Magnetic ring, circuit board and power converter

Abstract

The utility model discloses a magnetic ring, a circuit board and a power converter, the middle part of the magnetic ring is provided with an inner hole penetrating through the magnetic ring along the axial direction of the magnetic ring, and the magnetic ring is attached to a board body through a connecting layer. According to the circuit board, the magnet ring is attached to the board body through the connecting layer, compared with a connecting mode in the prior art, automation is easier to achieve through an attaching mode, and therefore the installation efficiency of the magnet ring and the board body is improved.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a magnetic ring, a circuit board, and a power converter. Background Technology

[0002] Currently, magnetic rings are manually fitted onto circuit wiring harnesses or electronic components. When the number of magnetic rings in a circuit is too large or the size of the magnetic rings is too small, the manual fitting method is cumbersome and has low production efficiency.

[0003] Therefore, how to improve the installation efficiency of magnetic rings has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] This application proposes a magnetic ring, a circuit board, and a power converter to improve the installation efficiency of the magnetic ring.

[0005] To achieve the above objectives, this application discloses the following technical solutions:

[0006] In a first aspect, this application provides a magnetic ring having an inner hole extending through the magnetic ring along its axial direction, and the magnetic ring having a connecting layer electronic component for attaching to a board body of a circuit board.

[0007] In some instances, the bonding layer includes a plating layer used for soldering to the plate.

[0008] In some instances, the surface of the magnetic ring that contacts the plate includes an outwardly protruding protrusion, and the plating is disposed on the surface of the protrusion.

[0009] In some instances, the distance between the outer and inner walls of the protrusion is no greater than the distance between the hole wall and the side wall of the magnetic ring.

[0010] In some instances, the protrusions are annular structures arranged around the inner hole.

[0011] In some instances, the ring structure is a circular ring structure, a rectangular ring structure, or an elliptical structure.

[0012] In some instances, the protrusion includes a first protrusion section and a second protrusion section on both sides of the inner hole.

[0013] In some instances, the first protruding segment and the second protruding segment are arranged along a first direction, and the first protruding segment has a first end wall and a second end wall arranged opposite to each other in a second direction. The first end wall and the second end wall are arranged in parallel, and the second direction is perpendicular to the first direction.

[0014] In some instances, the distance between the first end wall and the second end wall in the second direction is not less than the maximum distance between the inner hole walls in the second direction.

[0015] In some instances, the distance between the first end wall and the second end wall in the second direction is less than the maximum distance between the inner hole walls in the second direction. In some instances, the surface where the magnetic ring contacts the plate also includes an outwardly protruding support.

[0016] In some examples, the support includes a first support section and a second support section, which are arranged opposite to each other along a second direction.

[0017] In some instances, the coating is applied to two opposite sides of the magnetic ring.

[0018] In some instances, an adhesive layer is provided on the side of the magnetic ring closest to the plate, and the adhesive layer is used to bond it to the plate.

[0019] In some instances, the connecting layer includes a riveting portion disposed near the surface of the plate, and the plate is provided with riveting holes, the riveting portion being used to rivet with the riveting holes.

[0020] In some examples, the cross-section of the inner hole wall perpendicular to the axial direction is rectangular, circular, elliptical, triangular, hexagonal, or pentagonal.

[0021] In some instances, the surface of the magnetic ring that is attached to the plate is either the end face or the side face of the magnetic ring, with the end faces of the magnetic ring arranged opposite each other along the axial direction of the magnetic ring.

[0022] In some instances, the outer periphery of the magnetic ring in a cross-section perpendicular to the axial direction is rectangular, circular, elliptical, triangular, hexagonal, or pentagonal.

[0023] Secondly, this application provides a circuit board, including a board body, electronic components, and a magnetic ring as described above. The magnetic ring is attached to the board body through a connecting layer, and the magnetic ring is sleeved on the conductive part of the electronic components and disposed on the board body.

[0024] Secondly, this application provides a power converter, including a circuit board as described above.

