Multi-wire bonding device

Abstract

The utility model relates to the technical field of gluing devices, and particularly discloses a multi-wire bonding device. Wherein the gluing device comprises a gluing device, a first wire passing structure arranged on one side of the gluing device and a second wire passing structure arranged on the other side of the gluing device, the first wire passing structure and the second wire passing structure are oppositely arranged, and a wire sequentially passes through the first wire passing structure, the gluing device and the second wire passing structure; the first wire passing structure and the second wire passing structure each comprise a base used for containing the wire, a width adjusting structure used for adjusting the wire inlet width and a height adjusting structure used for adjusting the wire inlet height. The electric wire bonding device is suitable for bonding electric wires of various specifications, the applicability of equipment is improved, and the bonding effect is ensured.

Description

A multi-wire bonding device Technical Field

[0001] This utility model relates to the field of adhesive device technology, and in particular to a multi-wire bonding device. Background Technology

[0002] In modern industrial production, electrical wires are an indispensable and crucial component. Like the blood vessels of a city, they continuously deliver electricity to every corner. Wires are typically made of highly conductive metals, with an outer layer of insulation material to ensure safe and efficient power transmission. However, during the processing of electrical wires, multiple wires often need to be bonded together to meet different usage requirements. Because the thickness of the wires bonded varies each time, and the number of wires to be bonded also frequently changes, if these differences are not adjusted accordingly, poor adhesive bonding can occur, leading to an increase in defective products. Summary of the Invention

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a multi-wire bonding device suitable for bonding wires of various specifications, improving the applicability of the equipment and ensuring bonding effectiveness.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A multi-wire bonding device includes: an adhesive device, a first wire guiding structure disposed on one side of the adhesive device, and a second wire guiding structure disposed on the other side of the adhesive device. The first wire guiding structure and the second wire guiding structure are disposed opposite to each other, and the wire passes through the first wire guiding structure, the adhesive device, and the second wire guiding structure in sequence.

[0006] Both the first wire guide structure and the second wire guide structure include a base for placing the wire, a width adjustment structure for adjusting the width of the wire inlet, and a height adjustment structure for adjusting the height of the wire inlet.

[0007] According to some embodiments of the present invention, the adhesive device includes an adhesive structure and an adhesive application structure disposed above the adhesive structure.

[0008] According to some embodiments of the present invention, the adhesive structure includes an adhesive tank for holding adhesive and an adhesive roller disposed in the adhesive tank. When the adhesive roller rolls, its lower part can contact the adhesive in the adhesive tank, and its upper part can contact the wire.

[0009] According to some embodiments of the present invention, the glue-adding structure includes a container for holding glue, a glue-adding pipe disposed at the bottom of the container, and a control valve disposed on the glue-adding pipe for controlling the flow rate.

[0010] According to some embodiments of the present invention, the base includes a base plate, a plurality of side plates disposed on the base plate, and a pivot disposed on the base plate for placing the wire, wherein the wire entry width is defined between two adjacent side plates.

[0011] According to some embodiments of the present invention, the width adjustment structure includes a first adjustment groove disposed on the base plate and a first fastener that cooperates with the first adjustment groove. The extension direction of the first adjustment groove is parallel to the width direction of the incoming line, and the first fastener passes through the first adjustment groove and is connected to the side plate.

[0012] According to some embodiments of the present invention, the height adjustment structure includes a second adjustment groove extending vertically on the side plate and an adjustment structure, the adjustment structure being used to adjust the height of the rotating shaft within the second adjustment groove.

[0013] According to some embodiments of the present invention, the adjustment structure includes an adjustment side plate connected to the rotating shaft and a second fastener for connecting the rotating shaft to the adjustment side plate, the second fastener being capable of adjusting the vertical position of the rotating shaft on the adjustment side plate.

[0014] According to some embodiments of the present invention, the adjustment structure includes limiting posts disposed on both sides of the rotating shaft and pads placed below the rotating shaft.

[0015] According to some embodiments of the present invention, the adjustment structure further includes a limiting member disposed on the side plate for limiting the height of the rotating shaft, the limiting member being able to pass through the second adjustment groove and move relatively closer to or away from the rotating shaft.

