Heat dissipation device

Abstract

The utility model provides a heat dissipation device which comprises a phase change vapor chamber and a liquid cooling plate which are arranged in a stacked mode, the phase change vapor chamber comprises a shell and a first cover plate, the shell and the first cover plate are welded in a sealed mode to form a sealed cavity, and a phase change cooling medium is arranged in the sealed cavity; the surface, away from the shell, of the first cover plate is provided with a plurality of protruding cooling fins and protruding columns, the protruding columns are located among the multiple cooling fins, the liquid cooling plate comprises an interlayer flow channel plate and a second cover plate, the interlayer flow channel plate is internally provided with a flow channel for cooling liquid to flow, and the first cover plate and the second cover plate are arranged on the bottom face and the top face of the interlayer flow channel plate respectively. The first cover plate and the second cover plate are connected with the interlayer flow channel plate in a welded mode, the protruding column is connected with at least part of the interlayer flow channel plate in a welded mode, the phase change soaking plate and the liquid cooling plate which are arranged in a stacked mode are connected in a welded mode, the multiple protruding heat dissipation fins and the protruding column are used in an assisted mode, a flow channel in the heat dissipation device is smoother, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation, specifically to a heat dissipation device. Background Technology

[0002] With the rapid development of artificial intelligence computing power, traditional air cooling has reached its performance limit. The concept of liquid-cooled servers has attracted widespread attention in the heat dissipation industry. Currently, the mainstream liquid cooling solution on the market is cold plate heat dissipation. In recent years, the power of chips has continued to increase. In order to meet the demand for improved heat dissipation capacity brought about by high-power chips, improving the internal structure of VC (Vapor Chamber) cold plates, enhancing heat dissipation performance and reducing flow resistance has become the direction that the industry is constantly exploring and advancing.

[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art:

[0004] The existing VC cold plate structure is prone to structural collapse during welding, which makes it difficult to transfer heat effectively and affects the service life of the heat dissipation device. Utility Model Content

[0005] This application provides a heat dissipation device that uses a stacked phase change heat dissipation plate and a liquid cooling plate welded together, supplemented by multiple protruding heat dissipation fins and protruding pillars, which makes the internal flow channels of the VC cold plate smoother, improves the overall structural stability of the heat dissipation device, and extends its service life.

[0006] This application provides a heat dissipation device, which includes a phase change heat dissipation plate and a liquid cooling plate stacked together. The phase change heat dissipation plate includes a shell and a first cover plate. The shell and the first cover plate are sealed and welded to form a sealed cavity. A phase change cooling medium is disposed in the sealed cavity. The surface of the first cover plate away from the shell is provided with a plurality of protruding heat dissipation fins and protruding posts. The protruding posts are located between the plurality of heat dissipation fins.

[0007] The liquid cooling plate includes a sandwich flow channel plate and a second cover plate. The sandwich flow channel plate has a flow channel for coolant to flow. The first cover plate and the second cover plate are respectively disposed on the bottom surface and the top surface of the sandwich flow channel plate. The first cover plate and the second cover plate are welded to the sandwich flow channel plate, and the protruding post is welded to at least a portion of the sandwich flow channel plate.

[0008] In one embodiment, the second cover plate is provided with an inlet and an outlet, and the inlet and the outlet are connected to the flow channel.

[0009] In one embodiment, the heat dissipation device further includes a water inlet and a water outlet, wherein the water inlet and the water outlet are respectively connected to the liquid inlet and the liquid outlet.

[0010] In one embodiment, the phase change heat spreader further includes a plurality of support columns protruding from the bottom of the housing, one end of which is welded to the first cover plate.

[0011] In one embodiment, the housing is further provided with a recessed groove, and the vertical projection of the protrusion on the housing is located within the groove.

[0012] In one embodiment, the edge of the housing is provided with a protruding sidewall, and a plurality of the support columns are disposed in the area between the groove and the sidewall, the height of the sidewall being flush with the height of the plurality of support columns.

[0013] In one embodiment, the top surface of the sandwich flow channel plate is provided with a recessed first receiving area, and the bottom surface of the sandwich flow channel plate is provided with a recessed second receiving area, and the flow channel connects the first receiving area and the second receiving area.

[0014] In one embodiment, the flow channel includes an inlet flow channel and an outlet flow channel that are connected to each other.

