Heat dissipation structure for PCB and adapter

Abstract

The utility model relates to the technical field of adapters, and provides a heat dissipation structure for a PCB (Printed Circuit Board) and an adapter, a primary side heat dissipation piece is fixed on the primary side of the PCB, a secondary side heat dissipation piece is fixed on the secondary side of the PCB, and the primary side heat dissipation piece and the secondary side heat dissipation piece are arranged at an interval; the second heat dissipation piece covers the primary side heat dissipation piece and the secondary side heat dissipation piece in the thickness direction of the PCB; the first insulating part A is clamped between the primary side heat dissipation part and the PCB, and the first insulating part B is clamped between the secondary side heat dissipation part and the PCB; the second insulating layer is clamped between the second heat dissipation piece and the first heat dissipation assembly. Therefore, the primary side and the secondary side of the PCB are respectively and independently cooled, and mutual conduction of heat generated by the primary side and heat generated by the secondary side is avoided. The heat of the primary side heat dissipation piece and the heat of the secondary side heat dissipation piece can be transmitted to the second heat dissipation piece, the heat dissipation area of the second heat dissipation piece is relatively large, the heat dissipation efficiency can be further improved, and the shielding effect can be enhanced.

Description

Technical Field

[0001] This utility model relates to the field of adapter technology, and in particular to a heat dissipation structure and adapter for PCB boards. Background Technology

[0002] High-power adapters typically refer to power conversion devices with an output power of no less than 100W, and are widely used in fast charging, data centers, industrial equipment, electric vehicle charging, server power supplies, and other fields. Compared to ordinary adapters, their thermal management design is a challenge.

[0003] The PCB board of an adapter generally includes a primary side and a secondary side. The primary side and the secondary side are two key parts of isolated power conversion. Generally, the primary side is the high voltage side and the secondary side is the low voltage side. Since there is a relatively large difference in the voltage values ​​of the two, there is also a large temperature difference in the heat generated. During heat dissipation, the heat generated by the primary side and the heat generated by the secondary side can easily conduct to each other, resulting in local temperature rise superposition and aggravating the problem of thermal stress.

[0004] Therefore, there is an urgent need for a heat dissipation structure and adapter for PCB boards to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure and adapter for PCB boards, which can dissipate heat from the primary and secondary sides of the PCB board separately and independently, avoiding the mutual conduction of heat generated by the primary and secondary sides and enhancing the shielding effect.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A heat dissipation structure for a PCB board, the PCB board including a primary side and a secondary side, the heat dissipation structure including:

[0008] The first heat dissipation component includes a primary heat dissipation component and a secondary heat dissipation component. The primary heat dissipation component is fixed to the primary edge of the PCB board, and the secondary heat dissipation component is fixed to the secondary edge of the PCB board. The primary heat dissipation component and the secondary heat dissipation component are spaced apart.

[0009] The second heat sink covers the primary heat sink and the secondary heat sink in the thickness direction of the PCB board.

[0010] The first insulating layer includes a first insulating component A and a first insulating component B, wherein the first insulating component A is sandwiched between the primary heat sink and the PCB board, and the first insulating component B is sandwiched between the secondary heat sink and the PCB board.

[0011] The second insulating layer is sandwiched between the second heat sink and the first heat sink assembly.

[0012] As a preferred technical solution of the above-mentioned heat dissipation structure for PCB board, the first heat dissipation component and / or the second heat dissipation component are metal components.

[0013] As a preferred technical solution of the above-mentioned heat dissipation structure for PCB board, the primary heat dissipation component and / or the secondary heat dissipation component are fixed to the PCB board by welding.

[0014] As a preferred technical solution of the heat dissipation structure for the PCB board, in the thickness direction of the PCB board, one side of the first insulating member A is fixed to the original heat dissipation member by adhesive, and the other side is fixed to the PCB board by adhesive.

[0015] And / or, in the thickness direction of the PCB board, one side of the first insulating member B is fixed to the secondary heat sink by adhesive, and the other side is fixed to the PCB board by adhesive.

[0016] As a preferred technical solution of the heat dissipation structure for the PCB board, in the thickness direction of the PCB board, one side of the second insulating layer is fixed to the first heat dissipation component by adhesive, and the other side is fixed to the second heat dissipation component by adhesive.