[0016] This utility model has at least the following beneficial effects:

[0017] The width and height adjustment structures allow for flexible adjustment of the wire entry width and height based on the thickness and quantity of the wires. The width adjustment structure restricts the entry width of the wires, ensuring accurate bonding of multiple wires and improving bonding quality. The height adjustment structure adjusts the height of the wires entering and exiting the adhesive device. The device can adapt to different specifications of wires, ensuring that the wires are in the optimal position before bonding, greatly improving the versatility and applicability of the device. Attached Figure Description

[0018] Figure 1 is a structural schematic diagram of an embodiment of the present invention;

[0019] Figure 2 is a cross-sectional view of one embodiment of the present invention. Detailed Implementation

[0020] This invention provides the following description with reference to the accompanying drawings to aid in a comprehensive understanding of the various embodiments of the invention as defined by the claims and their equivalents. The description includes various specific details to aid understanding, but these details should be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the invention.

[0021] In the description of this utility model, the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] It should be understood that when one element (e.g., the first element) is “connected” to another element (e.g., the second element), the element may be directly connected to the other element, or there may be an intervening element (e.g., the third element) between the element and the other element.

[0023] An embodiment of this utility model provides a multi-wire bonding device, as shown in Figures 1-2, including: a bonding device 1, a first wire passing structure 201 disposed on one side of the bonding device 1, and a second wire passing structure 202 disposed on the other side of the bonding device 1. The first wire passing structure 201 and the second wire passing structure 202 are disposed opposite to each other, and the wire 3 passes through the first wire passing structure 201, the bonding device 1, and the second wire passing structure 202 in sequence.

[0024] Both the first wire guide structure 201 and the second wire guide structure 202 include a base 203 for placing the wire 3, a width adjustment structure 205 for adjusting the width of the wire inlet, and a height adjustment structure 204 for adjusting the height of the wire inlet.

[0025] Both the first wire guide structure 201 and the second wire guide structure 202 are equipped with a width adjustment structure 205 and a height adjustment structure 204, which can flexibly adjust the width and height of the wires 3 according to their thickness and quantity. Furthermore, multiple sets of wires 3 can be glued simultaneously. The width adjustment structure 205 restricts the entry width of the wires 3, ensuring accurate bonding positions of multiple wires 3 and improving bonding quality. The base 203 can be a roller, pulley, platform, or other structure for wire guiding. The width adjustment structure 205 can be a baffle, protrusion, groove, or other structure that restricts the entry width, located on or to one side of the base 203. The height adjustment structure 204 can adjust the height of the wires 3 when entering and exiting the gluing device 1. The height adjustment structure 204 can be a screw that can adjust the base 203 up and down, multiple wire holes located at different positions, multiple stacked rollers, or other structures that can achieve height adjustment. The device can adapt to wires 3 of different specifications, ensuring that the wires 3 are in the optimal position before bonding, greatly improving the versatility and applicability of the device. The first wire-passing structure 201 and the second wire-passing structure 202 can be the same or different.

[0026] In some embodiments, as shown in FIG1, the adhesive device 1 includes an adhesive structure 101 and an adhesive application structure 102 disposed above the adhesive structure 101.

[0027] The adhesive structure 101 can bond the wires 3 together, ensuring a firm connection between the wires 3; the glue-adding structure 102 is located above the adhesive structure 101, which facilitates timely replenishment of adhesive, ensures the continuity of adhesive supply, avoids bonding interruption due to insufficient adhesive, and thus effectively improves production efficiency and bonding quality.

[0028] Further, as shown in Figure 2, the adhesive structure 101 includes an adhesive tank 103 for holding adhesive and an adhesive roller 104 disposed on the adhesive tank 103. When the adhesive roller 104 rolls, its lower part can contact the adhesive in the adhesive tank 103, and its upper part can contact the wire 3.

[0029] The adhesive roller 104 is designed to ensure that the adhesive is evenly applied to each wire 3 as the roller rolls, reducing friction between the roller and the wire 3 and protecting the wire 3 while applying the adhesive. During rolling, the lower part of the adhesive roller 104 makes full contact with the adhesive in the adhesive groove 103, ensuring that each roll carries an appropriate amount of adhesive, while the upper part contacts the wire 3, precisely applying the adhesive to the surface of the wire 3 for efficient and uniform bonding. Furthermore, the adhesive roller 104 has multiple grooves along the rolling direction, which further control the amount and distribution of adhesive, preventing excessive or insufficient application of adhesive.

[0030] Further, as shown in Figure 2, the glue dispensing structure 102 includes a container 105 for holding glue, a glue dispensing tube 106 disposed at the bottom of the container 105, and a control valve 107 disposed on the glue dispensing tube 106 for controlling the flow rate.

