Wafer detaching and pasting integrated transfer table

Abstract

The utility model discloses a wafer detaching and pasting integrated transfer table. The wafer detaching and pasting integrated transfer table comprises a main body frame, a film pasting vacuum table, a rotating bearing, a rotating handle and a vacuum system. Wherein the film pasting vacuum table is located at the top of the main body frame, and a vacuum adsorption hole array is arranged on the surface of the film pasting vacuum table; the rotating bearing is arranged in the main body frame and is fixedly connected with the bottom of the film pasting vacuum table; the rotating handle is arranged on the film pasting vacuum table; the vacuum system comprises a vacuum switch, and the vacuum switch is used for controlling the film pasting vacuum table to release or adsorb the wafer. According to the invention, the efficiency of wafer dismounting and film pasting can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to an integrated wafer transfer station. Background Technology

[0002] In semiconductor wafer fabrication, wafer detachment and film application are key steps that affect production efficiency and product yield.

[0003] In existing technologies, after a complete wafer (such as an 8-inch wafer) is divided into quarter wafers (8K4), it needs to be transferred through wafer cassettes multiple times and multiple electrostatic films are used to isolate the wafers to prevent collisions. The operation is cumbersome and inefficient. Utility Model Content

[0004] This application provides an integrated wafer stripping and bonding transfer station, which can improve the efficiency of wafer stripping and bonding.

[0005] This application provides an integrated wafer transfer station, comprising:

[0006] Main framework;

[0007] A film-applying vacuum stage is located at the top of the main frame, and the surface of the film-applying vacuum stage is provided with an array of vacuum adsorption holes.

[0008] A rotary bearing is disposed within the main frame and fixedly connected to the bottom of the film-applying vacuum stage;

[0009] Rotate the handle, which is mounted on the film-applying vacuum stage;

[0010] A vacuum system, comprising a vacuum switch for controlling the release or adsorption of wafers by the film-attachment vacuum stage.

[0011] The integrated wafer transfer station provided in this application embodiment also includes:

[0012] A heating module is embedded inside the film-applying vacuum stage.

[0013] The integrated wafer transfer station provided in this application embodiment also includes:

[0014] A temperature control system, comprising a temperature display and a temperature adjustment knob, is electrically connected to the heating module.

[0015] In the integrated wafer transfer station provided in this application embodiment, the vacuum system further includes a vacuum pressure gauge, which is used to display the vacuum pressure of the film-attaching vacuum station in real time.

[0016] The integrated wafer transfer station provided in this application embodiment also includes a height adjustment mechanism, which is disposed at the bottom of the main frame.

[0017] In the integrated wafer transfer station provided in the embodiments of this application, the bottom of the height adjustment mechanism is provided with casters, and the casters are equipped with brake devices.

[0018] In the integrated wafer transfer station provided in this application embodiment, the height adjustment mechanism is a hydraulic lifting device or a screw adjustment device.

[0019] In the integrated wafer transfer stage provided in this application embodiment, the rotation angle range of the rotary bearing is 0° to 180°, and it is equipped with an angle locking device.

[0020] In summary, the integrated wafer stripping and bonding transfer stage provided in this embodiment includes a main frame, a film-applying vacuum stage, a rotary bearing, a rotating handle, and a vacuum system. The film-applying vacuum stage is located at the top of the main frame, and its surface is provided with an array of vacuum adsorption holes. The rotary bearing is disposed within the main frame and fixedly connected to the bottom of the film-applying vacuum stage. The rotating handle is disposed on the film-applying vacuum stage. The vacuum system includes a vacuum switch used to control the film-applying vacuum stage to release or adsorb wafers. The integrated wafer stripping and bonding transfer stage provided in this embodiment enables direct film application after wafer stripping, eliminating the redundant steps of "electrostatic film wrapping → wafer cassette transfer → multiple pick-and-place operations" in traditional processes. Therefore, this embodiment can improve the efficiency of wafer stripping and film application. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the integrated wafer transfer station provided in this application.

[0023] Figure 2 This is another structural schematic diagram of the integrated wafer transfer station provided in this application. Detailed Implementation

[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0025] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application and in its specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0026] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0027] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. Devices may be oriented otherwise (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly. Furthermore, terms such as “first,” “second,” etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In existing technologies, after a complete wafer (such as an 8-inch wafer) is divided into quarter wafers (8K4), it needs to be transferred through wafer cassettes multiple times and multiple electrostatic films are used to isolate the wafers to prevent collisions. The operation is cumbersome and inefficient.

[0029] Based on this, embodiments of this application provide an integrated wafer transfer station for both placement and removal. The technical solution described in this application will be explained in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0030] Please see Figure 1 and Figure 2 , Figure 1 and Figure 2 This is a schematic diagram of the integrated wafer stripping and mounting transfer stage provided in this application. The integrated wafer stripping and mounting transfer stage may include a main frame 10, a film-mounting vacuum stage 20, a rotary bearing 30, a rotating handle 40, and a vacuum system 50.

