Novel multifunctional wafer film tearing equipment

Abstract

Novel multifunctional wafer film tearing equipment belongs to the technical field of wafer production auxiliary equipment and comprises a PLC (programmable logic controller), a vacuum pump, a bottom plate, a rear plate, a movable sucker mechanism, an adhesive tape unwinding and separating mechanism, a limiting mechanism and an adhesive tape recycling mechanism. The adhesive tape unwinding and separating mechanism comprises a servo motor speed reduction sub-mechanism, a winding shaft and a guide roller, the limiting mechanism comprises an air cylinder, a rotating roller and a door frame, and the adhesive tape recycling mechanism comprises an electric lead screw sliding table, a linear sliding table, a servo motor, a driving belt wheel, a driven belt wheel, an air cylinder A, a transmission belt, a rotating roller A, a door frame A, a mounting plate and a winding shaft A; the movable suction cup mechanism, the adhesive tape unwinding and separating mechanism, the limiting mechanism, the adhesive tape recycling mechanism, the bottom plate and the rear plate are installed together. According to requirements, pasting and tearing can be carried out firstly, a plating layer can be torn, pasting and tearing can be carried out at the same time, a protective film can be torn, rolling can be carried out, the adhesive tape recycling mechanism can roll the adhesive tape bonded with the protective film or the plating layer, convenience is brought to workers, and the working efficiency is improved.

Description

New multi-functional wafer peeling equipment Technical Field

[0001] This utility model relates to the field of wafer production auxiliary equipment technology, and in particular to a new type of multifunctional wafer film peeling equipment. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. In production, high-purity polycrystalline silicon is dissolved and doped with silicon seed crystals, then slowly pulled out to form a cylindrical single silicon ingot. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. Before subsequent dicing, bonding, and packaging, wafers (silicon wafers with circuitry already laid out on the front) require backthinning to reduce the package mounting height, thereby reducing the chip package size, improving thermal diffusion efficiency, electrical performance, mechanical properties, and reducing the amount of dicing work. Backthinning has the advantages of high efficiency and low cost, and has now replaced traditional wet etching and ion etching processes as the most important thinning technology.

[0003] After wafer thinning, to ensure stable production in the next process, its lower end is glued to a processing ring (the inner diameter of the processing ring is larger than the outer diameter of the wafer). After the next process is completed, the wafer is removed from the ring. A protective film (or protective plating) is glued to the upper part of the wafer. Before the next production process, this protective film (or protective plating) needs to be peeled off. In existing technology, the process of peeling off the thinned protective film generally involves workers fixing the ring at the relevant workstation and then manually peeling off the protective film from the wafer (for the protective plating, adhesive tape is rolled onto the plating, and then the tape is pulled up to peel it off). This process requires manual operation, which is inconvenient for workers and consequently hinders work efficiency. To overcome the problems associated with manual film removal, the applicant filed a patent application with patent number "202421363115.2" and patent title "A Wafer Film Removal Device", which was granted by the State Intellectual Property Office. In this patent application, after the worker places the wafer that needs to be peeled at the work station, the device can automatically peel off the adhesive film on the upper part of the wafer and wind it onto a spool, thereby bringing convenience to the worker and improving work efficiency accordingly. Although the authorized patent for a wafer film peeling device has achieved good technical results, there are still some technical points that urgently need improvement. Specifically, due to structural limitations, it can only peel off the protective film while it is being applied, and cannot implement a process of applying first and then peeling (applying tape to the top of the entire protective film and then peeling it off). Relatively speaking, applying first and then peeling involves more operations and is less efficient than applying first and then peeling. Under normal circumstances, the method of applying first and then peeling is generally used in production. However, some wafers do not have a protective film on the top and are protected by a coating. The adhesive force applied by the tape can only act on the coating once in the application first and cannot effectively guarantee the separation of the coating and the wafer. Therefore, its application still has certain limitations. Summary of the Invention

