Temperature and pressure sensor

Abstract

The utility model relates to the technical field of sensors, and particularly discloses a temperature and pressure sensor, which comprises a shell provided with a first mounting cavity and a second mounting cavity communicated with the first mounting cavity, the circuit board assembly is connected with one end of the connector in a buckled mode, and one end of the connector partially extends into the first installation cavity so that the circuit board assembly can be arranged in the first installation cavity in a sealed mode; the temperature sensing assembly is arranged in the second mounting cavity, one end of the temperature sensing assembly is electrically connected with the circuit board assembly, the other end of the temperature sensing assembly extends out of the second mounting cavity, the temperature sensing assembly comprises a sheath with a containing cavity and a temperature sensing element support partially arranged in the containing cavity, and a thermistor is arranged at one end of the temperature sensing element support and located in the containing cavity; according to the temperature and pressure sensor, the temperature response time is effectively shortened, and meanwhile, the temperature and pressure sensor can be applied to more different medium measurement scenes.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a temperature and pressure sensor. Background Technology

[0002] Temperature and pressure sensors are two important components in industrial control systems. To facilitate installation and measurement, integrated temperature and pressure sensors are now available that can simultaneously measure the pressure and temperature signals of a medium. In particular, the demand for integrated temperature and pressure sensors is increasing in the automotive industry.

[0003] However, existing integrated temperature and pressure sensors typically have two design approaches for the temperature measurement component: one is to directly place the thermistor in the medium for measurement, and the other is to insulate the thermistor with a thermally conductive material and place it in the medium for measurement. The first design has very limited applicability, for example, it cannot measure acidic, alkaline, or oily media. The second design has a long temperature response time during measurement, making it difficult to obtain the medium temperature in a timely manner. Utility Model Content

[0004] This application aims to solve the problem of excessively long temperature response time in related technologies using temperature and pressure sensors. Therefore, this utility model proposes a temperature and pressure sensor.

[0005] To achieve the above objectives, embodiments of this application provide a temperature and pressure sensor, comprising:

[0006] A housing having a first mounting cavity and a second mounting cavity communicating with the first mounting cavity;

[0007] A connector and a circuit board assembly snapped together at one end of the connector, wherein one end of the connector extends into the first mounting cavity to enclose the circuit board assembly within the first mounting cavity.

[0008] A temperature sensing component is disposed in the second mounting cavity. One end of the temperature sensing component is electrically connected to the circuit board assembly, and the other end extends outside the second mounting cavity. The temperature sensing component includes a sheath with a receiving cavity and a temperature sensing element bracket partially disposed in the receiving cavity. A thermistor is disposed at one end of the temperature sensing element bracket. The thermistor is located in the receiving cavity, wherein the receiving cavity is filled with thermally conductive silicone grease that surrounds the thermistor.

[0009] In some embodiments, the receiving cavity has an opening at one end and a closed temperature sensing area at the other end. The thermistor is disposed in the temperature sensing area and is filled with thermally conductive silicone grease within the temperature sensing area.

[0010] In some embodiments, the sheath is provided with a riveting protrusion near the side wall of the opening end, and the component bracket is provided with a slot on its side surface, and the riveting protrusion is riveted to the slot.

[0011] In some embodiments, the component support is provided with a sheath sealing ring on the side surface between the slot and the thermistor, and the outer contour of the sheath sealing ring fits against the inner wall of the receiving cavity.

[0012] In some embodiments, the circuit board assembly includes a support and a circuit board embedded in the support, wherein a pressure-sensitive element is disposed on the surface of the circuit board near the temperature-sensing component.

[0013] In some embodiments, the support has a through hole on the side away from the circuit board, and an inner sealing ring is provided in the through hole. The pressure-sensitive element is exposed in the second mounting cavity through the through hole.

[0014] In some embodiments, the temperature sensing element bracket has a flow guide hole on the side away from the sheath. One end of the flow guide hole is connected to the area where the pressure sensing element is located, and the other end is connected to a flow guide groove arranged axially on the surface of the sheath. The flow guide groove and the flow guide hole are used to guide the medium to the pressure sensing element to achieve pressure measurement.

[0015] In some embodiments, a riveting flange is provided at the opening of the first mounting cavity, a protrusion is provided on the outer surface of the connector, the riveting flange is riveted to the protrusion, and a sealant is applied to the riveting connection.

[0016] In some embodiments, the housing is provided with a threaded section near the outer surface of the second mounting cavity.

