Cushion pad for IC (integrated circuit) pressed glass substrate

Abstract

The utility model belongs to the technical field of cushions, and particularly relates to a cushion for an IC (integrated circuit) pressed glass substrate, which comprises a plurality of identical cushion blocks, two fixing blocks are fixedly mounted on two side surfaces of each cushion block, the inner wall of each fixing block is in threaded connection with a detaching screw, the outer surface of each detaching screw is in threaded connection with a screw cylinder, and the screw cylinder is in threaded connection with the fixing blocks. Two dismounting grooves are formed in the bottom surface of each cushion block, a double-sided sticky plate is fixedly mounted on the inner wall of each dismounting groove, the two side faces of each double-sided sticky plate are fixedly connected with the side face, close to the corresponding cushion block, of the corresponding fixing block, and a mounting base plate is fixedly mounted on the upper surface of each double-sided sticky plate; the conveying belt is arranged on the sides, close to each other, of the cushion blocks, the cushion blocks, the fixing blocks, the disassembling screw rods, the screw cylinders, the disassembling grooves, the double-face sticky plates, the mounting base plate, the conveying belt and the rotating plates are arranged, the cushion blocks are attached to the conveying belt, and the effect of independently disassembling the single cushion block can be achieved when the single cushion block is in a condition.

Description

Technical Field

[0001] This utility model belongs to the field of buffer pad technology, specifically relating to a buffer pad used for pressing ICs against glass substrates. Background Technology

[0002] Cushioning pads are functional components widely used in various fields. They are mainly used to absorb and disperse impact forces, reduce vibration, and protect the objects being cushioned. Cushioning pads absorb and disperse impact forces mainly through their own elastic deformation. When subjected to external impact, the cushioning pad will undergo deformations such as compression, bending, or twisting, converting the impact force into its own elastic potential energy, thereby reducing the impact force on the protected object. Pressing ICs onto glass substrates is a key step in the chip packaging process, which usually involves using anisotropic conductive adhesive films to connect IC chips to glass substrates through a thermo-pressing process.

[0003] During the process of pressing glass substrates into ICs, buffer pads are sometimes used on the conveyor belt for transport and processing. However, buffer pads may wear out or be damaged during use. Since the buffer pads are in full contact with the conveyor belt, they are inconvenient to replace. Even if a small area of ​​the buffer pad is damaged, it needs to be completely replaced, resulting in waste of the buffer pads.

[0004] To address the aforementioned issues, this application proposes a buffer pad for pressing an IC against a glass substrate. Utility Model Content

[0005] To address the aforementioned problems in the prior art, this utility model provides a buffer pad for pressing an IC onto a glass substrate, which features convenient replacement of the buffer block.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a buffer pad for pressing an IC onto a glass substrate, comprising several identical pads, each pad having two fixing blocks fixedly installed on both sides, each fixing block having a disassembly screw threadedly connected to its inner wall, each disassembly screw having a screw barrel threadedly connected to its outer surface, each pad having two disassembly grooves on its bottom surface, each disassembly groove having a double-sided adhesive plate fixedly installed on its inner wall, each double-sided adhesive plate having its two sides fixedly connected to the side of the fixing block closest to the pad, each double-sided adhesive plate having a mounting base fixedly installed on its upper surface, a conveyor belt being provided on the side of the several pads that are close to each other, each mounting base being fixedly installed on the conveyor belt, a rotating plate being fixedly installed on both sides of the conveyor belt, and the outer surface of each screw barrel being fixedly connected to the inner wall of the rotating plate.

[0007] As a preferred technical solution of the buffer pad for pressing glass substrates of ICs according to the present invention, the outer surface of the conveyor belt is provided with a number of identical positioning holes, and the bottom surface of each pad is fixedly installed with a number of identical positioning posts, and the outer surface of each positioning post is engaged with the inside of the positioning hole.