[0004] To overcome the shortcomings of existing wafer film removal devices after thinning, which are limited by their structure and have the drawbacks described in the background art, this utility model provides a new type of multi-functional wafer film removal equipment. Under the joint action of related mechanisms, after the operator or PLC-controlled multi-axis robot places the wafer to be peeled at the work station, it can peel off the coating (film) as needed, or peel off the protective film while applying the coating, thereby bringing convenience to the operator and improving work efficiency and application scope.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A novel multifunctional wafer film peeling device includes a PLC, a vacuum pump, a base plate, a rear plate, and a movable suction cup mechanism. It also features a tape unwinding and separating mechanism, a limiting mechanism, and a tape recycling mechanism. The rear plate is mounted on one side of the rear end of the base plate. The tape unwinding and separating mechanism includes a servo motor reduction sub-mechanism, a winding shaft, and guide rollers. There are at least two sets of winding shafts and guide rollers. The servo motor reduction sub-mechanism is fixedly mounted on the lower part of one side of the rear end of the rear plate. The rear end of one set of winding shafts is rotatably mounted on the upper part of one side of the rear plate. The front side of the servo motor reduction sub-mechanism's rotating shaft and... The rear end of another set of winding shafts is fixedly installed together, and the rear ends of the two sets of guide rollers are respectively rotatably installed on the lower part of the other side of the rear plate; the limiting mechanism includes cylinders, rotating rollers, and a gantry, with at least two sets of cylinders, the two sets of cylinders being fixedly installed on the outer front and rear ends of the gantry, the front and rear sides of the rotating rollers being rotatably installed on the upper part of the piston rods of the two sets of cylinders and located inside the gantry, and the lower ends of the gantry being fixedly installed on the front and rear sides of the middle part of the base plate; guide grooves are distributed on the front and rear parts of one side of the base plate, and the tape recycling mechanism includes an electric screw slide, a linear slide, and The system includes a servo motor, a drive pulley, a driven pulley, cylinder A, a transmission belt, a rotating roller A, a gantry A, a mounting plate, and a winding shaft A. The lower end of the mounting plate is fixedly installed on the upper rear end of the gantry A. Multiple sets of rotating rollers A are included, with two sets rotatably mounted on the front and rear sides of the upper part of the gantry A, respectively. Two sets of cylinders A are fixedly mounted on the front and rear sides of the upper part of the gantry A, respectively. The other two sets of rotating rollers A are rotatably mounted on the lower ends of the piston rods of the two sets of cylinders A, respectively. The linear slide and the electric lead screw slide are fixedly installed on the lower exterior of the base plate. A connecting plate is fixedly installed at the lower end of the sliding block. The front and rear sides of the lower end of the gantry A are fixedly installed together with the front and rear ends of the connecting plate, respectively. The winding shaft A and the servo motor are fixedly installed at the front of the mounting plate. The rear outer side of the winding shaft A and the rear outer side of the servo motor shaft rotate outside the rear end of the mounting plate. The driving pulley, the driven pulley, the rear outer side of the servo motor shaft, and the rear outer side of the winding shaft A are fixedly installed together. The transmission belt is looped around the outside of the driving pulley and the driven pulley. The movable suction cup mechanism is installed on the base plate between the gantry and the gantry A.

[0007] Furthermore, limit plates are respectively installed on the front ends of the two sets of winding shafts and winding shaft A, and the roll of tape is rotated around the outside of the upper set of winding shafts.

[0008] Furthermore, the distance between the two sets of guide rollers and the distance between the other two sets of rotating rollers A are both greater than the thickness of the tape.

[0009] Furthermore, the heights of the two sets of rotating rollers A are inconsistent.

[0010] Furthermore, the outer diameter of the driving pulley is smaller than the outer diameter of the driven pulley.

[0011] Furthermore, the movable suction cup mechanism includes an electric lead screw slide A, an electric push rod, a suction cup, and a cylinder B. The suction cup has an opening in the middle. The lower ends of multiple sets of electric push rods are respectively fixedly installed around the upper end of the sliding block of the electric lead screw slide A. The lower end of the cylinder B is fixedly installed on the sliding block. A top block is fixedly installed on the upper end of the piston rod of the cylinder B. Multiple negative pressure holes are distributed on the upper end of the suction cup. An exhaust pipe is fixedly installed on the lower end of the suction cup. The exhaust pipe is connected to the air inlet end of the vacuum pump's air inlet solenoid valve via a pipe. The electric lead screw slide A is installed on the middle of the base plate.

[0012] Furthermore, the outer diameter of the top block is smaller than the inner diameter of the suction cup opening. When the piston rod of cylinder B is at the bottom dead center, the upper end height of the top block is lower than the upper end height of the suction cup. When the piston rod of cylinder B is at the top dead center, the upper end height of the top block is higher than the upper end height of the suction cup.

