Wafer loading equipment

Abstract

The utility model provides wafer loading equipment. The wafer loading equipment comprises a cantilever paddle and a protective layer located on the surface of the cantilever paddle, the cantilever paddle comprises an arc-shaped groove for placing a wafer basket, and a plurality of wafers are placed in the wafer basket; when the wafer basket is placed in the groove, the outer surface, close to the cantilever paddle, of the wafer basket is at least partially attached to the groove; the outer diameter of the protective layer is the same as the inner diameter of the groove, and the protective layer is used for covering the groove; and the protective layer is detachably connected with the cantilever paddle. The protection layer is arranged on the surface of the cantilever paddle, so that the problem of quick loss of the silicon carbide cantilever paddle in high-temperature, corrosion and mechanical shock environments is solved, the service life of the cantilever paddle is prolonged, and meanwhile, the stability of wafer loading equipment during operation is improved.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing technology, and more specifically, to a wafer loading device. Background Technology

[0002] Currently, silicon carbide (SiC) is widely used in semiconductor manufacturing, glass production, and high-temperature material handling due to its high strength, high temperature resistance, and chemical corrosion resistance. For example, silicon carbide is used in the cantilever propellers of wafer loading equipment. However, under extreme conditions, such as prolonged exposure to high-temperature shocks or highly corrosive media, silicon carbide cantilever propellers can experience surface erosion, thermal stress cracking, and mechanical wear, leading to frequent propeller replacements and increased production costs.

[0003] In related technologies, most protective solutions for silicon carbide cantilever propellers employ coating techniques, such as silicon nitride coatings. However, these coatings suffer from defects such as insufficient adhesion and peeling due to mismatched coefficients of thermal expansion. Therefore, a lightweight, highly compatible, and extreme-environment-resistant protective device for silicon carbide cantilever propellers is needed. Utility Model Content

[0004] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a wafer loading device, including a cantilever propeller and a protective layer located on the surface of the cantilever propeller;

[0005] The cantilever propeller includes an arc-shaped groove for placing a wafer basket, in which multiple wafers are placed; when the wafer basket is placed in the groove, the outer surface of the wafer basket near the cantilever propeller is at least partially in contact with the groove;

[0006] The outer diameter of the protective layer is the same as the inner diameter of the groove, and the protective layer is used to cover the groove;

[0007] The protective layer is detachably connected to the cantilever propeller.

[0008] In one possible implementation, the protective layer includes at least a first sub-protective layer and a second sub-protective layer, wherein the first sub-protective layer and the second sub-protective layer are sequentially placed in the groove along the through direction of the groove;

[0009] Wherein, the first side of the first sub-protective layer near the second sub-protective layer is attached to the second side of the second sub-protective layer near the first sub-protective layer.

[0010] In one possible implementation, a first protrusion and a second protrusion extending along the through direction of the groove are respectively provided on both sides of the arc-shaped groove, and the first protrusion and the second protrusion are used to prevent the protective layer from shifting.

[0011] In one possible implementation, the cantilever paddle includes a first surface and a second surface opposite thereto, the first surface being the surface where the groove is located;

[0012] The protective layer further includes a first bend extending from the first surface to the second surface, the first bend serving to fix the protective layer to the cantilever propeller.

[0013] In one possible implementation, the protective layer further includes a second bend extending from the first bend toward the center of the second surface;

[0014] The protective layer is inserted into the groove of the cantilever propeller.

[0015] In one possible implementation, the wafer loading device further includes a drive unit and a control unit;

[0016] The drive unit is used to drive the cantilever propeller to move so as to move the wafer.

[0017] The drive unit is electrically connected to the control unit, which receives electrical signals from other components of the wafer loading equipment and transmits electrical signals to the drive unit to control the drive unit to drive the cantilever propeller.

[0018] In one possible implementation, the cantilever paddle further includes a paddle shank located on one side of the groove in the through direction and connected to the groove;

[0019] The propeller is connected to the drive unit.

[0020] In one possible implementation, the weight of the cantilever propeller is at least 20 times the weight of the protective layer.

[0021] In one possible implementation, the cantilever propeller is made of silicon carbide.

[0022] In one possible implementation, the material of the protective layer includes quartz.

