Multi-sensor integrated device and boiler state online monitoring system

Abstract

The utility model relates to the technical field of intelligent monitoring, and discloses a multi-sensor integrated device and a boiler state online monitoring system, and the device comprises a modular housing, a temperature collection module, a vibration collection module, a pressure collection module, and a controller. The modular shell is mounted at a key part of the boiler, and the key part is a joint of a hearth, a superheater, a reheater, an economizer or a pipeline; the temperature acquisition module, the vibration acquisition module and the pressure acquisition module are arranged on the inner wall of the modular shell; the controller is electrically connected with the temperature acquisition module, the vibration acquisition module and the pressure acquisition module. Through the design that temperature, vibration and pressure data acquisition is integrated on the modular device and the modular shell, the modular device can be quickly deployed at key parts of the boiler, and effective fusion of actual measurement data and simulation data is facilitated so as to realize accurate acquisition of boiler data.

Description

Technical Field

[0001] This application relates to the field of intelligent monitoring, and in particular to a multi-sensor integrated device and an online boiler status monitoring system. Background Technology

[0002] In the context of current industrial intelligent and digital transformation, boilers, as core equipment in many industrial production processes, require real-time and accurate monitoring of their operating status for ensuring production safety, improving energy efficiency, and reducing operation and maintenance costs. However, existing online boiler status monitoring systems have revealed insufficient rapid deployment capabilities when facing complex and ever-changing industrial environments, particularly in the effective integration of simulation technology and measured data to achieve accurate data acquisition, where significant technical bottlenecks exist.

[0003] Traditional monitoring systems often rely on fixed hardware installations and complex wiring projects. This not only prolongs the system deployment cycle and increases upfront investment costs, but also limits the flexible adjustment and expansion of monitoring points. More importantly, these systems tend to focus on single-dimensional measured data during data acquisition, lacking in-depth interaction with simulation models, making it difficult to comprehensively and accurately reflect the true operating status of the boiler. Utility Model Content

[0004] The purpose of this application is to provide a multi-sensor integrated device and a boiler condition online monitoring system, which aims to solve the technical problem that existing boiler condition online monitoring systems cannot be quickly deployed to key parts of the boiler to accurately collect simulation and measured data.

[0005] To achieve the above objectives, this application proposes a multi-sensor integrated device, which includes: a modular housing, a temperature acquisition module, a vibration acquisition module, a pressure acquisition module, and a controller;

[0006] The modular outer shell is used for installation in key parts of the boiler, such as the furnace, superheater, reheater, economizer, or pipe connections.

[0007] The temperature acquisition module, the vibration acquisition module, and the pressure acquisition module are all installed on the inner wall of the modular housing, and are used to collect temperature data, vibration data, and pressure data of the key parts, respectively.

[0008] The controller is electrically connected to the temperature acquisition module, the vibration acquisition module, and the pressure acquisition module, respectively, and is used to receive the temperature data, the vibration data, and the pressure data.

[0009] In one embodiment, the modular housing includes a removable mounting plate;

[0010] The mounting plate is provided with mounting holes for fixing to the critical parts.

[0011] In one embodiment, the temperature acquisition module includes: at least one temperature sensor;

[0012] The temperature sensor is connected to the controller;

[0013] The temperature sensor is used to collect temperature data from the key components.

[0014] In one embodiment, the vibration acquisition module includes: a vibration sensor;

[0015] The vibration sensor is connected to the controller;

[0016] The vibration sensor is used to collect vibration data from the key components.

[0017] In one embodiment, the pressure acquisition module includes: a pressure sensor;

[0018] The pressure sensor is connected to the controller;

[0019] The pressure sensor is used to measure the pressure data of the critical parts.

[0020] In one embodiment, the controller includes: a data amplification unit, a data filtering unit, and a data conversion unit;

[0021] The data amplification unit is connected to the data filtering unit; the data filtering unit is connected to the data conversion unit;

[0022] The data amplification unit is used to amplify the temperature data, the vibration data, and the pressure data.

[0023] The data filtering unit is used to filter the amplified temperature data, vibration data, and pressure data.

[0024] The data conversion unit is used to perform analog-to-digital conversion on the filtered temperature data, vibration data, and pressure data, and generate the converted temperature data, vibration data, and pressure data respectively.