[0008] As a preferred technical solution of the buffer pad for pressing glass substrates of ICs according to the present invention, the inner ring of the conveyor belt is connected to two belt shafts, and a drive motor is fixedly installed on the right side of one of the belt shafts.

[0009] As a preferred technical solution of the buffer pad for pressing glass substrates of IC according to the present invention, two bearings are fixedly installed on the outer surface of each of the shafts, and a bracket is fixedly installed on the outer surface of each pair of bearings, wherein the upper surface of one of the brackets is fixedly connected to the bottom surface of the drive motor.

[0010] As a preferred technical solution of the buffer pad for pressing glass substrates of IC according to the present invention, each of the brackets is provided with a baffle inside, and a rotating shaft is fixedly installed on the inner wall of each baffle. The outer surface of each rotating shaft is rotatably connected to the inner wall of the bracket.

[0011] As a preferred technical solution of the buffer pad for pressing the glass substrate of IC according to the present invention, each of the two brackets has a mounting groove on one side that is close to each other, and a guide plate is fixedly installed on the inner side wall of each mounting groove.

[0012] As a preferred technical solution of the buffer pad for pressing the glass substrate of IC according to the present invention, each of the guide plates has an adjustment slider slidably connected to its outer surface, and the outer surface of each adjustment slider is in contact with the inner wall of the mounting groove.

[0013] As a preferred technical solution of the buffer pad for pressing the glass substrate of IC according to the present invention, the two adjustment sliders are fixedly installed on one side of each other, and an electric slide rail is slidably connected inside the electric slide rail. A visual detector is fixedly installed on the upper surface of the displacement slider.

[0014] Compared with the prior art, the beneficial effects of this utility model are: by setting up pads, fixing blocks, disassembly screws, screw cylinders, disassembly grooves, double-sided adhesive plates, mounting base plates, conveyor belts and rotating plates, and attaching them to the conveyor belt in the form of several pads, it can play the role of disassembling a single pad when a single buffer pad is in a condition, so as to achieve the purpose of easy replacement of pads without the need for overall disassembly, which is beneficial to save buffer pads when replacing them. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a cross-sectional view of the bracket in this utility model;

[0018] Figure 3 This is a schematic diagram of the electric slide rail in this utility model;

[0019] Figure 4 This is a cross-sectional view of the conveyor belt in this utility model;

[0020] Figure 5 This is a schematic diagram of the screw barrel structure in this utility model;

[0021] Figure 6 This is a schematic diagram of the disassembled structure of the pad block in this utility model;

[0022] In the diagram: 1. Pad; 2. Shaft; 3. Bearing; 4. Bracket; 5. Drive motor; 6. Mounting slot; 7. Baffle; 8. Rotating shaft; 9. Guide plate; 10. Adjustment slider; 11. Electric slide rail; 12. Displacement slider; 13. Vision detector; 14. Positioning hole; 15. Conveyor belt; 16. Rotating plate; 17. Screw; 18. Fixing block; 19. Removal screw; 20. Removal slot; 21. Positioning post; 22. Double-sided adhesive plate; 23. Mounting base plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0024] Please see Figure 1-6The present invention provides the following technical solution: a buffer pad for pressing glass substrates of ICs, comprising several identical pad blocks 1, two fixing blocks 18 fixedly installed on both sides of each pad block 1, a disassembly screw 19 threadedly connected to the inner wall of each fixing block 18, a screw cylinder 17 threadedly connected to the outer surface of each disassembly screw 19, two disassembly grooves 20 opened on the bottom surface of each pad block 1, a double-sided adhesive plate 22 fixedly installed on the inner wall of each disassembly groove 20, both sides of each double-sided adhesive plate 22 fixedly connected to the side of the fixing block 18 near the pad block 1, a mounting base plate 23 fixedly installed on the upper surface of each double-sided adhesive plate 22, a conveyor belt 15 is provided on the side of several pad blocks 1 that is close to each other, each mounting base plate 23 is fixedly installed on the conveyor belt 15, a rotating plate 16 is fixedly installed on both sides of the conveyor belt 15, and the outer surface of each screw cylinder 17 is fixedly connected to the inner wall of the rotating plate 16;

[0025] In this embodiment, the mounting base plate 23 and the rotating plate 16 are used to determine the installation position of each pad 1, so that the pads 1 will not affect each other and cause installation inconvenience. The rotating plate 16 rotates with the conveyor belt 15 to ensure that the pads 1 rotate with the conveyor belt 15 at the same time.

