Driver heat dissipation device and driver

Abstract

The utility model discloses a driver heat dissipation device, and the driver comprises a housing, a PCB assembly disposed in the housing, a main heat dissipation air channel, a secondary heat dissipation air channel, and a main and secondary air channel switching valve disposed between the main heat dissipation air channel and the secondary heat dissipation air channel. And the primary and secondary air duct switch valve controls the connection or disconnection of the primary heat dissipation air duct and the secondary heat dissipation air duct. According to the utility model, through reasonable thermal design and complete machine process design, the power density of the driver using the structure is obviously improved, and the driver has the characteristics of high power density, good protection, simple assembly and low cost.

Description

Technical Field

[0001] This utility model relates to the field of drivers, specifically to a driver heat dissipation device and a driver. Background Technology

[0002] Compared to low-power servo drives, medium-power servo drives (4.5KW-7.5KW) are mainly used in medium-sized machinery such as milling machines, injection molding machines, pillow packaging machines, and glass processing. Yaskawa is a leading player in the medium-power servo market, with its products boasting excellent performance and accurate market positioning. These drives are widely used in related industries. Meanwhile, manufacturers such as Panasonic, Delta, Inovance, and Invt, while strengthening their market position in the Chinese OEM market for small servo drives, are actively expanding into the medium-power servo market and have achieved considerable success.

[0003] Looking ahead, medium-power drives will continue to evolve towards higher power density, digital intelligence, and higher efficiency. Currently, mainstream 7.5kW drives, represented by Yaskawa and Panasonic, are characterized by large size, low power density, and complex assembly processes. (See figure).

[0004] model Power supply method Voltage level V Power KW Height(mm) Width (mm) Depth (mm) Volume (cm)^3 Power density (W / cm^3) brand SGD7S-330A Three-phase 200 5.00 258 110 210 5959.8 0.84 Yaskawa SGDV-170D Three-phase 380 4.4 250 135 230 7762.5 0.57 Yaskawa SGDV-210D Three-phase 380 5.5 350 230 210 16905.0 0.33 Yaskawa SGDV-260D Three-phase 380 7.5 350 230 210 16905.0 0.44 Yaskawa MFDL-B3S Three-phase 200 5.00 250 130 219.5 7133.75 0.7 Matsushita

[0005] Existing drivers suffer from problems such as large size, low power density, and complex assembly processes. There is a need for a driver with high power density and good heat dissipation to provide higher power within a limited space. Summary of the Invention

[0006] In order to solve the above technical problems, the purpose of this utility model is to provide a driver heat dissipation device and driver with high power density and good heat dissipation performance.

[0007] To achieve the above objectives, the technical solution of this utility model is: a driver heat dissipation device, the driver including a housing and a PCB assembly disposed in the housing, including a main heat dissipation air duct and a secondary heat dissipation air duct, and a main and secondary air duct switching valve disposed between the main heat dissipation air duct and the secondary heat dissipation air duct, the main and secondary air duct switching valve controlling the connection or closure of the main heat dissipation air duct and the secondary heat dissipation air duct.

[0008] Preferably, the main heat dissipation duct is equipped with a main air duct radiator and a main cooling fan.

[0009] More preferably, the main cooling fan is disposed at one end of the main cooling duct.

[0010] More preferably, the primary and secondary air duct switching valves are disposed between the primary air duct radiator and the primary cooling fan, and the primary and secondary air duct switching valves are disposed close to the primary cooling fan.

[0011] More preferably, the main air duct radiator has a plurality of fins distributed along the length of the main air duct.

[0012] More preferably, the secondary heat dissipation duct is formed by a duct baffle and the housing of the driver.

[0013] More preferably, a secondary cooling fan is provided in the secondary cooling duct, and the secondary cooling fan is located at one end of the secondary cooling duct away from the main cooling fan.