[0013] Compared with the prior art, the advantages of this utility model are as follows: In this application, the wafers that need to be peeled are placed at the workstation by the worker or by a PLC-controlled multi-axis robot. The tape unwinding and separating mechanism can automatically separate and rewind the release film layer at the lower end of the adhesive tape. Then, under the combined action of the limiting mechanism and the movable suction cup mechanism, the tape can be applied and then peeled off as needed, peeling off the coating (film), or applied and peeled off simultaneously, peeling off the protective film and rewinding. Subsequently, the tape recycling mechanism can rewind the tape with the protective film or coating attached, which brings convenience to the workers and improves work efficiency and application scope, so it has good application prospects. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] Figure 1 is a schematic diagram of the overall three-dimensional structure of this utility model.

[0016] Figure 2 is a schematic diagram of the overall planar structure of this utility model.

[0017] Figure 3 is a partial structural schematic diagram of the tape recycling mechanism of this utility model.

[0018] Figures 4 and 5 are schematic diagrams of the structure of this utility model in the state of being applied and torn simultaneously.

[0019] Figures 6 and 7 are schematic diagrams of the structure of this utility model in the state of being pasted on and then peeled off. Detailed Implementation

[0020] As shown in Figures 1, 2, 3, 4, 5, 6, and 7, the novel wafer film-removing equipment includes a PLC or host computer (existing mature technology, its working principle will not be described in detail here, and it is not shown in the figures), a vacuum pump (not shown in the figures, existing mature technology, its working principle will not be described in detail here), a base plate 1, a rear plate 2, and a movable suction cup mechanism 3. It also has a tape unwinding and separating mechanism 4, a limiting mechanism 5, and a tape recycling mechanism 6. The lower end of the rear plate 2 is fixedly installed on the rear left end of the base plate 1. The tape unwinding and separating mechanism includes a servo motor reduction gear 41, a winding shaft 42, a guide roller 43, and a bearing seat 44. There are at least two sets of each of the winding shaft 42, guide roller 43, and bearing seat 44. Mechanism 41 is fixedly installed on the lower left side of the rear plate 2. The rear end of one set of winding shafts 42 is rotatably installed on the upper left side of the rear plate 2. The rotating shaft of the servo motor reduction sub-mechanism 41 is led out to the front and outer ends through the opening on the left side of the rear plate 2. The rear end of the other set of winding shafts 42 is fixedly installed on the front side of the rotating shaft of the servo motor reduction sub-mechanism 41. Two sets of bearing seats 44 are respectively fixedly installed on the lower right front part of the rear plate 2. The rear ends of two sets of guide rollers 43 are respectively fixedly installed in the inner rings of the bearings of the two sets of bearing seats 44. The limiting mechanism includes cylinder 51, rotating roller 52, and "Π"-shaped gantry 53. The front and rear ends of the gantry 53 each have a sliding groove 531. There are two sets of cylinders 51. The cylinder bodies of the two sets of cylinders 51 are vertically aligned. The components are respectively fixedly installed on the outer middle of the front and rear ends of the gantry 53. The two sides of the shaft in the middle of the rotating roller 52 are respectively fixedly installed on the upper part of the piston rod of the two sets of cylinders 51, and the rotating roller 52 rotates longitudinally between the inner sides of the gantry 53. The front and rear parts of the lower end of the gantry 53 are respectively fixedly installed on the front and rear sides of the middle part of the base plate 1. A guide groove 101 is distributed on the front and rear sides from the middle to the right of the base plate 1. The tape recycling mechanism includes an electric screw slide 61, a linear slide 62, a servo motor 63, a driving pulley, a driven pulley, a cylinder A66, a transmission belt, a rotating roller A68, a gantry A69, a mounting plate 601, and a winding shaft A605. The lower end of the mounting plate 601 is fixedly installed on the upper part of the rear end of the gantry A69. The rotating roller A68... There are four sets of 68. The shaft of the middle part of each set of rotating rollers A68 is fixedly installed in the inner ring of the bearing of a bearing seat A602. The bearing seats A602 of two sets of rotating rollers A68 are fixedly installed on the front and rear sides of the upper part of the gantry A69 with a distance between the front and rear ends. The cylinder bodies of two sets of cylinders A66 are vertically distributed and fixedly installed on the front and rear sides of the upper left part of the gantry A69. The bearing seats A602 of the other two sets of rotating rollers A68 are vertically distributed with a distance between the front and rear ends and are fixedly installed on the inner side of two fixed plates 603 (the distance between the outer side of the two fixed plates 603 and the upper side of the gantry A69). The lower end of the piston rod of the two sets of cylinders A66 and the upper end of the two fixed plates 603 are fixedly installed together.At least two sets of linear slide tables 62 are provided. The guide rails of the two sets of unpowered linear slide tables 62 are respectively fixedly installed on the front and rear sides of the lower end of the base plate 1 and are respectively located on the lower inner side of the two sets of guide grooves 101. The electric screw slide tables 61 are horizontally distributed and fixedly installed in the middle of the front and rear sides of the lower end of the base plate 1. A connecting plate 604 is fixedly installed on the lower end of the sliding block of the electric screw slide table 61. The front and rear sides of the lower end of the gantry A69 are respectively fixedly installed together with the front and rear ends of the two connecting plates 604. A support foot is fixedly installed on each of the four sides of the lower end of the base plate 1 (Figure). (Not shown in the drawing); The winding shaft A605 and the servo motor 63 are respectively rotated and fixedly installed on the left and right front parts of the mounting plate at intervals. The rear outer side of the winding shaft A605 and the rear outer side of the servo motor 63 are rotated outside the rear end of the mounting plate. The driving pulley, the driven pulley, the rear outer side of the servo motor 63 shaft, and the rear outer side of the winding shaft A605 are respectively fixedly installed together. The transmission belt is looped around the outside of the driving pulley and the driven pulley. The movable suction cup mechanism 3 is installed on the base plate 1 between the gantry 53 and the gantry A69.