[0017] In some embodiments, an outer sealing ring is fitted onto the surface of the housing near the threaded section.

[0018] Compared with the prior art, the technical solutions provided by the above embodiments of this application have at least the following beneficial effects:

[0019] The temperature and pressure sensor provided in this application, through the setting of the temperature sensing component, includes a sheath, a temperature sensing element support, and a thermistor set at one end of the temperature sensing element support. The sheath can be made of a metal material with good thermal conductivity. The thermistor is located in the temperature sensing area of ​​the closed end of the receiving cavity set in the sheath, and the temperature sensing area is filled with thermally conductive silicone grease that surrounds the thermistor. In this way, by thinning the sidewalls of the sheath and filling the space between the thermistor and the inner wall of the sheath with thermally conductive silicone grease with better thermal conductivity, the temperature response time can be effectively shortened during the sensor measurement process. At the same time, the sheath setting achieves isolation between the thermistor and the measuring medium, enabling the sensor to be applied to more different medium measurement scenarios.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is an exploded schematic diagram of a temperature and pressure sensor according to an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the structure of a temperature and pressure sensor according to an embodiment of this application;

[0024] Figure 3 It is based on Figure 2 A cross-sectional view along the AA direction;

[0025] Figure 4 This is a schematic diagram of a circuit board assembly from a first-view perspective according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of a circuit board assembly from a second perspective according to an embodiment of this application;

[0027] Figure 6 This is another cross-sectional view of a temperature and pressure sensor according to an embodiment of this application;

[0028] Figure 7 This is an exploded view of a temperature-sensing component according to an embodiment of this application;

[0029] Figure 8 This is a cross-sectional view of the sheath according to an embodiment of this application;

[0030] Figure 9 This is a cross-sectional view of a temperature-sensing component according to an embodiment of this application.

[0031] Figure label:

[0032] 10. Temperature and pressure sensor;

[0033] 100. Housing; 110. First mounting cavity; 111. Riveting flange; 120. Second receiving cavity; 130. Threaded section; 140. Outer sealing ring; 150. Sealant;

[0034] 200. Circuit board assembly; 210. Support; 211. Receiving groove; 212. Snap-fit; 213. Through hole; 214. Inner sealing ring; 220. Circuit board; 221. Pressure sensitive element; 222. Temperature sensitive element;

[0035] 300. Connector; 310. Connecting cavity; 320. Protrusion; 330. Snap-fit ​​hole;

[0036] 400. Temperature sensing component; 410. Sheath; 411. Receiving cavity; 4111. Temperature sensing area; 412. Riveting protrusion; 413. Flow guide groove; 420. Temperature sensing element bracket; 421. Sheath sealing ring; 422. Slot; 423. Flow guide hole; 430. Thermistor; 440. Thermal grease. Detailed Implementation

[0037] The embodiments of this application are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. It should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. "Multiple" means at least two, that is, two or more; "multiple" means at least two, that is, two or more.

[0039] In this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0042] Please see Figure 1 This embodiment provides a temperature and pressure sensor 10, which includes a housing 100, a connector 300, a circuit board assembly 200, and a temperature sensing component 400. The housing 100 has a mounting cavity communicating with both end faces. The circuit board assembly 200 is snap-fitted to one end face of the connector 300. Simultaneously, the end portion of the connector 300 connected to the circuit board assembly 200 extends into the mounting cavity to enclose the circuit board assembly 200 within the mounting cavity. The temperature sensing component 400 extends from the other end of the housing 100 into the mounting cavity. Furthermore, the extension end of the temperature sensing component 400 is electrically connected to the circuit board assembly 200. The housing 100 facilitates the connection and fixation of the connector 300, the circuit board assembly 200, and the temperature sensing component 400, while effectively protecting the circuit board assembly 200. The connector 300 facilitates the installation and connection of the temperature and pressure sensor 10 to external devices. The temperature sensing component 400 can shorten the temperature response time of the temperature and pressure sensor 10 during measurement, and at the same time, enable the temperature and pressure sensor 10 to be applied to more different media measurement scenarios.

[0043] Please see Figure 2 and Figure 3 The housing 100 has a first mounting cavity 110 and a second mounting cavity 120 communicating with the first mounting cavity 110. The first mounting cavity 110 and the second mounting cavity 120 are arranged along the axial direction of the housing 100 and extend through the entire housing 100 along the axial direction. At the same time, the outer contour of the housing 100 body projected along the central axis at the location of the first mounting cavity 110 can be larger than the outer contour of the housing 100 body projected along the central axis at the location of the second mounting cavity 120. That is, the outer contour of the housing is stepped along the central axis. With this arrangement, the housing 100 serves as a connection and housing for the sensor in the middle, and at the same time, it further protects the structural stability of the connection.