[0023] Compared with the prior art, this application has the following beneficial effects:

[0024] This solution addresses the rapid wear and tear of silicon carbide cantilever propellers under high temperature, corrosion, and mechanical impact environments by adding a protective layer to the surface of the cantilever propeller, thereby extending the service life of the cantilever propeller and improving the stability of the wafer loading equipment during operation. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a cross-sectional schematic diagram of the wafer loading device provided in this embodiment;

[0027] Figure 2 This is a three-dimensional structural diagram of the wafer loading device provided in this embodiment;

[0028] Figure 3 This is a cross-sectional schematic diagram of the groove of the cantilever propeller provided in this embodiment;

[0029] Figure 4 This is one of the cross-sectional schematic diagrams of the protective layer provided in this embodiment;

[0030] Figure 5 This is the second cross-sectional schematic diagram of the protective layer provided in this embodiment;

[0031] Figure 6 This is a top view of the cantilever propeller provided in this embodiment.

[0032] Icons: Cantilever propeller-100; First surface-101; Second surface-102; Groove-110; Propeller handle-120; First protrusion-130; Second protrusion-140; Protective layer-200; First sub-protective layer-201; Second sub-protective layer-202; First bend-210; Second bend-220. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0038] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] Currently, silicon carbide (SiC) is widely used in semiconductor manufacturing, glass production, and high-temperature material handling due to its high strength, high temperature resistance, and chemical corrosion resistance. For example, silicon carbide is used in the cantilever propellers of wafer loading equipment. However, under extreme conditions, such as prolonged exposure to high-temperature shocks or highly corrosive media, silicon carbide cantilever propellers can experience surface erosion, thermal stress cracking, and mechanical wear, leading to frequent propeller replacements and increased production costs.

[0040] The inventors' investigation revealed that most protective solutions for silicon carbide cantilever propellers in related technologies employ coating techniques, such as silicon nitride coatings. However, these coatings suffer from defects such as insufficient adhesion and peeling due to mismatched coefficients of thermal expansion. Therefore, a lightweight, highly compatible, and extreme-environment-resistant protective device for silicon carbide cantilever propellers is needed.

[0041] In view of this, this application provides a wafer loading device, please refer to... Figure 1 and Figure 2 It includes a cantilever propeller 100 and a protective layer 200 located on the surface of the cantilever propeller 100.

[0042] During the use of the wafer loading equipment, when the cantilever paddle 100 moves the wafer or performs operations, its original coating or itself may be corroded by the cleaning fluid during the cleaning process. Therefore, the number of times the cantilever paddle 100 needs to be cleaned can be reduced by minimizing the direct fall of particles or other workpieces from the production process onto the cantilever paddle 100. Therefore, in this embodiment, a protective layer 200 is laid on the surface of the cantilever paddle 100.

[0043] Please refer to Figure 3 The cantilever propeller 100 includes an arc-shaped groove 110 for placing a wafer basket, and multiple wafers are placed in the wafer basket; when the wafer basket is placed in the groove 110, the outer surface of the wafer basket near the cantilever propeller 100 is at least partially in contact with the groove 110.

[0044] The wafer loading equipment may also include a drive unit. The drive unit can control the cantilever paddle 100 to move in multiple directions, so that the wafers in the wafer basket can be moved along a specific path to a designated position.

[0045] In this embodiment, an arc-shaped wafer basket can be used. To accommodate the arc-shaped wafer basket and the wafers within it, the cantilever paddle 100 has an arc-shaped groove 110. This ensures that the wafer basket remains stable when placed within the groove 110.

[0046] Please refer to Figure 2 The outer diameter of the protective layer 200 is the same as the inner diameter of the groove 110, and the protective layer 200 is used to cover the groove 110.

[0047] In this embodiment, the protective layer 200 is used to cover the groove 110 of the cantilever propeller 100 to protect the cantilever propeller 100. Therefore, the outer diameter of the protective layer 200 is the same as the inner diameter of the groove 110. In this way, the protective layer 200 in the groove 110 can fit well with the groove 110 and is not prone to relative displacement.

[0048] The protective layer 200 is detachably connected to the cantilever propeller 100.

[0049] In this embodiment, if the protective layer 200 is damaged or deformed, the protective layer 200 located on the cantilever propeller 100 can be directly replaced. Under extreme working conditions, such as long-term contact with high temperature impact or strong corrosive media, the cantilever propeller 100 may suffer from surface erosion, thermal stress cracks and mechanical wear. The cantilever propeller 100 has limitations such as high cost, difficult processing and slightly brittleness. Therefore, replacing the protective layer 200 can greatly reduce costs compared to replacing the cantilever propeller 100.

[0050] In this embodiment, by providing a protective layer 200 on the surface of the cantilever propeller 100, the problem of rapid wear and tear of the cantilever propeller 100 under high temperature, corrosion and mechanical impact environments is solved. Since the manufacturing process of the cantilever propeller 100 is relatively complex and the cost is high, reducing the wear and tear of the cantilever propeller 100 can greatly reduce the cost of the wafer loading equipment, extend the service life of the cantilever propeller 100, and improve the stability of the wafer loading equipment during operation.

