Mold double-layer cooling device capable of eliminating injection molding defects

Abstract

The utility model relates to the technical field of injection molding cooling devices, in particular to a mold double-layer cooling device capable of eliminating injection molding defects, which is technically characterized by comprising a fixed part and two groups of cooling structures positioned on the fixed part, the two groups of cooling structures are respectively an upper-layer cooling circulation loop and a lower-layer cooling circulation loop, the upper-layer cooling circulation loop comprises an F groove, the F groove is a semicircular ring and is positioned in the middle position of the fixed part in the height direction, and the two ends of the annular groove are respectively used for feeding and discharging cooling water; the lower-layer cooling circulation loop comprises a groove B, the groove B is located at the bottom of the fixing part and surrounds the fixing part, and the two ends of the groove B are not communicated and are used for cooling water to enter and exit respectively. The design of double-layer cooling water ways is adopted, the cooling water ways are independent, the temperature difference between an inlet and an outlet is small, and the cooling area and efficiency are greatly improved.

Description

A double-layer cooling device for molds that can eliminate injection molding defects Technical Field

[0001] This utility model relates to the technical field of injection mold cooling devices, specifically to a double-layer cooling device for molds that can eliminate injection defects. Background Technology

[0002] In daily injection mold production, products often exhibit clearly visible defects such as sunburst patterns, burn marks, color differences, and whitening on their surface. This is a common injection molding defect that is difficult to avoid. The core reason is insufficient cooling of the hot runner, which causes various defects on the plastic surface, especially noticeable with high-temperature materials such as PC. The temperature near the hot nozzle is extremely high, and the injection point is the surface of the product. Even with parameter adjustments or general cooling structures, these defects can only be mitigated, not completely eliminated. This has a significant impact on products with high appearance requirements. The presence of these defects greatly reduces the overall product quality, which is unacceptable to customers and results in considerable economic losses. Summary of the Invention

[0003] Therefore, the purpose of this application is to solve the technical problem that the cooling mechanism in the prior art cannot completely eliminate defects in injection molded products.

[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0005] A double-layer cooling device for molds that can eliminate injection molding defects is disposed on the outer periphery of a hot nozzle. It includes a fixing part and a cooling structure. The fixing part is located on the outer periphery of the hot nozzle, and the cooling structure is located on the fixing part. The cooling structure comprises two sets: an upper cooling circulation loop and a lower cooling circulation loop. The upper cooling circulation loop includes an F-groove, which is a semi-circular annular groove located at the middle of the height direction of the fixing part. The two ends of the annular groove are used for the inlet and outlet of cooling water, respectively. The lower cooling circulation loop includes a B-groove, which is located at the bottom of the fixing part. The B-groove is annular and surrounds the fixing part. The two ends of the B-groove are not connected and are used for the inlet and outlet of cooling water, respectively.

[0006] Preferably, the upper cooling circulation loop further includes a G-slot and an E-slot, the G-slot and the E-slot extending vertically, the line connecting the G-slot and the E-slot passing through the axis of the fixing part, the two ends of the F-slot respectively communicating with the bottom of the G-slot and the E-slot, and the G-slot and the E-slot respectively being used for the inlet and outlet of cooling water.

[0007] Preferably, the upper cooling circulation loop further includes a second water inlet pipe and a second water outlet pipe, wherein the second water inlet pipe is connected to the G tank and the second water outlet pipe is connected to the top of the F tank.

[0008] Preferably, the lower cooling circulation loop further includes a groove A and a groove C, which are vertically arranged and radially symmetrically arranged. The two ports of groove B are respectively connected to the bottom of groove A and groove C.

[0009] Preferably, the lower cooling circulation loop includes a first water inlet pipe and a first water outlet pipe, the first water inlet pipe being connected to the top of the A tank and the first water outlet pipe being connected to the top of the C tank.

[0010] Preferably, a large sealing ring is also provided at the bottom of the fixing part.

[0011] Preferably, a small sealing ring is provided above the first water inlet pipe, the first water outlet pipe, the second water inlet pipe, and the second water outlet pipe to prevent water from flowing out.

[0012] Preferably, the cross-sectional dimensions of the G-channel and E-channel in the vertical direction are 14*6mm, and the diameter of the second inlet pipe and the second outlet pipe is 10mm.

[0013] Preferably, the size of the F-groove is 26*3mm.

[0014] Preferably, the dimensions of groove B are 15*5mm, and the dimensions of grooves A and C are 14*8mm.