[0044] Optionally, the volume of the first mounting cavity 110 and the second mounting cavity 120 can be selectively designed according to the structure of the connector 300, the circuit board assembly 200 and the temperature sensing assembly 400. A nut structure is provided on the outer contour surface of the housing 100 corresponding to the first mounting cavity 110, and a threaded section 130 is provided on the outer contour surface of the housing 100 corresponding to the second mounting cavity 120. An outer sealing ring 140 is provided at the root of the threaded section 130 on the outer contour surface of the housing 100. In this way, the nut structure and the threaded section 130 facilitate the installation, fixing and disassembly of the temperature and pressure sensor 10, and the outer sealing ring 140 improves the sealing performance at the connection between the temperature and pressure sensor 10 and the external equipment.

[0045] In some embodiments, the connector 300 and the circuit board assembly 200 snap-fitted to one end of the connector 300 are included. One end of the connector 300 extends into the first mounting cavity 110 to enclose the circuit board assembly 200 within the first mounting cavity 110. The connector 300 includes a socket cavity 310 at one end for connecting to an external device. The structure of the socket cavity 310 can be selectively designed according to different usage scenarios or environments. Preferably, rib protrusions for positioning and guiding functions can be provided on the inner wall of the outer cavity of the connector or on the side surface of the connector. At the same time, protrusions or snap-fits can be provided on the side surface of the connector to cooperate with corresponding slots of the device to be connected, thereby fixing the connector. Conductive pins for electrical connection can be provided in the socket cavity 310. Of course, the structure of the socket cavity 310 can refer to existing sensor connector designs and is not limited here.

[0046] Optionally, a protrusion 320 and a snap-fit ​​hole 330 are provided on the surface of the connector 300 away from the insertion cavity 310. The protrusion 320 can be provided on the side wall and extend along the vertical axis. The snap-fit ​​hole 330 can be opened on the end face of the connector 300. A riveting flange 111 is provided at the opening of the first mounting cavity 110. The riveting flange 111 is riveted to the protrusion 320. A sealant 150 is applied to the riveting connection. The sealant 150 can be an environmental sealant, such as RTV adhesive. This ensures the sealing of the connection between the connector and the housing, preventing external water and dirt from entering the housing cavity, thereby further protecting the circuit board assembly 200. At the same time, the snap-fit ​​hole 330 is provided for snap-fit ​​connection with the circuit board assembly 200. This setting facilitates the assembly of the connector 300 and the circuit board assembly 200 and ensures the stability of the connection between the connector 300 and the circuit board assembly 200.

[0047] Please see Figure 4 and Figure 5The circuit board assembly 200 includes a support 210 and a circuit board 220 embedded in the support 210. For example, a receiving groove 211 is formed on one surface of the support 210 to accommodate the circuit board 220. Buckles 212 are provided on the surfaces of the support 210 near the receiving groove 211. These buckles 212 cooperate with snap-fit ​​holes 330 to achieve a snap-fit ​​connection between the circuit board assembly 200 and the connector 300. A through hole 213 is formed on the side of the support 210 away from the circuit board 220, extending from the receiving groove 211 to the bottom surface of the support 210. An inner sealing ring 214 is provided within the through hole 213. A pressure-sensitive element 221 is exposed in the second mounting cavity 120 through the through hole 213.

[0048] Thus, by setting the support 210, on the one hand, the electrical connection between the circuit board assembly 200 and the connector 300 and / or the temperature sensing component 400 is ensured, and on the other hand, the circuit board 220 is further effectively protected. At the same time, by setting the inner sealing ring 214 in the through hole 213, the medium can be effectively prevented from entering the area between the circuit board assembly 200 and the connector 300 during pressure testing of different media.

[0049] In some embodiments, the circuit board 220 is a ceramic circuit board. A pressure-sensitive element 221 is provided on the surface of the circuit board 220 near the temperature-sensing component 400, and a temperature-sensitive element 222 is provided on the other surface. The circuit board 220 is used to process the measured pressure and temperature data. It should be noted that the circuit board 220 can be selectively obtained from the market according to actual needs. The specific functional implementation and other structures of the circuit board 220 will not be described in detail here.