[0015] In one embodiment, the height of the heat dissipation fins is flush with that of the protrusions, the second receiving area accommodates a plurality of the heat dissipation fins and protrusions, and the bottom surface of the second receiving area abuts against the top surface of the heat dissipation fins and the protrusions.

[0016] In one embodiment, the phase change heat spreader and the liquid cooling plate are made of copper; the protruding post and the sandwich flow channel plate are connected by diffusion welding.

[0017] The beneficial effects of adopting the above technical solution are:

[0018] This application provides a heat dissipation device, which includes a phase change heat spreader and a liquid cooling plate stacked together. The phase change heat spreader includes a first cover plate with multiple protruding pillars on its surface away from the shell. The liquid cooling plate includes a sandwich channel plate and a second cover plate. The first and second cover plates are respectively disposed on the bottom and top surfaces of the sandwich channel plate, and are welded to the sandwich channel plate. The protruding pillars are also welded to at least a portion of the sandwich channel plate. In this application, the phase change heat spreader and liquid cooling plate share a common first cover plate and are connected by welding. The multiple protruding pillars on the first cover plate provide structural support during welding, reducing structural collapse or damage to the heat dissipation fins caused by welding, ensuring unobstructed flow, and solving the problem of flow channel blockage caused by solder overflow during welding of current VC cold plate structures. This makes the internal flow channels of the VC cold plate more unobstructed. The composite structure of the phase change heat spreader and liquid cooling plate improves the heat dissipation efficiency and extends the service life of the heat dissipation device. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the exploded structure of a heat dissipation device.

[0021] Figure 2 This is a schematic diagram of the housing of a heat dissipation device.

[0022] Figure 3 This is a schematic diagram of the structure of the first cover plate of a heat dissipation device.

[0023] Figure 4 This is a schematic diagram of the structure of a sandwich flow channel plate for a heat dissipation device.

[0024] Figure 5 This is a schematic cross-sectional view of a sandwich channel plate for a heat dissipation device.

[0025] Figure 6 This is a schematic diagram of the structure of the second cover plate of a heat dissipation device.

[0026] Figure label:

[0027] 100 - Heat dissipation device;

[0028] 10-Phase change heat spreader;

[0029] 11-Shell; 111-Groove; 112-Support column; 113-Bottom wall; 115-Side wall;

[0030] 12-First cover plate; 121-Heat dissipation fins; 122-Protruding pillar; 123-First central area;

[0031] 13-Sealed cavity;

[0032] 20-Liquid cooling plate;

[0033] 21-Mezzanine flow channel plate; 211-Flow channel; 212-First receiving area; 2121-Inlet flow channel; 21211-Inlet branch flow channel; 21212-Inlet through flow channel; 2122-Outlet flow channel; 2123-Bottom frame; 213-Second receiving area;

[0034] 22-Second cover plate; 221-Liquid inlet; 222-Liquid outlet;

[0035] 23 - Water inlet nozzle;

[0036] 25 - Water outlet. Detailed Implementation

[0037] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0038] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0039] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0040] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0041] With the rapid development of artificial intelligence computing power, in order to meet the heat dissipation requirements of high-power chips and solve the problem of structural collapse that easily occurs during the current VC cold plate flow channel welding process, resulting in ineffective heat transfer and affecting the service life of heat dissipation devices, this application provides a heat dissipation device 100. Figure 1 This is a schematic diagram of the exploded structure of a heat dissipation device. Figure 2 This is a schematic diagram of the housing of a heat dissipation device, as shown below. Figure 1 and Figure 2 As shown, the heat dissipation device 100 includes a phase change heat dissipation plate 10 and a liquid cooling plate 20 stacked together. The phase change heat dissipation plate 10 includes a shell 11 and a first cover plate 12. The shell 11 and the first cover plate 12 are sealed and welded to form a sealed cavity 13. The sealed cavity 13 is provided with a phase change cooling medium. The surface of the first cover plate 12 away from the shell 11 is provided with a plurality of protruding heat dissipation fins 121 and protruding posts 122. The protruding posts 122 are located between the plurality of heat dissipation fins 121.

[0042] The liquid cooling plate 20 includes a sandwich flow channel plate 21 and a second cover plate 22. The sandwich flow channel plate 21 has a flow channel 211 for coolant flow. The first cover plate 12 and the second cover plate 22 are respectively disposed on the bottom surface and the top surface of the sandwich flow channel plate 21. The first cover plate 12 and the second cover plate 22 are welded to the sandwich flow channel plate 21, and the protruding post 122 is welded to at least a portion of the sandwich flow channel plate 21.

