Double-layer flexible circuit board

Abstract

The utility model relates to the field of circuit boards, in particular to a double-layer flexible circuit board, which comprises a soft board, a first bias connection board, a second bias connection board, a main connection board and a hard board, one end of the soft board is connected with the main connection board, branch parts of two side ends of the main connection board are connected with the first bias connection board and the second bias connection board, and the other end of the soft board is connected with the hard board. According to the design, the electronic equipment can bear millions of times of dynamic bending without damaging the wires of the inner core material layer, and the electronic equipment is more reliable and durable in a complex environment.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, specifically to a double-layer flexible circuit board. Background Technology

[0002] Printed circuit boards (PCBs) are indispensable components in the electronics industry. Manufactured using electronic printing technology, they are primarily used to connect and fix electronic components and serve as carriers for electrical connections. A Chinese patent (authorization announcement number CN 218183622 U) discloses a double-layer flexible circuit board. This patent technology features a first flexible circuit board with several molded groove-shaped circuit boards. These groove-shaped circuit boards are directly molded onto the first flexible circuit board using a molding process. The lower end of each groove-shaped circuit board passes through an insulating layer and is fixedly connected to a second flexible circuit board, ensuring contact and conductivity between the two boards. This eliminates the need for through-holes, resulting in higher production efficiency. However, the connection at the grooves in this design is relatively thin, posing a risk of breakage due to prolonged bending. Therefore, those skilled in the art have developed a double-layer flexible circuit board to address the problems mentioned in the background section. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a double-layer flexible circuit board, including a flexible board, a first offset board, a second offset board, a main offset board, and a rigid board. The main offset board is connected and installed at one end of the flexible board, the first offset board and the second offset board are connected and installed at the two ends of the main offset board, and the rigid board is connected and installed at the other end of the flexible board.

[0004] Preferably, the flexible board includes a core layer, an inner PI layer No. 1 is installed on the upper sidewall of the core layer, and an inner PI layer No. 2 is installed on the lower sidewall of the core layer.

[0005] Preferably: an inner adhesive is installed on the upper side of the first inner PI layer, an inner adhesive is installed on the lower side of the second inner PI layer, a copper layer is installed on the upper side of the first inner adhesive, and a copper layer is installed on the lower side of the second inner adhesive.

[0006] Preferably: an outer adhesive is installed on the upper side of the first copper layer, an outer adhesive is installed on the lower side of the second copper layer, an outer PI layer is installed on the upper side of the first outer adhesive, and an outer PI layer is installed on the lower side of the second outer adhesive.

[0007] The technical effects and advantages of this utility model are as follows:

[0008] 1. This design enables it to withstand millions of dynamic bends without damaging the internal core layer conductors, making electronic devices more reliable and durable in complex environments;

[0009] 2. The main connector board is installed at one end of the flexible board, and the first and second offset connector boards are installed at the two ends of the main connector board. With three connector boards, multiple external devices can be connected to realize data transmission and control functions, and ensure smooth communication between external devices and the motherboard. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of a double-layer flexible circuit board provided in an embodiment of this application;

[0011] Figure 2 This is a schematic diagram of the cross-sectional structure of a double-layer flexible circuit board provided in an embodiment of this application;

[0012] Figure 3 This application provides an embodiment of a double-layer flexible circuit board. Figure 2 An enlarged schematic diagram of the A structure.

[0013] In the diagram: 1. Flexible board; 2. Offset board 1; 3. Offset board 2; 4. Main board; 5. Rigid board; 101. Core layer; 102. Inner PI layer 1; 103. Inner PI layer 2; 104. Inner adhesive layer 1; 105. Inner adhesive layer 2; 106. Copper layer 1; 107. Copper layer 2; 108. Outer adhesive layer 1; 109. Outer adhesive layer 2; 110. Outer PI layer 1; 111. Outer PI layer 2. Detailed Implementation

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0015] Example

[0016] Please see Figures 1-3 In this embodiment, a double-layer flexible circuit board is provided, including a flexible board 1, a first offset board 2, a second offset board 3, a main board 4 and a rigid board 5. The main board 4 is connected and installed at one end of the flexible board 1, and the first offset board 2 and the second offset board 3 are connected and installed at the two ends of the main board 4. The rigid board 5 is connected and installed at the other end of the flexible board 1.

[0017] Specifically, the flexible board 1 includes a core material layer 101, an inner PI layer 102 installed on the upper side wall of the core material layer 101, and a second inner PI layer 103 installed on the lower side wall of the core material layer 101.

[0018] Inner PI layer 102 is fitted with inner adhesive 104 on top; inner PI layer 103 is fitted with inner adhesive 105 on bottom; copper layer 106 is fitted with inner adhesive 104 on top; copper layer 107 is fitted with inner adhesive 105 on bottom; outer adhesive 108 is fitted with outer adhesive 108 on top; outer adhesive 109 is fitted with outer adhesive 109 on bottom; outer PI layer 110 is fitted with outer adhesive 108 on top; and outer PI layer 111 is fitted with outer adhesive 109 on bottom.

[0019] The working principle of this utility model is as follows:

[0020] A double-layer flexible circuit board is used, with a main connector board 4 connected to one end of the flexible board 1. Offset board 2 and offset board 3 are connected to the two ends of the main connector board 4. By providing three connector boards, multiple external devices can be connected to realize data transmission and control functions, ensuring smooth communication between external devices and the motherboard. This design enables it to withstand millions of dynamic bends without damaging the internal core layer 101 conductors. This design makes electronic devices more reliable and durable in complex environments.

[0021] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A double-layer flexible circuit board, characterized in that, It includes a flexible board (1), a first offset plate (2), a second offset plate (3), a main plate (4), and a rigid board (5). One end of the flexible board (1) is connected to the main plate (4), and the first offset plate (2) and the second offset plate (3) are connected to the two ends of the main plate (4). The other end of the flexible board (1) is connected to the rigid board (5).

2. The double-layer flexible circuit board according to claim 1, characterized in that, The flexible board (1) includes a core material layer (101), and an inner PI layer (102) is installed on the upper side wall of the core material layer (101).

3. A double-layer flexible circuit board according to claim 2, characterized in that, The second inner PI layer (103) is installed on the lower side wall of the core material layer (101).

4. A double-layer flexible circuit board according to claim 2, characterized in that, The first inner PI layer (102) is installed with the first inner adhesive (104) on the upper side, and the second inner PI layer (103) is installed with the second inner adhesive (105) on the lower side.

5. A double-layer flexible circuit board according to claim 4, characterized in that, A first copper layer (106) is installed on the upper side of the first inner adhesive (104), and a second copper layer (107) is installed on the lower side of the second inner adhesive (105).

6. A double-layer flexible circuit board according to claim 5, characterized in that, The first copper layer (106) is fitted with the first external adhesive (108), and the second copper layer (107) is fitted with the second external adhesive (109).

7. A double-layer flexible circuit board according to claim 6, characterized in that, The first outer adhesive (108) is fitted with a first outer PI layer (110) on its upper side, and the second outer adhesive (109) is fitted with a second outer PI layer (111) on its lower side.

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