[0026] Specifically, the outer surface of the conveyor belt 15 is provided with several identical positioning holes 14, and several identical positioning posts 21 are fixedly installed on the bottom surface of each pad 1. The outer surface of each positioning post 21 is engaged with the inside of the positioning hole 14. In this embodiment, the pad 1 can be further positioned and installed through the positioning holes 14 and positioning posts 21, which is beneficial to the stability of the pad 1 during use.

[0027] Specifically, the inner ring of the conveyor belt 15 is connected to two belt shafts 2, and a drive motor 5 is fixedly installed on the right side of one of the belt shafts 2. In this embodiment, the belt shaft 2 and the drive motor 5 are used to drive the conveyor belt 15 to rotate.

[0028] Specifically, two bearings 3 are fixedly installed on the outer surface of each belt shaft 2, and a bracket 4 is fixedly installed on the outer surface of each pair of bearings 3. The upper surface of one of the brackets 4 is fixedly connected to the bottom surface of the drive motor 5. In this embodiment, the bracket 4 supports the belt shaft 2 and the drive motor 5 as a whole through the bearings 3 and the bracket 4. The bearings 3 play the role of supporting the stable rotation of the belt shaft 2.

[0029] Specifically, each bracket 4 is provided with a baffle 7 inside, and a rotating shaft 8 is fixedly installed on the inner wall of each baffle 7. The outer surface of each rotating shaft 8 is rotatably connected to the inner wall of the bracket 4. In this embodiment, through the baffle 7 and the rotating shaft 8, the baffle 7 is supported by the rotating shaft 8 to rotate, so that the baffle 7 can be opened to the top of the bracket 4. After the baffle 7 is opened, it is convenient to replace the pad 1.

[0030] Specifically, each of the two brackets 4 has a mounting groove 6 on one side that is close to each other. A guide plate 9 is fixedly installed on the inner side wall of each mounting groove 6. In this embodiment, the mounting groove 6 is used to install the guide plate 9, and the guide plate 9 provides linear movement guidance.

[0031] Specifically, each guide plate 9 has a sliding adjustment slider 10 connected to its outer surface. The outer surface of each adjustment slider 10 is in contact with the inner wall of the mounting groove 6. In this embodiment, the position is adjusted under the conveyor belt 15 by adjusting the adjustment slider 10, which requires manual adjustment.

[0032] Specifically, an electric slide rail 11 is fixedly installed on one side of the two adjustment sliders 10 that are close to each other. A displacement slider 12 is slidably connected inside the electric slide rail 11. A vision detector 13 is fixedly installed on the upper surface of the displacement slider 12. In this embodiment, the electric slide rail 11 drives the displacement slider 12 to move left and right through the electric slide rail 11, the displacement slider 12, and the vision detector 13 to detect wear or damage to the surface of the pad block 1. The vision detector 13 is usually equipped with a high-resolution camera, which compares and analyzes the extracted features with a pre-set standard or template, and determines whether the target object meets the requirements through an algorithm.