[0043] The heat dissipation device 100 provided in this application includes a phase change heat spreader 10 and a liquid cooling plate 20 stacked together. The phase change heat spreader 10 includes a first cover plate 12. The surface of the first cover plate 12 away from the shell 11 is provided with a plurality of protruding protrusions 122. The liquid cooling plate 20 includes a sandwich flow channel plate 21 and a second cover plate 22. The first cover plate 12 and the second cover plate 22 are respectively covered on the bottom surface and the top surface of the sandwich flow channel plate 21. The first cover plate 12 and the second cover plate 22 are welded to the sandwich flow channel plate 21, and the protrusions 122 are welded to at least a portion of the sandwich flow channel plate 21. In this application, the phase change heat spreader 10 and the liquid cooling plate 20 are welded together using a common first cover plate 12 and are connected by an integrated diffusion welding process, eliminating the need for solder. The multiple protruding pillars 122 on the first cover plate 12 provide structural support during the welding process, reducing structural collapse or damage to the heat dissipation fins 121 caused by diffusion welding. This ensures unobstructed flow channels, solving the problem of heat transfer difficulties caused by structural collapse during the welding process of current VC cold plate structures. It also solves the problem of flow channel blockage caused by solder overflow, making the internal flow channels of the VC cold plate more unobstructed. The composite structure of the phase change heat spreader 10 and the liquid cooling plate 20 can improve the heat dissipation efficiency of the heat dissipation device 100 and extend its service life.

[0044] To make the technical solution, purpose, and advantages of this application clearer, the application will be described in detail below with reference to the accompanying drawings and embodiments. For ease of understanding, the heat dissipation device 100 will be used as a reference object for direction. The heat dissipation device 100 will be conventionally placed horizontally on the ground. The direction perpendicular to the horizontal direction and away from the ground will be defined as upward, and vice versa as downward.

[0045] In this application, the heat dissipation device 100 includes two basic components: a phase change heat dissipation plate 10 and a liquid cooling plate 20 stacked together. The phase change heat dissipation plate 10 is located below the connected liquid cooling plate 20 and is in direct contact with the heating element (not shown). Therefore, the phase change heat dissipation plate 10 is the initial component for contacting the heating element (not shown) and transferring heat.

[0046] like Figure 1As shown, the phase change heat spreader 10 includes a shell 11 and a first cover plate 12. The shell 11 is further provided with a recessed groove 111 for accommodating the cooling medium. The cooling medium can undergo a phase change under the action of heat, thus converting heat during the phase change process and achieving the purpose of heat dissipation.

[0047] The housing 11 includes a bottom wall 113 and a side wall 115 connected to the bottom wall 113. The phase change heat spreader 10 also includes a plurality of support columns 112 protruding from the bottom of the housing 11. One end of each support column 112 is connected to the bottom wall 113 of the housing 11, and the other end is connected to the first cover plate 12. During the welding process of the housing 11 and the first cover plate 12, the welding connection of one end of the support column 112 to the first cover plate 12 provides sufficient welding contact points and support force, which can increase the welding strength of the housing 11 and the first cover plate 12, prevent deformation of the housing 11 and the first cover plate 12 during the welding process, and also increase the phase change process of the cooling medium and accelerate the heat dissipation rate.

[0048] Please continue reading. Figure 2 The housing 11 has a square structure. In some embodiments, the bottom wall 113 of the housing 11 has a downwardly protruding square boss for contacting the heating element (not shown). The square boss on both sides of the housing 11 forms a phase change region. The support columns 112 of the housing 11 are cylindrical and spaced apart within the phase change region. After the first cover plate 12 is placed on the upper surface of the housing 11 and welded to it, the housing 11 and the first cover plate 12 are sealed together to form a sealed cavity 13. The sealed cavity 13 contains a phase change cooling medium. The spaced-apart support columns 112 and grooves 111, together with the first cover plate 12, accommodate the cooling medium. Exemplarily, the support columns 112 can be circular, square, polygonal, etc., and are not limited here.

