Display substrate and display device

Abstract

The utility model discloses a display substrate and a display device. The display substrate comprises a substrate; the driving layer is positioned on one side of the substrate and is provided with a plurality of conductive bonding pads; the light absorption layer is located on the side, away from the substrate, of the driving layer, the orthographic projection of the light absorption layer on the substrate and the orthographic projection of the driving layer on the substrate are overlapped, the light absorption layer is provided with a plurality of first via holes corresponding to the plurality of conductive bonding pads, and the orthographic projection of the first via holes on the substrate and the orthographic projection of the corresponding conductive bonding pads on the substrate are overlapped; the light-emitting units are located on the side, away from the substrate, of the light absorption layer and electrically connected with at least part of the conductive bonding pads through the first via holes; the display substrate further comprises a light transmitting layer and a base material layer which are located on the side, away from the substrate, of the light absorbing layer and sequentially arranged in a stacked mode, the light transmitting layer and the base material layer are continuously distributed film layers, and the light transmitting layer is located between the adjacent light emitting units and located on the side, away from the substrate, of the light emitting units. The display substrate has low reflectivity and high transmittance at the same time, and the application scene is wider.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, and in particular relates to a display substrate and a display device. Background Technology

[0002] In related technologies, the packaging structure of the display substrate uses a blackening layer or a combination of a blackening layer and a gray adhesive layer to make the display substrate have sufficient blackness in the dark state. However, there are often defects such as poor blackness uniformity and low overall transmittance of the display substrate in the dark state.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] This disclosure aims to at least partially solve the technical problems of poor blackness uniformity and low overall transmittance of display substrates in the dark state. To this end, this disclosure provides a display substrate and a display device.

[0005] This disclosure provides a display substrate comprising: a substrate; a driving layer located on one side of the substrate, the driving layer having a plurality of conductive pads; a light-absorbing layer located on the side of the driving layer away from the substrate, wherein the orthographic projection of the light-absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate, and the light-absorbing layer having a plurality of first vias corresponding to the plurality of conductive pads, wherein the orthographic projection of the first vias on the substrate overlaps with the orthographic projection of the corresponding conductive pads on the substrate; and a plurality of light-emitting units located on the side of the light-absorbing layer away from the substrate, the light-emitting units being electrically connected to at least a portion of the conductive pads through the first vias; wherein the display substrate further comprises a light-transmitting layer and a substrate layer sequentially stacked on the side of the light-absorbing layer away from the substrate, the light-transmitting layer and the substrate layer being continuously distributed film layers, the light-transmitting layer being located between adjacent light-emitting units and on the side of the light-emitting units away from the substrate.

[0006] In some embodiments, the surface of the light-transmitting layer facing away from the substrate layer is a plane parallel to the substrate.

[0007] In some embodiments, the material of the substrate layer is any one of polyethylene terephthalate, transparent polyimide, polycarbonate, and glass.

[0008] In some embodiments, the transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit is greater than or equal to 50%.

[0009] In some embodiments, the light-transmitting layer includes scattering particles to scatter the light emitted by the light-emitting unit.

[0010] In some embodiments, the light-transmitting layer is in direct contact with the substrate layer, the light-transmitting layer is in direct contact with the light-emitting unit, and the light-transmitting layer is a single film layer.

[0011] In some embodiments, the light-emitting unit includes a light-emitting diode, and / or the light-emitting unit includes a light-emitting diode, the surface of which is provided with a low-reflection film.

[0012] In some embodiments, the light-emitting unit includes sub-millimeter light-emitting diodes and / or micro light-emitting diodes.

[0013] In some embodiments, the light-transmitting layer and the substrate layer are disposed in contact, and the refractive index of the light-transmitting layer is greater than the refractive index of the substrate layer.

[0014] In some embodiments, the display substrate further includes a first insulating layer located on the side of the light-absorbing layer opposite to the substrate, wherein the refractive index of the light-transmitting layer is greater than the refractive index of the first insulating layer.

[0015] In some embodiments, the refractive index of the substrate layer is in the range of 1.5-1.8, and the refractive index of the light-transmitting layer is in the range of 1.8-2.4; or, the display substrate further includes a first insulating layer located on the side of the light-absorbing layer opposite to the substrate, wherein the refractive index of the light-transmitting layer is greater than the refractive index of the first insulating layer, the refractive index of the substrate layer is in the range of 1.5-1.8, the refractive index of the light-transmitting layer is in the range of 1.8-2.4, and the refractive index of the first insulating layer is in the range of 1.4-1.6.

[0016] In some embodiments, the display substrate further includes an anti-reflective film located on the side of the substrate layer opposite to the substrate; or, the display substrate further includes an anti-glare layer located on the side of the substrate layer opposite to the substrate; or, the display substrate further includes an anti-glare layer and an anti-reflective film located on the side of the substrate layer opposite to the substrate, with the anti-glare film located on the side of the anti-glare layer away from the substrate layer.

[0017] In some embodiments, the antireflective film includes at least two antireflective layers, which are stacked sequentially in an alternating manner of high and low refractive indices, and the refractive index of the antireflective layer adjacent to the substrate layer is greater than that of the substrate layer.

[0018] In some embodiments, within the display area of ​​the display substrate, the orthographic projection of the light-absorbing layer onto the substrate covers the orthographic projection of the portion of the driving layer other than the conductive pads onto the substrate.

[0019] In some embodiments, the display substrate further includes: a first insulating layer located on the side of the light-absorbing layer opposite to the substrate, the first insulating layer having a plurality of second vias corresponding one-to-one with the plurality of first vias, the second vias communicating with the corresponding first vias; wherein the light-emitting unit is electrically connected to the conductive pad through the second vias and the first vias.

[0020] In some embodiments, a portion of the first insulating layer extends into the first via and covers at least a portion of the inner wall of the first via; the first insulating layer includes at least one of an inorganic insulating layer and an organic insulating layer.

[0021] In some embodiments, the first insulating layer includes both an inorganic insulating layer and an organic insulating layer, wherein the inorganic insulating layer is closer to the light-absorbing layer than the organic insulating layer; a portion of the inorganic insulating layer extends into the first via and covers the inner wall of the first via; and / or, a portion of the organic insulating layer extends into the first via and covers the inner wall of the first via.

[0022] In some embodiments, the first insulating layer includes both an inorganic insulating layer and an organic insulating layer, wherein the organic insulating layer is closer to the light-absorbing layer than the inorganic insulating layer; a portion of the inorganic insulating layer extends into the first via and covers the inner wall of the first via; and / or, a portion of the organic insulating layer extends into the first via and covers the inner wall of the first via.

[0023] In some embodiments, the inner wall of the first via is completely covered by the first insulating layer.

[0024] In some embodiments, the thickness of the first insulating layer is 1 μm to 6 μm.

[0025] In some embodiments, the display substrate further includes: a first passivation layer located on the side of the driving layer away from the substrate and on the side of the light-absorbing layer close to the substrate layer, the first passivation layer having a plurality of third vias corresponding to the plurality of conductive pads, wherein the orthographic projection of the third vias on the substrate overlaps with the orthographic projection of the corresponding conductive pads on the substrate.

[0026] In some embodiments, neither the light-transmitting layer nor the substrate layer contains light-absorbing particles.

[0027] This disclosure provides a display device, which includes a driving component and the aforementioned display substrate; wherein the driving component is electrically connected to the driving layer, and the driving component is used to provide a driving signal to the light-emitting unit through the driving layer.

[0028] The embodiments disclosed herein have at least the following beneficial effects:

[0029] In the aforementioned display substrate, on the one hand, the light-absorbing layer is located on one side of the substrate, which makes the thickness of the light-absorbing layer on the substrate more uniform. At the same time, the light-emitting unit is located on the side of the light-absorbing layer away from the substrate, and the orthographic projection of the light-absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate. In this way, the light-absorbing layer can absorb the ambient light incident on the display substrate, so that the degree of reflection of the ambient light incident on the display substrate by the driving layer is low, thereby ensuring that the display substrate has a low reflectivity to ambient light, and can make the display substrate exhibit sufficient blackness and relatively uniform blackness in the dark state. At the same time, it can also improve the transmittance of the light-transmitting layer and the substrate layer, thereby improving the overall transmittance of the display substrate. Furthermore, there is no need to set additional structures such as a gray adhesive layer with low transmittance to assist the light-absorbing layer in the light-emitting direction of the light-emitting unit, thus avoiding the absorption of light emitted by the light-emitting unit, improving the light extraction efficiency of the display substrate, reducing the energy consumption of the display substrate, and also avoiding the blackness fluctuation of the display substrate due to the thickness variation of structures such as the gray adhesive layer, thereby improving the uniformity of the blackness of the display substrate over time. On the other hand, the light-emitting unit is located on the side of the light-absorbing layer away from the substrate. This avoids the light-absorbing layer from blocking the side of the light-emitting unit, which can improve the luminous efficiency of the light-emitting unit and thus improve the overall transmittance of the display substrate to a certain extent, thereby reducing the power consumption of the display substrate. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A top view of a display substrate according to an embodiment of the present disclosure is shown;

[0032] Figure 2 It shows Figure 1 A schematic diagram of the film structure of the display substrate at point AA;

[0033] Figure 3 It shows Figure 1 A simplified diagram of the film layer structure of a display substrate;

[0034] Figure 4 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0035] Figure 5 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0036] Figure 6 A simplified diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0037] Figure 7 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0038] Figure 8 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0039] Figure 9 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0040] Figure 10 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0041] Figure 11 It shows Figure 7 A graph showing the change in refractive index of a display substrate as a function of the thickness of an inorganic insulating layer.

[0042] Figure 12 It shows Figure 8 A graph showing the change in refractive index of a display substrate as a function of the thickness of an inorganic insulating layer.

[0043] Figure 13 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0044] Figure 14 A schematic diagram of the film layer structure of the display substrate is shown in another embodiment of this disclosure;

[0045] Figure 15 A schematic diagram of the film layer structure of a display substrate in the related art is shown.

[0046] Figure label:

[0047] 100, Substrate; 200, Driving layer; 201, First metal layer; 202, Second metal layer; 300, Light-absorbing layer; 400, Light-emitting unit; 401, LED; 402, Driving chip; 500, Light-transmitting layer; 500', Light-transmitting layer; 600, Substrate layer; 700, Anti-reflective film; 800, Anti-glare layer; 900, First insulating layer; 901, Inorganic insulating layer; 902, Organic insulating layer; 1000, First passivation layer; 1100, Second insulating layer; 1101, First inorganic protective layer; 1102, Organic planarization layer; 1103, Second inorganic protective layer; 1200, Second passivation layer; 10, Substrate and film layer between substrate and light-absorbing layer; S, Conductive pad; V1, First via; V2, Second via; V3, Third via. Detailed Implementation

[0048] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this disclosure.

[0049] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this disclosure. Such repetition is for simplification and clarity purposes and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this disclosure provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0050] This disclosure is described below with reference to the accompanying drawings and specific embodiments:

[0051] The packaging structure of the display substrate is used to protect the light-emitting unit, adjust the blackness of the display substrate and the light pattern of the light-emitting chip. The transmittance and blackness uniformity of the display substrate are key issues to be addressed in the packaging.

[0052] In related technologies, a blackening layer or a combination of a blackening layer and a gray adhesive layer is used in the packaging structure of the display substrate to absorb at least a portion of the ambient light incident on the display substrate, reducing the reflection of ambient light and ensuring sufficient blackness in the dark. For example, in a light-emitting diode (LED) display substrate, a relatively thick blackening layer needs to be formed between adjacent LEDs by applying a black base coat to ensure sufficient blackness in the dark. The thickness of the blackening layer typically needs to reach about 20 μm. On the one hand, the uniformity of the thickness of the blackening layer formed by applying a black base coat is poor, resulting in poor blackness uniformity of the display substrate. On the other hand, a thick blackening layer will block the side light emission of the LEDs, reducing the light emission rate of the display substrate by about 30%, making it difficult for the overall transmittance of the display substrate to exceed 70%. Therefore, achieving the desired brightness requires greater power consumption, resulting in higher energy consumption of the display substrate. In addition, due to the thick blackening layer, it is not suitable for smaller micro light-emitting diodes (Micro LEDs). For example, in LED display substrates, in addition to setting a blackening layer, a gray adhesive layer needs to be set on the side of the blackening layer away from the substrate, so that the gray adhesive layer wraps the LED. That is, the gray adhesive layer is located between adjacent LEDs and on the side of the LED away from the substrate 100. This encapsulation structure can make the display substrate have sufficient blackness through the blackening layer and the gray adhesive layer together, and can improve the overall transmittance of the display substrate by minimizing the thickness of the film layer on the LED light-emitting side. However, even a small fluctuation in the thickness of the film layer on the LED light-emitting side will cause a large fluctuation in the transmittance of the display substrate. The fluctuation in transmittance will result in poor blackness uniformity of the display substrate in the dark state, and will also cause certain differences in brightness at a large viewing angle in the bright state. It is necessary to strictly control the transmittance of each film layer of the display substrate, which will affect the utilization rate of each film layer and the product yield. In addition, during the manufacturing process of this encapsulation structure, the blackening layer needs to be pressed towards the light-emitting side of the LED, and the LED pierces the blackening layer to make the blackening layer located on one side of the substrate 100. The smaller Micro LED is not easy to pierce the blackening layer, so this encapsulation structure is also not suitable for the smaller Micro LED display substrate. For example, in the LED 401 display substrate, in addition to setting a blackening layer, a gray adhesive layer needs to be set on the side of the LED away from the substrate. In order to ensure the blackness of the display substrate, the transmittance of the gray adhesive layer is low, resulting in a low overall transmittance of the display substrate, which greatly limits the improvement of the overall transmittance of the display substrate.

[0053] As can be seen from the above analysis, in related technologies, when the display substrate achieves sufficient blackness in the dark state through the packaging structure, it often cannot simultaneously ensure the uniformity of blackness and the overall transmittance of the display substrate in the dark state. This results in a decrease in the light emission rate of the display substrate, requiring greater power consumption to achieve the set brightness, leading to higher energy consumption of the display substrate.

[0054] To address the issue of low overall transmittance of display substrates, this disclosure proposes a display substrate, such as... Figures 1 to 10 As shown, a display substrate according to an embodiment of the present disclosure may include a substrate 100, a driving layer 200, a light-absorbing layer 300, a plurality of light-emitting units 400, a light-transmitting layer 500, and a substrate layer 600.

[0055] The driving layer 200 in the display substrate may be located on one side of the substrate 100, and the driving layer 200 may have multiple conductive pads S. Optionally, the driving layer 200 may include metal signal lines with high reflectivity.