[0025] In one embodiment, the controller is further configured to receive temperature data, pressure data, and vibration data from the simulation test, fuse the temperature data, pressure data, and vibration data from the simulation test with the converted temperature data, vibration data, and pressure data, and store the generated fused data.

[0026] In one embodiment, the multi-sensor integration device further includes: a communication module;

[0027] The communication module is disposed on the inner wall of the modular housing, and the communication module is connected to the controller and the external detection terminal;

[0028] The communication module is used to transmit the fused data to an external monitoring terminal.

[0029] In one embodiment, an isolation layer is provided inside the modular housing to isolate the temperature acquisition module, the vibration acquisition module, the pressure acquisition module, and the controller.

[0030] In addition, to achieve the above objectives, this application also proposes an online boiler status monitoring system, which includes the multi-sensor integrated device described above.

[0031] This application proposes a multi-sensor integrated device, comprising: a modular housing, a temperature acquisition module, a vibration acquisition module, a pressure acquisition module, and a controller. The modular housing is used for installation in key parts of the boiler, such as the furnace, superheater, reheater, economizer, or pipe connections. The temperature, vibration, and pressure acquisition modules are all disposed on the inner wall of the modular housing and are used to acquire temperature, vibration, and pressure data from the key parts, respectively. The controller is electrically connected to the temperature, vibration, and pressure acquisition modules and is used to receive the temperature, vibration, and pressure data. By integrating the acquisition of temperature, vibration, and pressure data into a single modular device, this device can accurately acquire measured data. The modular housing design allows for rapid deployment in key boiler parts, facilitating the effective fusion of measured and simulated data for accurate boiler data acquisition. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the modules of the first embodiment of the multi-sensor integrated device proposed in this application;

[0033] Figure 2 This is a schematic diagram of the modules of the second embodiment of the multi-sensor integrated device proposed in this application;

[0034] Figure 3 This is a schematic diagram of the modules of the third embodiment of the multi-sensor integrated device proposed in this application.

[0035] Explanation of icon numbers:

[0036] label name label name 100 Modular shell 110 Mounting plate 200 Temperature acquisition module 210 Temperature sensor 300 Vibration acquisition module 310 Vibration sensor 400 Pressure acquisition module 410 pressure sensor 500 controller 510 Data amplification unit 600 Communication module 520 Data filtering unit 700 isolation layer 530 Data conversion unit Detailed Implementation

[0037] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0040] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0041] Reference Figure 1 , Figure 1 This is a schematic diagram of the modules of the first embodiment of the multi-sensor integrated device proposed in this application. Figure 1 The first embodiment of the multi-sensor integrated device of this application is presented.

[0042] The multi-sensor integrated device includes: a modular housing 100, a temperature acquisition module 200, a vibration acquisition module 300, a pressure acquisition module 400, and a controller 500;

[0043] The modular housing 100 is used to install in key parts of the boiler, such as the furnace, superheater, reheater, economizer, or pipe connections.

[0044] It should be noted that the modular housing 100 is designed for installation in critical parts of the boiler. These critical parts include the furnace, superheater, reheater, economizer, or piping connections. Installing the housing in these locations allows the device to directly collect data from these vital parts of the boiler, providing an accurate location basis for monitoring the boiler's operating status.

[0045] It should be understood that the modular housing 100, as the external structure of the entire device, serves to protect the internal sensor modules, while also providing an integrated installation space for the temperature acquisition module 200, vibration acquisition module 300, and pressure acquisition module 400, ensuring that these modules can operate stably in the harsh environment of the boiler.

[0046] The temperature acquisition module 200, the vibration acquisition module 300, and the pressure acquisition module 400 are all disposed on the inner wall of the modular housing 100, and are used to acquire temperature data, vibration data, and pressure data of the key parts respectively.

[0047] It should be noted that the temperature acquisition module 200 is located on the inner wall of the modular housing 100. This location allows it to directly contact the environment of critical parts of the boiler, thus enabling accurate temperature data acquisition. The temperature acquisition module 200 is specifically designed to collect temperature data from critical boiler components (such as the furnace and superheater). This temperature data is crucial for monitoring the boiler's operating status. For example, excessively high furnace temperatures may indicate abnormal combustion efficiency or potential safety hazards, while superheater temperature data can reflect factors such as heat exchange efficiency.