[0049] The heating element is thermally connected to the boss. After absorbing heat in the phase change heat spreader 10, the heat is conducted to the cooling medium through the housing 11 and the support column 112, so as to promote the phase change cooling medium to undergo the phase change process of heat absorption and release. For example, the phase change cooling medium can be pure water, alcohol, methanol, acetone, etc., and is not limited here.

[0050] In some embodiments, a capillary structure, such as copper mesh, copper fiber, copper powder, or copper foam, may also be laid inside the phase change heat spreader 10.

[0051] In the above scheme, the sealed cavity 13 can be in a vacuum state, and the cooling medium in the sealed cavity 13 can achieve heat dissipation of the heat spreader through the gas-liquid two-phase change.

[0052] To improve heat dissipation efficiency, the heat dissipation device 100 of this application also includes a liquid cooling plate 20 connected to the phase change heat spreader 10, thereby transferring part of the heat on the phase change heat spreader 10 to the outside through the cooling water inside the liquid cooling plate 20. The first cover plate 12 is located between the phase change heat spreader 10 and the liquid cooling plate 20, connecting the two and conducting heat, which makes the structure of the heat dissipation device 100 more compact and can also reduce costs.

[0053] Figure 3 This is a schematic diagram of the structure of the first cover plate of a heat dissipation device, as shown below. Figure 3 As shown, the first cover plate 12 has a plurality of protruding heat dissipation fins 121 and protruding posts 122 on the surface away from the housing 11, and the protruding posts 122 are located between the plurality of heat dissipation fins 121, and the height of the heat dissipation fins 121 is flush with the height of the protruding posts 122.

[0054] In some embodiments, the height of the protrusion 122 may be higher than the height of the heat dissipation fin 121, which can further reduce the deformation and damage of the heat dissipation fin 121 during the welding process.

[0055] For details, please continue reading Figure 3 The first cover plate 12 has a square structure and a first central area 123 that protrudes upward in the center of the top surface. The first central area 123 is square in shape.

[0056] The heat dissipation fins 121 are multiple rows of upwardly protruding thin sheet structures. Multiple rows of heat dissipation fins 121 are spaced apart in the first central area 123. The spacing between two heat dissipation fins 121 can be the thickness of at least one heat dissipation fin 121.

[0057] The protruding pillars 122 are cylindrical structures that protrude upwards along the first central region 123, meaning that multiple protruding pillars 122 are distributed at intervals between multiple rows of heat dissipation fins 121. To facilitate support, the multiple protruding pillars 122 are at the same height as the heat dissipation fins 121. At the same time, the diameter of the protruding pillars 122 is at least greater than the span distance of three connected heat dissipation fins 121.

[0058] For example, the protrusion 122 can be circular, square, polygonal, etc., and the vertical projection of the protrusion 122 on the housing 11 is located within the groove 111. The first central area 123 can be a square protrusion, a circular protrusion, or a protrusion of other shapes, which is not limited here.

[0059] In the above scheme, the first cover plate 12 serves as an intermediate structure connecting the liquid cooling plate 20 and the shell 11. The first central area 123 on the top surface of the first cover plate 12 has multiple heat dissipation fins 121 and protrusions 122. The bottom surface of the first cover plate 12 is connected to the shell 11. This design is conducive to simplifying the structure, reducing the number of components, and also to accelerating the conduction of heat from bottom to top.

[0060] In some implementations, such as Figure 1 As shown, the liquid cooling plate 20 has a square structure and includes a sandwich flow channel plate 21 and a second cover plate 22. The first cover plate 12 and the second cover plate 22 are respectively installed on the bottom and top surfaces of the sandwich flow channel plate 21.

[0061] Specifically, such as Figure 1 As shown, the lower surface of the second cover plate 22 is welded to the top surface of the sandwich channel plate 21, and the upper surface of the first cover plate 12 is welded to the lower surface of the sandwich channel plate 21. In some embodiments, the second cover plate 22, the sandwich channel plate 21, and the first cover plate 12 are formed into an integral structure by an integral diffusion welding process.

[0062] In the above scheme, the second cover plate 22, the sandwich flow channel plate 21 and the first cover plate 12 are integrated into a single structure through an integrated diffusion welding process. This can reduce the decrease in structural stability caused by hot welding, and the formed coolant flow channel and containment cavity can remain stable. It solves the problem that heat cannot be effectively transferred due to structural collapse during the welding process. The integrated structure has strong structural stability, which can improve service life and heat conduction efficiency.