[0051] In one possible implementation, please refer to Figure 2 The protective layer 200 includes at least a first sub-protective layer 201 and a second sub-protective layer 202, which are placed sequentially in the groove 110 along the through direction of the groove 110.

[0052] In this embodiment, the protective layer 200 can be configured as a composite of multiple sub-protective layers. This modular design of multiple sub-protective layers can improve the ease of maintenance and economy of the wafer loading equipment. In the semiconductor manufacturing environment, the protective layer 200, located on the surface of the cantilever paddle 100, needs to withstand mechanical friction, chemical corrosion, and temperature changes for a long time, making it prone to localized damage or deformation. With the sub-protective layer composite structure, each sub-protective layer can independently perform its protective function. When a sub-protective layer is damaged, the operator does not need to disassemble the entire protective layer 200; only the damaged sub-protective layer needs to be replaced, avoiding the material waste caused by replacing the entire protective layer 200 due to a localized problem.

[0053] Specifically, for the cantilever propeller 100 with a total length of 2260mm, the part that needs protection is 1168mm long, and multiple sub-protective layers with a length of 125mm can be used to protect it.

[0054] The first side of the first sub-protective layer 201 near the second sub-protective layer 202 is attached to the second side of the second sub-protective layer 202 near the first sub-protective layer 201.

[0055] In this embodiment, in order to ensure that any position on the cantilever propeller 100 can be protected by the protective layer 200, the multiple sub-protective layers arranged sequentially along the through direction of the groove 110 should be a seamless splicing design with the ends connected.

[0056] In one possible implementation, please refer to Figure 3 The arc-shaped groove 110 has a first protrusion 130 and a second protrusion 140 extending along the through direction of the groove 110 on both sides. The first protrusion 130 and the second protrusion 140 are used to prevent the protective layer 200 from shifting.

[0057] In this embodiment, the first protrusion 130 and the second protrusion 140 can not only prevent the protective layer 200 from shifting, but also prevent the wafer basket in the groove 110 from shifting.

[0058] Specifically, the first protrusion 130 and the second protrusion 140 can be protrusions with an arc-shaped cross section. In this way, when the protective layer 200 is tightly attached to the side where the groove 110 of the cantilever propeller 100 is located, if the protective layer 200 is subjected to other external forces or the cantilever propeller 100 rotates or moves too fast, the first protrusion 130 and the second protrusion 140 can limit the displacement of the protective layer 200 to a certain extent.

[0059] In one possible implementation, please refer to Figure 4 The cantilever propeller 100 includes a first surface 101 and a second surface 102 opposite to it. The first surface 101 is the surface where the groove 110 is located. The protective layer 200 also includes a first bent portion 210 extending from the first surface 101 to the second surface 102. The first bent portion 210 is used to fix the protective layer 200 to the cantilever propeller 100.

[0060] In this embodiment, to make the connection between the protective layer 200 and the cantilever propeller 100 more secure, the protective layer 200 is provided with a first bend 210, which matches the shape of both sides of the groove 110 of the cantilever propeller 100. Thus, the protective layer 200 forms an L-shaped snap-fit ​​portion that engages with both ends of the cantilever propeller 100. The snap-fit ​​connection between the protective layer 200 and the cantilever propeller 100 restricts the horizontal displacement of the protective layer 200, providing better stability.

[0061] It should be noted that for the cantilever propeller 100 with the first protrusion 130 and the second protrusion 140, the first bending portion 210 can form an L-shaped snap-fit ​​portion that matches the protrusion, which can further improve the connection stability between the cantilever propeller 100 and the protective layer 200.

[0062] In one possible implementation, please refer to Figure 5 The protective layer 200 further includes a second bend 220 extending from the first bend 210 toward the center of the second surface 102.

[0063] The protective layer 200 is inserted into the groove 110 of the cantilever propeller 100.

[0064] In this embodiment, to make the connection between the protective layer 200 and the cantilever propeller 100 more stable, the protective layer 200 is provided with a first bend 210 and a second bend 220, which match the shapes of the two sides of the groove 110 of the cantilever propeller 100. Thus, the protective layer 200 forms U-shaped receiving grooves to accommodate both ends of the cantilever propeller 100. The protective layer 200 and the cantilever propeller 100 are connected by an insertion method, which restricts the displacement of the protective layer 200 in the horizontal and vertical directions, resulting in good stability.