[0017] As a preferred technical solution of the above-mentioned heat dissipation structure for PCB board, the primary side heat dissipation component includes a primary side main heat dissipation part and a primary side secondary heat dissipation part. The primary side main heat dissipation part and the primary side secondary heat dissipation part are fixedly connected. The primary side main heat dissipation part abuts against the PCB board in the thickness direction of the PCB board, and the primary side secondary heat dissipation part abuts against the PCB board in the direction perpendicular to the thickness direction of the PCB board.

[0018] As a preferred technical solution of the above-mentioned heat dissipation structure for PCB board, the primary side heat dissipation part includes primary side heat dissipation part A and primary side heat dissipation part B, the PCB board includes a first peripheral sidewall and a second peripheral sidewall, the first peripheral sidewall and the second peripheral sidewall intersect, the primary side heat dissipation part A can abut against the first peripheral sidewall, and the primary side heat dissipation part B can abut against the second peripheral sidewall.

[0019] As a preferred technical solution of the above-mentioned heat dissipation structure for PCB board, the secondary heat dissipation component includes a secondary main heat dissipation part and a secondary secondary heat dissipation part. The secondary main heat dissipation part is fixedly connected to the secondary secondary heat dissipation part. The secondary main heat dissipation part abuts against the PCB board in the thickness direction of the PCB board, and the secondary secondary heat dissipation part abuts against the PCB board in the direction perpendicular to the thickness direction of the PCB board.

[0020] As a preferred technical solution of the above-mentioned heat dissipation structure for PCB board, the secondary side heat dissipation part includes secondary side heat dissipation part A and secondary side heat dissipation part B, the PCB board includes a third peripheral sidewall and a fourth peripheral sidewall, the third peripheral sidewall and the fourth peripheral sidewall intersect, the secondary side heat dissipation part A can abut against the third peripheral sidewall, and the secondary side heat dissipation part B can abut against the fourth peripheral sidewall.

[0021] An adapter is also provided, including a housing, the aforementioned PCB board, and the aforementioned heat dissipation structure for the PCB board. The PCB board and the aforementioned heat dissipation structure are both installed inside the housing, and the aforementioned heat dissipation structure is sandwiched between the PCB board and the inner wall of the housing.

[0022] The beneficial effects of this utility model are:

[0023] This utility model provides a heat dissipation structure and adapter for a PCB board. The PCB board includes a primary edge and a secondary edge. The heat dissipation structure includes a first heat dissipation component, a second heat dissipation element, a first insulating layer, and a second insulating layer. The first heat dissipation component includes a primary edge heat dissipation element and a secondary edge heat dissipation element. The primary edge heat dissipation element is fixed to the primary edge of the PCB board, and the secondary edge heat dissipation element is fixed to the secondary edge of the PCB board, with the primary edge heat dissipation element and the secondary edge heat dissipation element spaced apart. The second heat dissipation element covers the primary edge heat dissipation element and the secondary edge heat dissipation element in the thickness direction of the PCB board. The first insulating layer includes a first insulating element A and a first insulating element B. The first insulating element A is sandwiched between the primary edge heat dissipation element and the PCB board, and the first insulating element B is sandwiched between the secondary edge heat dissipation element and the PCB board. The second insulating layer is sandwiched between the second heat dissipation element and the first heat dissipation component.

[0024] The primary side of the PCB board is the voltage input side, and the secondary side is the voltage output side. Therefore, the voltage values ​​on the primary and secondary sides of the PCB board differ, resulting in different amounts of heat generated. To dissipate heat from the PCB board, this embodiment provides a heat dissipation structure in which a first insulating layer, a first heat dissipation component, a second insulating layer, and a second heat dissipation component are arranged sequentially along the thickness direction of the PCB board.

[0025] The first insulating layer covers the heat dissipation surface of the PCB board. The first insulating layer includes a first insulating component A and a first insulating component B, wherein the first insulating component A is laid on the primary edge of the PCB board and the first insulating component B is laid on the secondary edge of the PCB board.

[0026] The first heat dissipation assembly includes a primary-side heat sink and a secondary-side heat sink. The primary-side heat sink is installed on the side of the first insulating member A that faces away from the primary side of the PCB board. The first insulating member A prevents electrical connection between the PCB board and the primary-side heat sink, and the primary-side heat sink dissipates heat from the primary side of the PCB board. The secondary-side heat sink is installed on the side of the first insulating member B that faces away from the secondary side of the PCB board. The first insulating member B also prevents electrical connection between the PCB board and the secondary-side heat sink, and the secondary-side heat sink dissipates heat from the secondary side of the PCB board. The primary-side and secondary-side heat sinks are spaced apart, allowing each heat sink to independently dissipate heat from the primary and secondary sides of the PCB board. This separate and independent heat dissipation prevents heat from being conducted between the primary and secondary sides, avoiding localized temperature rises and increased thermal stress.