[0015] Compared with the prior art, this application has the following beneficial effects:

[0016] This application employs a dual-layer cooling water channel design, with each layer operating independently and a small temperature difference between the inlet and outlet, significantly increasing the cooling area and efficiency. Furthermore, the flow rates described in this application have been verified through practical testing and calculation, ensuring no stagnant water, no flow bottlenecks, and no speed reduction. The dual-layer mold cooling device provided in this application, capable of eliminating injection molding defects, offers excellent cooling performance and effectively solves the problem of insufficient mold cooling, thus addressing a pain point in the hot runner mold industry. After multiple verifications, it perfectly resolves common injection molding defects in hot runner molds such as sunburst patterns, color differences, white spots, and burns, improving product appearance and providing a strong guarantee for product competitiveness and performance. Attached Figure Description

[0017] Figure 1 is a schematic diagram of the overall structure of a mold double-layer cooling device that can eliminate injection molding defects according to an embodiment of this application.

[0018] Figure 2 is a schematic diagram of the overall structure of a mold double-layer cooling device that can eliminate injection molding defects from another angle according to one embodiment of this application.

[0019] Figure 3 is a schematic diagram of the overall structure of a mold double-layer cooling device that can eliminate injection molding defects from the third angle according to an embodiment of this application.

[0020] In the diagram, 1. Fixing part; 11. O-ring; 12. Fixing bolt; 13. Fixing plate; 2. Cooling structure; 21. Upper cooling circulation loop; 211. G groove; 212. F groove; 213. E groove; 214. Second water inlet pipe; 215. Second water outlet pipe; 22. Lower cooling circulation loop; 221. A groove; 222. B groove; 223. C groove; 224. First water inlet pipe; 225. First water outlet pipe; 23. Large sealing ring; 24. Small sealing ring; 3. Hot nozzle. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0022] Please refer to Figures 1 and 2. A mold double-layer cooling device can eliminate injection molding defects, specifically used to eliminate defects such as sunspots and color spots during the process. The double-layer cooling device is disposed on the outer periphery of the hot nozzle 3. The double-layer cooling device includes a fixing part 1 and a cooling structure 2, wherein the fixing part 1 is located on the outer periphery of the hot nozzle 3, and the cooling structure is located on the fixing part 1.

[0023] Please refer to Figures 1 and 2. In one embodiment, the fixing part 1 is annular, and a fixing plate 13 is provided above the fixing part 1. The fixing plate 13 is cylindrical and is fixed by bolts. An O-ring 11 is provided on the inner side of the fixing plate 13. The position of the fixing part 1 is fixed by the setting of the fastening bolts.

[0024] Please refer to Figures 1 and 2. The cooling structure 2 is provided in two sets, namely an upper cooling circulation loop 21 and a lower cooling circulation loop 22. The upper cooling circulation loop 21 includes an upper water channel and an upper pipe channel. The upper pipe channel is used for the flow of the upper water channel. In one embodiment, please refer to Figures 2 and 3. The upper pipe channel includes a G-channel 211, an F-channel 212, and an E-channel 213. The G-channel 211 and the E-channel 213 extend vertically, and the line connecting the G-channel 211 and the E-channel 213 passes through the axis of the fixing part 1. The F-channel 212 is a semi-circular annular groove, and its two ends are respectively connected to the bottom of the G-channel 211 and the E-channel 213. In one embodiment, the cross-sectional dimensions of the G-channel 211 and the E-channel 213 in the vertical direction are 14*6 mm, and the dimensions of the F-channel 212 are 26*3 mm. By adjusting the size of the F-slot 212, water can flow through the flat slot, achieving large-area cooling without encountering a bottleneck in flow rate.

[0025] The upper water passage includes a second inlet pipe 214 and a second outlet pipe 215. The second inlet pipe 214 is connected to the G-slot 211, and the second outlet pipe 215 is connected to the top of the F-slot 212. In one embodiment, the diameter of the second inlet pipe 214 and the second outlet pipe 215 is 10 mm. By limiting the size of the G-slot 211, the E-slot 213, the second inlet pipe 214, and the second outlet pipe 215, it is ensured that the flow rates of the G-slot 211 and the E-slot 213 are basically the same as those of the second inlet pipe 214 and the second outlet pipe 215.

[0026] The lower cooling circulation loop 22 includes a lower water channel and a lower pipe channel. The lower pipe channel includes a channel A 221, a channel B 222, and a channel C 223. The channel B 222 is located at the bottom of the fixing part 1 and is arranged in a ring around the fixing part 1. The channel A 221 and the channel C 223 are arranged vertically and are radially symmetrical. The two ends of the channel B 222 are respectively connected to the bottom of the channel A 221 and the channel C 223.