[0065] It should be noted that for the cantilever propeller 100 with the first protrusion 130 and the second protrusion 140, the first bend 210 and the second bend 220 can form a U-shaped receiving groove that matches the protrusion, which can further improve the connection stability between the cantilever propeller 100 and the protective layer 200.

[0066] In one possible implementation, the wafer loading device further includes a drive unit and a control unit.

[0067] The drive unit is used to drive the cantilever propeller 100 to move so as to move the wafer.

[0068] The drive unit is electrically connected to the control unit, which receives electrical signals from other components of the wafer loading equipment and transmits electrical signals to the drive unit to control the drive unit to drive the cantilever propeller 100.

[0069] In this embodiment, the drive unit includes components such as a drive motor. The drive motor has a connector that connects to the cantilever propeller 100, and is used to drive the cantilever propeller 100 to translate or rotate under the control of the control unit. The control unit is used to receive electrical signals from other components of the wafer loading equipment, such as electrical signals indicating the position, quantity, and presence of defects of the wafers, and simultaneously transmits electrical signals to the drive unit based on the aforementioned information to control the motor to operate or stop.

[0070] It should be noted that, in addition to the drive unit and control unit, the wafer loading equipment may also include other units, such as a support frame unit and a detection unit, etc., without specific limitations here. The support frame unit is used to support the overall structure of the wafer loading equipment; the detection unit is used to scan and detect the wafers in the wafer basket, such as detecting the position, quantity, and whether there are defects in the wafers, and transmits the above information as signals to the control unit to provide data support for subsequent wafer handling and processing.

[0071] In one possible implementation, please refer to Figure 6 The cantilever propeller 100 also includes a propeller shank 120 located on one side of the groove 110 in the through direction and connected to the groove 110; the propeller shank 120 is connected to the drive unit.

[0072] In this embodiment, the drive unit is connected to the propeller 120, and the drive propeller 120 moves the wafer on the groove 110 to the designated position.

[0073] In one possible implementation, the weight of the cantilever propeller 100 is at least 20 times the weight of the protective layer 200.

[0074] In this embodiment, the weight of the protective layer 200 can be controlled to be within 5% of the total weight of the cantilever propeller 100. By using lightweight materials for the protective layer 200, the overall pressure on the cantilever propeller 100 can be avoided due to the excessive weight of the protective layer 200, thereby reducing the additional counterweight burden. For example, in some usage scenarios of the cantilever propeller 100, if the protective layer 200 is too heavy, it may cause the center of gravity to shift, requiring additional counterweights to balance the torque. However, controlling the weight of the protective layer 200 to within 5% of the weight of the cantilever propeller 100 can minimize such additional costs while maintaining the mechanical balance of the cantilever propeller 100 and not affecting its operation.

[0075] In one possible implementation, the cantilever propeller 100 is made of silicon carbide.

[0076] Silicon carbide's high strength and hardness allow it to withstand complex loads while minimizing deformation and fracture, and its high-temperature resistance ensures stability at high temperatures. Therefore, silicon carbide is used as the material for the cantilever propeller 100. However, under extreme conditions, such as prolonged exposure to high-temperature impacts or highly corrosive media, the silicon carbide cantilever propeller 100 can experience surface erosion, thermal stress cracking, and mechanical wear. Furthermore, silicon carbide cantilever propeller 100 has limitations such as high cost, difficult processing, and relatively high brittleness. Therefore, frequent replacement of silicon carbide cantilever propeller 100 increases production costs.

[0077] It should be noted that in other possible embodiments, the cantilever propeller 100 can also be made of other materials with good high-temperature resistance and corrosion resistance, and no specific limitation is made here. The protective layer 200 in this application can protect the cantilever propeller 100 from corrosion that may occur with long-term use.

[0078] In one possible implementation, the material of the protective layer 200 includes quartz.

[0079] In this embodiment, high-purity fused silica can be used as the protective material. High-purity fused silica has the following advantages: Quartz has a low coefficient of thermal expansion. In the structure formed by the quartz protective layer 200 and the silicon carbide cantilever propeller 100, quartz can form a gradient match with silicon carbide, thereby reducing the internal stress caused by excessive differences in thermal expansion and contraction at the interface between the two protective layers 200 and the cantilever propeller 100. This reduces the risk of material cracking and detachment due to stress concentration, improving the overall stability and reliability of the structure. Quartz has high temperature resistance, corrosion resistance, and thermal shock resistance. When the cantilever propeller 100 is under extreme conditions such as high temperature, the quartz protective layer 200 can adapt to rapid temperature changes and resist corrosion from acidic and alkaline media. Quartz has high hardness, which reduces mechanical wear during contact with the wafer basket. Furthermore, quartz has a low manufacturing cost. When the protective layer 200 is damaged or deformed, it can be directly replaced, reducing costs compared to directly replacing the cantilever propeller 100.