[0027] The second insulating layer covers the side of the first heat dissipation assembly that is opposite to the first insulating layer.

[0028] The second heat sink is installed on the side of the second insulating layer facing away from the first heat sink assembly. The second insulating layer is used to prevent the primary and secondary heat sinks in the first heat sink assembly from being electrically connected through the second heat sink. The heat from both the primary and secondary heat sinks can be transferred to the second heat sink. The second heat sink has a relatively large heat dissipation area, which can further accelerate the heat dissipation efficiency and enhance the shielding effect. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the assembly of a PCB board and a first insulating layer provided in an embodiment of the present invention;

[0031] Figure 2 This is an assembly diagram of a PCB board, a first insulating layer, and a first heat dissipation assembly provided in an embodiment of the present invention.

[0032] Figure 3 This is an exploded view of the heat dissipation structure for a PCB board provided in an embodiment of this utility model.

[0033] In the picture:

[0034] X, the thickness direction of the PCB board;

[0035] 1. Heat dissipation structure; 2. PCB board;

[0036] 100. First heat dissipation component; 110. Primary side heat dissipation component; 111. Primary side main heat dissipation section; 112. Primary side secondary heat dissipation section; 120. Secondary side heat dissipation component; 121. Secondary side main heat dissipation section; 122. Secondary side secondary heat dissipation section;

[0037] 200. Second heat sink; 210. Second main heat sink; 220. Second auxiliary heat sink;

[0038] 300. First insulating layer; 310. First insulating component A; 320. First insulating component B;

[0039] 400. Second insulation layer. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0041] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0044] like Figures 1 to 3 As shown, this utility model provides a heat dissipation structure 1 for a PCB board 2, the PCB board 2 including a primary side and a secondary side, and the heat dissipation structure 1 including a first heat dissipation component 100, a second heat dissipation component 200, a first insulating layer 300 and a second insulating layer 400. The first heat dissipation component 100 includes a primary heat dissipation component 110 and a secondary heat dissipation component 120. The primary heat dissipation component 110 is fixed to the primary edge of the PCB board 2, and the secondary heat dissipation component 120 is fixed to the secondary edge of the PCB board 2. The primary heat dissipation component 110 and the secondary heat dissipation component 120 are spaced apart. The second heat dissipation component 200 covers the primary heat dissipation component 110 and the secondary heat dissipation component 120 in the thickness direction X of the PCB board 2. The first insulating layer 300 includes a first insulating component A310 and a first insulating component B320. The first insulating component A310 is sandwiched between the primary heat dissipation component 110 and the PCB board 2, and the first insulating component B320 is sandwiched between the secondary heat dissipation component 120 and the PCB board 2. The second insulating layer 400 is sandwiched between the second heat dissipation component 200 and the first heat dissipation component 100.

[0045] For example, the primary side of PCB 2 is the voltage input side, and the secondary side of PCB 2 is the voltage output side. Therefore, the voltage values ​​of the primary and secondary sides of PCB 2 are different, and the generated heat energy is also different. In order to dissipate heat from PCB 2, a heat dissipation structure 1 is provided in this embodiment. Along the thickness direction X of PCB 2, a first insulating layer 300, a first heat dissipation component 100, a second insulating layer 400, and a second heat dissipation component 200 are arranged sequentially.

[0046] The first insulating layer 300 covers the heat dissipation surface of the PCB board 2. The first insulating layer 300 includes a first insulating component A310 and a first insulating component B320, wherein the first insulating component A310 is laid on the primary edge of the PCB board 2 and the first insulating component B320 is laid on the secondary edge of the PCB board 2.

[0047] The first heat dissipation assembly 100 includes a primary-side heat sink 110 and a secondary-side heat sink 120. The primary-side heat sink 110 is installed on the side of the first insulating member A310 opposite to the primary side of the PCB board 2. The first insulating member A310 is used to prevent the PCB board 2 from being electrically connected to the primary-side heat sink 110, and the primary-side heat sink 110 is used to dissipate heat from the primary side of the PCB board 2. The secondary-side heat sink 120 is installed on the side of the first insulating member B320 opposite to the secondary side of the PCB board 2. The first insulating member B320 is used to prevent the PCB board 2 from being electrically connected to the secondary-side heat sink 120, and the secondary-side heat sink 120 is used to dissipate heat from the secondary side of the PCB board 2. Furthermore, the primary heat sink 110 and the secondary heat sink 120 are spaced apart. In this way, the primary heat sink 110 can independently dissipate heat for the primary side of the PCB board 2, and the secondary heat sink 120 can independently dissipate heat for the secondary side of the PCB board 2. The primary and secondary sides of the PCB board 2 are dissipated separately and independently, avoiding the mutual conduction of heat generated by the primary side and heat generated by the secondary side, which would lead to the superposition of local temperature rise and aggravate thermal stress.