[0048] It should be understood that the vibration acquisition module 300 is also installed on the inner wall of the modular housing 100, close to the critical parts of the boiler. This allows for effective sensing of vibrations generated in these critical parts. Its function is to collect vibration data from these critical parts. During boiler operation, vibrations in certain components may indicate equipment malfunctions or abnormalities. For example, abnormal vibrations at pipe connections may be due to loose connections or abnormal internal fluid flow. By collecting vibration data, these potential problems can be detected in a timely manner.

[0049] It should be noted that the pressure acquisition module 400 is located on the inner wall of the modular outer shell 100, allowing direct contact with the environmental pressure conditions of critical components. It is responsible for collecting pressure data from key parts of the boiler. During boiler operation, the pressure at different locations is a crucial operating parameter. For example, pressure changes in the economizer can reflect the water flow status, and the pressures of the superheater and reheater are closely related to steam generation and transmission. Abnormal pressure data may indicate equipment malfunctions or low operating efficiency.

[0050] The controller 500 is electrically connected to the temperature acquisition module 200, the vibration acquisition module 300 and the pressure acquisition module 400 respectively, and is used to receive the temperature data, the vibration data and the pressure data.

[0051] It should be understood that the controller 500 is electrically connected to the temperature acquisition module 200, vibration acquisition module 300, and pressure acquisition module 400, respectively. This connection method ensures that the controller 500 can receive data from each sensor module in a timely manner. Its main function is to receive temperature data, vibration data, and pressure data. The controller 500 can perform preliminary processing, analysis, or storage of this data, and determine whether the boiler's operating status is normal based on preset conditions. For example, if the temperature exceeds a certain threshold, or the vibration amplitude exceeds the normal range, or the pressure fluctuates abnormally, the controller 500 can issue an alarm or take corresponding measures to ensure the safe and stable operation of the boiler.

[0052] In this embodiment, the multi-sensor integrated device includes: a modular housing 100, a temperature acquisition module 200, a vibration acquisition module 300, a pressure acquisition module 400, and a controller 500. The modular housing 100 is used to install in key parts of the boiler, such as the furnace, superheater, reheater, economizer, or pipe connections. The temperature acquisition module 200, the vibration acquisition module 300, and the pressure acquisition module 400 are all disposed on the inner wall of the modular housing 100, and are used to acquire temperature data, vibration data, and pressure data of the key parts, respectively. The controller 500 is electrically connected to the temperature acquisition module 200, the vibration acquisition module 300, and the pressure acquisition module 400, and is used to receive the temperature data, the vibration data, and the pressure data. By integrating the acquisition of temperature, vibration, and pressure data into a modular device, this modular device can accurately acquire measured data. The design of the modular housing 100 allows this modular device to be quickly deployed in key parts of the boiler, which is beneficial for the effective fusion of measured data and simulation data to achieve accurate boiler data acquisition.

[0053] Reference Figure 2 , Figure 2 This is a schematic diagram of the modules of the second embodiment of the multi-sensor integration device proposed in this application. Based on the first embodiment of the multi-sensor integration device described above, a second embodiment of the multi-sensor integration device of this application is proposed.

[0054] The modular housing 100 includes a removable mounting plate 110.

[0055] It should be noted that the removability of the mounting plate 110 provides great flexibility. During equipment installation, maintenance, or upgrades, the mounting plate 110 can be easily removed. For example, if critical components need to be inspected, it is not necessary to disassemble the entire housing; only the mounting plate 110 needs to be removed, which greatly saves time and labor costs. This design facilitates interaction with critical internal components. As part of the housing, it plays a vital role in connecting the housing to critical components, while its removable nature makes operation more convenient.

[0056] The mounting plate 110 is provided with mounting holes for fixing to the critical parts.

[0057] It should be understood that the mounting holes are designed to securely fasten the mounting plate 110 to the critical components. Using appropriate fasteners (such as screws), a tight connection between the mounting plate 110 and the critical components can be ensured, allowing the entire modular housing 100 to stably cover and protect the critical components. The position and size of the mounting holes need to be precisely designed. Their position must match the corresponding connection points on the critical components to ensure accurate installation. Regarding dimensions, they must be determined based on the specifications of the fasteners used, ensuring that the fasteners can pass smoothly through the mounting holes while also ensuring appropriate tolerances between the fasteners and the mounting holes to prevent loosening after installation.