[0025] As can be seen from the above technical solution, the magnetic ring of this application is attached to the plate through a connecting layer. Compared with the connection method of the prior art, the attachment method is easier to automate, thereby improving the installation efficiency of the magnetic ring and the plate. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort, and this application can be applied to other similar scenarios based on the provided drawings. Unless obvious from the linguistic context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0027] Figure 1 A perspective view of a circuit board provided in an embodiment of this application;

[0028] Figure 2 An exploded view of a circuit board provided in an embodiment of this application;

[0029] Figures 3 to 5 A perspective view of the three magnetic rings provided in the embodiments of this application;

[0030] Figure 6 A perspective view of the second type of circuit board provided in an embodiment of this application;

[0031] Figure 7 An exploded view of the second type of circuit board provided in the embodiments of this application;

[0032] Figures 8 to 14 A perspective view of the seven types of magnetic rings provided in the embodiments of this application;

[0033] Figure 15 A perspective view of the third type of circuit board provided in the embodiments of this application;

[0034] Figure 16 An exploded view of the third type of circuit board provided in the embodiments of this application;

[0035] Figures 17 to 19 A perspective view of the three magnetic rings provided in the embodiments of this application;

[0036] Figures 20 to 21 The images show two types of magnetic rings provided in the embodiments of this application.

[0037] Figure 22 A perspective view of the fourth type of circuit board provided in the embodiments of this application;

[0038] Figure 23 An exploded view of the fourth type of circuit board provided in the embodiments of this application;

[0039] In the diagram: 1-Board; 2-Electronic components; 3-Magnetic ring; 1a-First plate; 1b-Second plate; 3a-First end face; 3b-Second end face; 3c-Side face;

[0040] 11-Socket; 12-Rivet hole;

[0041] 31-Inner hole; 32-Connecting layer; 321-Platinum coating; 322-Adhesive layer; 323-Riveted part; 33-Protrusion; 34-Supporting part;

[0042] 331 - First protruding segment; 332 - Second protruding segment;

[0043] 341 - First support segment; 342 - Second support segment. Detailed Implementation

[0044] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit it. The described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without inventive effort are within the scope of protection of the present application.

[0045] A ferrite core is an electromagnetic compatibility (EMC) component widely used in electronic devices to suppress or filter high-frequency noise, improve signal quality, and enhance the EMC of electronic equipment. For example, currently, ferrite cores are manually fitted onto circuit wiring harnesses, pins, or pins. When the number of ferrite cores on a circuit board is large or the cores are small, this manual fitting method becomes cumbersome and inefficient.

[0046] To improve the installation efficiency of magnetic rings, this application describes the structure of the magnetic ring in detail with reference to the accompanying drawings:

[0047] See Figures 1 to 3 To achieve the above objectives, this application discloses the following technical solutions:

[0048] A magnetic ring 3 has an inner hole 31 extending through the magnetic ring 3 along its axial direction, and a connecting layer 32 for attaching to a circuit board. Compared with existing connection methods, the magnetic ring 3 of this application is attached to the board 1 using a bonding method that is easier to automate, thereby improving the installation efficiency of the magnetic ring 3.

[0049] It should be noted here that the bonding methods can include soldering, gluing, and riveting. Among these, soldering, for example, uses surface mount technology (SMT) to connect the magnetic ring 3 and the board 1. SMT is a technology that directly mounts electronic components onto the surface of a printed circuit board (PCB). SMT offers higher component density, better electrical performance, and higher production efficiency. Specifically, the connecting layer 32 includes a plating layer 321 disposed on the surface of the magnetic ring 3 near the board 1, and is soldered to the board 1 through the plating layer 321.

[0050] For example, the formation of the above-mentioned plating layer 321 is specifically achieved by applying silver paste to the surface of the magnetic ring 3 near the plate 1, then sintering it, and then electroplating a layer of nickel and a layer of tin to form plating layer 321.

[0051] To improve the compactness of the circuit board, the surface of the magnetic ring 3 that contacts the board body 1 includes an outwardly protruding protrusion 33, and a plating layer 321 is disposed on the surface of the protrusion 33. Because of the protrusion 33, the distance between the magnetic ring 3 and adjacent conductive parts is kept within the allowable safety distance range, which reduces the distance between the magnetic ring 3 and adjacent electronic components 2, thereby improving the compactness of the circuit board. Figure 4a As shown.