[0050] Please see Figures 6 to 9A temperature sensing component 400 is disposed in the second mounting cavity 120. One end of the temperature sensing component 400 is electrically connected to the circuit board assembly 200, and the other end extends outside the second mounting cavity 120. The temperature sensing component 400 includes a sheath 410 having a receiving cavity 411 and a temperature sensing element bracket 420 partially disposed within the receiving cavity 411. A thermistor 430 is disposed at one end of the temperature sensing element bracket 420 and is located within the receiving cavity 411. The receiving cavity 411 is filled with thermally conductive silicone grease 440 that surrounds the thermistor 430. Thus, through the arrangement of the temperature sensing component 400, the temperature sensing component 400 includes the sheath 410, the temperature sensing element, and the temperature sensing element. The temperature sensor 10 includes a support bracket 420 and a thermistor 430 disposed at one end of the temperature sensing element support bracket 420. The sheath 410 can be made of a metal material with good thermal conductivity, such as 304 stainless steel. At the same time, the sidewalls of the sheath 410 can be thinned. By filling the space between the thermistor 430 and the inner wall of the sheath 410 with thermally conductive silicone grease 440, which has better thermal conductivity, the temperature response time is effectively shortened during the measurement process of the temperature and pressure sensor 10. In addition, the sheath 410 realizes the encapsulation and isolation of the thermistor 430 from the measuring medium, so that the temperature and pressure sensor 10 can be used in most media measurements, thus improving the applicability of the temperature and pressure sensor 10.

[0051] In some embodiments, the receiving cavity 411 has an opening at one end and a closed temperature sensing area 4111 at the other end. The diameter of the receiving cavity 411 decreases intermittently from the opening end to the closed end. The temperature sensing element bracket 420 is inserted into the receiving cavity 411 from the opening end and riveted together. At this time, the thermistor 430 extends and is disposed in the closed temperature sensing area 4111. The diameter of the temperature sensing area 4111 is relatively smaller. Thus, on the one hand, less thermal grease 440 can be used to fill the temperature sensing area 4111. On the other hand, the distance between the thermistor 430 and the outer medium of the sheath 410 is reduced, ensuring the temperature response speed of the NTC (thermistor).

[0052] Optionally, the sheath 410 has a riveting protrusion 412 on the side wall near the opening end, and the component support 420 has a slot 422 on its side surface. The riveting protrusion 412 is riveted to the slot 422. A sheath sealing ring 421 is provided on the side surface of the component support 420 between the slot 422 and the thermistor 430. The outer contour of the sheath sealing ring 421 fits against the inner wall of the receiving cavity 411. The thermistor 430 is wrapped by the metal sheath and does not directly contact the measuring medium, thus isolating the thermistor 430 from the measuring medium. The sheath 410 and the temperature sensing element support are reliably fixed by compression and limiting. The internal O-ring sheath sealing ring 421 ensures the airtightness and prevents the medium from entering the sheath and contacting the thermistor 430.

[0053] Optional, combined Figure 9The temperature sensing element bracket 420 has a flow guide hole 423 on the side away from the sheath 410. One end of the flow guide hole 423 is connected to the area where the pressure sensing element 221 is located, and the other end is connected to the flow guide groove 413 arranged axially on the surface of the sheath 410. Specifically, the flow guide groove 413 and the side wall of the second receiving cavity 120 form a flow channel connected to the flow guide hole 423. Furthermore, the other end of the flow guide groove 413 is connected to the outside through an opening. In this way, the flow channel formed by the medium is used to guide the medium to the pressure sensing element 221 to achieve pressure measurement.

[0054] It should be noted that, in combination Figure 3 and Figure 9 For the second receiving cavity 120, multiple stepped portions or protrusions that fit with the outer surface of the temperature sensing component 400 can be provided on its inner sidewall. Specifically, a stepped portion that fits completely with the surface of the temperature sensing component 400 can be provided on the inner sidewall at the bottom of the second receiving cavity 120. At the same time, a corresponding flow channel hole is reserved at the position corresponding to the flow guide groove 413, so as to facilitate the limiting and fixing of the temperature sensing component 400 after installation.

[0055] In some embodiments, a manufacturing process for the temperature and pressure sensor 10 described above is provided. Exemplarily, this manufacturing process may include the following steps:

[0056] S1: The thermistor 430 (NTC) is resistively soldered to one end of the temperature sensing element bracket 420;

[0057] S2: Place the sheath sealing ring 421 onto the circumferential surface of the temperature sensing element bracket 420;

[0058] S3: Fill the bottom of the metal sheath 410 with thermal grease 440;

[0059] S4: Assemble the temperature sensing element bracket 420 assembled in S2 into the metal sheath 410, and assemble the thermistor 430 into the bottom of the metal sheath 410, immersing it in the thermal grease 440.