[0058] The temperature acquisition module 200 includes at least one temperature sensor 210.

[0059] It should be noted that the temperature acquisition module 200 includes at least one temperature sensor 210. This means that the number of temperature sensors 210 can be flexibly configured according to actual needs. For example, if the temperature of multiple key components needs to be collected, multiple temperature sensors 210 may be set up; if only one key component needs to be monitored, one temperature sensor 210 is sufficient. The main function of the temperature sensor 210 is to collect temperature data of the key component. It can sense the temperature of the key component and convert this temperature information into an electrical signal or digital signal that can be recognized by the controller 500.

[0060] The temperature sensor 210 is connected to the controller 500.

[0061] It should be understood that the temperature sensor 210 is connected to the controller 500. This connection is for data transmission. The temperature data collected by the temperature sensor 210 needs to be transmitted to the controller 500 for further processing, such as analysis, storage, or triggering corresponding control actions. This connection ensures that temperature data can accurately reach the controller 500 from the temperature sensor 210. The controller 500 can make decisions based on the received temperature data; for example, when the temperature exceeds a certain set threshold, the controller 500 can take measures such as issuing an alarm or adjusting the operating status of relevant equipment.

[0062] Used to collect temperature data of the key components.

[0063] It's important to note that collecting temperature data from critical components is crucial for many systems. In industrial production, the temperature of critical components can affect equipment efficiency, safety, and lifespan. For example, in an engine, excessively high temperatures in critical components can damage parts; collecting temperature data allows for timely detection of anomalies and the implementation of preventative measures. In electronic devices, the temperature of certain critical chips also needs to be monitored to ensure the proper functioning of the equipment.

[0064] The vibration acquisition module 300 includes a vibration sensor 310.

[0065] It should be understood that the vibration sensor 310 is the fundamental component of the entire vibration acquisition module 300. Its main function is to sense the vibration of critical components, converting the physical vibration phenomenon into measurable and processable electrical signals or other forms of signals (depending on the type of sensor; for example, a piezoelectric sensor converts the pressure generated by vibration into an electrical signal). It is placed at or near the critical components where vibration monitoring is needed. For example, in a mechanical system, if engine vibration needs to be monitored, the vibration sensor 310 would be installed near the engine casing or a critical internal support structure to accurately capture the vibration data generated during engine operation.

[0066] The vibration sensor 310 is connected to the controller 500.

[0067] It should be noted that the vibration sensor 310 is connected to the controller 500. This connection ensures that the signals collected by the sensor can be transmitted to the controller 500. The connection method can be wired, such as transmitting analog or digital signals via cable; or wireless, such as using wireless communication protocols like Bluetooth or ZigBee to transmit data, depending on the specific application scenario and data transmission requirements. The sensor and controller 500 work together. The sensor is responsible for data acquisition, while the controller 500 is responsible for further processing, analysis, and decision-making on the acquired data. For example, the controller 500 can determine whether the operating status of key components is normal and whether there are potential faults based on the received vibration data.

[0068] The vibration sensor 310 is used to collect vibration data of the key parts.

[0069] It should be understood that collecting vibration data from key components allows for the monitoring of the health status of equipment or systems. Abnormal vibrations are often early warning signs of equipment failure; for example, wear, loosening, or imbalance of mechanical parts can all lead to changes in vibration characteristics. By analyzing vibration data, these potential faults can be detected in a timely manner, allowing for appropriate maintenance measures to prevent further damage to the equipment. Vibration data can also be used to optimize the performance of equipment or systems. For example, in the development of automotive engines, by collecting and analyzing vibration data under different operating conditions, engine design parameters, such as cylinder arrangement and crankshaft balance, can be adjusted to reduce vibration levels and improve engine efficiency and ride comfort.

[0070] The pressure acquisition module 400 includes a pressure sensor 410.

[0071] It should be noted that the pressure sensor 410 is a key component in the pressure acquisition module 400. Its main function is to measure pressure data at critical locations. It acts like a sophisticated "pressure detector," capable of sensing information such as the magnitude of pressure exerted on critical locations. For example, in some strain gauge-based pressure sensors 410, when pressure is applied to a critical location, the strain gauge inside the sensor deforms. This deformation causes a change in resistance, and according to electrical principles, the magnitude of the pressure can be calculated by measuring this change in resistance. Different types of pressure sensors 410 may be based on different physical principles; for example, a capacitive pressure sensor 410 measures pressure by changing the distance between capacitor plates due to pressure, thereby changing the capacitance value.