[0048] The second insulating layer 400 covers the side of the first heat dissipation assembly 100 that is opposite to the first insulating layer 300.

[0049] The second heat sink 200 is installed on the side of the second insulating layer 400 facing away from the first heat sink assembly 100. The second insulating layer 400 is used to prevent the primary heat sink 110 and the secondary heat sink 120 in the first heat sink assembly 100 from being electrically connected through the second heat sink 200. The heat from both the primary heat sink 110 and the secondary heat sink 120 can be transferred to the second heat sink 200. The second heat sink 200 has a relatively large heat dissipation area, which can further accelerate the heat dissipation efficiency and enhance the shielding effect.

[0050] In this embodiment, the first heat dissipation component 100 and / or the second heat dissipation component 200 are metal components.

[0051] In other embodiments, the first heat dissipation component 100 and / or the second heat dissipation component 200 are ceramic components.

[0052] Furthermore, the first insulating layer 300 and / or the second insulating layer 400 are polyester films, i.e., PET films.

[0053] Optionally, the primary heat sink 110 and / or the secondary heat sink 120 are fixed to the PCB board 2 by soldering.

[0054] With this configuration, the welding connection can maintain the assembly stability of the primary heat sink 110 and the primary side of the PCB board 2, and / or, can maintain the assembly stability of the secondary heat sink 120 and the secondary side of the PCB board 2.

[0055] Optionally, in the thickness direction X of the PCB board 2, one side of the first insulating member A310 is glued to the primary heat sink 110, and the other side is glued to the PCB board 2; and / or, in the thickness direction X of the PCB board 2, one side of the first insulating member B320 is glued to the secondary heat sink 120, and the other side is glued to the PCB board 2. With this configuration, the first insulating member A310 is glued to the primary edge of the PCB board 2, and the first insulating member A310 is glued to the primary heat sink 110, facilitating installation without the need for other screws, pins, or other fasteners. Furthermore, the glued connection helps reduce the gaps in the thickness direction X between the primary edge of the PCB board 2, the first insulating member A310, and the primary heat sink 110, venting air between the contact surfaces and thus improving heat transfer efficiency.

[0056] With this configuration, the first insulating component B320 is fixed to the secondary side of the PCB board 2, and the first insulating component B320 is fixed to the secondary side heat sink 120 by adhesive, which facilitates installation and eliminates the need for other fasteners such as screws and pins. Furthermore, adhesive bonding helps reduce the gaps in the thickness direction X of the PCB board 2 between the secondary side of the PCB board 2, the first insulating component B320, and the secondary side heat sink 120, thus eliminating air between the contact surfaces and improving heat transfer efficiency.

[0057] Optionally, in the thickness direction X of the PCB board 2, one side of the second insulating layer 400 is fixed to the first heat dissipation component 100 by adhesive, and the other side is fixed to the second heat dissipation component 200 by adhesive.

[0058] With this configuration, the second insulating layer 400 and the first heat dissipation component 100, as well as the second insulating layer 400 and the second heat dissipation component 200, are all fixed by adhesive, which facilitates installation and eliminates the need for other fasteners such as screws and pins. Furthermore, adhesive bonding helps to reduce the gap between the first heat dissipation component 100, the second insulating layer 400, and the second heat dissipation component 200 in the thickness direction X of the PCB board 2, thereby venting the air between the contact surfaces and improving heat transfer efficiency.

[0059] Optionally, the primary heat sink 110 includes a primary main heat sink 111 and a primary secondary heat sink 112. The primary main heat sink 111 and the primary secondary heat sink 112 are fixedly connected. The primary main heat sink 111 abuts against the PCB board 2 in the thickness direction X of the PCB board 2, and the primary secondary heat sink 112 abuts against the PCB board 2 in the thickness direction X perpendicular to the PCB board 2.