[0052] The safety distance for electronic components 2 on the circuit board refers to the shortest path measured along the insulating surface between two conductive parts or between a conductive part and the protective interface of the equipment. It takes into account the influence of factors such as contamination and humidity on the insulating material surface on the insulation performance. For example, in a 220V circuit, the safety distance is generally required to be greater than 2.5mm.

[0053] like Figure 4b and Figure 4c As shown, Figure 4b The magnetic ring 3 in the electronic component 2 does not have a protrusion 33. The electronic component 2 includes three conductive parts 21. The magnetic ring 3 is arranged on the conductive part 21 on the right. The shortest path between the conductive part 21 in the middle and the conductive part 21 on the left is the safety distance, denoted by L1. The shortest path between the conductive part 21 in the middle and the magnetic ring 3 is the safety distance, denoted by L2. Both L1 and L2 meet the industry requirements for safety distances.

[0054] Figure 4c The magnetic ring 3 in the electronic component 2 has a protrusion 33. The electronic component 2 includes three conductive parts 21. The magnetic ring 3 is arranged on the conductive part 21 on the right. The shortest path between the conductive part 21 in the middle and the conductive part 21 on the left is the safety distance, denoted by L1. The shortest path between the conductive part 21 in the middle and the protrusion 33 is the safety distance, denoted by L2'. Both L1 and L2' meet the industry requirements for safety distances.

[0055] When L1 = L2 = L2', then we have Figure 4c In the structure shown, the distance between the conductive part 21 in the middle and the conductive part 21 on the right is less than [missing information]. Figure 4b The structure shown is such that the protrusion 33 can improve the compactness between the conductive parts 21 of the electronic component 2.

[0056] The protrusion 33 may be formed by protruding outward from one side of the magnetic ring 3 or by being recessed inward from one side of the magnetic ring 3. For example, if it is formed by protruding outward from one side of the magnetic ring 3, the outward protruding structure of the magnetic ring 3 can be considered as the protrusion 33; if it is formed by being recessed inward from one side of the magnetic ring 3, that side of the magnetic ring 3 can be considered as the protrusion 33.

[0057] The protrusion 33 can be formed, for example, by additive manufacturing on the surface of the magnetic ring 3. Specifically, by adding components to the overall surface of the magnetic ring 3 to form a structure that protrudes from the overall surface of the magnetic ring 3, the protruding structure is the protrusion 33; or it can be formed by cutting the magnetic ring 3, for example, by cutting out excess structure on the surface of the magnetic ring 3 to form a protruding structure that protrudes relative to the recessed position, the protruding structure is the protrusion 33.

[0058] The distance between the outer and inner walls of the protrusion 33 is no greater than the distance between the hole wall and the side wall of the magnetic ring 3. The distance between the outer and inner walls of the protrusion 33 can be understood as the width of the protrusion 33, and the distance between the hole wall and the side wall of the magnetic ring 3 can be understood as the thickness of the magnetic ring 3. Since the surface of the protrusion 33 is coated with a plating layer 321, by controlling the width of the protrusion 33 within the thickness range of the magnetic ring 3, the area of ​​the plating layer 321 can be controlled, thereby making it easy to adjust the shortest path between the conductive part 21 of the adjacent electronic component 2 and the magnetic ring 3.

[0059] It should be noted that the magnetic ring 3 is typically formed by a first end face 3a, a second end face 3b, and a side face 3c. The first end face 3a and the second end face 3b are arranged opposite each other. The side face 3c connects the outer edges of the first end face 3a and the second end face 3b. The hole wall connects the inner edges of the first end face 3a and the second end face 3b. The side face 3c can be formed by multiple planes, such as three planes, four planes, five planes, etc. The side face 3c can also be formed by curved surfaces, such as cylindrical surfaces, elliptical cylindrical surfaces, etc. The protrusion 33 is typically formed by an upper surface, an outer side wall, and an inner side wall. The inner side wall and the outer side wall are arranged opposite each other, and the inner side wall is closer to the inner hole 31 than the outer side wall.