[0072] The pressure sensor 410 is connected to the controller 500.

[0073] It should be understood that the pressure sensor 410 is connected to the controller 500, and the importance of this connection lies in its ability to transmit the pressure data measured by the pressure sensor 410 to the controller 500. This connection can be imagined as a "data pipeline," through which pressure data continuously flows from the sensor to the controller 500. This connection enables the entire system to work collaboratively. The controller 500 can further analyze, process, or make corresponding decisions based on the pressure data received from the pressure sensor 410. For example, if the pressure data exceeds a certain set threshold, the controller 500 can trigger an alarm device or adjust the operating parameters of relevant equipment.

[0074] The pressure sensor 410 is used to measure the pressure data of the critical parts.

[0075] It should be noted that the main function of the pressure acquisition module 400 in the system is to accurately measure the pressure of critical components. Pressure data is accurately acquired through the pressure sensor 410 and transmitted to the controller 500, thereby enabling monitoring of the pressure status of critical components. This helps ensure that critical components operate within a safe pressure range, preventing equipment damage, performance degradation, or safety accidents caused by abnormal pressure.

[0076] In this embodiment, the temperature sensor 210, vibration sensor 310, and pressure sensor 410 are integrated into a modular device, enabling this modular device to accurately collect measured temperature data, vibration data, and pressure data respectively. The modular housing 100 design allows this modular device to be quickly deployed in key locations such as the boiler furnace, superheater, reheater, economizer, or pipe connections, facilitating the effective fusion of measured and simulated data for accurate boiler data acquisition.

[0077] Reference Figure 3 , Figure 3 This is a schematic diagram of the modules of the third embodiment of the multi-sensor integration device proposed in this application. Based on the first and second embodiments of the multi-sensor integration device described above, the third embodiment of the multi-sensor integration device of this application is proposed.

[0078] The controller 500 includes: a data amplification unit 510, a data filtering unit 520, and a data conversion unit 530;

[0079] The data amplification unit 510 is connected to the data filtering unit 520; the data filtering unit 520 is connected to the data conversion unit 530.

[0080] It should be understood that the controller 500 consists of a data amplification unit 510, a data filtering unit 520, and a data conversion unit 530. The data amplification unit 510 is connected to the data filtering unit 520, allowing data processed by the data amplification unit 510 to be successfully transmitted to the data filtering unit 520. The data filtering unit 520 is connected to the data conversion unit 530, so that the filtered data is passed to the data conversion unit 530 for further processing. These three units work collaboratively in processing temperature, vibration, and pressure data. The data first enters the data amplification unit 510 for amplification, then is sent to the data filtering unit 520 for filtering, and finally, the data conversion unit 530 performs analog-to-digital conversion to generate the converted temperature, vibration, and pressure data.

[0081] The data amplification unit 510 is used to amplify the temperature data, the vibration data, and the pressure data.

[0082] It should be noted that the data amplification unit 510 is responsible for amplifying the temperature, vibration, and pressure data. In many practical applications, the temperature, vibration, and pressure data collected by sensors may have weak signal strength. For example, some high-precision temperature sensors 210 may output weak voltage signals, and the electrical signals corresponding to the minute vibrations detected by the vibration sensor 310 are also very weak, as are those of the pressure sensor 410. Through the amplification processing of the data amplification unit 510, these weak signals can be enhanced to a level that subsequent processing units can effectively process.

[0083] The data filtering unit 520 is used to filter the amplified temperature data, vibration data, and pressure data.

[0084] It should be understood that the data filtering unit 520 filters the temperature, vibration, and pressure data after they have been amplified by the data amplification unit 510. In real-world environments, the acquired data is often subject to various interferences. For example, interference from surrounding electromagnetic fields may introduce noise into the temperature, vibration, and pressure data signals. The function of the data filtering unit 520 is to remove this noise, making the data cleaner and more reflective of the actual temperature, vibration, and pressure conditions.

[0085] The data conversion unit 530 is used to perform analog-to-digital conversion on the filtered temperature data, vibration data, and pressure data, and generate the converted temperature data, vibration data, and pressure data respectively.

