Semiconductor equipment ceramic arm preparation mold with anti-oxidation coating

Abstract

The utility model discloses a semiconductor equipment ceramic arm preparation die with an anti-oxidation coating, which comprises a machine table, a lower die holder is fixedly arranged on the upper end face of the machine table, a lower die is fixedly arranged at the upper end of the lower die holder, a support frame is fixedly arranged above the machine table, and an air cylinder is fixedly arranged at the upper end of the support frame. One end of the air cylinder penetrates through the interior of the supporting frame, the extending end of the air cylinder is connected with an upper mold base, an upper mold is fixedly arranged below the upper mold base, cooling structures are arranged in the upper mold and the lower mold correspondingly, a demolding structure is arranged below the lower mold, and the demolding structure comprises a positioning plate fixedly installed in the machine table; a driving motor is arranged on the rear side of the positioning plate, a transmission structure is arranged below the driving motor, an eccentric disc is arranged on the front side of the positioning plate, a connecting column is fixedly arranged at the position, away from the circle center, of the outer wall of the eccentric disc, the connecting column is slidably connected with an ejection frame, and rapid demolding can be achieved after the ceramic arm is machined.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment ceramic arm processing technology, and in particular to a semiconductor equipment ceramic arm preparation mold with an anti-oxidation coating. Background Technology

[0002] Semiconductor equipment ceramic arms refer to robotic arms used in semiconductor manufacturing equipment to grasp, transport, and position semiconductor wafers or other related components, and their main body is made of ceramic.

[0003] Existing semiconductor equipment ceramic arms have some shortcomings in processing and casting. The ceramic arms have complex shapes, which may increase the adhesion between the ceramic arms and the mold surface, making it easy for the blank to break or deform during demolding. This affects the overall aesthetics of the semiconductor ceramic arms. Traditional demolding of ceramic arms is relatively difficult, time-consuming and labor-intensive, reducing the processing efficiency of ceramic arms. To address the above problems, an improved and upgraded mold for preparing semiconductor equipment ceramic arms with an anti-oxidation coating is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a mold for preparing a semiconductor equipment ceramic arm with an antioxidant coating, so as to solve the problems mentioned in the background art.

[0005] To solve the above problems, the following technical solution is provided: a semiconductor equipment ceramic arm preparation mold with an anti-oxidation coating, including a machine base, a lower mold base is fixedly disposed on the upper surface of the machine base and a lower mold is fixedly disposed on the upper end of the lower mold base, a support frame is fixedly disposed above the machine base and a cylinder is fixedly disposed on the upper end of the support frame, one end of the cylinder passes through the inside of the support frame and the extended end is connected to the upper mold base, and an upper mold is fixedly disposed below the upper mold base, and a cooling structure is provided inside both the upper mold and the lower mold;

[0006] A demolding structure is provided below the lower mold. The demolding structure includes a positioning plate fixedly installed inside the machine. A drive motor is provided on the rear side of the positioning plate, and a transmission structure is provided below the drive motor. An eccentric disk is provided on the front side of the positioning plate, and a connecting column is fixedly provided on the outer wall of the eccentric disk away from the center. An ejector frame is slidably connected to the connecting column, and a top plate is provided above the ejector frame.

[0007] As a preferred embodiment of the above technical solution, the drive motor is fixedly mounted on the outer wall of the positioning plate, the transmission structure includes a worm and a worm wheel, the output end of the drive motor is fixedly connected to the worm, the worm is meshed with the worm wheel, the worm and the worm wheel are both rotatably mounted inside the limiting box, and the limiting box is fixedly mounted on the outer wall of the positioning plate.

[0008] As a preferred embodiment of the above technical solution, a guide rod is fixedly provided in the middle of the worm gear and one end of the guide rod is connected to the inner wall of the eccentric disk. A guide groove is provided inside the ejector frame. The size of the connecting column on the outer wall of the eccentric disk is adapted to the guide groove. The eccentric disk is rotatably mounted on the outer wall of the positioning plate.