[0056] The light-absorbing layer 300 in the display substrate can be located on the side of the driving layer 200 away from the substrate 100. The orthographic projection of the light-absorbing layer 300 on the substrate 100 overlaps with the orthographic projection of the driving layer 200 on the substrate 100, and the light-absorbing layer 300 can have a plurality of first vias V1 corresponding to a plurality of conductive pads S, and the orthographic projection of each first via V1 on the substrate 100 can overlap with the orthographic projection of the corresponding conductive pad S on the substrate 100. The first via V1 ensures that the light-absorbing layer 300 does not block the conductive pad S, allowing the conductive pad S to be electrically connected to the light-emitting unit 400. Therefore, the light-absorbing layer 300 can be formed on the substrate 100 before the light-emitting unit 400, resulting in a more uniform thickness of the light-absorbing layer 300 on the substrate 100. The light-absorbing layer 300 absorbs ambient light incident on the display substrate, reducing the degree of reflection of ambient light incident on the display substrate by the driving layer 200. This ensures a low reflectivity of the display substrate to ambient light, enabling the display substrate to exhibit sufficient and uniform blackness in the dark. Furthermore, when subsequently setting the light-emitting unit 400, it is not necessary to fabricate the display substrate by having the light-emitting unit 400 pierce the light-absorbing layer 300, simplifying the display substrate fabrication process, reducing costs, and improving product yield.

[0057] Multiple light-emitting units 400 in the display substrate can all be located on the side of the light-absorbing layer 300 facing away from the substrate 100. This avoids the light-absorbing layer 300 from blocking the sides of the light-emitting units 400, improving the luminous efficiency of the light-emitting units 400, and thus improving the overall transmittance of the display substrate to a certain extent, reducing the power consumption of the display substrate. At the same time, the light-emitting units 400 can be electrically connected to at least a portion of the conductive pads S through the first via V1. That is, the conductive pads S in the driving layer 200 can be electrically connected to the light-emitting units 400 through the first via V1, thereby electrically connecting the driving layer 200 and the light-emitting units 400, so that the driving layer 200 in the display substrate can drive the light-emitting units 400 to emit light.

[0058] It should be noted that the portion of the display substrate located below the plurality of light-emitting units 400 can be considered as a driving backplane in the display substrate. That is, the driving backplane may include a substrate 100, and a driving layer 200 and a light-absorbing layer 300 located on one side of the substrate 100. All the plurality of light-emitting units 400 in the display substrate can be disposed on the driving backplane. Here, "below the plurality of light-emitting units 400" refers to the side opposite to the light emission direction of the plurality of light-emitting units 400.

[0059] The light-transmitting layer 500 in the display substrate can be located on the side of the light-absorbing layer 300 away from the substrate 100. The light-transmitting layer 500 is a continuously distributed film layer, and the light-transmitting layer 500 can be located between adjacent light-emitting units 400 and on the side of the light-emitting unit 400 away from the substrate 100. In other words, the light-transmitting layer 500 can wrap around the light-emitting unit 400 and cover the side of the light-absorbing layer 300 away from the substrate 100. The light-transmitting layer 500 can protect the light-emitting unit 400 and the light-absorbing layer 300 below it, and isolate the light-absorbing layer 300 and the light-emitting unit 400 from the outside air and / or water vapor to avoid water and oxygen corrosion. The light-transmitting layer 500 can also facilitate the subsequent setting of film layer structures such as the substrate layer 600. In addition, compared with the encapsulation structure of the light-emitting unit 400 wrapped by the gray adhesive layer, the light-transmitting layer 500 in the display substrate of this embodiment has a higher transmittance. The transmittance of the light-transmitting layer 500 fluctuates less when the thickness changes, which can avoid, to a certain extent, the defects of poor uniformity of blackness in the dark state and large brightness difference at a large viewing angle in the bright state caused by the transmittance fluctuation.

[0060] In the display substrate, the substrate layer 600 and the light-transmitting layer 500 are stacked. The substrate layer 600 can be located on the side of the light-transmitting layer 500 away from the substrate 100, and the substrate layer 600 is a continuously distributed film layer. The substrate layer 600 can cover the light-transmitting layer 500, thereby effectively protecting the light-transmitting layer 500 and preventing it from being damaged under the impact of external forces.

[0061] In summary, the display substrate proposed in this embodiment has the following characteristics: Firstly, the light-absorbing layer 300 is located on one side of the substrate 100, allowing for a more uniform thickness of the light-absorbing layer 300 on the substrate 100. Secondly, the light-emitting unit 400 is disposed on the side of the light-absorbing layer 300 away from the substrate 100, and the orthographic projection of the light-absorbing layer 300 on the substrate 100 overlaps with the orthographic projection of the driving layer 200 on the substrate 100. This allows the light-absorbing layer 300 to absorb ambient light incident on the display substrate, resulting in a lower degree of reflection of ambient light by the driving layer 200, thereby ensuring a low reflectivity of the display substrate to ambient light. This allows the display substrate to exhibit sufficient and uniform blackness in the dark state. Simultaneously, it improves the transmittance of the light-transmitting layer 500 and the substrate layer 600, thereby increasing the overall transmittance of the display substrate. Furthermore, it eliminates the need for an additional light-absorbing layer 300 with low transmittance, such as a gray adhesive layer, in the light-emitting direction of the light-emitting unit 400. This avoids absorption of light emitted from the light-emitting unit 400, improving the light extraction efficiency of the display substrate, reducing its energy consumption, and preventing fluctuations in blackness due to variations in the thickness of the gray adhesive layer or similar structures. This enhances the uniformity of blackness in the dark state. On the other hand, the light-emitting unit 400 is positioned on the side of the light-absorbing layer 300 away from the substrate 100. This prevents the light-absorbing layer 300 from obscuring the side of the light-emitting unit 400, preserving its luminous efficiency and further improving the overall transmittance of the display substrate while reducing its power consumption.

[0062] It should be noted that the reflectance in this disclosure is the proportion of light reflected after ambient light shines on the display to the incident light. In the embodiments of this disclosure, unless otherwise specified, reflectance generally refers to the overall reflectance of the display substrate, used to describe the blackness of the display substrate in a dark state.

[0063] As an alternative implementation method, such as Figures 2 to 10 As shown, the surface of the light-transmitting layer 500 facing away from the substrate layer 600 is a plane parallel to the substrate 100.

[0064] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, by making the surface of the light-transmitting layer 500 facing away from the substrate layer 600 a plane parallel to the substrate 100, the display substrate can be flattened on the light-emitting side of the light-emitting unit 400, which facilitates the subsequent setting of film layer structures such as the substrate layer 600.

[0065] As an alternative embodiment, the material of the substrate layer 600 is any one of polyethylene terephthalate (PET), colorless polyimide (CPI), polycarbonate (PC), and glass.

[0066] In some embodiments of this disclosure, PET, CPI, PC and glass have certain hardness and strength, and have certain water and oxygen barrier capabilities. Using any one of PET, CPI, PC and glass to prepare the substrate layer 600 can make the substrate layer 600 have certain hardness and strength, which can effectively protect the light-transmitting layer 500 and other structures below the substrate layer 600 in the display substrate, and prevent water and oxygen from eroding the light-emitting unit 400 and other structures.

[0067] As an optional implementation, the transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit 400 is greater than or equal to 50%.

[0068] In some embodiments of this disclosure, optionally, the transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit 400 can be detected by testing instruments such as a spectrometer and a transilluminator. During the detection process, the emitted light intensity A1 of the light-emitting unit 400 can be detected first when both the light-emitting unit 400 on the substrate and the structure on the light-emitting side of the light-emitting unit 400 are present; then, after removing the structure on the light-emitting side of the light-emitting unit 400 on the substrate, the emitted light intensity A2 of the light-emitting unit 400 on the substrate is detected. The transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit 400 is then determined.

[0069]

[0070] For example, the transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit 400 can be 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, etc.

[0071] In some embodiments of this disclosure, optionally, the transmittance of the light-transmitting layer 500 to visible light is greater than or equal to 90%. By making the transmittance of the light-transmitting layer 500 to visible light greater than or equal to 90%, the influence of the light-transmitting layer 500 on the transmittance of the light-emitting unit 400 can be reduced, and the thickness of the light-transmitting layer 500 is not affected by its transmittance, thus ensuring that the display substrate as a whole has a high transmittance.

[0072] In some embodiments of this disclosure, optionally, the transmittance of the light-transmitting layer 500 to visible light is greater than or equal to 75%, and the thickness of the light-transmitting layer 500 is 10 μm to 30 μm greater than the thickness of the light-emitting unit 400 in the same direction. When the transmittance of the light-transmitting layer 500 to visible light is greater than or equal to 75%, the overall transmittance of the display substrate can still meet the usage requirements. However, to avoid the light-transmitting layer 500 being too thick and affecting the overall transmittance of the display substrate, the thickness of the light-transmitting layer 500 can be 10 μm to 30 μm greater than the thickness of the light-emitting unit 400 in the same direction.

[0073] As an alternative implementation, the light-transmitting layer 500 includes scattering particles to scatter the light emitted by the light-emitting unit 400.

[0074] In some embodiments of this disclosure, the light-transmitting layer 500 includes scattering particles, which can cause the emitted light from the light-emitting unit 400 to be scattered on the scattering particles, thereby improving the uniformity of light output in all directions and effectively improving color deviation.

[0075] In some embodiments of this disclosure, the material used to prepare the light-transmitting layer 500 may be selected from at least one of transparent materials such as acrylic resin, epoxy resin, polyurethane resin, and silicone, for example, it may be at least one of polymethyl methacrylate (PMMA) and polyurethane (PU).

[0076] In some embodiments of this disclosure, when the light-transmitting layer 500 includes heat-dissipating particles, the scattering particles can be distributed in the light-transmitting material used to prepare the light-transmitting layer.

[0077] In some embodiments of this disclosure, the scattering particles may be one or more of titanium dioxide, silicon dioxide, and organic polymer particles.

[0078] As an alternative implementation method, such as Figures 2 to 10 As shown, the light-transmitting layer 500 is in direct contact with the substrate layer 600 and the light-emitting unit 400, and the light-transmitting layer 500 is a single film layer.

[0079] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, by making the light-transmitting layer 500 directly contact the substrate layer 600 and the light-emitting unit 400, the light-transmitting layer 500 is a single film layer; on the one hand, it can ensure that the light-transmitting layer 500 and the substrate layer 600 are tightly bonded, preventing water and oxygen from entering the display substrate from between the light-transmitting layer 500 and the substrate layer 600; on the other hand, the light-emitting unit 400 can be wrapped in the light-transmitting layer 500, preventing water and oxygen from corroding the light-emitting unit 400.

[0080] In some embodiments of this disclosure, a semi-solid light-transmitting layer 500 material can be pre-positioned on a substrate layer 600, and then the substrate layer 600 is pressed onto the light-absorbing layer 300 and the light-emitting unit 400 with the light-transmitting layer 500 material facing towards the light-absorbing layer 300 and the light-emitting unit 400. During the pressing process, the semi-solid light-transmitting layer 500 material deforms according to the shape of the light-emitting unit 400, causing the light-transmitting layer 500 material to adhere to the light-emitting unit 400 and the light-absorbing layer 300. After pressing, a curing process can be performed to solidify the semi-solid light-transmitting layer 500 material to form a light-transmitting layer 500 that encapsulates the light-emitting unit 400 and adheres to the light-absorbing layer 300.

[0081] As an alternative implementation method, such as Figures 2 to 10 As shown, the light-emitting unit 400 includes a light-emitting diode 401; and / or, the light-emitting unit 400 includes a light-emitting diode 401, and the surface of the light-emitting diode 401 is provided with a low-reflection film.

[0082] In some embodiments of this disclosure, the light-emitting unit 400 in the display substrate may optionally include a light-emitting diode 401.

[0083] In some embodiments of this disclosure, optionally, the light-emitting unit 400 in the display substrate may include a light-emitting diode 401, the surface of which is provided with a low-reflection film. By providing a low-reflection film on the surface of the light-emitting diode 401, the reflection of ambient light by the light-emitting diode 401 itself can be further reduced, resulting in a lower degree of reflection of ambient light incident on the display substrate by the light-emitting diode 401, further reducing the reflectivity of the display substrate to ambient light, thereby enabling the display substrate to exhibit sufficient blackness and relatively uniform blackness in the dark state.

[0084] In some embodiments of this disclosure, the low-reflection film on the surface of the light-emitting diode 401 can be a multilayer dielectric film, thereby reducing the reflection of external ambient light through the multilayer dielectric.

[0085] In some embodiments of this disclosure, the low-reflection film can be prepared using a metal oxide, which can be selected from any one or more of SiO2, SiNO2, TiO2, Ta2O5, ZrO2, ZnO, SnO2 and ITO.

[0086] In some embodiments of this disclosure, a low-reflection film can be coated and formed on the surface of the light-emitting diode 401; the low-reflection film can also be formed on the surface of the light-emitting diode 401 using dry processes such as atmospheric pressure plasma treatment and chemical vapor deposition; the low-reflection film can also be pre-formed on a carrier using dry processes such as atmospheric pressure plasma treatment and chemical vapor deposition, and then transferred to the surface of the light-emitting diode 401.

[0087] In some embodiments of this disclosure, such as Figure 3 As shown, the light-emitting unit 400 in the display substrate may simultaneously include an LED 401 and a driver chip 402 electrically connected to the LED 401. The driver chip 402 is used to control the light emission of the LED 401, and the driver chip 402 can also control the brightness of the LED 401. At least a portion of the conductive pads S are electrically connected to the driver chip 402, meaning that both the LED 401 and the driver chip 402 need to be electrically connected to the driving layer 200 in the display substrate through the conductive pads S.

[0088] In the following embodiments of this disclosure, the light-emitting unit 400 is illustrated by the example of simultaneously including LED 401 and driver chip 402.

[0089] As an alternative implementation, the light-emitting diode can be a sub-millimeter light-emitting diode and / or a micro light-emitting diode.

[0090] In some embodiments of this disclosure, the light-emitting diode can be a conventionally sized light-emitting diode, or a relatively small sub-millimeter light-emitting diode (Mini LED) and / or a micro light-emitting diode (Micro LED).

[0091] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, since the light-absorbing layer 300 is located on the side of the driving layer 200 away from the substrate 100, and the light-absorbing layer 300 can have multiple first vias V1 corresponding to multiple conductive pads S, the light-emitting diode can be electrically connected to the conductive pads S through the first vias V1. Therefore, the light-absorbing layer 300 can be formed in the display substrate before the light-emitting diode. During the fabrication of the display substrate, the light-emitting diode does not need to pierce the light-absorbing layer 300, so that the display substrate can be used for relatively small Mini LEDs or Micro LEDs.

[0092] In some embodiments of this disclosure, for example, each light-emitting unit 400 may include three light-emitting diodes, namely a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode; wherein the first light-emitting diode can emit green light, the second light-emitting diode can emit blue light, and the third light-emitting diode can emit red light, so that the light-emitting unit 400 can constitute a pixel of the display substrate.

[0093] In some embodiments of this disclosure, for example, each light-emitting unit 400 can be a three-in-one light-emitting diode made using Mini / Micro LED in Package (MIP) technology, that is, a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode are packaged together using MIP technology to form a three-in-one light-emitting diode.