[0086] It should be noted that the data conversion unit 530 performs analog-to-digital conversion on the filtered temperature, vibration, and pressure data. In modern control systems, analog signals acquired by sensors (such as electrical signals corresponding to temperature, vibration, and pressure) need to be converted into digital signals before they can be processed by a computer or digital control system. The data conversion unit 530 completes this important conversion process, ultimately generating the converted temperature, vibration, and pressure data, respectively. This digital data can be easily analyzed, stored, and used for control operations in subsequent digital systems.

[0087] The controller 500 is also used to receive temperature data, pressure data and vibration data from the simulation test, fuse the temperature data, pressure data and vibration data from the simulation test with the converted temperature data, vibration data and pressure data, and store the generated fused data.

[0088] It should be understood that the controller 500 has the function of receiving simulation test data. This simulation test data includes temperature data, pressure data, and vibration data. These data are obtained in a simulation test environment and reflect the relevant physical quantities of the system under simulated conditions. The controller 500 will fuse the received simulation test data with the converted temperature, vibration, and pressure data. The "converted data" mentioned here may be data that has undergone some processing (such as unit conversion, format conversion, etc.). The purpose of data fusion may be to integrate data from different sources to obtain more comprehensive and accurate information about the system state. During the fusion process, factors such as the weight and accuracy of different data need to be considered. For example, if the simulation test data has higher accuracy, it may be given a larger weight during fusion.

[0089] The multi-sensor integration device also includes: a communication module 600;

[0090] The communication module 600 is disposed on the inner wall of the modular housing 100, and the communication module 600 is connected to the controller 500 and the external detection terminal.

[0091] It should be understood that the communication module 600, located on the inner wall, is physically protected by the outer casing, reducing direct damage from the external environment, such as from impacts, dust, and moisture. Its proximity to the controller 500 and other internal components facilitates wiring connections. When connected to the controller 500, it reduces wiring length and complexity, and minimizes interference and signal loss during transmission.

[0092] It should be noted that the connection between the communication module 600 and the controller 500 enables the communication module 600 to acquire the fused data processed by the controller 500. The controller 500 plays a central role in data processing and coordination within the multi-sensor integrated device, and the connection between the communication module 600 and it ensures the acquisition of accurate fused data. This connection enables information exchange between the internal and external systems of the device. External detection terminals may be devices used for further analysis, display, or storage of the fused data; the communication module 600 transmits the fused data to them, allowing the external devices to perform various operations using this data.

[0093] The communication module 600 is used to transmit the fused data to an external monitoring terminal.

[0094] It should be understood that the purpose of data collection and processing by multi-sensor integrated devices is often not limited to internal use; transmitting the fused data to an external monitoring terminal can enable broader applications. For example, the external monitoring terminal might be a computer system in a monitoring center, which, by receiving the fused data, can perform comprehensive analysis and monitoring of the entire monitoring area; or it might be a data storage device used to permanently store this fused data for subsequent analysis. During transmission, the communication module 600 needs to ensure the accuracy and integrity of the fused data. This may involve employing appropriate communication protocols, such as those with error correction capabilities, to prevent errors or loss of information during transmission.

[0095] The modular housing 100 has an isolation layer 700 inside, which is used to isolate the temperature acquisition module 200, the vibration acquisition module 300, the pressure acquisition module 400 and the controller 500.

[0096] It should be noted that the temperature acquisition module 200, vibration acquisition module 300, pressure acquisition module 400, and controller 500 may each have different operating principles, sensitivities, and operational requirements. The isolation layer 700 prevents mutual interference between them. For example, the temperature acquisition module 200 may be affected by the vibration of the vibration acquisition module 300, leading to inaccurate temperature readings; or minute pressure changes generated by the pressure acquisition module 400 may interfere with the normal operation of the controller 500. The isolation layer 700 acts as a barrier, ensuring that each module can operate in a relatively independent and stable environment.

[0097] It should be understood that, from a safety perspective, if a module malfunctions, such as a short circuit causing overheating in the temperature acquisition module 200 or a pressure leak in the pressure acquisition module 400, the isolation layer 700 can prevent these problems from spreading to other modules, avoiding wider damage. This is especially important for the controller 500, as it is typically the core of the entire system, and the isolation layer 700 effectively protects it from damage caused by malfunctions in other modules.