[0063] Figure 4 This is a schematic diagram of the structure of a sandwich flow channel plate for a heat dissipation device. Figure 5 Please refer to the schematic cross-sectional view of a sandwich channel plate for a heat dissipation device. Figure 4 and Figure 5 The sandwich flow channel plate 21 is provided with a flow channel 211 for coolant flow; the flow channel 211 includes a liquid inlet flow channel 2121 and a liquid outlet flow channel 2122 that are connected to each other.

[0064] The sandwich flow channel plate 21 has a square structure. The top surface of the sandwich flow channel plate 21 is provided with a recessed first receiving area 212, and the bottom surface of the sandwich flow channel plate 21 is provided with a recessed second receiving area 213. The second receiving area 213 accommodates a plurality of heat dissipation fins 121 and protrusions 122. The flow channel 211 connects the first receiving area 212 and the second receiving area 213.

[0065] Specifically, such as Figure 5As shown, the first receiving area 212 is a square recessed area, and the first receiving area 212 is provided with a groove-shaped liquid inlet channel 2121 and a liquid outlet channel 2122. Among them, the liquid outlet channel 2122 is a straight groove structure in the center of the first receiving area 212 and is connected to the second receiving area 213.

[0066] Specifically, such as Figure 4 As shown, the liquid inlet channel 2121 is a U-shaped structure located in the first receiving area 212. The bottom end of the U-shaped structure is a trough-shaped liquid inlet branch channel 21211. The liquid inlet branch channel 21211 is located on one side of the first receiving area 212 and is perpendicular to the liquid outlet channel 2122 but not connected. The left and right sides of the U-shaped structure of the liquid inlet channel 2121 are liquid inlet passage channels 21212 and are parallel to the liquid outlet channel 2122. The liquid inlet passage channel 21212 is a trough structure and is connected to the second receiving area 213.

[0067] The bottom of the first receiving area 212 is also provided with a strip-shaped bottom frame 2123, the top surface of which is flush with the bottom surface of the first receiving area 212.

[0068] Since the surface of the inlet channel 21212 is lower than the bottom surface of the first receiving area 212, and the inlet channel 21212 is connected to the second receiving area 213, the coolant is diverted from the inlet branch channel 21211 to the inlet channels 21212 on both sides of the first receiving area 212 and enters the second receiving area 213. The coolant in the second receiving area 213 can be returned through the outlet channel 2122 located in the first receiving area 212.

[0069] For example, the first receiving area 212 and the second receiving area 213 can be square, circular or other shapes, and the liquid inlet channel 2121 and the liquid outlet channel 2122 can be grooves, holes or other shapes or structures, without limitation.

[0070] In the above scheme, the top and bottom surfaces of the sandwich flow channel plate 21 are provided with a first receiving area 212 and a second receiving area 213, so that the coolant can flow into the second receiving area 213 through the liquid inlet diversion channel 21211 and then return through the liquid outlet flow channel 2122. That is, the flow channel structure of the sandwich flow channel plate 21 combined with the recessed receiving areas on its top and bottom surfaces gives the coolant in the liquid cooling plate 20 a receiving cavity and a clear return path. This structure is simple and practical, and the processing technology is relatively simple.

[0071] Figure 6 This is a schematic diagram of the structure of the second cover plate of a heat dissipation device, as shown below. Figure 6 As shown, in order to make the circulation of coolant in the liquid cooling plate 20 faster, the second cover plate 22 is provided with a liquid inlet 221 and a liquid outlet 222, and both the liquid inlet 221 and the liquid outlet 222 are connected to the flow channel 211.

[0072] Specifically, such as Figure 1 As shown, the second cover plate 22 is a square thin plate structure covering the first receiving area 212. The middle area of ​​the second cover plate 22 is provided with a circular liquid inlet 221 and a liquid outlet 222. The liquid inlet 221 is located above and connected to the liquid inlet diversion channel 21211, and the liquid outlet 222 is located above and connected to the liquid outlet channel 2122.

[0073] To facilitate connection to the cooling circulation system piping, the heat dissipation device 100 further includes an inlet nozzle 23 and an outlet nozzle 25. Both the inlet nozzle 23 and the outlet nozzle 25 are circular tube structures. The top ends of these circular tube structures are equipped with tapered anti-detachment structures for connecting to the cooling circulation piping, and the tail ends of these circular tube structures are equipped with connecting portions. The inlet nozzle 23 and the outlet nozzle 25 are respectively connected to the liquid inlet 221 and the liquid outlet 222.