[0060] The inner wall of the protrusion 33 coincides with the wall of the inner hole 31. Figure 4a , Figure 5 , Figure 9 , Figure 10 , Figure 11 and Figure 14 As shown, in some examples, the inner wall of the protrusion 33 does not coincide with the wall of the inner hole 31, such as... Figure 12 and Figure 13 As shown.

[0061] The protrusion 33 is a ring-shaped structure arranged around the inner hole 31. For example, the ring-shaped structure can be a circular ring or a rectangular ring, as shown in Figure 4. Figure 9 As shown in Figure 4, the protrusion 33 is a ring structure. Figure 9 The protrusion 33 shown is a rectangular ring structure.

[0062] To further improve compactness, in some examples of this application, the protrusion 33 includes a first protrusion segment 331 and a second protrusion segment 332 arranged on both sides of the inner hole 31, such as... Figure 5 , Figures 10 to 14 .

[0063] In some embodiments, the first protrusion 331 and the second protrusion 332 are arranged along a first direction. The first protrusion 331 has a first end wall 331a and a second end wall 331b arranged opposite each other in a second direction. The first end wall 331a and the second end wall 331b are arranged in parallel, and the second direction is perpendicular to the first direction. In some examples, the first direction corresponds to a safety distance, so the distance between the outer side wall and the inner side wall can reflect the width of the first protrusion 331, and thus affect the shortest path between the first protrusion 331 and the adjacent conductive part 21. In other examples, the second direction corresponds to a safety distance, so the distance between the first end wall 331a and the second end wall 331b can reflect the length of the first protrusion 331, and thus affect the shortest path between the first protrusion 331 and the adjacent conductive part 21.

[0064] The first and second directions mentioned above can be perpendicular to the axis z, or they can be non-perpendicular. Their specific arrangement is related to the arrangement of the magnetic ring 3 on the circuit board.

[0065] Similarly, the first direction mentioned above corresponds to a safety distance, and the distance between the outer and inner sidewalls reflects the width of the second protrusion 332, which in turn affects the shortest path between the second protrusion 332 and the adjacent conductive part. In some other examples, the second direction mentioned above corresponds to a safety distance, and the distance L3 between the first end wall 331a and the second end wall 331b reflects the length of the second protrusion 332, which in turn affects the shortest path between the second protrusion 332 and the adjacent conductive part.

[0066] Taking the safety distance corresponding to the second direction as an example, in order to balance connection strength and structural compactness, in some examples of this application, the distance L3 between the first end wall 331a and the second end wall 331b in the second direction is not less than the maximum aperture D of the inner hole 31 in the second direction, such as... Figures 10 to 13 As shown. In some embodiments, the distance between the first end wall 331a and the second end wall 331b in the second direction is less than the maximum distance between the inner hole 31 and the hole wall in the second direction. When the inner hole 31 is a cuboid structure, the distance between the inner hole 31 and the hole wall in the second direction is equal. When the inner hole 31 is a cylindrical structure, the distance between the inner hole 31 and the hole wall in the second direction gradually decreases towards both ends as it passes through the center of the circle.

[0067] Furthermore, to enhance the connection strength between the magnetic ring 3 and the plate 1 in this situation, the surface where the magnetic ring 3 and the plate 1 are in contact also includes an outwardly protruding support portion 34, such as... Figure 14 As shown in the figure, there are two support sections 34. Each support section 34 includes a first support segment 341 and a second support segment 342. The first support segment 341 and the second support segment 342 are arranged opposite to each other along a second direction.

[0068] In this application, the cross-section of the inner hole 31 perpendicular to the axial direction is rectangular, circular, or elliptical. Figure 3 Figure 4 Figure 5 , Figure 11 , Figure 12 , Figure 13 , Figure 18 The inner hole 31 is circular. Figure 8 , Figure 9 , Figure 10 , Figure 14 , Figure 17 and Figure 19 It is a rectangle.

[0069] In this application example, the inner hole 31 is designed as a circle: see the following formulas (I) to (III):

[0070] impedance Formula (1)

[0071] Where f is the frequency (Hz) and L is the inductance (H).