[0080] It should be noted that in other possible implementations, other suitable materials with good high temperature resistance, corrosion resistance, high hardness and low cost can also be used to make the protective layer 200, and no specific limitation is made here.

[0081] After testing by the inventors, it was found that the service life of the silicon carbide cantilever propeller 100 covered with a quartz protective layer 200 in this application is increased by more than 300%, reducing the replacement frequency and downtime recovery costs of the cantilever propeller 100; under high-temperature conditions of 1200℃, the continuous working life is not less than 800 hours, and the surface erosion rate of the cantilever propeller 100 is less than 0.1mm / 100h, which significantly reduces the cleaning cycle of the silicon carbide cantilever propeller 100 and extends its service life; in addition, the quartz protective layer 200 has a hardness of up to Mohs 7 and a smooth surface, which reduces dust caused by mechanical friction and improves the performance of the wafer loading equipment.

[0082] In summary, this application provides a wafer loading device, including a cantilever propeller 100 and a protective layer 200 on the surface of the cantilever propeller 100. The cantilever propeller 100 includes an arc-shaped groove 110 for placing a wafer basket, in which multiple wafers are placed. When the wafer basket is placed in the groove 110, the outer surface of the wafer basket near the cantilever propeller 100 is at least partially in contact with the groove 110. The outer diameter of the protective layer 200 is the same as the inner diameter of the groove 110, and the protective layer 200 is used to cover the groove 110. The protective layer 200 is detachably connected to the cantilever propeller 100. By providing a protective layer 200 on the surface of the cantilever propeller 100, the problem of rapid wear and tear of the silicon carbide cantilever propeller 100 under high temperature, corrosion, and mechanical impact environments is solved, extending the service life of the cantilever propeller 100 and improving the stability of the wafer loading device during operation.

[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer loading device, characterized in that, Includes a cantilever propeller and a protective layer located on the surface of the cantilever propeller; The cantilever propeller includes an arc-shaped groove for placing a wafer basket, in which multiple wafers are placed; when the wafer basket is placed in the groove, the outer surface of the wafer basket near the cantilever propeller is at least partially in contact with the groove; The outer diameter of the protective layer is the same as the inner diameter of the groove, and the protective layer is used to cover the groove; The protective layer is detachably connected to the cantilever propeller.

2. The wafer loading apparatus according to claim 1, characterized in that, The protective layer includes at least a first sub-protective layer and a second sub-protective layer, and the first sub-protective layer and the second sub-protective layer are placed sequentially in the groove along the through direction of the groove; Wherein, the first side of the first sub-protective layer near the second sub-protective layer is attached to the second side of the second sub-protective layer near the first sub-protective layer.

3. The wafer loading apparatus according to claim 1, characterized in that, The arc-shaped groove has a first protrusion and a second protrusion extending along the through direction of the groove on both sides, and the first protrusion and the second protrusion are used to prevent the protective layer from shifting.

4. The wafer loading apparatus according to claim 1, characterized in that, The cantilever paddle includes a first surface and a second surface opposite to it, wherein the first surface is the surface where the groove is located; The protective layer further includes a first bend extending from the first surface to the second surface, the first bend serving to fix the protective layer to the cantilever propeller.

5. The wafer loading apparatus according to claim 4, characterized in that, The protective layer further includes a second bend extending from the first bend toward the center of the second surface; The protective layer is inserted into the groove of the cantilever propeller.

6. The wafer loading apparatus according to claim 1, characterized in that, The wafer loading device also includes a drive unit and a control unit; The drive unit is used to drive the cantilever propeller to move so as to move the wafer. The drive unit is electrically connected to the control unit, which receives electrical signals from other components of the wafer loading equipment and transmits electrical signals to the drive unit to control the drive unit to drive the cantilever propeller.

7. The wafer loading apparatus according to claim 6, characterized in that, The cantilever propeller also includes a propeller shank located on one side of the groove in the through direction and connected to the groove; The propeller is connected to the drive unit.

8. The wafer loading apparatus according to claim 1, characterized in that, The weight of the cantilever propeller is at least 20 times the weight of the protective layer.

9. The wafer loading apparatus according to claim 1, characterized in that, The material of the cantilever propeller includes silicon carbide.

10. The wafer loading apparatus according to claim 1, characterized in that, The material of the protective layer includes quartz.

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