[0094] As an alternative implementation method, such as Figures 6 to 10 As shown, the light-transmitting layer 500 and the substrate layer 600 are in contact, and the refractive index of the light-transmitting layer 500 is greater than the refractive index of the substrate layer 600.

[0095] In some embodiments of this disclosure, such as Figures 6 to 10 As shown, the light-transmitting layer 500 and the substrate layer 600 are in contact. The refractive index of the light-transmitting layer 500 is greater than that of the substrate layer 600. Therefore, the light-transmitting layer 500 and the substrate layer 600 form a phase difference in the display substrate. When ambient light passes through, they can interfere and cancel each other out, thereby reducing the overall reflectivity of the display substrate.

[0096] As an alternative implementation method, such as Figures 6 to 10 As shown, the display substrate also includes a first insulating layer 900 located on the side of the light-absorbing layer 300 away from the substrate 100, and the refractive index of the light-transmitting layer 500 is greater than the refractive index of the first insulating layer 900.

[0097] In some embodiments of this disclosure, such as Figures 6 to 10 As shown, the first insulating layer 900 is located on the side of the light-absorbing layer 300 away from the substrate 100. At the same time, the refractive index of the light-transmitting layer 500 is greater than that of the first insulating layer 900. Therefore, the light-transmitting layer 500 and the first insulating layer 900 form a phase difference in the display substrate. When ambient light passes through, they can interfere and cancel each other out, thereby reducing the overall reflectivity of the display substrate.

[0098] In some embodiments of this disclosure, such as Figures 6 to 10 As shown, the refractive index of the light-transmitting layer 500 can be greater than that of the substrate layer 600, and the refractive index of the light-transmitting layer 500 can also be greater than that of the first insulating layer 900. In the first insulating layer 900, the light-transmitting layer 500 and the substrate layer 600 stacked sequentially in the display substrate, the refractive indices alternate, forming a phase difference. Thus, the first insulating layer 900, the light-transmitting layer 500 and the substrate layer 600 can form an anti-reflection effect that is basically the same as that of a multilayer anti-reflection layer. This achieves the purpose of improving the anti-reflection effect of the display substrate through its own functional film layer structure. When combined with the light-absorbing layer 300, the overall anti-reflection effect of the display substrate can be significantly improved. Therefore, compared with related technologies, the thickness of the light-absorbing layer 300 can be appropriately reduced or the gray adhesive layer and other film layer structures used to reduce reflectivity that affect the overall transmittance of the display substrate can be avoided.

[0099] As an optional implementation, the refractive index of the substrate layer 600 is in the range of 1.5 to 1.8, and the refractive index of the light-transmitting layer 500 is in the range of 1.8 to 2.4; or, the display substrate further includes a first insulating layer 900 located on the side of the light-absorbing layer 300 opposite to the substrate 100, wherein the refractive index of the light-transmitting layer 500 is greater than the refractive index of the first insulating layer 900, the refractive index of the substrate layer 600 is in the range of 1.5 to 1.8, the refractive index of the light-transmitting layer 500 is in the range of 1.8 to 2.4, and the refractive index of the first insulating layer 900 is in the range of 1.4 to 1.6.

[0100] In some embodiments of this disclosure, provided that the refractive index of the light-transmitting layer 500 is greater than the refractive index of the substrate layer 600, the refractive index of the light-transmitting layer 500 can be 1.8 to 2.4; and the refractive index of the substrate layer 600 can be 1.5 to 1.8.

[0101] In some embodiments of this disclosure, the display substrate further includes a first insulating layer 900 located on the side of the light-absorbing layer 300 away from the substrate 100. Provided that the refractive index of the light-transmitting layer 500 is greater than the refractive index of the substrate layer 600 and the refractive index of the light-transmitting layer 500 is greater than the refractive index of the first insulating layer 900, the refractive index of the substrate layer 600 can be 1.5 to 1.8, the refractive index of the light-transmitting layer 500 can be 1.8 to 2.4, and the refractive index of the first insulating layer 900 can be 1.4 to 1.6.

[0102] For example, the refractive index of the light-transmitting layer 500 can be 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, etc.

[0103] For example, the refractive index of the substrate layer 600 can be 1.5, 1.6, 1.7, 1.8, etc.

[0104] For example, the refractive index of the first insulating layer 900 can be 1.4, 1.5, 1.6, etc.

[0105] As an alternative implementation method, such as Figures 4 to 10 As shown, the display substrate also includes an anti-reflective film 700 located on the side of the substrate layer 600 opposite to the substrate 100; or,

[0106] The display substrate also includes an anti-glare layer 800 located on the side of the substrate layer 600 opposite to the substrate 100; or,

[0107] The display substrate also includes an anti-glare layer 800 and an anti-reflection film 700 located on the side of the substrate layer 600 away from the substrate 100. The anti-reflection film 700 is located on the side of the anti-glare layer 800 away from the substrate layer 600.

[0108] In some embodiments of this disclosure, such as Figures 4 to 10As shown, the display substrate may include an anti-reflection (AR) layer located on the side of the substrate layer 600 opposite to the substrate 100. The anti-reflection film 700 can reduce the reflected light of the display substrate. In conjunction with the light-absorbing layer 300, it can reduce the overall reflectivity of the display substrate. On the one hand, after the overall reflectivity of the display substrate is reduced, there is no need to set an auxiliary light-absorbing film layer such as a gray adhesive layer on the light-emitting side of the light-emitting unit 400, which can improve the overall transmittance of the display substrate.

[0109] In some embodiments of this disclosure, such as Figure 4 As shown, the display substrate may include an anti-glare layer 800 (AG) located on the side of the substrate layer 600 opposite to the substrate 100. The anti-glare layer 800 can reduce the glare of the display substrate, making the display substrate more comfortable in strong sunlight; at the same time, it can also improve the transmittance of the display substrate.

[0110] In some embodiments of this disclosure, such as Figure 4 As shown, an anti-reflective film 700 and an anti-glare layer 800 can be simultaneously disposed on the side of the substrate layer 600 away from the substrate 100. The anti-reflective film 700 is located on the side of the anti-glare layer 800 away from the substrate layer 600. Through the functions of the anti-reflective film 700 and the anti-glare layer 800, the overall transmittance of the display substrate can be improved, and the glare of the display substrate can be reduced, making the display substrate more comfortable in strong sunlight. In some embodiments of this disclosure, the anti-reflective film 700 and the anti-glare layer 800 can be formed separately on the side of the substrate layer 600 away from the substrate 100. For example, the anti-glare layer 800 can be formed on the side of the substrate layer 600 away from the substrate 100 by inkjet printing, and then the anti-reflective film 700 can be formed on the side of the anti-glare layer 800 away from the substrate by coating, atmospheric pressure plasma treatment, chemical vapor deposition, or other methods. For example, the anti-glare layer 800 can be formed on the carrier by inkjet printing. Then, the anti-reflective film 700 can be formed on the side of the anti-glare layer 800 away from the carrier by coating, atmospheric pressure plasma treatment, chemical vapor deposition, etc., and then transferred as a whole to the side of the substrate layer 600 away from the substrate 100. In some embodiments of this disclosure, optionally, the anti-glare layer 800 can be formed on the side of the substrate layer 600 away from the substrate 100 by inkjet printing. For example, ink droplets containing compounds that form a fine textured structure to impart anti-glare properties can be jetted onto the transparent substrate layer, forming an anti-glare layer with a fine textured structure on the surface of the substrate layer, thereby forming an anti-glare layer with excellent anti-glare effect, clarity, and visibility.

[0111] In some embodiments of this disclosure, optionally, the compound imparting anti-glare properties may be achieved by employing a photochemically cured resin or a thermosetting resin to achieve the extremely fine structure specified above.

[0112] In some embodiments of this disclosure, optionally, the centerline average roughness (Ra) of the fine uneven structure is 0.05 μm to 5.0 μm. More optionally, the centerline average roughness (Ra) of the fine uneven structure is 0.07 μm to 1 μm; even more optionally, the centerline average roughness (Ra) of the fine uneven structure is 0.1 μm to 5 μm.

[0113] In some embodiments of this disclosure, optionally, using the concave bottom surface of the uneven structure as a reference, the anti-glare film is divided into sections per 100 μm. 2 It has 1 to 50 protrusions, and the height 'a' can be 0.5 μm to 10.0 μm.

[0114] In some embodiments of this disclosure, the concave-convex structure may optionally take the form of a sphere, hemisphere, or cone.

[0115] In some embodiments of this disclosure, by matching the refractive indices of structural layers such as the light-transmitting layer 500, the substrate layer 600, and the anti-reflection film 700 on the substrate, the reflectivity of the display substrate can be reduced, while the transmittance of the light-transmitting layer 500 and the substrate layer 600 can be increased. This allows the transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit 400 to be greater than or equal to 90%. For example, by making the transmittance of the light-transmitting layer 500 to visible light greater than or equal to 90%, the influence of the light-transmitting layer 500 on the transmittance on the light-emitting side of the light-emitting unit 400 can be reduced. Simultaneously, by matching the refractive indices of the anti-reflection film 700, the light-transmitting layer 500, the substrate layer 60, and the anti-reflection film, the overall reflectivity of the display substrate is reduced, thereby ensuring that the transmittance to visible light on the light-emitting side of the light-emitting unit 400 is increased to over 90%. At the same time, while the light-absorbing layer 300 and the anti-reflection film 700 reduce the reflectivity of the display substrate, the matching refractive indices of the light-transmitting layer 500, the substrate layer 60 and the anti-reflection film 700 can further reduce the overall reflectivity of the display substrate, ensuring the blackness and uniformity of the display substrate in the dark state. Thus, the display substrate can balance transmittance and blackness in the dark state, that is, the display substrate has high transmittance, as well as high blackness and blackness uniformity.

[0116] In some embodiments of this disclosure, such as Figures 4 to 10As shown, even if there is a certain difference between the color of the outer surface of LED 401 and the color of the outer surface of driver chip 402, since an anti-reflection film 700 is provided on the side of substrate layer 600 away from substrate 100, the reflectivity of ambient light can be reduced by the anti-reflection film 700, so that the outer surface of LED 401 and the outer surface of driver chip 402 can be made consistent, thereby effectively eliminating the color difference between the outer surfaces of LED 401 and driver chip 402.

[0117] As an alternative implementation method, such as Figure 6 As shown, the antireflective film 700 includes at least two antireflective layers, which are stacked sequentially in an alternating manner of high and low refractive indices, and the refractive index of the antireflective layer adjacent to the substrate layer 600 is greater than the refractive index of the substrate layer 600.

[0118] In some embodiments of this disclosure, such as Figure 6 As shown, the antireflective film 700 includes at least two antireflective layers, which are stacked sequentially in an alternating manner of high and low refractive indices. This means that by using two or more antireflective layers, the antireflective film 700 can achieve its antireflective effect through the principle of light interference. Simultaneously, the refractive index of the antireflective layer adjacent to the substrate layer 600 is greater than that of the substrate layer 600. Therefore, a similar antireflective effect as the antireflective film 700 can be formed between the antireflective layer adjacent to the substrate layer 600 and the substrate layer 600. Thus, the antireflective effect can be achieved using the functional film layer (substrate layer) of the display substrate itself. This reduces the overall reflectivity of the display substrate and also reduces the film thickness on the light-emitting side of the light-emitting unit 400, thereby further improving the transmittance of the display substrate.

[0119] In some embodiments of this disclosure, optionally, the antireflective film 700 may be composed of an antireflective layer with a higher refractive index than the substrate layer 600 and / or the antiglare layer 800, and an antireflective layer with a lower refractive index than the substrate layer 600. For example, the antireflective film 700 may be composed of three or more antireflective layers, with a first antireflective layer, a second antireflective layer, and a third antireflective layer stacked along a direction perpendicular to and away from the substrate layer 600 or the antiglare layer 800, wherein the refractive index of the first antireflective layer is higher than that of the substrate layer 600 and / or the antiglare layer 800, the refractive index of the second antireflective layer is higher than that of the first antireflective layer, and the refractive index of the third antireflective layer is lower than that of the second antireflective layer. Alternatively, the antireflective film 700 may be composed of two or more high-refractive-index antireflective layers and two or more low-refractive-index antireflective layers, with the high-refractive-index and low-refractive-index layers alternating sequentially.

[0120] In some embodiments of this disclosure, such as Figure 6As shown, the reflectivity of the display substrate to ambient light can be effectively reduced by the light-absorbing layer 300 and the anti-reflection film 700 in the display substrate. Simultaneously, by utilizing the refractive index variation among the functional layers such as the first insulating layer 900, the light-transmitting layer 500, and the substrate layer 600 in the display substrate, a certain anti-reflection effect can be achieved through these functional layers. With the cooperation of the functional layers such as the first insulating layer 900, the light-transmitting layer 500, and the substrate layer 600 with the light-absorbing layer 300 and the anti-reflection film 700, the overall anti-reflection effect of the display substrate can be further improved. Therefore, given a high overall anti-reflection effect of the display substrate, it is not necessary to reduce the reflectivity of the display substrate by setting light-absorbing particles in the light-transmitting layer 500 and / or the substrate layer 600, or by adding auxiliary light-absorbing layers. Without resorting to methods such as adding light-absorbing particles or auxiliary light-absorbing layers in the light-transmitting layer 500 and / or the substrate layer 600 to reduce the reflectivity of the display substrate, the light-transmitting layer 500 and / or the substrate layer 600 can have higher transmittance. This means the overall transmittance of each structural layer located on the side of the multiple light-emitting units 400 facing away from the substrate 100 can be appropriately increased. Consequently, the absorption of light emitted from the light-emitting units 400 by the light-transmitting layer 500 and the substrate layer 600 is reduced, resulting in an overall transmittance of over 90% for the display substrate, thus improving its luminous efficiency. Therefore, without requiring a large driving current from the display substrate to the light-emitting units 400, a high overall display brightness can be achieved, effectively reducing the power consumption of the display substrate. Here, specular reflectance refers to a method of expressing color that includes specular reflection.

[0121] As an alternative implementation method, such as Figures 4 to 10 As shown, within the display area of ​​the display substrate, the orthographic projection of the light-absorbing layer 300 on the substrate 100 covers the orthographic projection of the portion of the driving layer 200 other than the conductive pads S on the substrate 100.

[0122] In some embodiments of this disclosure, such as Figures 4 to 10 As shown, within the display area of ​​the display substrate, the orthographic projection of the light-absorbing layer 300 onto the substrate 100 covers the orthographic projection of the portion of the driving layer 200 other than the conductive pads S onto the substrate 100. In other words, by ensuring that the orthographic projection of each first via V1 onto the substrate 100 lies within the orthographic projection of the corresponding conductive pad S onto the substrate 100, the light-absorbing layer 300 can be prevented from obscuring the conductive pads S, facilitating the connection between the light-emitting unit 400 and the conductive pads S. Furthermore, it prevents the area outside the conductive pads S in the driving layer 200 from being uncovered by the light-absorbing layer 300 due to the first via V1 being too large.