[0072] inductance Formula (II)

[0073] Where N is the number of laps, It is the inductance coefficient.

[0074] Inductance Formula (3)

[0075] in, It is the air permeability. It is the effective permeability. It is the cross-sectional area of ​​the magnetic circuit. It is the effective magnetic circuit length.

[0076] The effective magnetic circuit length can be determined from formulas (I) to (III). The larger the value, the higher the inductance coefficient. The smaller the value, the smaller the inductance L, and the smaller the impedance Z. Impedance Z is positively correlated with EMC performance. Therefore, when the inner hole 31 is circular, the effective magnetic circuit length... If the inductance L is lower, the impedance Z will increase, resulting in better EMC performance.

[0077] The above describes the shape of the inner hole 31. In some examples of this application, the outer periphery of the magnetic ring 3 in the cross-section perpendicular to the axial direction is a regular shape such as a circle, ellipse, rectangle, triangle, pentagon, or hexagon. It can also be an irregular shape, which will not be described in detail here. Figure 3 As shown in Figure 4, the side surface 3c of the magnetic ring 3 is circular, and the magnetic ring 3 has an axial direction z. Figure 5 The side surface 3c of the middle magnetic ring 3 is elliptical. Figures 8 to 14 ,as well as Figures 17 to 19 The side 3c of the magnetic ring 3 is rectangular. The magnetic ring 3 has an axial direction z, a width direction x, and a length direction y, wherein the axial direction z, the width direction x, and the length direction y are all perpendicular to each other.

[0078] Furthermore, the surface on which the aforementioned magnetic ring 3 is welded to the plate 1 is either the end face of the magnetic ring 3 or the side face 3c of the magnetic ring 3. The end faces of the magnetic ring 3 are arranged opposite each other along the axial direction of the magnetic ring 3, such as... Figures 1 to 14 As shown, the end face of the magnetic ring 3 is welded to the plate 1. Figures 15 to 19 The side 3c of the magnetic ring 3 is welded to the plate 1. The plate 1 includes a first plate 1a and a second plate 1b. The first plate 1a and the second plate 1b are arranged at an angle. The first plate 1a is provided with a socket 11 for cooperating with electronic components 2. The side 3c of the magnetic ring 3 is welded to the second plate 1b.

[0079] See Figure 20 and Figure 21 Taking the magnetic ring 3 bonded to the plate 1 as an example, the connecting layer 32 includes an adhesive layer 322 disposed on the surface of the magnetic ring 3 near the plate 1, and is bonded to the plate 1 through the adhesive layer 322. Similarly, the surface of the magnetic ring 3 bonded to the plate 1 is either the end face of the magnetic ring 3 or the side face 3c of the magnetic ring 3. The adhesive layer 322 can be understood as applying a layer of adhesive to the surface of the magnetic ring 3 to make the surface of the magnetic ring 3 sticky. Other methods that can make the surface of the magnetic ring 3 sticky are also possible, such as using adhesive backing.

[0080] See Figures 22 to 23 The magnetic ring 3 is riveted to the plate 1, and the plate 1 is provided with riveting holes 12. The connecting layer 32 includes a riveting part 323 disposed on the surface of the magnetic ring 3 near the plate 1. The magnetic ring 3 can be riveted to the plate 1 through the riveting part 323. Similarly, the surface of the magnetic ring 3 riveted to the plate 1 is either the end face of the magnetic ring 3 or the side face 3c of the magnetic ring 3.

[0081] The aforementioned plating layer 321, adhesive layer, and riveting part 323 can be arranged on any surface of the magnetic ring 3, and the aforementioned plating layer 321, adhesive layer, and riveting part 323 can be arranged on two opposite surfaces of the magnetic ring 3. In this way, the time required to determine the plating layer 321, adhesive layer, and riveting part 323 during installation can be reduced, further improving installation efficiency.

[0082] The material of the magnetic ring 3 can be ferrite, magnetic powder core (one or more mixed materials such as iron-silicon, iron-silicon-aluminum, iron-nickel, etc.), nanocrystal, silicon steel and other soft magnetic materials.