[0074] After the second cover plate 22 is placed over the first receiving area 212, the bottom surface of the second cover plate 22 abuts against the bottom and bottom frame 2123 of the first receiving area 212, thereby forming a sealed flow channel between the second cover plate 22 and the liquid inlet channel 21211.

[0075] The heat dissipation device 100 of this application, from top to bottom, consists of a second cover plate 22, a sandwich flow channel plate 21, a first cover plate 12, and a housing 11. All of these can be square, circular, or other shapes. The connection between the liquid inlet 221, the liquid outlet 222, the water inlet 23, and the water outlet 25 can be achieved by welding, threaded connection, or other connection methods, which are not limited here.

[0076] In the above scheme, the second cover plate 22 is installed inside the first receiving area 212 and is flush with the top surface of the sandwich flow channel plate 21, resulting in a relatively flat overall structure. Meanwhile, the middle part of the second cover plate 22 is also provided with a circular liquid inlet 221 and a liquid outlet 222, with the liquid inlet 221 located at one end of the second cover plate 22. This structural design helps to shorten the connection distance between the liquid inlet 221, the liquid outlet 222, and the liquid inlet flow channel 2121 and the liquid outlet flow channel 2122. It also makes it easier to process the connecting structure at the liquid inlet 221 and the liquid outlet 222 to connect with the water inlet nozzle 23 and the water outlet nozzle 25.

[0077] In some embodiments, the phase change heat spreader 10 and the liquid cooling plate 20 are made of copper. Furthermore, the first cover plate 12 and the second cover plate 22 are respectively disposed on the bottom and top surfaces of the sandwich flow channel plate 21, and the first cover plate 12 and the second cover plate 22 are welded to the sandwich flow channel plate 21.

[0078] Specifically, such as Figure 1As shown, the second cover plate 22, the sandwich flow channel plate 21, the first cover plate 12 and the shell 11 are stacked in a welding fixture for integral diffusion welding from top to bottom. The welding fixture is equipped with a pressure device that can tightly press the second cover plate 22, the sandwich flow channel plate 21, the first cover plate 12 and the shell 11 together.

[0079] During the pressing process, the bottom surface of the second cover plate 22 abuts against the top surface of the interlayer flow channel plate 21. Specifically, the four periphery of the bottom surface of the second cover plate 22 abuts against the bottom edge 2123 of the first receiving area 212, and the middle part of the bottom of the second cover plate 22 abuts against the bottom surface of the first receiving area 212.

[0080] The bottom surface of the sandwich flow channel plate 21 abuts against the top surface of the first cover plate 12; and the bottom surface of the second receiving area 213 abuts against the top surfaces of the heat dissipation fins 121 and the protrusions 122.

[0081] The bottom surface of the first cover plate 12 abuts against the top surface of the housing 11. Specifically, the periphery of the bottom surface of the first cover plate 12 abuts against the side wall 115 of the housing 11, and the bottom surface of the first cover plate 12 abuts against the multiple support columns 112 on the top surface of the housing 11.

[0082] The protruding post 122 is welded to at least a portion of the sandwich flow channel plate 21, and the protruding post 122 and the sandwich flow channel plate 21 are welded together by diffusion welding. The top surface of the protruding post 122 can effectively support the bottom surface of the second receiving area 213 of the sandwich flow channel plate 21, and there is no deformation or collapse between them during the diffusion welding process, thereby solving the problem of flow channel blockage caused by the overflow of solder and brazing material during the existing VC cold plate brazing process. For example, the second cover plate 22, the sandwich flow channel plate 21, the first cover plate 12 and the shell 11 can all be made of copper or aluminum; the second cover plate 22, the sandwich flow channel plate 21, the first cover plate 12 and the shell 11 can be connected by integral diffusion welding, laser welding or other welding and connection methods, which are not limited here.

[0083] In the above scheme, the second cover plate 22, the sandwich flow channel plate 21, the first cover plate 12 and the shell 11 made of copper material are more conducive to heat transfer and processing.

