platform and is fixedly connected to the mounting base.

[0011] Preferably, a ball screw is rotatably mounted inside the screw box, a sliding block is slidably mounted on the outer side of the ball screw, and one end of the transmission baffle extends into the interior of the screw box and is fixedly connected to the sliding block.

[0012] Preferably, a stabilizing block is fixedly installed below the transmission baffle, a stabilizing rod is provided on one side of the screw box, the stabilizing rod slides through the stabilizing block, and a fixing plate seat is fixedly installed at both the front and rear ends of the stabilizing rod, the lower end of the fixing plate seat is fixedly connected to the mounting frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This utility model features a conveyor frame with an internal conveyor belt. The conveyor belt operates stably via a first belt roller, a second belt roller, and multiple support rollers. The first belt roller is equipped with a drive motor that automatically drives the conveyor belt. Simultaneously, positioning clamps are symmetrically arranged at the front and rear ends above the conveyor belt inside the conveyor frame to position the wafer trays. This design allows the wafer trays to be automatically transported by the conveyor belt without manual loading and unloading, enabling continuous dispensing of wafers, improving processing efficiency, and benefiting semiconductor packaging processes.

[0015] This utility model utilizes the linkage design of the ball screw and the sliding block to enable the positioning clamping plate to open and close synchronously, ensuring uniform and stable clamping force. The reverse threaded screw structure allows the clamping plates on both sides to move synchronously, avoiding wafer tray displacement caused by uneven force on one side, thus increasing practicality.

[0016] This utility model is achieved through Attached Figure Description

[0017] Figure 1 This is a front view of a semiconductor packaging processing device according to the present invention;

[0018] Figure 2 This is a cross-sectional view of a semiconductor packaging processing device according to the present invention;

[0019] Figure 3 This is a side sectional view of the screw box II of this utility model.

[0020] In the diagram: 1. Conveyor frame; 2. Conveyor belt; 3. Mounting frame; 4. Screw box one; 5. Transmission folding plate; 6. Mounting platform; 7. Electric cylinder; 8. Mounting seat; 9. Dispensing head; 10. Vision camera; 11. Fixed plate seat; 12. Stabilizer bar; 13. Stabilizer block; 14. Sliding block one; 15. Ball screw one; 16. Roller one; 17. Roller two; 18. Support roller; 19. Positioning clamp; 20. Screw box two; 21. Ball screw two; 22. Sliding block two; 23. Transmission vertical plate; 24. Transmission horizontal plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Please see Figure 1-3 An embodiment of this utility model provides a semiconductor packaging processing device, including a conveyor frame 1, a conveyor belt 2 inside the conveyor frame 1, a belt roller 16 on one side inside the conveyor belt 2, a drive motor for the belt roller 16 at the front end of the conveyor frame 1, a belt roller 17 on the other side inside the conveyor belt 2, both the belt roller 16 and the belt roller 17 being rotatably connected to the conveyor frame 1, a plurality of support rollers 18 being arranged inside the conveyor belt 2 between the belt roller 16 and the belt roller 17, the support rollers 18 being rotatably connected to the conveyor frame 1, and positioning clamps 19 being symmetrically arranged inside the conveyor frame 1 along the front and rear ends above the conveyor belt 2.

[0023] The conveyor belt 2, together with the drive motor and support roller group, realizes the continuous transport of wafers, while the symmetrically arranged positioning clamps 19 ensure the positioning of wafers during the dispensing process. This design not only eliminates the need for manual intervention, but also enables continuous production of dispensing operations and improves processing efficiency.

[0024] Furthermore, a screw box 20 is provided inside the conveyor belt 2. The front and rear ends of the screw box 20 extend to the outside of the conveyor frame 1. A ball screw 21 is rotatably installed inside the screw box 20. A drive motor for the ball screw 21 is provided at one end of the screw box 20. The threads at both ends of the outer side of the ball screw 21 are arranged in opposite directions. Sliding blocks 22 are symmetrically slidably installed at both ends of the outer side of the ball screw 21. A transmission vertical plate 23 is fixedly installed above the sliding blocks 22. The upper end of the transmission vertical plate 23 extends to the upper part of the screw box 20. A transmission horizontal plate 24 is fixedly installed on the side of the transmission vertical plate 23 facing the conveyor frame 1. One end of the transmission horizontal plate 24 slides into the interior of the conveyor frame 1 and is fixedly connected to the positioning clamp 19.

[0025] The rotation of the ball screw 21 drives the symmetrical movement of the sliding block 22, thereby enabling the transmission plate 24 to move the positioning clamp 19 closer or further away synchronously. This allows for flexible adjustment of the spacing between the positioning clamps 19 according to different sizes of wafer trays, improving the equipment's adaptability to wafer trays of different specifications. Furthermore, it eliminates the need for manual adjustment, further reducing human intervention and improving the level of production automation.