[0009] As a preferred embodiment of the above technical solution, the upper end of the ejector frame is slidably connected to the inside of the lower mold base and the extended end passes through the lower mold. One end of the ejector frame is fixedly connected to the top plate. The top plate is set at the bottom of the inner side of the lower mold and is adapted to the size of the ceramic arm. The ejector frame is slidably connected to two limiting sleeves on the outer wall of the positioning plate.

[0010] As a preferred embodiment of the above technical solution, the cooling structure includes a liquid inlet pipe, one end of which is connected to a U-shaped pipe that penetrates the interior of the upper mold and the extended end is fixedly connected to a liquid outlet pipe.

[0011] As a preferred embodiment of the above technical solution, solenoid valves are fixedly installed on the outer walls of the inlet pipe and the outlet pipe, U-shaped tubes are installed inside the upper mold and the lower mold, and aluminum oxide coating is installed on the inner walls of the upper mold and the lower mold base. Guide posts are fixedly installed at the four corners of the upper end of the lower mold base, and the upper ends of the guide posts penetrate through the interior of the upper mold base.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. The device of this utility model is equipped with components such as a positioning plate, a drive motor, an eccentric plate, an ejector frame, and a top plate. The drive motor drives the transmission structure to rotate, which causes the connecting column on the eccentric plate to move along the guide groove on the ejector frame. This causes the top plate to quickly eject the ceramic arm on the lower mold for demolding, avoiding the situation where the blank is easily damaged or deformed during demolding due to manual operation, thus improving processing efficiency and saving time and effort.

[0014] 2. The device of this utility model is equipped with components such as an inlet pipe, a U-shaped pipe, an outlet pipe, and a solenoid valve, which facilitates effective cooling of the mold during long-term use. The cooling channels inside the upper and lower molds can reduce the working temperature of the mold, reduce the occurrence of thermal fatigue, thereby extending the service life of the mold and protecting it.

[0015] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications, and equivalents. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of a mold for preparing an antioxidant coating for a semiconductor equipment ceramic arm according to this utility model.

[0018] Figure 2 This is a schematic diagram of a partial telescopic structure of a semiconductor equipment ceramic arm preparation mold with an antioxidant coating according to the present invention;

[0019] Figure 3 for Figure 1 A partial enlarged diagram of the split structure;

[0020] Figure 4 for Figure 3 A magnified diagram of the localized decomposed structure;

[0021] Figure 5 This is a schematic diagram of the cooling structure of this utility model.

[0022] In the diagram: 1. Machine base; 2. Support frame; 3. Cylinder; 4. Upper mold base; 5. Lower mold base; 6. Lower mold; 7. Upper mold; 71. Alumina coating; 8. Guide pillar; 9. Demolding structure; 91. Positioning plate; 92. Ejector frame; 93. Drive motor; 94. Transmission structure; 95. Eccentric disc; 96. Connecting pillar; 97. Guide groove; 98. Limit sleeve; 99. Top plate; 10. Cooling structure; 101. Liquid inlet pipe; 102. U-shaped pipe; 103. Liquid outlet pipe; 104. Solenoid valve. Detailed Implementation

[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0024] like Figures 1 to 5 As shown in the figure, this embodiment provides a semiconductor equipment ceramic arm preparation mold with an anti-oxidation coating, including a machine base 1. A lower mold base 5 is fixedly arranged on the upper surface of the machine base 1, and a lower mold 6 is fixedly arranged on the upper end of the lower mold base 5. A support frame 2 is fixedly arranged above the machine base 1, and a cylinder 3 is fixedly arranged on the upper end of the support frame 2. One end of the cylinder 3 passes through the interior of the support frame 2 and the extended end is connected to the upper mold base 4. An upper mold 7 is fixedly arranged below the upper mold base 4. Cooling structures 10 are provided inside both the upper mold 7 and the lower mold 6. Guide pillars 8 are fixedly arranged at the four corners of the upper end of the lower mold base 5, and the upper ends of the guide pillars 8 pass through the interior of the upper mold base 4.