[0084] During the use of this heat dissipation device 100, the protruding part at the bottom of the phase change heat spreader 10 is directly in contact with the heating element (not shown). Then, the heat dissipation device 100 together with the heating element (not shown) is installed in the mounting frame (not shown). The fastening members provided in the mounting frame (not shown) press the heat dissipation device 100 and the heating element (not shown) together. Then, the water inlet 23 and the water outlet 25 are connected to the water inlet pipe and the water return pipe of the cooling circulation system, respectively. The cooling circulation system drives the cooling water to enter the flow channel 211 of the liquid cooling plate 20 for circulation and cooling treatment. Meanwhile, the pure water contained in the groove 111 inside the housing 11 of the phase change heat spreader 10 begins to undergo a phase change due to heating. When the temperature rises, the pure water absorbs heat and vaporizes into steam. Then, the gas is condensed into pure water by the first cover plate 12 at the bottom of the liquid cooling plate 20 and at a relatively low temperature, thereby releasing heat. Thus, the liquid cooling plate 20, together with the phase change heat spreader 10, repeatedly carries away the heat from the heating element (not shown) to prevent the heating element (not shown) from being damaged due to excessive temperature.

[0085] In summary, this heat dissipation device 100 uses a second cover plate 22, a sandwich flow channel plate 21, a first cover plate 12, and a shell 11 made of copper material, which are superimposed and welded together to form a combination of a liquid cooling plate 20 and a phase change heat dissipation plate 10. Moreover, because multiple protruding pillars 122 and support pillars 112 are used between the liquid cooling plate 20 and the phase change heat dissipation plate 10, the effective support is improved and the welding area is increased, making the welding connection of the related components of the two more stable and airtight. This solves the problem that the current VC cold plate structure is difficult to transfer heat effectively due to structural collapse during the cooling welding connection process. It can also solve the problem of flow channel blockage caused by solder overflow, reduce the structural collapse or damage of the heat dissipation fins 121 due to welding, thereby improving the efficiency of coolant replacement and phase change, and increasing service life.

[0086] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the scope of protection of the present utility model.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes a phase change heat dissipation plate and a liquid cooling plate stacked together. The phase change heat dissipation plate includes a shell and a first cover plate. The shell and the first cover plate are sealed and welded to form a sealed cavity. The sealed cavity contains a phase change cooling medium. The surface of the first cover plate away from the shell is provided with a plurality of protruding heat dissipation fins and protruding posts. The protruding posts are located between the plurality of heat dissipation fins. The liquid cooling plate includes a sandwich flow channel plate and a second cover plate. The sandwich flow channel plate has a flow channel for coolant to flow. The first cover plate and the second cover plate are respectively disposed on the bottom surface and the top surface of the sandwich flow channel plate. The first cover plate and the second cover plate are welded to the sandwich flow channel plate, and the protruding post is welded to at least a portion of the sandwich flow channel plate.

2. The heat dissipation device according to claim 1, characterized in that, The second cover plate is provided with an inlet and an outlet, and the inlet and outlet are connected to the flow channel.

3. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device also includes a water inlet and a water outlet, which are respectively connected to the liquid inlet and the liquid outlet.

4. The heat dissipation device according to claim 1, characterized in that, The phase change heat spreader also includes a plurality of support columns protruding from the bottom of the housing, one end of which is welded to the first cover plate.

5. The heat dissipation device according to claim 4, characterized in that, The housing is also provided with a recessed groove, and the vertical projection of the protrusion on the housing is located in the groove.

6. The heat dissipation device according to claim 5, characterized in that, The edge of the housing has a protruding sidewall, and a plurality of support columns are disposed in the area between the groove and the sidewall, the height of the sidewall being flush with the height of the plurality of support columns.

7. The heat dissipation device according to claim 1, characterized in that, The top surface of the sandwich flow channel plate is provided with a recessed first receiving area, and the bottom surface of the sandwich flow channel plate is provided with a recessed second receiving area. The flow channel connects the first receiving area and the second receiving area.

8. The heat dissipation device according to claim 1, characterized in that, The flow channel includes an inlet flow channel and an outlet flow channel that are connected to each other.

9. The heat dissipation device according to claim 7, characterized in that, The height of the heat dissipation fins is flush with that of the protrusions. The second receiving area accommodates a plurality of the heat dissipation fins and protrusions, and the bottom surface of the second receiving area abuts against the top surface of the heat dissipation fins and the protrusions.

10. The heat dissipation device according to claim 1, characterized in that, The phase change heat spreader and the liquid cooling plate are made of copper; the protruding post and the sandwich flow channel plate are connected by diffusion welding.

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