[0021] As shown in Figures 1, 2, 3, 4, 5, 6, and 7, a limiting plate 421 with an outer diameter larger than the outer diameter of the tape roll is threaded onto the front end of each of the two sets of winding shafts 42 (to prevent the tape from separating from the winding shaft). The hollow drum of the tape roll 7 rotates around the outside of the upper set of winding shafts 42, and the front and rear sides of the tape roll 7 are spaced apart from the rear side of the limiting plate 421 and the front side of the rear plate 2. The distance between the two sets of guide rollers 43 and the distance between the other two sets of rotating rollers A68 are greater than the thickness of the tape 71. The height of one set of rotating rollers A68 on the left is higher than the height of the set of rotating rollers A68 on the right. A limiting plate with an outer diameter larger than the outer diameter of the tape roll is threaded onto the front end of the winding shaft A605 (to prevent the tape from separating from the winding shaft A). The lateral width of the sliding groove 531 in the middle of the front and rear ends of the gantry 53 is greater than the outer diameter of the shaft in the middle of the rotating roller 52, and the width of the front and rear ends of the gantry A69 is less than the width of the front and rear ends of the guide groove 101. The outer diameter of the driving pulley is smaller than that of the driven pulley. The movable suction cup mechanism includes an electric screw slide A31, an electric push rod 32, a hollow suction cup 33, and a cylinder B34. The suction cup 33 has an annular opening 331 in the middle. The lower ends of the cylinders of the four sets of electric push rods 32 are respectively fixedly installed around the upper end of the sliding block of the electric screw slide A31. The lower end of the cylinder of the cylinder B34 is vertically fixedly installed on the left end of the sliding block. A top block 35 is fixedly installed on the upper end of the piston rod of the cylinder B34. Multiple negative pressure holes 332 are distributed on the upper end of the suction cup. An exhaust pipe (not shown in the figure) communicating with its interior is fixedly installed on the lower end of the suction cup 33. The exhaust pipe and the air intake end of the vacuum pump's air intake solenoid valve are connected via a flexible hose with sufficient length and a certain strength. The electric screw slide A31 is horizontally installed on the middle of the base plate. The outer diameter of the top block 35 is smaller than the inner diameter of the suction cup opening 331. When the piston rod of cylinder B34 is at the bottom dead center, the upper end height of the top block 35 is lower than the upper end height of the suction cup 33. When the piston rod of cylinder B34 is at the top dead center, the upper end height of the top block 35 is higher than the upper end height of the suction cup 33. The servo motor reduction sub-mechanism 41, the upper and lower end intake and exhaust solenoid valves of the cylinder bodies of the two cylinders 52, the servo motor 63, the upper and lower end intake and exhaust solenoid valves of the cylinder bodies of the two cylinders A66, the upper and lower end intake and exhaust solenoid valves of the cylinder body of cylinder B34, the four sets of electric push rods 32, the motor of the electric lead screw slide 61, the motor power input terminal of the electric lead screw slide A31, and 18 sets of power output terminals of the PLC are connected by wires.