[0033] The working principle and usage process of this utility model are as follows: During use, the drive motor 5 is started, and the drive motor 5 drives the conveyor belt 15 to move through the belt shaft 2. The pad 1 moves with the conveyor belt 15, and glass substrates are transported on the pad 1. When the pad 1 moves below the conveyor belt 15, the vision detector 13 detects the pad 1. The detection position can be adjusted by adjusting the position of the adjusting slider 10 to change the front and back position, and by adjusting the left and right position through the electric slide rail 11 and the displacement slider 12. When the vision detector 13 detects that the pad 1 is damaged and needs to be replaced, the drive can be stopped. Motor 5 rotates baffle 7, opens baffle 7 upward, and then screws disassembly screw 19 into the screw barrel 17 by turning it, and disengages it from the fixing block 18. At this time, disassembly screw 19 does not fix pad 1, and pad 1 can be moved upward so that pad 1 and double-sided adhesive plate 22 are removed together, leaving only mounting base plate 23 on conveyor belt 15. When installing new pad 1, align mounting base plate 23 and insert positioning pin 21 into positioning hole 14 accordingly, and then screw disassembly screw 19 into fixing block 18 in the opposite direction to complete the reinstallation of pad 1.

[0034] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A buffer pad for pressing an IC onto a glass substrate, characterized in that: The system comprises several identical pads (1), each pad (1) having two fixing blocks (18) fixedly installed on both sides. Each fixing block (18) has a threaded connection to its inner wall with a disassembly screw (19), and each disassembly screw (19) has a threaded connection to its outer surface with a screw cylinder (17). Each pad (1) has two disassembly grooves (20) on its bottom surface, and each disassembly groove (20) has a double-sided adhesive plate (22) fixedly installed on its inner wall. Each double-sided adhesive plate (22) has two... Each side is fixedly connected to the side of the fixed block (18) near the pad (1). Each double-sided adhesive plate (22) has a mounting base plate (23) fixedly installed on its upper surface. Several pads (1) are provided with a conveyor belt (15) on their sides that are close to each other. Each mounting base plate (23) is fixedly installed on the conveyor belt (15). Both sides of the conveyor belt (15) are fixedly installed with a rotating plate (16). The outer surface of each screw barrel (17) is fixedly connected to the inner wall of the rotating plate (16).

2. A buffer pad for pressing an IC onto a glass substrate according to claim 1, characterized in that: The outer surface of the conveyor belt (15) is provided with several identical positioning holes (14), and several identical positioning posts (21) are fixedly installed on the bottom surface of each pad (1). The outer surface of each positioning post (21) is engaged with the inside of the positioning hole (14).

3. A buffer pad for pressing an IC onto a glass substrate according to claim 1, characterized in that: The inner ring of the conveyor belt (15) is connected to two belt shafts (2), and a drive motor (5) is fixedly installed on the right side of one of the belt shafts (2).

4. A buffer pad for pressing an IC onto a glass substrate according to claim 3, characterized in that: Two bearings (3) are fixedly installed on the outer surface of each of the two bearings (3), and a bracket (4) is fixedly installed on the outer surface of each of the two bearings (3), with the upper surface of one of the brackets (4) being fixedly connected to the bottom surface of the drive motor (5).

5. A buffer pad for pressing an IC onto a glass substrate according to claim 4, characterized in that: Each of the brackets (4) is provided with a baffle (7) inside, and a rotating shaft (8) is fixedly installed on the inner wall of each baffle (7). The outer surface of each rotating shaft (8) is rotatably connected to the inner wall of the bracket (4).

6. A buffer pad for pressing an IC onto a glass substrate according to claim 4, characterized in that: The two brackets (4) are provided with mounting grooves (6) on their sides that are close to each other, and a guide plate (9) is fixedly installed on the inner side wall of each mounting groove (6).

7. A buffer pad for pressing an IC onto a glass substrate according to claim 6, characterized in that: Each of the guide plates (9) has an adjustment slider (10) slidably connected to its outer surface, and the outer surface of each adjustment slider (10) is in contact with the inner wall of the mounting groove (6).

8. A buffer pad for pressing an IC onto a glass substrate according to claim 7, characterized in that: Two adjustment sliders (10) are fixedly mounted on one side of each other with an electric slide rail (11). A displacement slider (12) is slidably connected inside the electric slide rail (11). A visual detector (13) is fixedly mounted on the upper surface of the displacement slider (12).

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