[0060] For example, the primary edge main heat dissipation part 111 is plate-shaped and located on the side of the first insulating member A310 facing away from the primary edge of the PCB board 2. The primary edge secondary heat dissipation part 112 is formed on the peripheral edge of the primary edge main heat dissipation part 111, intersecting with the primary edge main heat dissipation part 111. The primary edge secondary heat dissipation part 112 can abut against the peripheral sidewall of the PCB board 2. The heat generated by the primary edge of the PCB board 2 can be conducted and dissipated sequentially through the first insulating member A310, the primary edge main heat dissipation part 111, and the primary edge secondary heat dissipation part 112. Moreover, this semi-enclosed structure of the primary edge heat dissipation part 110 can reduce magnetic field leakage and improve shielding performance.

[0061] Optionally, the primary side heat sink 112 includes primary side heat sink A and primary side heat sink B, and the PCB board 2 includes a first peripheral sidewall and a second peripheral sidewall. The first peripheral sidewall and the second peripheral sidewall intersect, and the primary side heat sink A can abut against the first peripheral sidewall, and the primary side heat sink B can abut against the second peripheral sidewall.

[0062] With this configuration, the contact between the primary side heat sink A and the first peripheral sidewall, and the contact between the primary side heat sink B and the second peripheral sidewall, can limit the relative movement of the primary side heat sink 110 and the PCB board 2 in the thickness direction X perpendicular to the PCB board 2.

[0063] Optionally, the secondary heat sink 120 includes a secondary main heat sink 121 and a secondary secondary heat sink 122. The secondary main heat sink 121 and the secondary secondary heat sink 122 are fixedly connected. The secondary main heat sink 121 abuts against the PCB board 2 in the thickness direction X of the PCB board 2, and the secondary secondary heat sink 122 abuts against the PCB board 2 in the thickness direction X perpendicular to the PCB board 2.

[0064] For example, the secondary side main heat dissipation part 121 is plate-shaped and located on the side of the first insulating member B320 facing away from the secondary side of the PCB board 2. The secondary side secondary heat dissipation part 122 is formed on the peripheral edge of the secondary side main heat dissipation part 121, intersecting with the secondary side main heat dissipation part 121. The secondary side secondary heat dissipation part 122 can abut against the peripheral sidewall of the PCB board 2. The heat generated by the secondary side of the PCB board 2 can be conducted and dissipated sequentially through the first insulating member B320, the secondary side main heat dissipation part 121, and the secondary side secondary heat dissipation part 122. Moreover, this semi-enclosed structure of the secondary side heat dissipation part 120 can reduce magnetic field leakage and improve shielding performance.

[0065] Optionally, the secondary side heat dissipation section 122 includes secondary side heat dissipation section A and secondary side heat dissipation section B, and the PCB board 2 includes a third peripheral sidewall and a fourth peripheral sidewall. The third peripheral sidewall and the fourth peripheral sidewall intersect, and the secondary side heat dissipation section A can abut against the third peripheral sidewall, and the secondary side heat dissipation section B can abut against the fourth peripheral sidewall.

[0066] With this configuration, the contact between the secondary heat sink A and the third peripheral sidewall, and the contact between the secondary heat sink B and the fourth peripheral sidewall, can restrict the relative movement of the secondary heat sink 120 and the PCB board 2 in the thickness direction X perpendicular to the PCB board 2.

[0067] In this embodiment, the first and third circumferential sidewalls are parallel and opposite to each other, and the second and fourth circumferential sidewalls are on the same plane.

[0068] Optionally, the second heat sink 200 includes a second main heat sink 210 and a second auxiliary heat sink 220. The second main heat sink 210 and the second auxiliary heat sink 220 are fixedly connected. The second main heat sink 210 abuts against the first heat sink assembly 100 in the thickness direction X of the PCB board 2. The second auxiliary heat sink 220 abuts against the PCB board 2 and the first heat sink assembly 100 in the thickness direction X perpendicular to the PCB board 2.

[0069] An adapter is also provided, including a housing, a PCB board 2 and the aforementioned heat dissipation structure 1 for the PCB board. Both the PCB board 2 and the heat dissipation structure 1 are installed inside the housing, and the heat dissipation structure 1 is sandwiched between the PCB board 2 and the inner wall of the housing.

[0070] With this configuration, the heat generated by PCB board 2 can be quickly transferred to the housing through heat dissipation structure 1, and then dissipated through the housing. Heat dissipation structure 1 enhances the shielding effect, helping the adapter pass electromagnetic compatibility tests; it achieves safety insulation, ensuring electrical safety; and it optimizes heat dissipation performance, ensuring uniform heat distribution. This configuration not only increases the heat dissipation area but also reduces magnetic field leakage and improves shielding performance.