[0026] Furthermore, a mounting frame 3 is fixedly installed above the conveyor frame 1, a screw box 4 is fixedly installed above the mounting frame 3, a transmission baffle 5 is provided on one side of the screw box 4, a mounting platform 6 is fixedly installed on one side of the transmission baffle 5, a mounting seat 8 is provided below the mounting platform 6, a dispensing head 9 is fixedly installed below the mounting seat 8, the dispensing head 9 is connected to an external glue supply device through a pipe, a vision camera 10 is fixedly installed below the transmission baffle 5, the vision camera 10 is electrically connected to the vision inspection system of the control terminal of semiconductor packaging processing, an electric cylinder 7 is fixedly installed above the mounting platform 6, the push rod end of the electric cylinder 7 slides through the mounting platform 6 and is fixedly connected to the mounting seat 8, a ball screw 15 is rotatably installed inside the screw box 4, a drive motor for the ball screw 15 is provided at the rear end of the screw box 4, a sliding block 14 is slidably installed on the outside of the ball screw 15, and one end of the transmission baffle 5 extends into the interior of the screw box 4 and is fixedly connected to the sliding block 14.

[0027] The dispensing head 9 achieves two-dimensional movement through the ball screw 15 and the electric cylinder 7, ensuring the accuracy of the dispensing path. The vision camera monitors the wafer position in real time, which facilitates automatic correction of the dispensing coordinates, improves dispensing consistency, and enhances dispensing quality.

[0028] Furthermore, a stabilizing block 13 is fixedly installed below the transmission baffle 5, and a stabilizing rod 12 is provided on one side of the screw box 4. The stabilizing rod 12 slides through the stabilizing block 13. A fixing plate seat 11 is fixedly installed at both the front and rear ends of the stabilizing rod 12, and the lower end of the fixing plate seat 11 is fixedly connected to the mounting frame 3.

[0029] The cooperation between the stabilizer bar 12 and the stabilizer block 13 enhances the overall rigidity of the dispensing head moving mechanism, effectively reduces offset during high-speed movement, and ensures the reliability of the equipment in continuous production.

[0030] Working principle: During use, the wafer is transferred and dispensing is performed by placing it on the tray. The conveyor belt 2 is driven by the drive motor to rotate the roller group, so that the wafer tray is transported under the stable support of the support roller 18. When the wafer reaches the dispensing station, the reverse thread ball screw 21 is driven to make the positioning clamps 19 on both sides move synchronously to clamp and position the wafer tray. At the same time, the dispensing head 9 above the mounting frame 3 moves in two dimensions under the drive of the ball screw 15 and the electric cylinder 7 to perform dispensing, realizing the dispensing work of semiconductor packaging processing.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor packaging processing apparatus, comprising a conveyor (1), characterized in that: The conveyor frame (1) is equipped with a conveyor belt (2). A belt roller (16) is provided on one side of the conveyor belt (2), and a belt roller (17) is provided on the other side of the conveyor belt (2). Both the belt roller (16) and the belt roller (17) are rotatably connected to the conveyor frame (1). Multiple support rollers (18) are provided between the belt roller (16) and the belt roller (17) inside the conveyor belt (2). The support rollers (18) are rotatably connected to the conveyor frame (1). Positioning clamps (19) are symmetrically provided at the front and rear ends above the conveyor belt (2) inside the conveyor frame (1).

2. The semiconductor packaging processing equipment according to claim 1, characterized in that: The conveyor belt (2) is provided with a screw box (20) inside. The front end and rear end of the screw box (20) extend to the outside of the conveyor frame (1). A ball screw (21) is rotatably installed inside the screw box (20). The threads at both ends of the ball screw (21) are opposite. Sliding blocks (22) are symmetrically slidably installed at both ends of the ball screw (21).

3. The semiconductor packaging processing equipment according to claim 2, characterized in that: A transmission plate (23) is fixedly installed above the sliding block 2 (22). The upper end of the transmission plate (23) extends to the upper part of the screw box 2 (20). A transmission horizontal plate (24) is fixedly installed on the side of the transmission plate (23) facing the conveyor frame (1). One end of the transmission horizontal plate (24) slides into the interior of the conveyor frame (1) and is fixedly connected to the positioning clamp (19).

4. The semiconductor packaging processing equipment according to claim 1, characterized in that: A mounting frame (3) is fixedly installed above the conveyor frame (1). A screw box (4) is fixedly installed above the mounting frame (3). A transmission baffle (5) is provided on one side of the screw box (4). A mounting plate (6) is fixedly installed on one side of the transmission baffle (5). A mounting seat (8) is provided below the mounting plate (6). A dotted head (9) is fixedly installed below the mounting seat (8). A vision camera (10) is fixedly installed below the transmission baffle (5).

5. The semiconductor packaging processing equipment according to claim 4, characterized in that: An electric cylinder (7) is fixedly installed above the mounting plate (6). The push rod end of the electric cylinder (7) slides through the mounting plate (6) and is fixedly connected to the mounting seat (8).

6. The semiconductor packaging processing equipment according to claim 5, characterized in that: A ball screw (15) is rotatably mounted inside the screw box (4), and a sliding block (14) is slidably mounted on the outside of the ball screw (15). One end of the transmission baffle (5) extends into the interior of the screw box (4) and is fixedly connected to the sliding block (14).

7. The semiconductor packaging processing equipment according to claim 6, characterized in that: A stabilizing block (13) is fixedly installed below the transmission folding plate (5). A stabilizing rod (12) is provided on one side of the screw box (4). The stabilizing rod (12) slides through the stabilizing block (13). A fixing plate seat (11) is fixedly installed at both the front and rear ends of the stabilizing rod (12). The lower end of the fixing plate seat (11) is fixedly connected to the mounting frame (3).

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