[0123] In some embodiments of this disclosure, exemplarily, such as Figures 4 to 10As shown, within the display area of ​​the display substrate, the orthographic projection of the light-absorbing layer 300 on the substrate 100 can cover the orthographic projection of the portion of the driving layer 200, excluding the conductive pads S, on the substrate 100. That is, within the display area of ​​the display substrate, the portion of the driving layer 200, excluding the conductive pads S, is blocked by the light-absorbing layer 300. Since the conductive pads S in the driving layer 200 need to be connected to the light-emitting units 400, these conductive pads S can be blocked by the light-emitting units 400. However, the portion of the driving layer 200 excluding the conductive pads S can include metal signal lines with high reflectivity and will not be blocked by the light-emitting units 400. Therefore, when the light-absorbing layer 300 covers the portion of the driving layer 200 excluding the conductive pads S, the overall reflectivity of the display substrate can be further reduced.

[0124] It should be noted that the display area of ​​a display substrate refers to the area on the front of the substrate that can display images. Typically, the front of a display substrate also includes a non-display area distributed around the display area.

[0125] In some embodiments of this disclosure, the light-absorbing layer 300 in the display substrate may also be distributed in the non-display area of ​​the display substrate.

[0126] As an alternative implementation method, such as Figures 7 to 10 As shown, the display substrate also includes a first insulating layer 900 located on the side of the light-absorbing layer 300 away from the substrate 100. The first insulating layer 900 has a plurality of second vias V2 corresponding to a plurality of first vias V1, and the second vias V2 are connected to the corresponding first vias V1. The light-emitting unit 400 is electrically connected to the conductive pad S through the second vias V2 and the first vias V1.

[0127] In some embodiments of this disclosure, such as Figures 7 to 10 As shown, the display substrate may further include a first insulating layer 900 located on the side of the light-absorbing layer 300 facing away from the substrate 100. The first insulating layer 900 can protect the light-absorbing layer 300 of the display substrate. On the one hand, it can ensure that the light-absorbing layer 300 is not scratched. On the other hand, it can improve the water and oxygen barrier effect of the light-absorbing layer 300, preventing water and oxygen from corroding the light-absorbing layer 300. This can reduce or even avoid the risk that the shielding effect of the light-absorbing layer 300 on the driving layer 200 will deteriorate, thereby improving the overall reliability of the display substrate.

[0128] In some embodiments of this disclosure, such as Figures 7 to 10As shown, the first insulating layer 900 may have a plurality of second vias V2 corresponding one-to-one with the plurality of first vias V1, and each second via V2 in the first insulating layer 900 may be connected to a corresponding first via V1 in the light-absorbing layer 300. In this case, the plurality of light-emitting units 400 in the display substrate may be distributed on the side of the first insulating layer 900 away from the substrate 100, and the light-emitting units 400 may be electrically connected to the conductive pads S through the second vias V2 and the first vias V1.

[0129] As an alternative implementation method, such as Figures 7 to 10 As shown, a portion of the first insulating layer 900 extends into the first via V1 and covers at least a portion of the inner wall of the first via V1; the first insulating layer 900 includes at least one of an inorganic insulating layer 901 and an organic insulating layer 902.

[0130] In some embodiments of this disclosure, such as Figures 7 to 10 As shown, at least a portion of the first insulating layer 900 can extend into the first via V1, and this portion can cover at least a portion of the inner wall of the first via V1. In this case, the portion of the first insulating layer 900 extending into the first via V1 can have a second via V2 communicating with the first via V1, and the orthographic projection of the second via V2 onto the substrate 100 can lie within the orthographic projection of the corresponding first via V1 onto the substrate 100. Thus, the portion of the first insulating layer 900 extending into the first via V1 can protect at least a portion of the inner wall of the first via V1.

[0131] In some embodiments of this disclosure, such as Figures 7 to 10 As shown, exemplarily, the inner wall of the first via V1 of the light-absorbing layer 300 can be completely covered by the first insulating layer 900. That is, the portion of the first insulating layer 900 extending into the first via V1 can completely cover the inner wall of the first via V1. In this case, the light-absorbing layer 300 can be covered at various locations by the first insulating layer 900 to ensure that the light-absorbing layer 300 is not exposed, thereby improving the protection effect of the light-absorbing layer 300.

[0132] In some embodiments of this disclosure, such as Figures 7 to 10As shown, the first insulating layer 900 includes at least one of an inorganic insulating layer 901 and an organic insulating layer 902. That is, there are various types of the first insulating layer 900 in the display substrate. When the first insulating layer 900 in the display substrate simultaneously includes an inorganic insulating layer 901 and an organic insulating layer 902, the second via V2 in the first insulating layer 900 can include a first sub-opening and a second sub-opening that are connected, wherein the first sub-opening is located in the inorganic insulating layer 901 and the second sub-opening is located in the organic insulating layer 902. This disclosure will illustrate the following four cases as examples:

[0133] The first case, such as Figure 7 As shown, by way of example, when the first insulating layer 900 in the display substrate is a single-layer film structure and the first insulating layer 900 is an inorganic insulating layer 901, a portion of the inorganic insulating layer 901 can extend into the first via V1. The portion of the inorganic insulating layer 901 extending into the first via V1 can completely cover the inner wall of the first via V1 to ensure that the light-absorbing layer 300 is not exposed.

[0134] It should be noted that the portion of the inorganic insulating layer 901 located outside the first via V1 can contact the side of the light-absorbing layer 300 facing away from the substrate 100. The portion of the inorganic insulating layer 901 outside the first via V1 can protect the light-absorbing layer 300 from the side facing away from the substrate 100, while the portion of the inorganic insulating layer 901 inside the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1. Because the inorganic insulating layer 901 has good water and oxygen barrier properties, when the light-absorbing layer 300 is wrapped and protected by the inorganic insulating layer 901, the protection effect of the light-absorbing layer 300 can be effectively improved.

[0135] The second scenario, such as Figure 8 As shown, by way of example, when the first insulating layer 900 in the display substrate is a single-layer film structure and the first insulating layer 900 is an organic insulating layer 902, the portion of the organic insulating layer 902 extending into the first via V1 can completely cover the inner wall of the first via V1 to ensure that the light-absorbing layer 300 is not exposed.

[0136] It should be noted that, as Figure 8As shown, the portion of the organic insulating layer 902 located outside the first via V1 can contact the side of the light-absorbing layer 300 facing away from the substrate 100. The portion of the organic insulating layer 902 outside the first via V1 can protect the light-absorbing layer 300 from the side facing away from the substrate 100, while the portion of the organic insulating layer 902 located inside the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1. Because the organic insulating layer 902 can adhere well to the light-absorbing layer 300, the portion of the organic insulating layer 902 extending into the first via V1 can fit tightly against the inner wall of the first via V1. Furthermore, because the organic insulating layer 902 has good flatness, when the organic insulating layer 902 is provided on the side of the light-absorbing layer 300 facing away from the substrate 100, the flatness of that side of the organic insulating layer 902 can be ensured to be good. In this case, the side of the organic insulating layer 902 facing away from the substrate 100 is the outermost side of the driving backplate. Therefore, when multiple light-emitting units 400 are subsequently formed on the driving backplate, it can be ensured that the side of each light-emitting unit 400 facing away from the substrate 100 is flush, so as to ensure a better display effect of the display substrate.

[0137] The third scenario, such as Figure 9 As shown, when the first insulating layer 900 in the display substrate is a double-layer film structure, that is, the first insulating layer 900 simultaneously includes an inorganic insulating layer 901 and an organic insulating layer 902, and the inorganic insulating layer 901 is closer to the light-absorbing layer 300 than the organic insulating layer 902, a portion of the inorganic insulating layer 901 extends into the first via V1 and covers the inner wall of the first via V1, and / or a portion of the organic insulating layer 902 extends into the first via V1 and covers the inner wall of the first via V1.

[0138] In one of the embodiments of this disclosure, in Figure 9 In this example, both the inorganic insulating layer 901 and the organic insulating layer 902 have portions extending into the first via V1. The portion of the inorganic insulating layer 901 extending into the first via V1 completely covers the inner wall of the first via V1, and the portion of the organic insulating layer 902 extending into the first via V1 completely covers the portion of the inorganic insulating layer 901 facing away from the interior of the first via V1. This ensures that the light-absorbing layer 300 is not exposed.

[0139] It should be noted that, as Figure 9As shown, the portion of the inorganic insulating layer 901 located outside the first via V1 can contact the side of the light-absorbing layer 300 facing away from the substrate 100, and the portion of the organic insulating layer 902 located outside the first via V1 can contact the side of the inorganic insulating layer 901 facing away from the substrate 100. Thus, the portions of the inorganic insulating layer 901 and the organic insulating layer 902 located outside the first via V1 can protect the light-absorbing layer 300 from the side of the light-absorbing layer 300 facing away from the substrate 100, and the portions of the inorganic insulating layer 901 and the organic insulating layer 902 located inside the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1. Furthermore, because the organic insulating layer 902 has good flatness, when the organic insulating layer 902 is located on the side of the inorganic insulating layer 901 facing away from the substrate 100, the flatness of the side of the organic insulating layer 902 facing away from the substrate 100 can be guaranteed to be good. In this case, the side of the organic insulating layer 902 facing away from the substrate 100 is the outermost side of the driving backplate. Therefore, when multiple light-emitting units 400 are subsequently formed on the driving backplate, it can be ensured that the side of each light-emitting unit 400 facing away from the substrate 100 is flush, so as to ensure a better display effect of the display substrate.

[0140] In the fourth case, as shown in 10, when the first insulating layer 900 in the display substrate is a double-layer film structure, that is, the first insulating layer 900 simultaneously includes an inorganic insulating layer 901 and an organic insulating layer 902, and the organic insulating layer 902 is closer to the light-absorbing layer 300 than the inorganic insulating layer 901, a portion of the organic insulating layer 902 extends into the first via V1 and covers the inner wall of the first via V1, and / or a portion of the inorganic insulating layer 901 extends into the first via V1 and covers the inner wall of the first via V1.

[0141] In some embodiments of this disclosure, such as Figure 10 As shown, for example, both the organic insulating layer 902 and the inorganic insulating layer 901 have portions extending into the first via V1. The portion of the organic insulating layer 902 extending into the first via V1 completely covers the inner wall of the first via V1, and the portion of the inorganic insulating layer 901 extending into the first via V1 completely covers the portion of the organic insulating layer 902 facing away from the interior of the first via V1. This ensures that the light-absorbing layer 300 is not exposed.

[0142] It should be noted that, as Figure 10As shown, the portion of the organic insulating layer 902 located outside the first via V1 can contact the side of the light-absorbing layer 300 facing away from the substrate 100, and the portion of the inorganic insulating layer 901 located outside the first via V1 can contact the side of the organic insulating layer 902 facing away from the substrate 100. Thus, the portions of the organic insulating layer 902 and the inorganic insulating layer 901 located outside the first via V1 can protect the light-absorbing layer 300 from the side of the light-absorbing layer 300 facing away from the substrate 100, and the portions of the organic insulating layer 902 and the inorganic insulating layer 901 located inside the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1. Because the organic insulating layer 902 can adhere well to the light-absorbing layer 300, the portion of the organic insulating layer 902 extending into the first via V1 can tightly adhere to the inner wall of the first via V1. Furthermore, since the inorganic insulating layer 901 has good water and oxygen barrier capabilities, when the organic insulating layer 902 is covered by the inorganic insulating layer 901, it can ensure that water and oxygen in the external environment will not corrode the internal structure of the display substrate. In this way, the protection effect on the light-absorbing layer 300 can be further improved.

[0143] In some embodiments of this disclosure, the material used to prepare the inorganic insulating layer 901 in the first insulating layer 900 may be selected from silicon nitrides or silicon oxides.

[0144] In some embodiments of this disclosure, the material used to prepare the organic insulating layer 902 in the first insulating layer 900 may be selected from resins.

[0145] In some embodiments of this disclosure, such as Figure 11 and Figure 12 As shown, the thickness variations of the inorganic insulating layer 901 and the organic insulating layer 902 have different effects on the overall reactivity of the display substrate. The thickness variation of the inorganic insulating layer 901 causes greater fluctuations in the overall reactivity of the display substrate. This is because the refractive index of the inorganic insulating layer 901 is generally relatively high. On the one hand, the significant difference in refractive index of the inorganic insulating layer 901 for different wavelengths of light easily leads to dispersion. On the other hand, small fluctuations in the thickness of the inorganic insulating layer 901 at different locations more easily introduce differences in optical path, causing variations in the degree of destructive interference of reflected light, resulting in a reduction in the antireflection effect. The thickness variation of the organic insulating layer 902 has no effect on the overall reactivity of the display substrate. When the first insulating layer 900 in the display substrate is a single-layer film structure, and the first insulating layer 900 can be an organic insulating layer 902, a display substrate with low reflectivity and high inter-layer consistency can be achieved.

[0146] It should be noted that the surface height refers to the height between the substrate 100 and the substrate layer 600.

[0147] As an alternative implementation, the inner wall of the first via V1 is completely covered by the first insulating layer 900.

[0148] In some embodiments of this disclosure, the light-absorbing layer 300 in the display substrate may include black or gray particles such as carbon particles, which enable the light-absorbing layer 300 to have a light-absorbing function.

[0149] In some embodiments of this disclosure, during the fabrication of the display substrate, it is necessary to immerse the substrate in an immersion bath. The solution in the immersion bath (usually an acidic or alkaline solution) may precipitate substances such as carbon particles from the light-absorbing layer 300, thereby contaminating the immersion bath. Therefore, to prevent contamination of the immersion bath, the portion of the first insulating layer 900 extending into the first via V1 must completely cover the inner wall of the first via V1 to ensure that the light-absorbing layer 300 is not exposed. This ensures that when the display substrate is immersed in the immersion bath, the solution in the immersion bath will not precipitate carbon particles from the light-absorbing layer 300, thus preventing contamination of the immersion bath.

[0150] It should be noted that when the light-absorbing layer 300 contains carbon particles, it is typically made of organic materials. In other possible implementations, the light-absorbing layer 300 can also be made of inorganic materials (e.g., metallic materials). When the light-absorbing layer 300 is made of inorganic materials, the portion of the first insulating layer 900 extending into the first via V1 must completely cover the inner wall of the first via V1 to ensure that the light-absorbing layer 300 is not exposed. This ensures that when the display substrate is immersed in the gold plating bath, the solution in the bath will not corrode the sides of the light-absorbing layer 300, thus ensuring good conductivity of the light-absorbing layer 300.

[0151] As an optional implementation, the thickness of the light-absorbing layer 300 is 0.5 μm to 5.0 μm.

[0152] In some embodiments of this disclosure, the thickness of the light-absorbing layer 300 can range from 0.5 μm to 5.0 μm. The greater the thickness of the light-absorbing layer 300, the greater its absorption rate of light.

[0153] For example, the thickness of the light-absorbing layer 300 can be 0.5μm, 0.7μm, 0.9μm, 1.0μm, 1.2μm, 1.5μm, 1.7μm, 1.9μm, 2.0μm, 2.2μm, 2.5μm, 2.7μm, 2.9μm, 3.0μm, 3.2μm, 3.5μm, 3.7μm, 3.9μm, 4.0μm, 4.2μm, 4.5μm, 4.7μm, 4.9μm, 5.0μm, etc.