[0031] The container 105 holds sufficient glue to meet the continuous needs of the bonding process, ensuring a stable glue supply. The glue dispensing pipe 106 connects the container 105 to the adhesive bonding device 1, allowing the glue to flow smoothly from the container 105 to the adhesive bonding tank 103, achieving precise glue delivery. A control valve 107, located on the glue dispensing pipe 106, precisely controls the glue flow rate, flexibly adjusting the glue supply according to the bonding process requirements to avoid poor bonding caused by too much or too little glue. This structure not only improves the automation of glue replenishment and reduces manual intervention but also effectively enhances bonding quality and production efficiency.

[0032] In some embodiments, as shown in Figures 1-2, the base 203 includes a base plate 206, a plurality of side plates 207 disposed on the base plate 206, and a pivot 208 disposed on the base plate 206 for placing the wire 3, wherein the wire inlet width is defined between two adjacent side plates 207.

[0033] The base plate 206 provides a stable support foundation. In this embodiment, the base plate 206 is located on the upper edge of the adhesive groove 103, increasing the overall height of the base 203, saving materials, and ensuring the stability of the wire 3 during processing. Two or more side plates 207 are set on the base plate 206, with the wire entry width defined between adjacent side plates 207, effectively limiting and guiding the wire 3. The pivot 208 is used to place the wire 3. The wire 3 can be placed on top of the pivot 208 or pass between two pivots 208. The side plates 207 can be set on both sides of the pivot 208 or inserted between the pivots 208, realizing the adhesive bonding of multiple sets of multiple wires 3. The pivot 208 reduces the friction between the wire 3 and the base 203, preventing wear of the wire 3. The arrangement of multiple side plates 207 can also be flexibly combined according to different thicknesses and numbers of wires 3.

[0034] Further, as shown in Figures 1-2, the width adjustment structure 205 includes a first adjustment groove 209 disposed on the base plate 206 and a first fastener 210 cooperating with the first adjustment groove 209. The extension direction of the first adjustment groove 209 is parallel to the width direction of the incoming line, and the first fastener 210 passes through the first adjustment groove 209 and is connected to the side plate 207.

[0035] A first adjustment groove 209, whose extension direction is parallel to the width direction of the incoming line, is provided on the base plate 206, providing a flexible adjustment space for width adjustment. A first fastener 210 passes through the first adjustment groove 209 and is connected to the side plate 207, which facilitates precise adjustment of the distance between each side plate 207, thereby achieving flexible control of the incoming line width.

[0036] In some embodiments, as shown in FIG2, the height adjustment structure 204 includes a second adjustment groove 211 extending vertically on the side plate 207 and an adjustment structure 212, the adjustment structure 212 being used to adjust the height of the rotating shaft 208 within the second adjustment groove 211.

[0037] The second adjustment groove 211 is provided on the side plate 207, providing an adjustable mounting position for the rotating shaft 208. This allows the rotating shaft 208 to be flexibly adjusted up and down according to the actual height requirements of the wire 3 via the adjustment structure 212. Multiple rotating shafts 208 can also be stacked and restricted by the second adjustment groove 211 to prevent tipping. The adjustment structure 212 further restricts their highest point or both sides, ensuring that they do not fall off when the rollers rotate relative to each other.

[0038] Further, as shown in Figure 1, the adjustment structure 212 includes an adjustment side plate 215 connected to the rotating shaft 208 and a second fastener 216 for connecting the rotating shaft 208 to the adjustment side plate 215. The second fastener 216 can adjust the vertical position of the rotating shaft 208 on the adjustment side plate 215.

[0039] The second fastener 216 can change the height of the rotating shaft 208 by changing the position of its connection with the adjusting side plate 215. The adjusting side plate 215 can be provided with an adjusting groove or adjusting hole to connect with the second fastener 216.

[0040] Furthermore, as shown in Figures 1-2, the adjustment structure 212 includes limiting posts 214 disposed on both sides of the rotating shaft 208 and pads 217 placed below the rotating shaft 208.

[0041] The limiting post 214 can limit the front and rear displacement of the rotating shaft 208, the second adjusting groove 211 can limit the left and right displacement of the rotating shaft 208, and the height of the rotating shaft 208 is increased by the pad 217 below. In this embodiment, the pad 217 is a circular shaft, which reduces the rolling friction between it and the rotating shaft 208.