[0060] S5: The assembled temperature module is pressed with four riveting protrusions 412 on the outside of the metal sheath 410 using an extrusion tool, so that the temperature sensing element bracket 420 is fixed to the metal sheath 410, thus completing the assembly of the entire temperature module.

[0061] Assembly section:

[0062] S6: Place the inner sealing ring 214 into the support 210;

[0063] S7: Place the calibrated ceramic circuit board 220 into the support 210;

[0064] S8: After aligning the connector 300 with the support 210, fasten them together using the assembly bayonet.

[0065] S9: Assemble the temperature module assembled in step S5 into the inside of the housing 100, and limit its position by the slot on the temperature module and the groove on the housing 100.

[0066] S10: Assemble the pressure module assembled in process S8 into the internal position of housing 100 and press it down to the bottom of housing;

[0067] S11: Rivet the assembled components together with riveting equipment / tooling to secure the 100mm edge of the housing;

[0068] S12: Apply 150 g of sealant (environmental sealant) to the rivet joint.

[0069] S13: Finally, install the external sealing ring 5 at the root of the product thread to complete the production of the temperature and pressure sensor 10.

[0070] It is understandable that the temperature and pressure sensor 10 prepared by the above process can effectively shorten the temperature response time during the sensor measurement process. At the same time, the sheath 410 realizes the isolation between the thermistor 430 and the measurement medium, so that the temperature and pressure sensor 10 can be applied to more different medium measurement scenarios.

[0071] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the utility model.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0073] Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The reference to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily indicate the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0074] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A temperature and pressure sensor, characterized in that, include: A housing having a first mounting cavity and a second mounting cavity communicating with the first mounting cavity; A connector and a circuit board assembly snapped together at one end of the connector, wherein one end of the connector extends into the first mounting cavity to enclose the circuit board assembly within the first mounting cavity. A temperature sensing component is disposed in the second mounting cavity. One end of the temperature sensing component is electrically connected to the circuit board assembly, and the other end extends outside the second mounting cavity. The temperature sensing component includes a sheath with a receiving cavity and a temperature sensing element bracket partially disposed in the receiving cavity. A thermistor is disposed at one end of the temperature sensing element bracket. The thermistor is located in the receiving cavity, wherein the receiving cavity is filled with thermally conductive silicone grease that surrounds the thermistor.

2. A temperature and pressure sensor according to claim 1, characterized in that, The cavity has an opening at one end and a closed temperature sensing area at the other end. The thermistor is located in the temperature sensing area and is filled with thermal grease.

3. A temperature and pressure sensor according to claim 2, characterized in that, The sheath has a riveting protrusion on the side wall near the opening end, and the component bracket has a slot on its side surface. The riveting protrusion is riveted to the slot.

4. A temperature and pressure sensor according to claim 3, characterized in that, The component support has a sheath sealing ring on its side surface between the slot and the thermistor, and the outer contour of the sheath sealing ring fits against the inner wall of the receiving cavity.

5. A temperature and pressure sensor according to claim 1, characterized in that, The circuit board assembly includes a support and a circuit board embedded in the support, and a pressure-sensitive element is provided on the surface of the circuit board near the temperature sensing component.

6. A temperature and pressure sensor according to claim 5, characterized in that, The support has a through hole on the side away from the circuit board, and an inner sealing ring is provided in the through hole. The pressure sensitive element is exposed in the second mounting cavity through the through hole.

7. A temperature and pressure sensor according to claim 5, characterized in that, The temperature sensing element bracket has a flow guide hole on the side away from the sheath. One end of the flow guide hole is connected to the area where the pressure sensing element is located, and the other end is connected to the flow guide groove arranged axially on the surface of the sheath. The flow guide groove and the flow guide hole are used to guide the medium to the pressure sensing element to realize pressure measurement.

8. A temperature and pressure sensor according to claim 1, characterized in that, The first mounting cavity opening is provided with a riveting flange, the outer surface of the connector is provided with a protrusion, the riveting flange is riveted to the protrusion, and a sealant is applied to the riveting connection.

9. A temperature and pressure sensor according to claim 1, characterized in that, The housing has a threaded section on its outer surface near the second mounting cavity.

10. A temperature and pressure sensor according to claim 9, characterized in that, An outer sealing ring is fitted onto the surface of the housing near the threaded section.

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