[0154] In some embodiments of this disclosure, when the light-emitting unit 400 includes a relatively small Mini LED or MicroLED, the thickness of the light-absorbing layer 300 can range from 1.0 μm to 2.0 μm. This thickness range of the light-absorbing layer 300 can meet the light absorption rate requirements of the display substrate, and also reduce the inter-layer height of the display substrate, making the overall display substrate thinner and lighter.

[0155] As an optional implementation, the optical density value of the light-absorbing layer 300 is greater than or equal to 4.

[0156] In some embodiments of this disclosure, the optical density (OD) value of the light-absorbing layer 300 is greater than or equal to 4. The OD value of the light-absorbing layer 300 is used to represent the degree of light absorption by the light-absorbing layer 300. The larger the OD value of the light-absorbing layer 300, the greater its light absorption rate.

[0157] As an alternative implementation method, such as Figures 6 to 10 As shown, the thickness of the first insulating layer 900 satisfies:

[0158]

[0159] Where, d p k is the thickness of the first insulating layer. p λ is 0 or a positive integer. p For the wavelength of the incident light in the first insulating layer, n p is the refractive index of the first insulating layer.

[0160] In some embodiments of this disclosure, when the optical path difference between two reflected beams generated on either side of a film layer is one-quarter wavelength, the two reflected beams can interfere destructively, achieving an anti-reflection effect. For example... Figures 6 to 10 As shown, by making the thickness of the first insulating layer 900 satisfy... The reflected light generated on both sides of the first insulating layer 900 can interfere and cancel each other out, achieving an anti-reflection effect, thereby reducing the reflectivity of the display substrate to a certain extent. Under this premise, the transmittance of the film layer on the light-emitting side of the light-emitting unit 400 in the display substrate can be increased, thereby improving the overall transmittance of the display substrate.

[0161] As an alternative implementation method, such as Figures 6 to 10 As shown, the thickness of the first insulating layer 900 is 1μm to 6μm.

[0162] In some embodiments of this disclosure, such as Figures 6 to 10 As shown, the thickness of the first insulating layer 900 can be 1μm to 6μm. Within this thickness range, the first insulating layer 900 can effectively protect the light-absorbing layer 300 it covers.

[0163] For example, the thickness of the first insulating layer 900 can be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, etc.

[0164] In some embodiments of this disclosure, such as Figures 6 to 10 As shown, with the thickness of the first insulating layer 900 ranging from 1 μm to 6 μm, it can simultaneously satisfy... This ensures that the first insulating layer 900 can effectively protect the light-absorbing layer 300 and also reduce reflection, thereby lowering the overall reflectivity of the display substrate.

[0165] In some embodiments of this disclosure, such as Figures 6 to 10 As shown, the thickness of the first insulating layer 900 can be 1μm to 3μm. While ensuring that the first insulating layer 900 protects the light-absorbing layer 300, the thinner the first insulating layer 900, the better, thus allowing for a smaller overall thickness of the display substrate.

[0166] As an alternative implementation method, such as Figures 2 to 10 As shown, the thickness of the light-transmitting layer 500 satisfies:

[0167]

[0168] Where dt is the thickness of the light-transmitting layer, kt is 0 or a positive integer, λt is the wavelength of the incident light through the light-transmitting layer, and nt is the refractive index of the light-transmitting layer; the thickness of the 600 substrate layer satisfies:

[0169]

[0170] Where de is the thickness of the substrate layer, ke is 0 or a positive integer, λe is the wavelength of the incident light on the substrate layer, and ne is the refractive index of the substrate layer.

[0171] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, by making the thickness of the light-transmitting layer 500 satisfy... The thickness of the substrate layer 600 meets the requirements. The reflected light generated on both sides of the light-transmitting layer 500 can interfere and cancel each other out, and the reflected light generated on both sides of the substrate layer 600 can interfere and cancel each other out. Thus, the effect of reducing reflection is achieved by controlling the refractive index and thickness of the first insulating layer 900, the light-transmitting layer 500 and the substrate layer 600.

[0172] It should be noted that, since light of the same frequency has different wavelengths in different media, the wavelength of the incident light in the aforementioned formulas for calculating the thickness of the first insulating layer 900, the light-transmitting layer 500, and the substrate layer 600 can be based on incident light of the same frequency or on incident light of different frequencies. In specific applications, experiments or simulations can be conducted based on the main application environment of the display substrate to determine the refractive index and thickness of the first insulating layer 900, the light-transmitting layer 500, and the substrate layer 600.

[0173] It should be noted that the thicknesses of the first insulating layer 900, the light-transmitting layer 500, and the substrate layer 600 obtained by the aforementioned formulas for calculating the thicknesses of the first insulating layer 900, the light-transmitting layer 500, and the substrate layer 600 can fluctuate to a certain extent.

[0174] As an alternative implementation method, such as Figures 2 to 10 As shown, the display substrate also includes a first passivation layer 1000 located on the side of the driving layer 200 away from the substrate 100 and on the side of the light-absorbing layer 300 close to the substrate 100. The first passivation layer 1000 has a plurality of third vias V3 corresponding to a plurality of conductive pads S. The orthographic projection of the third vias V3 on the substrate 100 overlaps with the orthographic projection of the corresponding conductive pads S on the substrate 100.

[0175] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, the first passivation layer 1000 is located on the side of the driving layer 200 away from the substrate 100 and on the side of the light-absorbing layer 300 close to the substrate 100. That is, the first passivation layer 1000 is located between the driving layer 200 and the light-absorbing layer 300. The first passivation layer 1000 can ensure that water and oxygen in the external environment will not corrode the driving layer 200 from the side of the driving layer 200 away from the substrate 100, thereby further reducing the probability of the driving layer 200 being oxidized and corroded.

[0176] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, the first passivation layer 1000 has a plurality of third vias V3 corresponding to a plurality of conductive pads S. The orthographic projection of the third vias V3 on the substrate 100 overlaps with the orthographic projection of the corresponding conductive pads S on the substrate 100, which exposes the conductive pads S in the first passivation layer 1000 so that the conductive pads S can be electrically connected to the light-emitting unit 400.

[0177] It should be noted that, as Figures 2 to 10 As shown, the third via V3 can be connected to the first via V1 and the second via V2, so that the light-emitting unit 400 can pass through the second via V2, the first via V1 and the third via V3 in sequence and be electrically connected to the conductive pad S in the driving layer 200.

[0178] As an alternative implementation method, such as Figures 2 to 10 As shown, the orthographic projection of the first passivation layer 1000 on the substrate 100 covers the orthographic projection of the portion of the driving layer 200 other than the conductive pad S on the substrate 100.

[0179] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, by covering the orthogonal projection of the first passivation layer 1000 on the substrate 100 with the orthogonal projection of the part of the driving layer 200 other than the conductive pad S on the substrate 100, the part of the driving layer 200 other than the conductive pad S can be protected, completely isolating the path of water and oxygen in the external environment from the side of the driving layer 200 away from the substrate 100 to erode the driving layer 200.

[0180] As an alternative implementation, neither the light-transmitting layer 500 nor the substrate layer 600 contains light-absorbing particles.

[0181] In some embodiments of this disclosure, neither the light-transmitting layer 500 nor the substrate layer 600 contains light-absorbing particles, which allows both the light-transmitting layer 500 and the substrate layer 600 to have high transmittance. With high transmittance of the light-transmitting layer 500 and the substrate layer 600, the overall transmittance of the display substrate can be high.

[0182] As an alternative implementation method, such as Figures 2 to 10 As shown, the driving layer 200 may include a first metal layer 201 and a second metal layer 202 stacked together. The display substrate also includes a second insulating layer 1100 located between the first metal layer 201 and the second metal layer 202. The first metal layer 201 is closer to the substrate 100 than the second metal layer 202. The first metal layer 201 includes a plurality of first driving signal lines, and the second metal layer 202 includes a second driving signal line and a plurality of conductive pads S. The extension direction of the first driving signal lines intersects the extension direction of the second driving signal lines. Among the plurality of conductive pads S, a portion of the conductive pads S are electrically connected to the second driving signal lines, and another portion of the conductive pads S are electrically connected to the first driving signal lines.

[0183] In some embodiments of this disclosure, such as Figures 2 to 10As shown, the driving layer 200 may include a first metal layer 201 and a second metal layer 202 stacked together, wherein the first metal layer 201 is closer to the substrate 100 than the second metal layer 202. The first metal layer 201 may include multiple first driving signal lines. The second metal layer 202 may include second driving signal lines and multiple conductive pads S. The extension direction of the first driving signal lines may intersect with the extension direction of the second driving signal lines; for example, the extension direction of the first driving signal lines may be perpendicular to the extension direction of the second driving signal lines. Among the multiple conductive pads S in the second metal layer 202, some conductive pads S need to be electrically connected to the second driving signal lines, and other conductive pads S need to be electrically connected to the first driving signal lines.

[0184] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, the display substrate may further include a second insulating layer 1100 located between the first metal layer 201 and the second metal layer 202. The second insulating layer 1100 isolates the first metal layer 201 and the second metal layer 202, ensuring that the first driving signal line in the first metal layer 201 and the second driving signal line in the second metal layer 202 do not short-circuit at their intersection points. For example, the second insulating layer 1100 may have a fourth via, allowing a portion of the structure in the second metal layer 202 to be electrically connected to a portion of the structure in the first metal layer 201 through the fourth via.

[0185] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, optionally, the second insulating layer 1100 in the display substrate may include: a first inorganic protective layer 1101, an organic planarization layer 1102, and a second inorganic protective layer 1103 stacked in a direction perpendicular to and away from the substrate 100. The first inorganic protective layer 1101 may cover the first metal layer 201, and the first inorganic protective layer 1101 has a third sub-aperture; the organic planarization layer 1102 may be located on the side of the first inorganic protective layer 1101 away from the substrate 100, and the organic planarization layer 1102 may have a fourth sub-aperture communicating with the third sub-aperture; the second inorganic insulating layer 901 may be located on the side of the organic planarization layer 1102 away from the substrate 100, and a portion of the second inorganic insulating layer 901 extends into the third and fourth sub-apertures, and can cover the inner walls of the third and fourth sub-apertures, and the portion of the second inorganic insulating layer 901 extending into the third and fourth sub-apertures has a fifth sub-aperture. Therefore, the interconnected third sub-aperture, fourth sub-aperture, and fifth sub-aperture can form the fourth via of the second insulating layer 1100.

[0186] It should be noted that the first inorganic protective layer 1101 isolates water and oxygen from the external environment, preventing them from corroding the first metal layer 201 from the side facing away from the substrate 100, thus effectively reducing the probability of oxidation and corrosion of the first metal layer 201. The organic planarization layer 1102 provides a planarization effect, ensuring the stable formation of the subsequent film structure. As for the second inorganic protective layer 1103, since the subsequent second metal layer 202 needs to be located on the side of the second inorganic protective layer 1103 facing away from the substrate 100, the second inorganic protective layer 1103 ensures that water and oxygen from the external environment do not corrode the second metal layer 202 from the side facing away from the substrate 100, thus effectively reducing the probability of oxidation and corrosion of the second metal layer 202.

[0187] In some embodiments of this disclosure, such as Figures 2 to 10 As shown, optionally, the display substrate may also include a second passivation layer 1200 located on the side of the first metal layer 201 near the substrate 100. The second passivation layer 1200 can ensure that water and oxygen in the external environment will not corrode the first metal layer 201 from the side of the first metal layer 201 near the substrate 100, thereby further reducing the probability of the first metal layer 201 being oxidized and corroded.

[0188] In some embodiments of this disclosure, such as Figure 1 As shown, the light-emitting units 400 in the display substrate can be arranged in multiple rows and columns. Simultaneously, the multiple first driving signal lines within the first metal layer 201 can include multiple sets of first driving signal lines corresponding to the multiple columns of light-emitting units 400, with each set of first driving signal lines electrically connected to a corresponding column of light-emitting units 400. The multiple second driving signal lines within the second metal layer 202 can correspond to multiple rows of light-emitting units 400, with each second driving signal line electrically connected to a corresponding row of light-emitting units 400. The orthographic projection of a column of light-emitting units 400 onto the substrate 100 can overlap with the orthographic projection of a corresponding set of first driving signal lines onto the substrate 100, and a row of light-emitting units 400 can be distributed between two adjacent second driving signal lines.

[0189] In some embodiments of this disclosure, for example, a set of first driving signal lines connected to a row of light-emitting units 400 in the display substrate may include an anode driving signal line, a data signal line and a ground line, and a second driving signal line connected to a row of light-emitting units 400 may be a power signal line.

[0190] In some embodiments of this disclosure, such as Figure 3As shown, the light-emitting unit 400 in the display substrate may include a driver chip 402 and at least one LED 401. In this case, the plurality of metal pads distributed within the second metal layer 202 of the display substrate may include a first pad group for electrical connection with the LED 401 in the light-emitting unit 400, and a second pad group for electrical connection with the driver chip 402 in the light-emitting unit 400. Optionally, the orthographic projection of the first pad group on the substrate 100 may lie within the orthographic projection of the anode drive signal line on the substrate 100; the orthographic projection of the second pad group on the substrate 100 may lie within the orthographic projection of the ground line on the substrate 100. Optionally, the first pad group may include a first conductive pad S and a second conductive pad S; the second pad group may include a third conductive pad S, a fourth conductive pad S, and a fifth conductive pad S.

[0191] A portion of the first driving signal lines in a set of first driving signal lines electrically connected to the light-emitting unit 400 are used for electrical connection with the first conductive pad S in the first pad group. For example, the second metal layer 202 may also include a first transition electrode. The anode driving signal line in this set of first driving signal lines can be electrically connected to the first conductive pad S through the first transition electrode. The second conductive pad S in the first pad group is electrically connected to the third conductive pad S in the second pad group. For example, the second metal layer 202 may also include a second transition electrode. The first conductive pad S can be electrically connected to the third conductive pad S through the second transition electrode.

[0192] Another portion of the first driving signal lines in a set of first driving signal lines electrically connected to the light-emitting unit 400 are used for electrical connection to the fourth conductive pad S in the second pad group. For example, the second metal layer 202 may also include a third transition electrode. The data signal lines in this set of first driving signal lines can be electrically connected to a fourth conductive pad S through a third transition electrode; the ground lines in this set of first driving signal lines can be electrically connected to another fourth conductive pad S through another third transition electrode.

[0193] The second driving signal line, electrically connected to the light-emitting unit 400, is used for electrical connection to the fifth conductive pad S in the second pad group. For example, the second metal layer 202 may also include a fourth transition electrode. The second driving signal line can be electrically connected to the fifth conductive pad S through the fourth transition electrode.