[0042] Furthermore, as shown in Figures 1-2, the adjustment structure 212 includes a limiting member 213 disposed on the side plate 207, which can pass through the second adjustment groove 211 and move relatively closer to or away from the rotating shaft 208.

[0043] Limiting components 213, such as bolts, are installed on the side plate 207, passing through the side plate 207 into the second adjusting groove 211, moving relatively closer to or further away from the rotating shaft 208. By rotating the thread, the height of the rotating shaft 208 is limited, effectively preventing displacement of the rotating shaft 208 due to vibration or external force during processing. Furthermore, the bottom of the limiting component 213 is arc-shaped, limiting the height without restricting the rotation of the rotating shaft 208.

[0044] The terms and words used in the foregoing description and claims are not limited to their literal meaning, but are merely used by the applicant to enable a clear and consistent understanding of the present invention. Therefore, those skilled in the art should understand that the foregoing description of various embodiments of the present invention is for illustrative purposes only, and not intended to limit the present invention as defined by the appended claims and their equivalents.

Claims

1. A multi-wire bonding device, characterized in that, include: The device includes an adhesive device (1), a first wire guide structure (201) disposed on one side of the adhesive device (1), and a second wire guide structure (202) disposed on the other side of the adhesive device (1). The first wire guide structure (201) and the second wire guide structure (202) are disposed opposite to each other. The wire (3) passes through the first wire guide structure (201), the adhesive device (1), and the second wire guide structure (202) in sequence. The first wire guide structure (201) and the second wire guide structure (202) each include a base (203) for placing the wire (3), a width adjustment structure (205) for adjusting the wire inlet width, and a height adjustment structure (204) for adjusting the wire inlet height.

2. The multi-wire bonding device according to claim 1, characterized in that: The adhesive device (1) includes an adhesive structure (101) and an adhesive application structure (102) disposed above the adhesive structure (101).

3. The multi-wire bonding device according to claim 2, characterized in that: The adhesive structure (101) includes an adhesive tank (103) for holding adhesive and an adhesive roller (104) disposed in the adhesive tank (103). When the adhesive roller (104) rolls, its lower part can contact the adhesive in the adhesive tank (103), and its upper part can contact the wire (3).

4. A multi-wire bonding device according to claim 3, characterized in that: The glue dispensing structure (102) includes a container (105) for holding glue, a glue dispensing tube (106) disposed at the bottom of the container (105), and a control valve (107) disposed on the glue dispensing tube (106) for controlling the flow rate.

5. A multi-wire bonding device according to claim 1, characterized in that: The base (203) includes a base plate (206), a plurality of side plates (207) disposed on the base plate (206), and a pivot (208) disposed on the base plate (206) for placing the wire (3), wherein the wire inlet width is defined between two adjacent side plates (207).

6. A multi-wire bonding device according to claim 5, characterized in that: The width adjustment structure (205) includes a first adjustment groove (209) disposed on the base plate (206) and a first fastener (210) cooperating with the first adjustment groove (209). The extension direction of the first adjustment groove (209) is parallel to the width direction of the incoming line, and the first fastener (210) passes through the first adjustment groove (209) and is connected to the side plate (207).

7. A multi-wire bonding device according to any one of claims 5-6, characterized in that: The height adjustment structure (204) includes a second adjustment groove (211) extending vertically on the side plate (207) and an adjustment structure (212), the adjustment structure (212) being used to adjust the height of the rotating shaft (208) within the second adjustment groove (211).

8. A multi-wire bonding device according to claim 7, characterized in that: The adjustment structure (212) includes an adjustment side plate (215) connected to the rotating shaft (208) and a second fastener (216) for connecting the rotating shaft (208) to the adjustment side plate (215), the second fastener (216) being able to adjust the vertical position of the rotating shaft (208) on the adjustment side plate (215).

9. A multi-wire bonding device according to claim 7, characterized in that: The adjustment structure (212) includes limiting posts (214) disposed on both sides of the rotating shaft (208) and pads (217) placed below the rotating shaft (208).

10. A multi-wire bonding device according to any one of claims 8-9, characterized in that: The adjustment structure (212) also includes a limiting member (213) disposed on the side plate (207) for limiting the height of the rotating shaft (208), the limiting member (213) being able to pass through the second adjustment groove (211) and move relatively closer to or away from the rotating shaft (208).

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