[0031] The main frame 10 serves as the mounting base for other functional modules (such as the film-applying vacuum stage 20 and the rotary bearing 30), ensuring precise alignment and coordinated operation of each functional module.

[0032] In some embodiments, the surface of the main frame 10 may be coated with an antistatic coating (such as conductive paint), or may be made of antistatic engineering plastic (such as PEEK-CA30), with the surface resistance controlled between 10□–10□Ω to avoid static electricity accumulation. It should be noted that the material of the main frame 10 must meet the requirements of high rigidity and low coefficient of thermal expansion (such as aluminum alloy 6061-T6, stainless steel 304) to cope with the mechanical stress and temperature and humidity changes during long-term operation of the equipment.

[0033] In some embodiments, the integrated wafer transfer table may further include a height adjustment mechanism located at the bottom of the main frame 10. This height adjustment mechanism can be a hydraulic lifting device or a screw adjustment device. The bottom of the height adjustment mechanism is equipped with casters, which are equipped with brakes.

[0034] When the height adjustment mechanism is a hydraulic lifting device, it may include a hydraulic cylinder, a piston rod, and a hydraulic pump. In practice, the piston rod can be raised and lowered by the hydraulic pump. The stroke range of the hydraulic cylinder can be set according to actual conditions. The hydraulic system has a built-in pressure sensor that monitors the lifting height in real time and sends feedback to the control panel. Each hydraulic lifting device has a caster wheel at its bottom. The wheel body is made of polyurethane coated material and is equipped with a foot-operated brake device. When the foot is pressed, the wheel rotation is locked, supporting independent locking of a single wheel or simultaneous locking of all four wheels.

[0035] The control panel can integrate height adjustment buttons and a digital display screen. Operators can control the lifting and lowering via the buttons, and the screen displays the current height and level status in real time.

[0036] In practical applications, the hydraulic pump can be started, and the target height can be set through the control panel; the pressure sensor provides real-time height data, and the hydraulic system automatically adjusts to the preset position; after adjustment, the brake device is pressed to fix the position of the transfer platform.

[0037] When the height adjustment mechanism is a screw adjustment device, four sets of mounting slots can be set at the bottom of the main frame 10. Each set of mounting slots is fitted with a precision screw, and a hand crank is connected to the top. The precision screw cooperates with the guide rail to ensure no deviation during the lifting process. The casters can be fixed to the bottom of the precision screw via flanges, and the wheel body is made of polyurethane coated material. The braking device can be a knob-type locking mechanism, which locks the wheel body by rotating clockwise.

[0038] The film-applying vacuum stage 20 is located on the top of the main frame 10, and the surface of the film-applying vacuum stage 20 is provided with an array of vacuum adsorption holes.

[0039] In some embodiments, the lamination vacuum stage 20 may be made of aluminum alloy with an anodized surface and a size adapted to 8K4 wafers. The surface of the lamination vacuum stage 20 may be covered with a scratch-resistant flexible silicone layer, 2mm thick, with a Shore hardness of 30A, to prevent damage to the wafer surface.

[0040] In this embodiment, the integrated wafer transfer station may further include a vacuum system 50, which may include vacuum lines, a vacuum pressure gauge 51, a vacuum switch 52, a vacuum pressure sensor, and a vacuum pump.

[0041] The surface of the film-coating vacuum stage 20 can be uniformly distributed with several micro-vacuum adsorption holes, each with a diameter of 0.5 mm, which are connected to a vacuum pump via internal vacuum tubing. A vacuum pressure sensor is integrated into the vacuum tubing to monitor the adsorption force in real time (range: -80 kPa to -100 kPa) and feed it back to the vacuum pressure gauge 51 to display the vacuum pressure of the film-coating vacuum stage 20 in real time. A vacuum switch 52 can be used to control the release or adsorption of wafers by the film-coating vacuum stage 20.

[0042] In the specific implementation process, after the wafer is removed, it is placed on the film-coating vacuum stage 20. The vacuum pump is started by the vacuum switch 52, and the vacuum adsorption hole generates negative pressure to firmly adsorb the wafer. After the film-coating machine completes the film coating, the vacuum pump is turned off by the vacuum switch 52 to release the vacuum and remove the wafer.

[0043] The rotary bearing 30 is located inside the main frame 10 and is fixedly connected to the bottom of the film-applying vacuum stage 20; the rotating handle 40 is located on the film-applying vacuum stage 20; the rotation angle range of the rotary bearing 30 is 0° to 180°, supports clockwise / counterclockwise bidirectional rotation, and is equipped with an angle locking device.

[0044] In practice, the operator uses the rotating handle 40 to drive the rotating bearing 30 to adjust the film-applying vacuum stage 20 to the desired angle. After confirming the angle, the position is locked using the angle locking device, and vacuum adsorption is initiated for film application. After the operation is completed, the position lock is released, and the stage is rotated back to the initial 0° position.