[0194] In some embodiments of this disclosure, for example, the number of LEDs 401 in the light-emitting unit 400 can be three. These three LEDs 401 can be distributed as follows: a red LED 401 for emitting red light, a green LED 401 for emitting green light, and a blue LED 401 for emitting blue light. In this case, the number of first pad groups is also three, and these three first pad groups can be electrically connected to the red LED 401, the green LED 401, and the blue LED 401, respectively.

[0195] In some embodiments of this disclosure, the red LED 401, green LED 401, and blue LED 401 in the light-emitting unit 400 each have two solder feet, which are a positive solder foot and a negative solder foot, respectively. The positive solder foot of the red LED 401 can be soldered to the first conductive pad S in the corresponding first pad group, allowing the positive solder foot of the red LED 401 to be connected to the corresponding anode drive signal line through this first conductive pad S. The negative solder foot of the red LED 401 can be soldered to the second conductive pad S in the corresponding first pad group. The positive solder foot of the green LED 401 can be soldered to the first conductive pad S in the corresponding first pad group, allowing the positive solder foot of the green LED 401 to be connected to the corresponding anode drive signal line through this first conductive pad S. The negative solder foot of the green LED 401 can be soldered to the second conductive pad S in the corresponding first pad group. The positive terminal of the blue LED 401 can be soldered to the first conductive pad S in the corresponding first pad group, so that the positive terminal of the blue LED 401 can be connected to the corresponding anode drive signal line through this first conductive pad S. The negative terminal of the blue LED 401 can be soldered to the second conductive pad S in the corresponding first pad group.

[0196] Meanwhile, the driver chip 402 in the light-emitting unit 400 has six solder pins, namely a power signal input pin, a data signal input pin, a ground pin, and three signal output pins corresponding one-to-one with the three LEDs 401. The three signal output pins of the driver chip 402 can be soldered to the three third conductive pads S in the second pad group. Since the three third conductive pads S are electrically connected to the three second conductive pads S in the three first pad groups, the three signal output pins of the driver chip 402 can be electrically connected to the negative electrode pins of the three LEDs 401. The power signal input pin of the driver chip 402 can be soldered to a fifth conductive pad S in the second pad group, allowing the power signal input pin to be connected to the power signal line (i.e., the second driver signal line) through this fifth conductive pad S. The data signal input pin of the driver chip 402 can be soldered to a fourth conductive pad S in the second pad group, allowing the data signal input pin to be connected to the data signal line through this fourth conductive pad S. The grounding pin of the driver chip 402 can be soldered to another fourth conductive pad S in the second pad group, so that the grounding pin can be connected to the grounding line through this fourth conductive pad S.

[0197] In the above embodiment, when the display substrate needs to control the light-emitting unit 400 to emit light, a power drive signal can be applied to the power signal line electrically connected to the light-emitting unit 400 within the display substrate, and a data drive signal can be applied to the data signal line electrically connected to the light-emitting unit 400. Thus, after the driver chip 402 in the light-emitting unit 400 receives the power drive signal through the power signal input pin, the driver chip 402 can be in a working state. Furthermore, after the driver chip 402 receives the data signal through the data signal input pin, the driver chip 402 can generate three cathode signals corresponding to the three LEDs 401 based on the data signal. These three cathode signals can be transmitted to the negative electrode pins of the three LEDs 401 respectively through three signal output pins. Since the positive electrode of the LED 401 is always connected to the anode signal applied by the anode drive signal line, after the LED 401 receives both the anode and cathode signals, it can emit light of a corresponding intensity.

[0198] It should be noted that, to simplify the wiring structure within the display substrate, at least two of the positive terminals of the red LED 401, green LED 401, and blue LED 401 can be connected to the same anode drive signal line. Since the light-emitting characteristics of the red LED 401 differ significantly from those of the green LED 401 and blue LED 401, while the difference between the green and blue LED 401 is relatively small, the positive terminals of the green and blue LEDs 401 can be connected to the same anode drive signal line, while the positive terminal of the red LED 401 can be connected to different anode drive signal lines. In this case, the first conductive pad S soldered to the positive terminal of the green LED 401 and the first conductive pad S soldered to the positive terminal of the blue LED 401 can be a single integrated structure. That is, the positive electrode pin of the green LED 401 and the positive electrode pin of the blue LED 401 can be soldered to the same first conductive pad S, while the positive electrode pin of the red LED 401 can be soldered to another first conductive pad S.

[0199] In the above embodiments of this disclosure, the light-absorbing layer 300 can be made of either organic materials or conductive metallic materials. Therefore, the embodiments of this disclosure will be illustrated using the following two optional implementation methods as examples:

[0200] In a first alternative implementation, the light-absorbing layer 300 in the display substrate includes an organic film layer made of an organic material with light-absorbing properties.

[0201] In some embodiments of this disclosure, the organic material can be, for example, a Black Matrix (BM) material. That is, the light-absorbing layer 300 can be made of BM material. Because BM material has good light absorption properties, when the light-absorbing layer 300 is made of BM material, the light-absorbing layer 300 has a high degree of absorption of ambient light incident on the display substrate, thereby effectively reducing the reflectivity of the display substrate to ambient light. For example, the BM material may include an organic resin material and multiple carbon particles dispersed within the organic resin material. Here, the degree of light absorption by the BM material can be adjusted by adjusting the concentration of carbon particles filled in the organic resin material.

[0202] It should be noted that the display substrate in this disclosure can serve as a splicing display unit in a video wall. By splicing multiple display substrates, a larger splicing display screen can be obtained. When the display substrate serves as a splicing display unit, it is necessary to ensure that the bezel width of the display substrate is narrow. Therefore, this disclosure requires the driving components to be bonded to the display substrate using a back-mounting method.

[0203] As an optional implementation, the edge region of the side of the substrate 100 facing away from the driving layer 200 includes a bonding region, and the display substrate also includes multiple signal leads located within the bonding region, at least a portion of which are electrically connected to multiple first driving signal lines; wherein, the portion of the light-absorbing layer 300 covered by the bonding region has an auxiliary opening; the display substrate has a blank area, which is a region within the bonding region not covered by the first metal layer 201 and the second metal layer 202; the orthographic projection of the auxiliary opening on the substrate 100 overlaps with the orthographic projection of the blank area on the substrate 100.

[0204] In some embodiments of this disclosure, the edge drive of the side of the substrate 100 in the display substrate facing away from the driving layer 200 may include a bonding region. The display substrate may also include a plurality of signal leads located within the bonding region. Here, at least a portion of the plurality of signal leads may be electrically connected to a plurality of first driving signal lines. For example, a portion of the plurality of signal leads is used to be electrically connected to a plurality of first driving signal lines in the first metal layer 201, and another portion of the plurality of signal leads is used to be electrically connected to a plurality of second driving signal lines in the second metal layer 202.

[0205] It should be noted that the multiple signal leads within the bonding area are used for bonding and connecting with the driving component, enabling the driving component to be bonded to the display substrate. In this way, the driving component can send driving signals to the first and second driving signal lines via the signal leads, causing the corresponding light-emitting units 400 to be illuminated. Here, the driving component is bonded to the back of the display substrate, thus not occupying space on the front of the display substrate, resulting in a higher screen-to-body ratio on the front of the display substrate, and consequently ensuring a narrower bezel width. The horizontally arranged second driving signal lines can be converted into vertically arranged signal lines on the left and right sides of the display substrate. Thus, some of the signal leads arranged in the middle can be electrically connected to multiple first driving signal lines, and some of the signal leads arranged on the sides can be electrically connected to the converted vertically arranged second driving signal lines.

[0206] In some embodiments of this disclosure, the display substrate may, for example, further include multiple connection traces electrically connected to multiple signal leads. A portion of these connection traces is located on the side of the substrate 100 near the driving layer 200, and this portion of the connection traces may be electrically connected to the first driving signal line and the second driving signal line. Another portion of the connection traces is located on the side of the substrate 100, and the end of this portion of the connection traces facing the back of the display substrate may be electrically connected to the corresponding signal lead. The multiple connection traces and the multiple signal leads are formed in the same process. For example, a laser etching process can be used to simultaneously form the multiple connection traces and the multiple signal leads. For example, after the driving backplane is fabricated, a conductive layer can be sputtered in the edge region of the front side of the driving backplane, the side surface of the driving backplane, and the bonding area of ​​the back surface of the driving backplane. Then, a laser etching process can be performed on this conductive layer to simultaneously form multiple connection traces and multiple signal leads.

[0207] It should be noted that during the laser etching process to form multiple signal leads within the bonding area, the bonding area needs to be irradiated with a laser. During this process, the laser may penetrate the substrate 100 and irradiate the portion of the light-absorbing layer 300 covered by the bonding area. If this portion of the light-absorbing layer 300 is not blocked by the metal signal lines in the driving layer 200, bubbling defects are very likely to occur, resulting in low flatness of the light-absorbing layer 300. To reduce the likelihood of bubbling defects in the light-absorbing layer 300, the portion of the light-absorbing layer 300 that can be irradiated by the laser needs to be removed.

[0208] In some embodiments of this disclosure, for example, the portion of the light-absorbing layer 300 of the display substrate covered by the bonding region has an auxiliary opening. The display substrate may have a blank area, which refers to the area within the bonding region that is not covered by the first metal layer 201 and the second metal layer 202. Here, the orthographic projection of the auxiliary opening onto the substrate 100 overlaps with the orthographic projection of the blank area onto the substrate 100. After providing the auxiliary opening in the light-absorbing layer 300, during the process of forming multiple signal leads located within the bonding region using a laser etching process, the laser light passing through the substrate 100 can assist in passing through the opening, thereby reducing the probability of the laser directly irradiating the light-absorbing layer 300, and thus lowering the probability of bubbling in the light-absorbing layer 300.

[0209] It should be noted that the orthographic projection of the auxiliary openings in the light-absorbing layer 300 onto the substrate 100 needs to be within the orthographic projection of the blank area onto the substrate 100. In this case, it can be ensured that the orthographic projection of the auxiliary openings in the light-absorbing layer 300 onto the substrate 100 does not coincide with the orthographic projection of the first metal layer 201 onto the substrate 100, nor with the orthographic projection of the second metal layer 202 onto the substrate 100. Thus, even if the light-absorbing layer 300 is perforated, it can still effectively block the first metal layer 201 and the second metal layer 202, ensuring a low reflectivity of the display substrate to ambient light. Furthermore, during the laser etching process to form multiple signal leads located within the bonding area, the portion of the light-absorbing layer 300 covered by the driving layer 200 will not be irradiated by the laser. This portion of the light-absorbing layer 300 will not exhibit bubble defects; therefore, it is unnecessary to remove this portion of the light-absorbing layer 300.

[0210] In some embodiments of this disclosure, for example, the orthographic projection of the blank area on the substrate 100 completely coincides with the orthographic projection of the auxiliary opening on the substrate 100. In this case, in the portion of the light-absorbing layer 300 covered by the bonding area, any area not covered by the driving layer 200 will be removed. This ensures that no bubbling defects occur in the light-absorbing layer 300.

[0211] In other embodiments of this disclosure, the orthographic projection of the blank area on the substrate 100 may also lie within the orthographic projection of the auxiliary opening of the light-absorbing layer 300 on the substrate 100. This disclosure does not limit the scope of the embodiments.

[0212] In some embodiments of this disclosure, the distance between two adjacent drive signal lines in a set of first drive signal lines is small; for example, the distance between the anode drive signal line and the data signal line in a set of first drive signal lines is only about 15 micrometers. Therefore, during the process of forming multiple signal leads located in the bonding region using laser etching, even though the laser still passes through the substrate 100 and may pass through the area between two adjacent drive signal lines in a set of first drive signal lines before irradiating the light-absorbing layer 300, the small distance between these two adjacent drive signal lines results in low laser energy passing through the area between the two adjacent drive signal lines. Consequently, even if the laser irradiates the light-absorbing layer 300, it will not cause bubbling in the light-absorbing layer 300. Therefore, this portion of the light-absorbing layer 300 does not need to be removed, and because the width of this portion of the light-absorbing layer 300 is small, not removing this portion of the light-absorbing layer 300 can effectively reduce the processing difficulty of the light-absorbing layer 300.

[0213] In some embodiments of this disclosure, for example, auxiliary openings in the light-absorbing layer 300 may be distributed between at least two sets of adjacent first drive signal lines and two adjacent second drive signal lines.

[0214] It should be noted that, since the second drive signal line needs to connect to the conductive pad S in the second pad group via the fourth adapter electrode, and to ensure a small technical capacitance between the fourth adapter electrode and the first drive signal line, the overlap area between the fourth adapter electrode and the first drive signal line needs to be minimized. Therefore, the portion of the fourth adapter electrode arranged vertically will not overlap with the first drive signal line, and this portion of the fourth adapter electrode can be arranged on one side of a set of first drive signal lines. Thus, there are two interconnected sub-apertures between two adjacent sets of first drive signal lines and two adjacent second drive signal lines, with one sub-aperture being wider than the other. The two wider sub-apertures have two sets of first drive signal lines distributed on their sides; while the narrower sub-aperture has the fourth adapter electrode on one side and a set of first drive signal lines on the other side.

[0215] In some embodiments of this disclosure, optionally, the second metal layer 202 in the display substrate may further include an auxiliary grounding line arranged parallel to the second driving signal line. Here, the auxiliary grounding line may be electrically connected to the grounding line in the first metal layer 201, and the orthographic projection of the auxiliary grounding line on the substrate 100 may be located within the orthographic projection of the bonding area on the substrate 100. Specifically, one auxiliary grounding line and an adjacent second driving signal line are distributed between the two rows of light-emitting units 400. The auxiliary openings in the light-absorbing layer 300 may be distributed not only between two sets of adjacent first driving signal lines and two adjacent second driving signal lines, but also between two sets of adjacent first driving signal lines, an auxiliary grounding line, and an adjacent second driving signal line. This further reduces the probability of bubbling defects in the light-absorbing layer 300.

[0216] It should be noted that during the laser etching process to form multiple signal leads located within the bonding area, the laser will not illuminate areas outside the bonding area. Therefore, auxiliary openings are not required for the portions of the light-absorbing layer 300 not covered by the bonding area.

[0217] In the second optional implementation, the light-absorbing layer 300 in the display substrate is conductive, that is, the light-absorbing layer 300 is made of a metallic material.

[0218] In some embodiments of this disclosure, for example, the light-absorbing layer 300 in the display substrate may include a metal reflective layer and a first blackening layer located on the side of the metal reflective layer facing away from the substrate 100. Here, the metal reflective layer is closer to the substrate 100 than the first blackening layer. The metal reflective layer in the light-absorbing layer 300 may be made of a metal material with high light reflectivity. For example, the material of the metal reflective layer may include a molybdenum-niobium alloy. Thus, during the formation of multiple signal leads within the bonding area using a laser etching process, the laser light transmitted through the substrate 100 will irradiate the metal reflective layer in the light-absorbing layer 300, allowing the metal reflective layer to reflect the laser light, thereby effectively avoiding the bubbling phenomenon that occurs when the light-absorbing layer 300 absorbs laser energy.