[0027] The lower water channel includes a first inlet pipe 224 and a first outlet pipe 225. The first inlet pipe 224 is connected to the top of the A tank 221, and the first outlet pipe 225 is connected to the top of the C tank 223. Water is supplied to the A tank 221 through the first inlet pipe 224, and the water flows through the A tank 221 to the bottom B tank 222, thereby cooling the bottom product. In one embodiment, the B tank 222 has a size of 15*5 mm, and the A tank 221 and the C tank 223 have a size of 14*8 mm.

[0028] The bottom of the fixing part 1 is also provided with a large sealing ring 23, which is used to prevent water from entering the product area.

[0029] In one embodiment, a small sealing ring 24 is provided above the first water inlet pipe 224, the first water outlet pipe 225, the second water inlet pipe 214, and the second water outlet pipe 215 to prevent water from flowing out.

[0030] In this application, the dimensions of each pipe trench are width * depth.

[0031] This application employs a dual-layer cooling water channel design, with each layer operating independently and a small temperature difference between the inlet and outlet, significantly increasing the cooling area and efficiency. Furthermore, the flow rates described in this application have been verified through practical testing and calculation, ensuring no stagnant water, no flow bottlenecks, and no speed reduction. The dual-layer mold cooling device provided in this application, capable of eliminating injection molding defects, offers excellent cooling performance and effectively solves the problem of insufficient mold cooling, thus addressing a pain point in the hot runner mold industry. After multiple verifications, it perfectly resolves common injection molding defects in hot runner molds such as sunburst patterns, color differences, white spots, and burns, improving product appearance and providing a strong guarantee for product competitiveness and performance.

Claims

1. A double-layer cooling device for molds that can eliminate injection molding defects, disposed on the outer periphery of a hot nozzle, characterized in that: The device includes a fixing part and a cooling structure. The fixing part is located on the outer periphery of the hot nozzle, and the cooling structure is located on the fixing part. The cooling structure has two sets, namely an upper cooling circulation loop and a lower cooling circulation loop. The upper cooling circulation loop includes an F groove, which is a semi-circular annular groove located at the middle position in the height direction of the fixing part. The two ends of the annular groove are used for the inlet and outlet of cooling water, respectively. The lower cooling circulation loop includes a B groove, which is located at the bottom of the fixing part. The B groove is annular and surrounds the fixing part. The two ends of the B groove are not connected and are used for the inlet and outlet of cooling water, respectively.

2. The mold double-layer cooling device for eliminating injection molding defects according to claim 1, characterized in that: The upper cooling circulation loop also includes a G-slot and an E-slot, which extend vertically and are connected by a line passing through the axis of the fixing part. The two ends of the F-slot are respectively connected to the bottom of the G-slot and the E-slot. The G-slot and the E-slot are used for the inlet and outlet of cooling water.

3. The mold double-layer cooling device for eliminating injection molding defects according to claim 2, characterized in that: The upper cooling circulation loop also includes a second water inlet pipe and a second water outlet pipe, wherein the second water inlet pipe is connected to the G tank and the second water outlet pipe is connected to the top of the F tank.

4. A mold double-layer cooling device for eliminating injection molding defects according to claim 3, characterized in that: The lower cooling circulation loop also includes a groove A and a groove C. Grooves A and C are arranged vertically and radially symmetrically. The two ports of groove B are respectively connected to the bottom of grooves A and C.

5. A mold double-layer cooling device for eliminating injection molding defects according to claim 4, characterized in that: The lower cooling circulation loop includes a first inlet pipe and a first outlet pipe. The first inlet pipe is connected to the top of the A tank, and the first outlet pipe is connected to the top of the C tank.

6. A mold double-layer cooling device for eliminating injection molding defects according to claim 5, characterized in that: A large sealing ring is also provided at the bottom of the fixing part.

7. A mold double-layer cooling device for eliminating injection molding defects according to claim 6, characterized in that: Small sealing rings are installed above the first water inlet pipe, the first water outlet pipe, the second water inlet pipe, and the second water outlet pipe to prevent water from flowing out.

8. A mold double-layer cooling device for eliminating injection molding defects according to claim 7, characterized in that: The vertical cross-sectional dimensions of the G-channel and E-channel are 14*6mm, and the diameter of the second inlet pipe and the second outlet pipe is 10mm.

9. A mold double-layer cooling device for eliminating injection molding defects according to claim 8, characterized in that: The dimensions of the F-groove are 26*3mm.

10. A mold double-layer cooling device for eliminating injection molding defects according to claim 9, characterized in that: The dimensions of groove B are 15*5mm, and the dimensions of grooves A and C are 14*8mm.

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