[0045] In this embodiment, the integrated wafer transfer stage may further include a heating module 60 and a temperature control system 70, wherein the heating module 60 is embedded inside the film-attaching vacuum stage 20. The temperature control system 70 includes a temperature display 72 and a temperature adjustment knob 71, and the temperature control system 70 is electrically connected to the heating module 60.

[0046] In some embodiments, the heating module 60 may employ a ring-shaped arrangement of PTC ceramic heating elements. Thermal grease may be filled between the heating element module and the film-applying vacuum stage 20 to ensure efficient heat transfer to the film-applying vacuum stage 20.

[0047] The temperature display 72 is a digital display screen that can show the current tabletop temperature in real time. The temperature adjustment knob 71 can adopt a rotary encoder design, supporting 0.1℃ step adjustment, and the knob surface is marked with commonly used temperature settings (such as 60℃, 100℃, 150℃).

[0048] This embodiment achieves precise temperature control in the wafer lamination process through the collaborative design of the embedded heating module 60 and the temperature control system 70, solving problems such as film bubbles and warping caused by uneven temperature in traditional processes.

[0049] The following are actual application scenarios of the integrated wafer transfer station provided in the embodiments of this application.

[0050] For example, after the wafer stripping is completed, the integrated wafer stripping and bonding transfer table moves to the outlet of the stripping device via casters, and the height of the table is adjusted by the height adjustment mechanism to align with the discharge port of the stripping device; the operator uses a vacuum pen to directly adsorb the stripped wafer onto the film bonding vacuum stage 20 of the transfer table.

[0051] Next, the integrated wafer transfer station is moved to the laminating machine station and the height is adjusted to match the height of the laminating machine using the height adjustment mechanism. The wafer angle is adjusted to the required direction for lamination (such as 0° or 90°) by rotating the handle 40, and then the position is fixed by the angle locking device. Finally, the laminating machine is started to complete the lamination. The entire process does not require wafer box turnover and saves the use of 5 electrostatic films.

[0052] Experiments have shown that the integrated wafer stripping and bonding transfer station provided in this application embodiment can reduce the number of steps in the wafer stripping and bonding process from 17 to 6, shortening the operation time by 40%; and reducing the wafer breakage rate from 0.5% to 0.1%.

[0053] In summary, the integrated wafer stripping and bonding transfer station provided in this embodiment includes a main frame 10, a film-applying vacuum stage 20, a rotary bearing 30, a rotating handle 40, and a vacuum system 50. The film-applying vacuum stage 20 is located at the top of the main frame 10, and its surface is provided with an array of vacuum adsorption holes. The rotary bearing 30 is disposed within the main frame 10 and fixedly connected to the bottom of the film-applying vacuum stage 20. The rotating handle 40 is disposed on the film-applying vacuum stage 20. The vacuum system 50 includes a vacuum switch 52, which controls the film-applying vacuum stage 20 to release or adsorb wafers. The integrated wafer stripping and bonding transfer station provided in this embodiment enables direct film application after wafer stripping, eliminating the reliance on wafer cassette turnover and electrostatic film, achieving seamless integration of the entire process from "dicing → stripping → film application," and eliminating the redundant steps of "electrostatic film wrapping → wafer cassette transfer → multiple pick-and-place operations" in traditional processes. Therefore, this embodiment can improve the efficiency of wafer stripping and film application.

[0054] The above provides a detailed description of the integrated wafer transfer station provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of this application. At the same time, those skilled in the art will have changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A wafer transfer station integrating wafer mounting and dismounting, characterized in that, include: Main framework; A film-applying vacuum stage is located at the top of the main frame, and the surface of the film-applying vacuum stage is provided with an array of vacuum adsorption holes. A rotary bearing is disposed within the main frame and fixedly connected to the bottom of the film-applying vacuum stage; Rotate the handle, which is mounted on the film-applying vacuum stage; A vacuum system, comprising a vacuum switch for controlling the release or adsorption of wafers by the film-attachment vacuum stage.

2. The integrated wafer transfer station as described in claim 1, characterized in that, Also includes: A heating module is embedded inside the film-applying vacuum stage.

3. The integrated wafer transfer station as described in claim 2, characterized in that, Also includes: A temperature control system, comprising a temperature display and a temperature adjustment knob, is electrically connected to the heating module.

4. The integrated wafer transfer station as described in claim 1, characterized in that, The vacuum system also includes a vacuum pressure gauge, which is used to display the vacuum pressure of the film-applying vacuum stage in real time.

5. The integrated wafer transfer station as described in claim 1, characterized in that, It also includes a height adjustment mechanism, which is located at the bottom of the main frame.

6. The integrated wafer transfer station as described in claim 5, characterized in that, The bottom of the height adjustment mechanism is equipped with casters, and the casters are equipped with brakes.

7. The integrated wafer transfer station as described in claim 5, characterized in that, The height adjustment mechanism is a hydraulic lifting device or a screw adjustment device.

8. The integrated wafer transfer station as described in claim 1, characterized in that, The rotary bearing has a rotation angle range of 0° to 180° and is equipped with an angle locking device.

Images