[0014] More preferably, the air duct baffle includes a base plate and a side plate. The base plate is disposed close to the PCB board of the driver and has a plurality of holes or slots for the components on the PCB board of the driver to pass through. The side plate separates the heat-generating area from the non-heat-generating area of ​​the PCB board of the driver.

[0015] Preferably, the primary and secondary air duct switching valves are valve plates that can be detachably inserted into the housing of the driver.

[0016] A driver includes the aforementioned driver heat dissipation device.

[0017] The advantages of this utility model are:

[0018] This invention, through reasonable thermal design and overall process design, significantly improves the power density of the driver using this structure, while also featuring high power density, good protection, simple assembly, and low cost. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the following description of the embodiments will be briefly introduced. The drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0021] Figure 1 This is a schematic diagram of an embodiment;

[0022] Figure 2 This is a schematic diagram of a PCB board assembly.

[0023] Figure 3 Schematic diagram of air duct baffle;

[0024] Figure 4 Schematic diagram of the main heat dissipation airflow duct assembly;

[0025] Figure 5 This is a schematic diagram of the outer casing;

[0026] Figure 6 Example Model 1;

[0027] Figure 7 Example 2 is the second model;

[0028] Figure 8 Example 3 is the third model.

[0029] The components are as follows: 11. PCB substrate; 12. Main power heating module; 13. Capacitor heating module; 14. Switching power supply heating module; 21. Fixing and mounting parts; 22. Housing; 3. Main and secondary air duct switching valves; 41. Main air duct heat sink; 42. Main cooling fan; 51. Air duct baffle; 52. Secondary cooling fan; 51a. Base plate; 51b. Side plate; 51c. Hole; 6. Valve plate. Detailed Implementation

[0030] See appendix Figure 1-5 As shown, this embodiment provides a 7.5KW driver, which includes a housing, a PCB board assembly, and a heat dissipation device. The PCB board assembly includes a PCB substrate 11 and a main power heating module 12, a capacitor heating module 13, and a switching power supply heating module 14 disposed thereon. In this embodiment, the housing includes a die-cast aluminum integral mounting component 21 and an outer shell 22, and the PCB board assembly and the heat dissipation device are both disposed on the mounting component 21.

[0031] The heat dissipation device includes a main heat dissipation duct for the main power heating module 12 and a secondary heat dissipation duct for the capacitor heating module 13, as well as a main-secondary air duct switching valve 3 disposed between the main and secondary air ducts. The main-secondary air duct switching valve 3 controls the connection or closure of the main and secondary air ducts. The main-secondary air duct switching valve 3 is a valve plate 6 that is detachably inserted into the housing of the driver.

[0032] The main cooling duct is equipped with a main cooling duct heat sink 41 and a main cooling fan 42. The fan is located at one end of the main cooling duct. In this embodiment, the main cooling fan 42 is located close to the switching power supply heat-generating module 14 to help the switching power supply heat-generating module 14 dissipate heat.

[0033] The main air duct heat sink 41 and the main power heating module 12 are fully bonded together by thermal grease. It adopts aluminum profile technology and includes heat dissipation base plate and blades. The blades and base plate are integrally formed. The semi-enclosed blades effectively increase the contact area between air and heat dissipation profile, further increasing heat dissipation efficiency. It is simple to process and has a solid structure. It avoids the problems of complicated installation of insert blades and small heat dissipation area and low heat transfer efficiency of die-cast aluminum blades, and avoids the additional high mold costs.

[0034] The secondary cooling duct is formed by a plastic duct baffle 51 and the housing of the driver. A secondary cooling fan 52 is installed inside the secondary cooling duct, and the secondary cooling fan 52 is located at the end of the secondary cooling duct away from the main cooling fan 42.

[0035] The air duct baffle 51 includes a base plate 51a and a side plate 51b. The base plate 51a is set close to the PCB board of the driver. The base plate 51a is provided with multiple holes 51c for the capacitor heating module 13 on the PCB board of the driver to pass through. The side plate 51b separates the main power heating module 12 and capacitor heating module 13 on the PCB board of the driver from the other low-heating areas, which can prevent heat from being transferred to the low-heating areas.