[0025] A demolding structure 9 is provided below the lower mold 6. The demolding structure 9 includes a positioning plate 91 fixedly installed inside the machine base 1. A drive motor 93 is provided on the rear side of the positioning plate 91, and a transmission structure 94 is provided below the drive motor 93. An eccentric disk 95 is provided on the front side of the positioning plate 91, and a connecting column 96 is fixedly provided on the outer wall of the eccentric disk 95 away from the center. An ejector frame 92 is slidably connected to the connecting column 96, and a top plate 99 is provided above the ejector frame 92.

[0026] like Figures 3 to 4 As shown, the drive motor 93 is fixedly installed on the outer wall of the positioning plate 91. The transmission structure 94 includes a worm and a worm wheel. The output end of the drive motor 93 is fixedly connected to the worm. The worm is meshed with the worm wheel. Both the worm and the worm wheel are rotatably installed inside the limit box. The limit box is fixedly installed on the outer wall of the positioning plate 91. A guide rod is fixedly installed in the middle of the worm wheel, and one end of the guide rod is connected to the inner wall of the eccentric disk 95. A guide groove 97 is opened inside the ejector frame 92. The connecting column 96 on the outer wall of the eccentric disk 95 is adapted to the size of the guide groove 97. The eccentric disk 95 is rotatably installed on the outer wall of the positioning plate 91. The upper end of the ejector frame 92 is slidably connected to the inside of the lower mold base 5, and the extended end passes through the lower mold 6. One end of the ejector frame 92 is fixedly connected to the top plate 99. The top plate 99 is set at the bottom of the inner side of the lower mold 6 and is adapted to the size of the ceramic arm. The ejector frame 92 is slidably connected to the two limit sleeves 98 on the outer wall of the positioning plate 91.

[0027] By setting a limit box, the rotation of the worm gear and worm wheel can be limited to prevent deviation. The eccentric plate 95 drives the connecting column 96 to rotate and move left and right along the guide groove 97, which causes the ejector frame 92 to move up and down to demold the ceramic arm, avoiding the time-consuming and laborious problem of manual demolding. The ejector plate 99 is set at the bottom of the lower mold 6 and has the same shape and size as the injection-molded ceramic arm.

[0028] like Figure 5 As shown, the cooling structure 10 includes an inlet pipe 101. One end of the inlet pipe 101 is connected to a U-shaped pipe 102, which passes through the interior of the upper mold 7 and is fixedly connected to an outlet pipe 103 at its extended end. Solenoid valves 104 are fixedly installed on the outer walls of both the inlet pipe 101 and the outlet pipe 103. U-shaped pipes 102 are installed inside both the upper mold 7 and the lower mold 6. An aluminum oxide coating 71 is installed on the inner walls of both the upper mold 7 and the lower mold 6.

[0029] By setting the two sides of the U-shaped tube 102 at different heights, the coolant can flow from the inlet pipe 101 to the outlet pipe 103 along the inclined angle of the pipe, which facilitates the replacement of the coolant. At the same time, the upper mold 7 and the lower mold 6 are provided with a tungsten carbide coating to improve their wear resistance, and the outermost contact surface of the upper mold 7 and the lower mold 6 is provided with an alumina coating 71 to improve the oxidation resistance of the mold.