[0071] Furthermore, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A heat dissipation structure for a PCB board, the PCB board (2) comprising a primary side and a secondary side, characterized in that, The heat dissipation structure (1) includes: The first heat dissipation component (100) includes a primary heat dissipation component (110) and a secondary heat dissipation component (120). The primary heat dissipation component (110) is fixed to the primary side of the PCB board (2), and the secondary heat dissipation component (120) is fixed to the secondary side of the PCB board (2). The primary heat dissipation component (110) and the secondary heat dissipation component (120) are spaced apart. The second heat sink (200) covers the primary heat sink (110) and the secondary heat sink (120) in the thickness direction (X) of the PCB board (2); The first insulating layer (300) includes a first insulating component A (310) and a first insulating component B (320). The first insulating component A (310) is sandwiched between the primary heat sink (110) and the PCB board (2), and the first insulating component B (320) is sandwiched between the secondary heat sink (120) and the PCB board (2). The second insulating layer (400) is sandwiched between the second heat sink (200) and the first heat sink assembly (100).

2. The heat dissipation structure for a PCB board according to claim 1, characterized in that, The first heat dissipation component (100) and / or the second heat dissipation component (200) are metal components.

3. The heat dissipation structure for a PCB board according to claim 1, characterized in that, The primary heat sink (110) and / or the secondary heat sink (120) are fixed to the PCB board (2) by welding.

4. The heat dissipation structure for a PCB board according to claim 1, characterized in that, In the thickness direction (X) of the PCB board (2), one side of the first insulating member A (310) is fixed to the original heat sink (110) by adhesive, and the other side is fixed to the PCB board (2) by adhesive. And / or, in the thickness direction (X) of the PCB board (2), one side of the first insulating member B (320) is fixed to the secondary heat sink (120) by adhesive, and the other side is fixed to the PCB board (2) by adhesive.

5. The heat dissipation structure for a PCB board according to claim 1, characterized in that, In the thickness direction (X) of the PCB board (2), one side of the second insulating layer (400) is fixed to the first heat dissipation component (100) by adhesive, and the other side is fixed to the second heat dissipation component (200) by adhesive.

6. The heat dissipation structure for a PCB board according to claim 1, characterized in that, The primary heat sink (110) includes a primary main heat sink (111) and a primary secondary heat sink (112). The primary main heat sink (111) and the primary secondary heat sink (112) are fixedly connected. The primary main heat sink (111) abuts against the PCB board (2) in the thickness direction (X) of the PCB board (2). The primary secondary heat sink (112) abuts against the PCB board (2) in the thickness direction (X) perpendicular to the PCB board (2).

7. The heat dissipation structure for a PCB board according to claim 6, characterized in that, The primary side heat dissipation section (112) includes primary side heat dissipation section A and primary side heat dissipation section B. The PCB board (2) includes a first peripheral sidewall and a second peripheral sidewall. The first peripheral sidewall and the second peripheral sidewall intersect. The primary side heat dissipation section A can abut against the first peripheral sidewall, and the primary side heat dissipation section B can abut against the second peripheral sidewall.

8. The heat dissipation structure for a PCB board according to claim 1, characterized in that, The secondary side heat sink (120) includes a secondary side main heat sink (121) and a secondary side secondary heat sink (122). The secondary side main heat sink (121) and the secondary side secondary heat sink (122) are fixedly connected. The secondary side main heat sink (121) abuts against the PCB board (2) in the thickness direction (X) of the PCB board (2). The secondary side secondary heat sink (122) abuts against the PCB board (2) in the thickness direction (X) perpendicular to the PCB board (2).

9. The heat dissipation structure for a PCB board according to claim 8, characterized in that, The secondary side heat dissipation section (122) includes secondary side heat dissipation section A and secondary side heat dissipation section B. The PCB board (2) includes a third peripheral sidewall and a fourth peripheral sidewall. The third peripheral sidewall and the fourth peripheral sidewall intersect. The secondary side heat dissipation section A can abut against the third peripheral sidewall, and the secondary side heat dissipation section B can abut against the fourth peripheral sidewall.

10. An adapter, characterized in that, The device includes a housing, the PCB board (2), and a heat dissipation structure (1) for the PCB board as described in any one of claims 1-9. The PCB board (2) and the heat dissipation structure (1) are both installed inside the housing, and the heat dissipation structure (1) is sandwiched between the PCB board (2) and the inner wall of the housing.

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