[0219] The first blackening layer in the light-absorbing layer 300 can be made of a metal oxide material with a high light absorption rate. For example, the material of the first blackening layer may include molybdenum oxynitride (MoO2) or niobium oxynitride (NiO2). In this way, most of the ambient light incident on the display substrate will be absorbed by the first blackening layer, resulting in a low reflectivity of the display substrate to ambient light.

[0220] In some embodiments of this disclosure, when the light-absorbing layer 300 comprises a metal film layer made of a light-absorbing metal material, the light-absorbing layer 300 can also serve as a conductive structure in the display substrate. Since the conductivity of both the metal reflective layer and the first blackening layer in the light-absorbing layer 300 is low, it is necessary to increase the conductivity of the light-absorbing layer 300 to ensure it can better function as a conductive structure in the display substrate. For example, the light-absorbing layer 300 may further include an auxiliary metal layer located between the metal reflective layer and the first blackening layer. Here, the conductivity of the auxiliary metal layer is higher than that of the metal reflective layer, and the reflectivity of the metal reflective layer is higher than that of the auxiliary metal layer. In this way, placing the metal reflective layer with the highest reflectivity on the side closest to the substrate 100 can better reflect the laser; placing the first black light layer with the highest light absorption on the side furthest from the substrate 100 can better absorb ambient light; and placing the auxiliary metal layer with the highest conductivity between the metal reflective layer and the first black light layer can ensure that the overall conductivity of the light-absorbing layer 300 is high, thereby ensuring that the light-absorbing layer 300 can better serve as a conductive structure in the display substrate.

[0221] It should be noted that the light-absorbing layer 300 can serve as different conductive structures within the display substrate to achieve different functions. This disclosure will illustrate embodiments based on the following two possible scenarios:

[0222] One possible scenario is that the light-absorbing layer 300 in the display substrate can be divided into multiple auxiliary signal lines corresponding to multiple first driving signal lines in the first electrode layer. Here, the extension direction of each auxiliary signal line can be parallel to the extension direction of the corresponding first driving signal line, and can be connected in parallel with the corresponding first driving signal line. A first gap exists between two adjacent auxiliary signal lines. This ensures that two adjacent auxiliary signal lines will not short-circuit. In this case, by arranging auxiliary signal lines in parallel with each first driving signal line, the resistance of the first driving signal line can be effectively reduced, making the potential at various locations in the signal transmitted by the first driving signal line essentially consistent.

[0223] In some embodiments of this disclosure, for example, auxiliary signal lines may correspond to the anode driving signal line and the ground line among multiple first driving signal lines. Thus, the anode driving signal line can be connected in parallel to the corresponding auxiliary signal line, and the ground line can also be connected in parallel to the corresponding auxiliary signal line. Since both the anode driving signal line and the auxiliary signal line transmit signals at a fixed potential, when both the anode driving signal line and the auxiliary signal line are connected in parallel to the corresponding auxiliary signal line, it can be ensured that the potential of the signals transmitted on the anode driving signal line and the auxiliary signal line is basically consistent at various locations, thereby ensuring a good driving effect of the driving layer 200 on the light-emitting unit 400.

[0224] It should be noted that since a first passivation layer 1000 is distributed between the light-absorbing layer 300 and the second metal layer 202, the conductive light-absorbing layer 300 can be insulated from the second metal layer 202 through the first passivation layer 1000, so that there will be no short circuit between the auxiliary signal line in the light-absorbing layer 300 and the second driving signal line in the second metal layer 202.

[0225] In some embodiments of this disclosure, the display substrate may have multiple connection vias. The connection vias may sequentially penetrate the first passivation layer 1000 and the second insulating layer 1100 in the display substrate, so that the conductive light-absorbing layer 300 can pass through the connection vias and connect to the first metal layer 201.

[0226] In some embodiments of this disclosure, for example, multiple connection vias are distributed at least on both sides of multiple auxiliary signal lines that are disposed opposite each other. One end of each auxiliary signal line can be electrically connected to a corresponding first drive signal line through at least one connection via, and the other end of each auxiliary signal line can also be electrically connected to a corresponding first drive signal line through at least one connection via. Thus, each auxiliary signal line can be arranged parallel to its corresponding first drive signal line at both ends.

[0227] In other possible implementations, vias are distributed on both sides of each light-emitting unit 400 along the extension direction of the first driving signal line. This increases the parallel position of the auxiliary signal line and the first driving signal line, further reducing the resistance of the first driving signal line. In a first possibility, since the orthographic projection of the first pad group on the substrate 100 lies within the orthographic projection of a first driving signal line on the substrate 100, and the width of the first pad group is approximately equal to the width of this first driving signal line along the extension direction of the second driving signal line, after providing a first opening in the light-absorbing layer 300 corresponding to each conductive pad S in the first pad group, this first opening may disconnect the auxiliary signal line corresponding to this first driving signal line. However, when vias are distributed on both sides of each light-emitting unit 400, even if the first opening disconnects the auxiliary signal line, it can still ensure that each segment of this auxiliary signal line can be paralleled to the first driving signal line.

[0228] In a second possibility, the light-absorbing layer 300 in the display substrate can be divided into multiple parallel first touch signal lines, with a second gap between two adjacent first touch signal lines. This ensures that two adjacent first touch signal lines will not short-circuit.

[0229] As an optional implementation, the display substrate may further include a first insulating layer 900 located on the side of the light-absorbing layer 300 facing away from the substrate 100, and a plurality of second touch signal lines located on the side of the first insulating layer 900 facing away from the substrate 100. The plurality of second touch signal lines may be arranged in parallel, and the extending directions of the second touch signal lines may intersect with the extending directions of the first touch signal lines. For example, the extending directions of the second touch signal lines may be perpendicular to the extending directions of the first touch signal lines. One of the first and second touch signal lines may serve as a touch driving signal line, and the other as a touch sensing signal line. Through the cooperation of the touch driving signal line and the touch sensing signal line, the display substrate can possess touch functionality.

[0230] It should be noted that the extension direction of the first touch signal line can be parallel to the extension direction of the first driving signal line, and the extension direction of the second touch signal line can be parallel to the extension direction of the second driving signal line. Here, the orthographic projection of one first touch signal line on the substrate 100 can cover the orthographic projection of at least one column of light-emitting units 400 on the substrate 100. For example, the orthographic projection of one first touch signal line on the substrate 100 can cover the orthographic projections of two adjacent columns of light-emitting units 400 on the substrate 100.

[0231] In some embodiments of this disclosure, optionally, at least a portion of the second touch signal lines in the display substrate may be mesh-shaped metal signal lines. That is, at least a portion of the second touch signal lines may be provided with a plurality of arrayed mesh holes. For example, each portion of the second touch signal lines may be provided with arrayed mesh holes. In this case, the second touch signal lines are made of metal material, which can ensure good guidance of the second touch signal lines. Furthermore, when each portion of the second touch signal lines is provided with arrayed mesh holes, the area of ​​the orthographic projection of the second touch signal lines on the substrate 100 can be effectively reduced. Thus, even if the second touch signal lines are made of metal material and the second touch signal lines are away from the substrate 100 relative to the light-absorbing layer 300, the reflectivity of the second touch signal lines to ambient light can be kept low, so that the reflectivity of the display substrate to ambient light does not increase significantly.

[0232] In some embodiments of this disclosure, optionally, the display substrate may further include a virtual signal line located between two adjacent second touch signal lines. Here, the extension direction of the virtual signal line may be parallel to the extension direction of the second touch signal line, and at least a portion of the virtual signal line is a grid-like metal signal line. That is, at least a portion of the virtual signal line is provided with an array of grid-like structures. For example, each part of the virtual signal line is provided with an array of grid holes. It should be noted that the distribution density of the grid holes in the virtual signal line may be equal to the distribution density of the grid holes in the second touch signal line. In this way, by setting a virtual signal line between two adjacent second touch signal lines, it can be ensured that the reflectivity of ambient light at all positions on the front of the display substrate is equal, so as to ensure a better effect on the front of the display substrate when no image is displayed. It should be noted that when the distance between two adjacent second touch signal lines is small, it may not be necessary to set a virtual signal line between the two adjacent second touch signal lines.

[0233] In some embodiments of this disclosure, the virtual signal line and the second driving signal line are disposed on the same layer and made of the same material. That is, the virtual signal line and the second driving signal line are formed through the same communication process. In this way, the process difficulty of fabricating the display substrate can be effectively reduced.

[0234] In some embodiments of this disclosure, optionally, at least one of the second touch signal line and the virtual signal line may include: a conductive metal layer and a second blackening layer stacked together. The conductive metal layer is closer to the substrate 100 than the second blackening layer. It should be noted that since the second touch signal line and the virtual signal line are formed simultaneously in a single process, both the second touch signal line and the virtual signal line may include: a conductive metal layer and a second blackening layer stacked together. Thus, the second blackening layer can absorb ambient light incident on the display substrate, further reducing the reflectivity of the second touch signal line and the virtual signal line to ambient light.

[0235] In some embodiments of this disclosure, at least one of the second touch signal line and the virtual signal line may have a hollow structure. The orthogonal projection of the hollow structure onto the substrate 100 may cover the orthogonal projection of the first via V1 onto the substrate 100. Thus, the light-emitting unit 400 can sequentially pass through the hollow structure and the first via V1 and then be electrically connected to the conductive pad S.

[0236] In some embodiments of this disclosure, such as Figure 6 , Figure 8 as well as Figure 13 As shown, exemplarily, the fabrication process of this display substrate can be described as follows:

[0237] The substrate 100 can be made of glass, and the thickness of the substrate 100 can be 0.1mm to 0.5mm, for example, the thickness of the substrate 100 is 0.5mm.

[0238] A silicon nitride layer can be deposited on the substrate 100 as a second passivation layer 1200. The thickness of the second passivation layer 1200 can be 300nm to 700nm, for example, the thickness of the second passivation layer 1200 is 500nm.

[0239] A copper layer can be deposited on the side of the second passivation layer 1200 away from the substrate 100 as the first metal layer 201 (also known as the Gate electrode layer). The thickness of the first metal layer 201 can be 1.0 μm to 3.0 μm.

[0240] To separate the first metal layer 201 from other films such as the second metal layer 202, a silicon nitride layer can be deposited on the side of the first metal layer 201 facing away from the substrate 100 as a first inorganic protective layer 1101. The thickness of the first inorganic protective layer 1101 can be 200 nm to 500 nm, for example, the thickness of the first inorganic protective layer 1101 is 240 nm. Simultaneously, to ensure film planarity, an organic resin layer can be coated on the side of the first inorganic protective layer 1101 facing away from the substrate 100 as an organic planarizing layer. The thickness of the organic planarization layer 1102 can be 2.0 μm to 5.0 μm, for example, the thickness of the organic planarization layer 1102 is 3.5 μm; in order to further enhance the protection of the first metal layer 201, a silicon nitride layer can be deposited on the side of the organic planarization layer 1102 away from the substrate 100 as a second inorganic protective layer 1103. The thickness of the second inorganic protective layer 1103 can be 200 nm to 500 nm, for example, the thickness of the second inorganic protective layer 1103 is 300 nm.

[0241] A copper layer can be deposited on the side of the second inorganic protective layer 1103 away from the substrate 100 as a second metal layer 202 (also known as an SD layer). The thickness of the second metal layer 202 can be 1.0μm to 3.0μm, so that the second metal layer 202 can be used for signal transmission or for forming metal pads.

[0242] To protect the second metal layer 202, a silicon nitride layer can be deposited on the side of the second metal layer away from the substrate 100 as a first passivation layer 1000. The thickness of the first passivation layer 1000 can be 100nm to 300nm, for example, the thickness of the first passivation layer 1000 is 150nm.

[0243] A layer of BM material can be vapor-deposited or coated on the side of the first passivation layer 1000 away from the substrate 100 as a light-absorbing layer 300. The thickness of the light-absorbing layer 300 can be 0.5μm to 5.0μm, for example, the thickness of the light-absorbing layer 300 is 1.5μm.

[0244] To protect the light-absorbing layer 300, an organic insulating layer 902 can be coated on the side of the light-absorbing layer 300 away from the substrate 100 as a first insulating layer 900. The thickness of the first insulating layer 900 can be 1μm to 6μm, and the refractive index of the first insulating layer 900 can be 1.4 to 1.6. For example, the thickness of the first insulating layer 900 is 2.5μm and the refractive index is 1.54.

[0245] The light-emitting unit 400 can then be electrically connected to the metal pad.

[0246] After electrically connecting the light-emitting unit 400 to the metal pads, an optically transparent adhesive can be coated on the side of the light-emitting unit 400 and the first insulating layer 900 facing away from the substrate 100 to form a light-transmitting layer 500 that continuously covers the light-emitting side of the light-emitting unit 400. Simultaneously, the flatness of the optically transparent adhesive can be used to make the surface of the light-transmitting layer 500 facing away from the substrate layer 600 parallel to the plane of the substrate 100. The transmittance of the light-transmitting layer 500 can be above 90%, and the refractive index of the light-transmitting layer 500 can be 1.8 to 2.4. On the side of the light-transmitting layer 500 facing away from the substrate 100, a layer of PET can be bonded using the adhesiveness of the light-transmitting layer 500 (optically transparent adhesive) to form a substrate layer 600. The refractive index of the substrate layer 600 can be 1.5 to 1.8, for example, the refractive index of the substrate layer 600 is 1.65.

[0247] On the side of the substrate layer 600 facing away from the substrate 100, an antireflection film 700 composed of multiple antireflection layers can be attached to reduce the reflectivity of ambient light by utilizing the interference cancellation principle of the antireflection film 700.

[0248] In other embodiments, the light-transmitting layer 500 may be pre-formed on one side of the substrate layer 600, and then the light-transmitting layer 500 and the substrate layer 600 are pressed together onto the first insulating layer 900 and the light-emitting unit 400, and the light-transmitting layer 500 fills the spaces between adjacent light-emitting units 400 by the self-flowing nature of the material; alternatively, the light-transmitting layer 500 may be pre-formed on one side of the substrate layer 600, and the anti-glare layer 800 and the anti-reflective film 700 may be pre-formed on the other side of the substrate layer 600, and then pressed together with the light-transmitting layer 500 and the substrate layer 600 onto the first insulating layer 900 and the light-emitting unit. The light-transmitting layer 500 is filled between adjacent light-emitting units 400 by the self-flowing nature of the light-transmitting layer 500 material; or, the light-transmitting layer 500 can be pre-formed on the carrier layer, and then the light-transmitting layer 500 is pressed onto the first insulating layer 900 and the light-emitting unit 400 by the carrier layer, and is filled between adjacent light-emitting units 400 by the self-flowing nature of the light-transmitting layer 500 material. After the carrier layer is removed, the anti-glare layer 800 and the anti-reflection film 700 are pre-formed on the substrate layer 600 and are attached together with the substrate layer 600 on the side of the light-transmitting layer 500 away from the substrate 100.