[0036] The main and secondary air duct switching valve 3 is located between the main air duct radiator 41 and the main cooling fan 42, and the main and secondary air duct switching valve 3 is located close to the main cooling fan 42.

[0037] This embodiment balances the heat flow between the main and secondary air ducts through the main and secondary air duct switching valve 3. This allows for the satisfaction of the relationship between the heat dissipation of the main and secondary air ducts and the protection requirements of different models within the same structure. In some applications, the driver in this embodiment can be extended to higher power (e.g., 11KW). This embodiment has the following three models:

[0038] Model 1, see appendix Figure 6 As shown, there is a main cooling fan 42, a secondary cooling fan 52, and a valve plate 6. At this time, both the main air duct and the secondary air duct have a large cooling airflow.

[0039] Model 2, see appendix Figure 7 As shown, there is a main cooling fan 42, but no secondary cooling fan 52 and no valve plate 6. At this time, the main air duct has a large cooling airflow. Meanwhile, the secondary air duct is connected to the main air duct through the main-secondary air duct switching valve 3. Driven by the main cooling fan 42, it also has a certain amount of cooling airflow, which has a certain cooling effect on the secondary air duct.

[0040] Model 3, see appendix Figure 8 As shown, there is a main cooling fan 42, no secondary cooling fan 52, and a valve plate 6. At this time, the main air duct has a large cooling airflow, while the secondary air duct has no cooling airflow. This is suitable for situations where the secondary air duct does not need to be cooled. Furthermore, the gaps created by the valve plate 6 can prevent the spread of heat.

[0041] This embodiment can achieve different heat dissipation requirements by using a driver to open and close the main and secondary air duct switching valves 3 and whether or not the secondary cooling fan 52 is set, thereby reducing production costs.

Claims

1. A driver heat dissipation device, the driver comprising a housing and a PCB assembly disposed within the housing, characterized in that: It includes a main heat dissipation air duct and a secondary heat dissipation air duct, and a main-secondary air duct switching valve disposed between the main heat dissipation air duct and the secondary heat dissipation air duct, wherein the main-secondary air duct switching valve controls the connection or closure of the main heat dissipation air duct and the secondary heat dissipation air duct.

2. The driver heat dissipation device according to claim 1, characterized in that: The main cooling duct is equipped with a main cooling radiator and a main cooling fan.

3. The driver heat dissipation device according to claim 2, characterized in that: The main cooling fan is located at one end of the main cooling duct.

4. The driver heat dissipation device according to claim 3, characterized in that: The primary and secondary air duct switching valves are located between the primary air duct radiator and the primary cooling fan, and are positioned close to the primary cooling fan.

5. A driver heat dissipation device according to claim 3, characterized in that: The main air duct radiator has multiple fins distributed along the length of the main air duct.

6. The driver heat dissipation device according to claim 2, characterized in that: The secondary heat dissipation air duct is formed by the air duct baffle and the housing of the driver.

7. A driver heat dissipation device according to claim 6, characterized in that: A secondary cooling fan is installed inside the secondary cooling duct, and the secondary cooling fan is located at the end of the secondary cooling duct away from the main cooling fan.

8. A driver heat dissipation device according to claim 6, characterized in that: The air duct baffle includes a base plate and a side plate. The base plate is set close to the PCB board of the driver and has multiple holes or slots for the components on the PCB board of the driver to pass through. The side plate separates the heat-generating area from the non-heat-generating area of ​​the PCB board of the driver.

9. A driver heat dissipation device according to claim 1, characterized in that: The primary and secondary air duct switching valves are valve plates that can be detachably inserted into the housing of the driver.

10. A driver, characterized in that... Includes the driver heat dissipation device as described in any one of claims 1-9.

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