[0022] As shown in Figures 1, 2, 3, 4, 5, 6, and 7, the working process of this new invention is as follows: (1) Rotate the hollow roll of tape roll 7 in the middle to the outside of the upper set of winding shafts 42. Pull the front end of tape 71 out from the right to the left between the two guide rollers 43. Tear open the release film 72 on the lower front side of tape 71. Wrap the front end of release film 72 around the outside of the lower set of winding shafts 42 multiple times. The upper end of tape 7 passes through the lower end of rotating roller 52, passes through the lower part of one of the two sets of lower rotating rollers A68, and is pulled out to the left between the right sides of the two rotating rollers A68. The tape passes through the upper part of one of the two sets of left rotating rollers A68, passes through the lower part of one of the two sets of right rotating rollers A68, and finally wraps around the winding shaft A605 multiple times. (2) The PLC controls the multi-axis robot to place the wafer 8 that needs to be peeled on the suction cup 33. The PLC controls the vacuum pump and the connected air intake solenoid valve to be energized and work. The vacuum pump extracts the air in the suction cup, and the wafer and processing ring are adsorbed on the suction cup 22. (3) The PLC controls the positive and negative power input terminals of the electric screw slide A31 to be energized and work for a period of time. The sliding block of the electric screw slide A31 drives the suction cup to move to the left end and stop. The PLC controls the upper intake and exhaust solenoid valves of the two sets of cylinders 51 and the upper intake and exhaust solenoid valves of cylinder A to work for a period of time. The piston rods of the two sets of cylinders 51 and the piston rods of the two sets of cylinders A66 drive the rotating rollers 52 and the other two sets of 68 to move down. The rotating rollers 52 and A68 drive the tape to move down. The height of the tape is lower than the height of the upper end of the wafer 8 (the lower end of the tape is located on the right side of the upper end of the suction cup and the lower end of the rotating roller 52 rotates and presses on the right end of the suction cup). (4) The PLC synchronously controls the electric screw slide A31 to be powered on and work for a period of time (the suction cup moves a distance from left to right), and controls the electric screw slide 61 to be powered on and work for a period of time (the winding shaft A605 moves from left to right). The PLC also controls the servo motor 63 to be powered on and work for a period of time, which drives the driven pulley and the winding shaft A605 to rotate counterclockwise through the active pulley and the transmission belt, gradually winding up the adhesive tape after the protective film is bonded. During the process, the lower end of the tape is sticky, which can tear off the protective film covering the wafer 8 and wind it onto the winding shaft A605 with the tape (the synchronous PLC will control the motor reduction sub-mechanism 41 to work so that the lower winding shaft can wind up the release film). (5) The PLC controls the electric linear slide A31 to move the suction cup to the left end by the electric sliding block at the positive and negative power input terminals. Then the PLC controls the multi-axis robot to remove the wafer 8 that needs to be peeled from the suction cup 33 and place it in the finished product station. (During the process, the PLC will control the piston rod of the cylinder B34 to move upward, and then the top block 35 will push the wafer out to a height higher than the suction cup, so that it is convenient for manual or robot to take away the wafer. Afterwards, the PLC controls the top block to lower the height to prepare for placing the next wafer).Consistent with the above (1)-(5) process, this new invention can continuously remove the protective film from the wafer; specifically, under the joint action of relevant mechanisms, after the staff or the PLC-controlled multi-axis robot place the wafer that needs to be peeled at the work station, this new invention can peel off the protective film while applying it, or peel off the coating (coating) while applying it. That is, first, the film peeling tape is completely applied to the surface of the wafer 8, and then the film peeling action is performed. From the initial state of film peeling shown in Figure 4 to the state shown in Figure 6, the film peeling platform and the film peeling recycling cylinder move to the right synchronously. This process completes the action of applying the film peeling tape to the surface of the wafer; subsequently, from the state shown in Figure 6 to the state shown in Figure 7, the film peeling platform (suction cup) continues to move slowly to the right, and the tape recycling mechanism moves back. The two move in opposite directions until the film peeling tape is completely removed from the wafer, thus completing one film peeling action. It should be noted that the PLC's separate control of the motor reduction mechanism, vacuum pump, electric push rod, electric linear slide, and cylinder solenoid valve, with each component operating at intervals, is a mature existing control technology, and this application does not provide protection for that technology. This application protects a technical solution in actual production where workers only need to place the wafers requiring film removal at the film removal station, remove the film, and then remove them, providing convenience and improving work efficiency.

[0023] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model.