[0098] It should be noted that in electronic devices, different modules may generate electromagnetic radiation or have varying sensitivities to electromagnetic interference during operation. The isolation layer 700 helps improve the electromagnetic compatibility of the entire system. For example, the vibration acquisition module 300 may generate electromagnetic interference due to its internal electronic components and circuit structure. The isolation layer 700 can reduce the impact of this interference on other components such as the temperature acquisition module 200 and the controller 500, ensuring that the electromagnetic performance of each module meets requirements and enabling the entire system to operate stably.

[0099] In this embodiment, the temperature sensor 210, vibration sensor 310, and pressure sensor 410 are integrated into a modular device, enabling this modular device to accurately collect measured temperature data, vibration data, and pressure data respectively. The modular housing 100 design allows for rapid deployment in key areas such as the boiler furnace, superheater, reheater, economizer, or pipe connections, facilitating the effective fusion of measured and simulated data for accurate boiler data acquisition. A communication module 600 is also integrated to transmit the fused data to an external monitoring terminal for long-term storage and subsequent analysis. Isolation layers 700 are provided between the modules to ensure each module operates in a relatively independent and stable environment.

[0100] Furthermore, this application also proposes an online boiler condition monitoring system, which includes the multi-sensor integrated device described above. Since the online boiler condition monitoring system employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0101] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0102] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A multi-sensor integrated device, characterized in that, The multi-sensor integrated device includes: a modular housing, a temperature acquisition module, a vibration acquisition module, a pressure acquisition module, and a controller; The modular outer shell is used for installation in key parts of the boiler, such as the furnace, superheater, reheater, economizer, or pipe connections. The temperature acquisition module, the vibration acquisition module, and the pressure acquisition module are all installed on the inner wall of the modular housing, and are used to collect temperature data, vibration data, and pressure data of the key parts, respectively. The controller is electrically connected to the temperature acquisition module, the vibration acquisition module, and the pressure acquisition module, respectively, and is used to receive the temperature data, the vibration data, and the pressure data.

2. The multi-sensor integrated device as described in claim 1, characterized in that, The modular housing includes: a removable mounting plate; The mounting plate is provided with mounting holes for fixing to the critical parts.

3. The multi-sensor integrated device as described in claim 1, characterized in that, The temperature acquisition module includes: at least one temperature sensor; The temperature sensor is connected to the controller; The temperature sensor is used to collect temperature data from the key components.

4. The multi-sensor integrated device as described in claim 1, characterized in that, The vibration acquisition module includes: a vibration sensor; The vibration sensor is connected to the controller; The vibration sensor is used to collect vibration data from the key components.

5. The multi-sensor integrated device as described in claim 1, characterized in that, The pressure acquisition module includes: a pressure sensor; The pressure sensor is connected to the controller; The pressure sensor is used to measure the pressure data of the critical parts.

6. The multi-sensor integrated device as described in claim 1, characterized in that, The controller includes: a data amplification unit, a data filtering unit, and a data conversion unit; The data amplification unit is connected to the data filtering unit; the data filtering unit is connected to the data conversion unit; The data amplification unit is used to amplify the temperature data, the vibration data, and the pressure data. The data filtering unit is used to filter the amplified temperature data, vibration data, and pressure data. The data conversion unit is used to perform analog-to-digital conversion on the filtered temperature data, vibration data, and pressure data, and generate the converted temperature data, vibration data, and pressure data respectively.

7. The multi-sensor integrated device as described in claim 6, characterized in that, The controller is also used to receive temperature data, pressure data and vibration data from the simulation test, fuse the temperature data, pressure data and vibration data from the simulation test with the converted temperature data, vibration data and pressure data, and store the generated fused data.

8. The multi-sensor integrated device as described in claim 7, characterized in that, The multi-sensor integrated device further includes: a communication module; The communication module is disposed on the inner wall of the modular housing, and the communication module is connected to the controller and the external detection terminal; The communication module is used to transmit the fused data to an external monitoring terminal.

9. The multi-sensor integrated device as described in claim 1, characterized in that, The modular housing has an internal isolation layer for isolating the temperature acquisition module, the vibration acquisition module, the pressure acquisition module, and the controller.

10. A boiler status online monitoring system, characterized in that, The boiler status online monitoring system includes a multi-sensor integrated device as described in any one of claims 1 to 9.

Images