[0030] The working principle and process of this utility model are as follows: First, connect the external power supply. Drive the cylinder 3 on the support frame 2 to move the upper mold base 4 downward along the four guide columns 8. This causes the upper mold 7 at the bottom of the upper mold base 4 to press against the lower mold base 5 and the upper mold 6 above it, facilitating the injection molding of the semiconductor ceramic arm. After the ceramic arm is extruded and formed, the operator injects coolant into the upper mold 7 and the lower mold 6 through the liquid inlet pipe 101 on the outside, closes the solenoid valve 104 on the liquid outlet pipe 103, and then the coolant flows through the U-shaped pipe 102 into the entire pipeline, facilitating the cooling of the mold and preventing excessively high temperatures during prolonged mold processing. To prevent issues such as breakage, when the coolant needs to be replaced, simply open the solenoid valve 104 and re-inject the coolant to cool the mold. The drive motor 93 drives the worm gear to rotate, causing the worm gear to rotate stably inside the limit box, preventing misalignment between the worm gear and the worm wheel. Then, the worm wheel drives the connecting column 96 on the eccentric plate 95 to move along the guide groove 97 inside the ejector frame 92, thereby causing the ejector frame 92 to slide up and down along the two limit sleeves 98. As a result, the ejector frame 92 drives the top plate 99 to squeeze the ceramic arm out of the mold 6, facilitating quick demolding of the injected ceramic arm and avoiding problems such as low processing efficiency caused by manual demolding.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A mold for fabricating a semiconductor equipment ceramic arm with an antioxidant coating, characterized in that, The machine includes a machine base (1), a lower mold base (5) is fixedly provided on the upper surface of the machine base (1), and a lower mold (6) is fixedly provided on the upper end of the lower mold base (5). A support frame (2) is fixedly provided above the machine base (1), and a cylinder (3) is fixedly provided on the upper end of the support frame (2). One end of the cylinder (3) passes through the inside of the support frame (2), and the extended end is connected to the upper mold base (4). An upper mold (7) is fixedly provided below the upper mold base (4). Cooling structures (10) are provided inside both the upper mold (7) and the lower mold (6). A demolding structure (9) is provided below the lower mold (6). The demolding structure (9) includes a positioning plate (91) fixedly installed inside the machine base (1). A drive motor (93) is provided on the rear side of the positioning plate (91), and a transmission structure (94) is provided below the drive motor (93). An eccentric disk (95) is provided on the front side of the positioning plate (91), and a connecting column (96) is fixedly provided on the outer wall of the eccentric disk (95) away from the center. The connecting column (96) is slidably connected to an ejector frame (92), and a top plate (99) is provided above the ejector frame (92).

2. The semiconductor equipment ceramic arm fabrication mold with an antioxidant coating according to claim 1, characterized in that, The drive motor (93) is fixedly installed on the outer wall of the positioning plate (91). The transmission structure (94) includes a worm and a worm wheel. The output end of the drive motor (93) is fixedly connected to the worm. The worm is meshed with the worm wheel. The worm and the worm wheel are rotatably installed inside the limiting box. The limiting box is fixedly installed on the outer wall of the positioning plate (91).

3. The semiconductor equipment ceramic arm preparation mold with an antioxidant coating according to claim 2, characterized in that, A guide rod is fixedly installed in the middle of the worm gear and one end of the guide rod is connected to the inner wall of the eccentric disk (95). A guide groove (97) is opened inside the ejector frame (92). The connecting column (96) on the outer wall of the eccentric disk (95) is adapted to the size of the guide groove (97). The eccentric disk (95) is rotatably installed on the outer wall of the positioning plate (91).

4. The semiconductor equipment ceramic arm fabrication mold with an antioxidant coating according to claim 3, characterized in that, The upper end of the ejector (92) is slidably connected to the inside of the lower mold base (5) and the extended end passes through the lower mold (6). One end of the ejector (92) is fixedly connected to the top plate (99). The top plate (99) is set at the bottom of the inner side of the lower mold (6) and is adapted to the size of the ceramic arm. The ejector (92) is slidably connected to two limiting sleeves (98) on the outer wall of the positioning plate (91).

5. The semiconductor equipment ceramic arm fabrication mold with an antioxidant coating according to claim 1, characterized in that, The cooling structure (10) includes an inlet pipe (101), one end of which is connected to a U-shaped pipe (102) and the U-shaped pipe (102) passes through the interior of the upper mold (7) and the extended end is fixedly connected to an outlet pipe (103).

6. The semiconductor equipment ceramic arm preparation mold of an oxidation resistant coating according to claim 5, characterized in that, Solenoid valves (104) are fixedly installed on the outer walls of the inlet pipe (101) and outlet pipe (103). U-shaped tubes (102) are installed inside the upper mold (7) and lower mold (6). Alumina coating (71) is installed on the inner walls of the upper mold (7) and lower mold (6). Guide posts (8) are fixedly installed at the four corners of the upper end of the lower mold base (5), and the upper end of the guide posts (8) penetrates through the interior of the upper mold base (4).

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