[0024] Furthermore, it should be understood that although this specification describes the embodiments, the embodiments do not necessarily contain only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A new multifunctional wafer film tearing device, comprising a PLC, a vacuum pump, a bottom plate, a back plate, a movable suction cup mechanism, characterized in that, It also includes a tape unwinding and separating mechanism, a limiting mechanism, and a tape recycling mechanism; the rear plate is installed on one side of the rear end of the base plate. The tape unwinding and separating mechanism includes a servo motor reduction sub-mechanism, a winding shaft, and guide rollers. There are at least two sets of winding shafts and guide rollers. The servo motor reduction sub-mechanism is fixedly installed on the lower part of one side of the rear end of the rear plate. The rear end of one set of winding shafts is rotatably installed on the upper part of one side of the rear plate. The front side of the rotating shaft of the servo motor reduction sub-mechanism and the rear end of the other set of winding shafts are fixedly installed together. The rear ends of the two sets of guide rollers are... The limiting mechanism includes a cylinder, a rotating roller, and a gantry. There are at least two sets of cylinders, each fixedly installed on the outer front and rear ends of the gantry. The rotating roller is rotatably mounted on the upper part of the piston rods of the two sets of cylinders and located inside the gantry. The lower end of the gantry is fixedly installed on the front and rear sides of the middle section of the base plate. Guide grooves are distributed on the front and rear sides of one side of the base plate. The tape recycling mechanism includes an electric lead screw slide, a linear slide, a servo motor, a driving pulley, a driven pulley, and cylinder A. The system includes a transmission belt, rotating roller A, gantry A, mounting plate, and winding shaft A. The lower end of the mounting plate is fixedly installed on the upper rear end of gantry A. Multiple sets of rotating roller A are included, with two sets rotatably mounted on the front and rear sides of the upper part of gantry A, respectively. Two sets of cylinders A are fixedly mounted on the front and rear sides of the upper part of gantry A, respectively. The front and rear sides of the other two sets of rotating roller A are rotatably mounted on the lower ends of the piston rods of the two sets of cylinders A, respectively. The linear slide and electric lead screw are fixedly installed on the lower exterior of the base plate. The lower end of the sliding block of the electric lead screw slide is fixedly mounted... The lower end of the gantry A is fixedly installed with the front and rear ends of the connecting plate, respectively. The winding shaft A and the servo motor are fixedly installed on the front of the mounting plate. The rear outer side of the winding shaft A and the rear outer side of the servo motor shaft are rotated to be located outside the rear end of the mounting plate. The driving pulley, the driven pulley, the rear outer side of the servo motor shaft, and the rear outer side of the winding shaft A are fixedly installed together. The transmission belt is looped around the outside of the driving pulley and the driven pulley. The movable suction cup mechanism is installed on the base plate between the gantry and the gantry A.

2. The novel multifunctional wafer peeling equipment according to claim 1, characterized in that, Two sets of winding shafts are installed, and limit plates are installed on the front end of winding shaft A. The roll of tape rotates around the outside of the upper set of winding shafts.

3. The novel multifunctional wafer peeling equipment according to claim 1, characterized in that, The distance between the two sets of guide rollers and the distance between the other two sets of rotating rollers A are both greater than the thickness of the tape.

4. The novel multifunctional wafer peeling equipment according to claim 1, characterized in that, The heights of the two sets of rotating rollers A are inconsistent.

5. The novel multifunctional wafer peeling equipment according to claim 1, characterized in that, The outer diameter of the driving pulley is smaller than that of the driven pulley.

6. The novel multifunctional wafer peeling equipment according to claim 1, characterized in that, The movable suction cup mechanism includes an electric lead screw slide A, an electric push rod, a suction cup, and a cylinder B. The suction cup has an opening in the middle. The lower ends of multiple sets of electric push rods are fixedly installed around the upper part of the sliding block of the electric lead screw slide A. The lower end of the cylinder B is fixedly installed on the sliding block. A top block is fixedly installed on the upper end of the piston rod of the cylinder B. Multiple negative pressure holes are distributed on the upper end of the suction cup. An exhaust pipe is fixedly installed on the lower end of the suction cup. The exhaust pipe is connected to the air inlet end of the vacuum pump's air inlet solenoid valve via a pipe. The electric lead screw slide A is installed on the middle part of the base plate.

7. The novel multifunctional wafer film tearing apparatus according to claim 6, wherein The outer diameter of the top block is smaller than the inner diameter of the suction cup opening. When the piston rod of cylinder B is at the bottom dead center, the upper end of the top block is lower than the upper end of the suction cup. When the piston rod of cylinder B is at the top dead center, the upper end of the top block is higher than the upper end of the suction cup.

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