[0249] In such Figure 6 , Figure 8 as well as Figure 13In the illustrated embodiment, the reflectivity of the display substrate can be reduced by the light-absorbing layer 300. Simultaneously, the first insulating layer 900, the light-transmitting layer 500, the substrate layer 600, and the anti-reflection film 700 are sequentially stacked. Utilizing the refractive index variation among the first insulating layer 900, the light-transmitting layer 500, the substrate layer 600, and the anti-reflection film 700, the reflectivity of the display substrate can be further reduced. By comprehensively utilizing the light-absorbing layer 300, the first insulating layer 900, the light-transmitting layer 500, the substrate layer 600, and the anti-reflection film 700, the reflectivity of the display substrate can be significantly reduced, and the overall transmittance of the display substrate can be improved, allowing the display substrate to balance dark-state blackness and transmittance.

[0250] In such Figure 13 In the embodiment shown, as described above, the display substrate has a light-absorbing layer 300 on the side of the first passivation layer 1000 away from the substrate 100, and an anti-reflection film 700 and an anti-glare layer on the side of the substrate layer 600 away from the substrate 100. Through experimental verification, the dark state brightness value of the display substrate is 28, and the transmittance reaches 90%.

[0251] In such Figure 14 In the embodiment shown, the display substrate has a light-absorbing layer 300 on the side of the first passivation layer 1000 away from the substrate 100, and only an anti-glare layer on the side of the substrate layer 600 away from the substrate 100. Through experimental verification, the dark state brightness value of the display substrate is 34 and the transmittance reaches 90%.

[0252] In such Figure 15 In the illustrated embodiment, the display substrate has a light-absorbing layer 300 on the side of the first passivation layer 1000 facing away from the substrate 100. However, no anti-reflection film 700 and anti-glare layer are provided on the side of the substrate layer 600 facing away from the substrate 100. Furthermore, the refractive indices of the first insulating layer 900, the light-transmitting layer 500', and the substrate layer 600 are not alternately set, meaning that the first insulating layer 900, the light-transmitting layer 500', and the substrate layer 600 cannot achieve an anti-reflection effect. Under these circumstances, in order to reduce the reflectivity of the display substrate and achieve a dark-state brightness value of 28, the transmittance of the light-transmitting layer 500' (which can also be considered as a gray adhesive layer) needs to be 15%. Due to the low transmittance of the light-transmitting layer 500', the overall transmittance of the display substrate is 45%, which leads to a higher power consumption of the display substrate.

[0253] The above comparative analysis shows that the display substrate disclosed herein, through the combination of the light-absorbing layer 300 with the first insulating layer 900, the light-transmitting layer 500, the substrate layer 600, and the anti-reflection film 700, can enable the display substrate to have reduced reflectivity and high transmittance. Moreover, the manufacturing process is simple, which can achieve higher economic benefits and a wider range of high-brightness application scenarios.

[0254] In summary, the display substrate proposed in this embodiment includes a substrate 100, a driving layer 200, a light-absorbing layer 300, a light-emitting unit 400, a light-transmitting layer 500, and a substrate layer 600. The light-absorbing layer 300 is located on one side of the substrate 100, allowing for a more uniform thickness of the light-absorbing layer 300 on the substrate 100. Simultaneously, the light-emitting unit 400 is disposed on the side of the light-absorbing layer 300 away from the substrate 100, and the orthographic projection of the light-absorbing layer 300 on the substrate 100 overlaps with the orthographic projection of the driving layer 200 on the substrate 100. This allows the light-absorbing layer 300 to absorb ambient light incident on the display substrate, resulting in a lower degree of reflection of ambient light incident on the display substrate by the driving layer 200. This reduces the luminance value (L value) of the display substrate in the dark state to below 34, thereby ensuring sufficient and uniform blackness in the dark state. Furthermore, This design improves the transmittance of the light-transmitting layer 500 and the substrate layer 600, thereby increasing the overall transmittance of the display substrate. Furthermore, it eliminates the need for additional structures such as a gray adhesive layer with low transmittance to assist the light-absorbing layer 300 in the light-emitting direction of the light-emitting unit 400, thus avoiding absorption of light emitted from the light-emitting unit 400. This improves the light extraction efficiency of the display substrate, reduces its energy consumption, and prevents fluctuations in the blackness of the display substrate due to variations in the thickness of structures such as the gray adhesive layer, thereby improving the uniformity of blackness in the dark state. In addition, the light-emitting unit 400 is positioned on the side of the light-absorbing layer 300 away from the substrate 100, preventing the light-absorbing layer 300 from obscuring the side of the light-emitting unit 400 and maintaining its luminous efficiency. This further enhances the overall transmittance of the display substrate and reduces its power consumption. Based on this, the display substrate can also generate an anti-reflection effect by setting an anti-reflection film 700 on the side of the substrate layer 600 away from the substrate 100 and / or by using functional film layers such as the light-transmitting layer 500 and the substrate layer 600. This can further reduce the brightness value (L value) of the display substrate in the dark state to below 28, that is, reduce the specular reflectance (SCI) of the display substrate to below 5.6%, and at the same time increase the overall transmittance of the display substrate to above 80%, thereby significantly reducing the power consumption of the display substrate.

[0255] Based on the same inventive concept, this disclosure also proposes a display device, which includes a driving component and the above-mentioned display substrate; wherein the driving component is electrically connected to the driving layer 200, and the driving component is used to provide a driving signal to the light-emitting unit 400 through the driving layer 200.

[0256] In some embodiments of this disclosure, the display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0257] Since the display device provided by the present invention includes the display substrate of the above-mentioned technical solution, the display device provided by the present invention has all the beneficial effects of the above-mentioned display substrate, which will not be elaborated here.

[0258] In the fabrication process of the above-mentioned display substrate, the light-absorbing layer 300 can be disposed on the substrate 100 before the light-emitting unit 400.

[0259] In some embodiments of this disclosure, the light-absorbing layer 300 is disposed on the substrate 100 before the light-emitting unit 400, so the placement of the light-absorbing layer 300 is not affected by the light-emitting unit 400. On the one hand, the uniformity of the thickness of the light-absorbing layer 300 is not affected by the pre-placement of the light-emitting unit 400 on the substrate 100, thus enabling the light-absorbing layer 300 to have a uniform thickness, thereby making the blackness of the display substrate more uniform in the dark state; on the other hand, in the fabrication process of the display substrate, there is no need to use the fabrication process of the light-emitting unit 400 piercing the light-absorbing layer 300, thereby making the display substrate suitable for relatively small Mini LEDs and MicroLEDs.

[0260] In some embodiments of this disclosure, optionally, the light-absorbing layer 300 can be formed on the substrate 100 by spraying or other means, and then a first via V1 can be formed in the light-absorbing layer 300 by etching process, so that the orthographic projection of the first via V1 on the substrate 100 overlaps with the orthographic projection of the corresponding conductive pad S on the substrate 100, thereby exposing the conductive pad S in the light-absorbing layer 300, so as to facilitate subsequent electrical connection with the light-emitting unit 400.

[0261] In some embodiments of this disclosure, optionally, the light-transmitting layer 500 may be pre-formed on one side of the substrate layer 600, and then the light-transmitting layer 500 and the substrate layer 600 are pressed together onto the first insulating layer 900 and the light-emitting unit 400, and the light-transmitting layer 500 is filled between adjacent light-emitting units 400 by the self-flowing nature of the material.

[0262] In some embodiments of this disclosure, optionally, a light-transmitting layer 500 is pre-formed on one side of a substrate layer 600, and an anti-glare layer 800 and an anti-reflective film 700 are pre-formed on the other side of a substrate layer 600. They are then pressed together with the light-transmitting layer 500 and the substrate layer 600 onto the first insulating layer 900 and the light-emitting unit 400, and are filled between adjacent light-emitting units 400 by the self-flowing nature of the light-transmitting layer 500 material.

[0263] In some embodiments of this disclosure, optionally, the light-transmitting layer 500 may be pre-formed on the carrier layer, and then the light-transmitting layer 500 is pressed onto the first insulating layer 900 and the light-emitting unit 400 through the carrier layer, and is filled between adjacent light-emitting units 400 by the self-flowing nature of the light-transmitting layer 500 material. After the carrier layer is removed, the anti-glare layer 800 and the anti-reflection film 700 are pre-formed on the substrate layer 600 and are attached together with the substrate layer 600 to the side of the light-transmitting layer 500 away from the substrate 100.

[0264] In some embodiments of this disclosure, the functional structural layers such as the substrate 100, driving layer 200, light-emitting unit 400, light-transmitting layer 500, substrate layer 600, anti-reflection film 700, anti-glare layer 800, and first insulating layer 900 in the display substrate can be prepared using conventional preparation methods in the art, and will not be described in detail here.

[0265] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0266] Furthermore, the use of terms such as "first" and "second" in this disclosure is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include one or more features. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0267] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0268] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this disclosure.

[0269] Although embodiments of the present disclosure have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, characterized in that, The display substrate includes: Base; A driving layer located on one side of the substrate, the driving layer having a plurality of conductive pads; A light-absorbing layer located on the side of the driving layer away from the substrate has an orthographic projection on the substrate that overlaps with the orthographic projection of the driving layer on the substrate. The light-absorbing layer has a plurality of first vias corresponding to the plurality of conductive pads, and the orthographic projection of the first vias on the substrate overlaps with the orthographic projection of the corresponding conductive pads on the substrate. Additionally, a plurality of light-emitting units are located on the side of the light-absorbing layer opposite to the substrate, and the light-emitting units are electrically connected to at least a portion of the conductive pads through the first via. The display substrate further includes a light-transmitting layer and a substrate layer that are sequentially stacked on the side of the light-absorbing layer away from the substrate. Both the light-transmitting layer and the substrate layer are continuously distributed film layers. The light-transmitting layer is located between adjacent light-emitting units and on the side of the light-emitting unit away from the substrate.

2. The display substrate as described in claim 1, characterized in that, The surface of the light-transmitting layer facing away from the substrate layer is a plane parallel to the substrate.

3. The display substrate as described in claim 1, characterized in that, The substrate layer is made of any one of polyethylene terephthalate, transparent polyimide, polycarbonate, and glass.

4. The display substrate as described in claim 1, characterized in that, The transmittance of the display substrate to visible light on the light-emitting side of the light-emitting unit is greater than or equal to 50%.

5. The display substrate as described in claim 1, characterized in that, The light-transmitting layer includes scattering particles to scatter the light emitted by the light-emitting unit.

6. The display substrate as described in claim 1, characterized in that, The light-transmitting layer is in direct contact with the substrate layer and the light-emitting unit, and the light-transmitting layer is a single film layer.

7. The display substrate as described in claim 1, characterized in that, The light-emitting unit includes a light-emitting diode, and / or the light-emitting unit includes a light-emitting diode, the surface of which is provided with a low-reflection film.

8. The display substrate as described in claim 1, characterized in that, The light-emitting unit includes sub-millimeter light-emitting diodes and / or micro light-emitting diodes.

9. The display substrate as described in claim 1, characterized in that, The light-transmitting layer and the substrate layer are in contact, and the refractive index of the light-transmitting layer is greater than the refractive index of the substrate layer.

10. The display substrate as claimed in claim 9, characterized in that, The display substrate further includes: A first insulating layer is located on the side of the light-absorbing layer opposite to the substrate, and the refractive index of the light-transmitting layer is greater than that of the first insulating layer.

11. The display substrate as claimed in claim 10, characterized in that, The refractive index of the substrate layer is in the range of 1.5-1.8, and the refractive index of the light-transmitting layer is in the range of 1.8-2.4; or, The display substrate further includes a first insulating layer located on the side of the light-absorbing layer opposite to the substrate, wherein the refractive index of the light-transmitting layer is greater than the refractive index of the first insulating layer, the refractive index of the substrate layer is in the range of 1.5 to 1.8, the refractive index of the light-transmitting layer is in the range of 1.8 to 2.4, and the refractive index of the first insulating layer is in the range of 1.4 to 1.

6.

12. The display substrate according to any one of claims 1 to 11, characterized in that, The display substrate further includes an anti-reflective film located on the side of the substrate layer opposite to the substrate; or, The display substrate further includes an anti-glare layer located on the side of the substrate layer opposite to the substrate; or, The display substrate further includes an anti-glare layer and an anti-reflective film located on the side of the substrate layer away from the substrate, with the anti-reflective film located on the side of the anti-glare layer away from the substrate layer.

13. The display substrate as described in claim 12, characterized in that, The antireflective film includes at least two antireflective layers, which are stacked sequentially in an alternating manner of high and low refractive indices, and the refractive index of the antireflective layer adjacent to the substrate layer is greater than that of the substrate layer.

14. The display substrate according to any one of claims 1 to 11, characterized in that, Within the display area of ​​the display substrate, the orthographic projection of the light-absorbing layer on the substrate covers the orthographic projection of the portion of the driving layer other than the conductive pads on the substrate.

15. The display substrate according to any one of claims 1 to 11, characterized in that, The display substrate further includes: A first insulating layer located on the side of the light-absorbing layer away from the substrate, the first insulating layer having a plurality of second vias corresponding one-to-one with the plurality of first vias, the second vias communicating with the corresponding first vias; The light-emitting unit is electrically connected to the conductive pad through the second via and the first via.

16. The display substrate as claimed in claim 15, characterized in that, A portion of the first insulating layer extends into the first via and covers at least a portion of the inner wall of the first via; the first insulating layer includes at least one of an inorganic insulating layer and an organic insulating layer.

17. The display substrate as claimed in claim 16, characterized in that, The first insulating layer includes both an inorganic insulating layer and an organic insulating layer, wherein the inorganic insulating layer is closer to the light-absorbing layer than the organic insulating layer; A portion of the inorganic insulating layer extends into the first via and covers the inner wall of the first via; And / or, a portion of the organic insulating layer extends into the first via and covers the inner wall of the first via.

18. The display substrate as claimed in claim 16, characterized in that, The first insulating layer includes both an inorganic insulating layer and an organic insulating layer, wherein the organic insulating layer is closer to the light-absorbing layer than the inorganic insulating layer; A portion of the inorganic insulating layer extends into the first via and covers the inner wall of the first via; And / or, a portion of the organic insulating layer extends into the first via and covers the inner wall of the first via.

19. The display substrate as claimed in claim 15, characterized in that, The inner wall of the first via is completely covered by the first insulating layer.

20. The display substrate as claimed in claim 19, characterized in that, The thickness of the first insulating layer is 1 μm to 6 μm.

21. The display substrate according to any one of claims 1 to 11, characterized in that, The display substrate further includes: A first passivation layer is located on the side of the driving layer away from the substrate and on the side of the light-absorbing layer close to the substrate layer. The first passivation layer has a plurality of third vias corresponding to the plurality of conductive pads. The orthographic projection of the third vias on the substrate overlaps with the orthographic projection of the corresponding conductive pads on the substrate.

22. The display substrate according to any one of claims 1 to 11, characterized in that, Neither the light-transmitting layer nor the substrate layer contains light-absorbing particles.

23. A display device, characterized in that, The display device includes a driving component and a display substrate as described in any one of claims 1 to 22; wherein the driving component is electrically connected to the driving layer, and the driving component is used to provide a driving signal to the light-emitting unit through the driving layer.

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