[0083] This application provides a circuit board, including a board body 1, electronic components 2, and a magnetic ring 3 as described in the above embodiments. The magnetic ring 3 is attached to the board body 1 via a connecting layer 32, and is sleeved on the conductive portion 21 of the electronic components 2 and disposed on the board body 1. Since the magnetic ring 3 has the aforementioned effects, the circuit board including the magnetic ring 3 has corresponding effects, which will not be elaborated further here.

[0084] The conductive part 21 can be a conductive component such as a pin, wire harness, or pin of the electronic component 2.

[0085] This application provides a power converter including a circuit board as described in any of the preceding claims. Since the circuit board has the aforementioned effects, the power converter including the circuit board has corresponding effects, which will not be elaborated further here.

[0086] The aforementioned power converters can be inverters, converters, frequency converters, and grid simulators, etc.

[0087] In the above context, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0088] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0089] It should be noted that, for ease of description, only the parts relevant to the application are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0090] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed, and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. The scope of this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described application concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A magnetic ring, characterized in that, The magnetic ring has an inner hole extending through the magnetic ring along its axial direction, and the magnetic ring has a connecting layer for attaching to the board body of the circuit board.

2. The magnetic ring as described in claim 1, characterized in that, The connecting layer includes a plating layer for welding onto the plate.

3. The magnetic ring as described in claim 2, characterized in that, The surface of the magnetic ring that is in contact with the plate includes an outwardly protruding protrusion, and the plating is disposed on the surface of the protrusion.

4. The magnetic ring of claim 3, wherein, The distance between the outer and inner sidewalls of the protrusion is not greater than the distance between the hole wall and the sidewall of the magnetic ring.

5. The magnetic ring of claim 3, wherein, The protrusion is a ring-shaped structure arranged around the inner hole.

6. The magnetic ring as described in claim 5, characterized in that, The ring structure can be a circular ring, a rectangular ring, or an elliptical structure.

7. The magnetic ring as described in claim 3, characterized in that, The protrusion includes a first protrusion section and a second protrusion section disposed on both sides of the inner hole.

8. The magnetic ring as described in claim 7, characterized in that, The first protruding segment and the second protruding segment are arranged along a first direction. The first protruding segment has a first end wall and a second end wall arranged opposite to each other in a second direction. The first end wall and the second end wall are arranged in parallel. The second direction is perpendicular to the first direction.

9. The magnetic ring of claim 8, wherein, The distance between the first end wall and the second end wall in the second direction is not less than the maximum distance between the inner hole walls in the second direction.

10. The magnetic ring of claim 8, wherein, The distance between the first end wall and the second end wall in the second direction is less than the maximum distance between the inner hole walls in the second direction.

11. The magnetic ring as described in claim 10, characterized in that, The surface of the magnetic ring that is in contact with the plate also includes an outwardly protruding support portion.

12. The magnetic ring as described in claim 11, characterized in that, The support portion includes a first support section and a second support section, wherein the first support section and the second support section are arranged opposite to each other along the second direction.

13. The magnetic ring according to any one of claims 2 to 12, characterized in that, The coating is arranged on two opposite sides of the magnetic ring.

14. The magnetic ring as claimed in claim 1, characterized in that, An adhesive layer is provided on the surface of the magnetic ring near the plate, and the adhesive layer is used to bond it to the plate.

15. The magnetic ring of claim 1, wherein, The connecting layer includes a riveting portion disposed near the surface of the plate, and the plate is provided with a riveting hole, the riveting portion being used to rivet with the riveting hole.

16. The magnetic ring of any one of claims 1 to 12 and 14, 15, wherein, The cross-section of the inner hole wall perpendicular to the axial direction is rectangular, circular, elliptical, triangular, hexagonal, or pentagonal.

17. The magnetic ring according to any one of claims 1 to 12 and 14, 15, characterized in that, The surface of the magnetic ring that is attached to the plate is either the end face of the magnetic ring or the side face of the magnetic ring, and the end faces of the magnetic ring are arranged opposite each other along the axial direction of the magnetic ring.

18. The magnetic ring according to any one of claims 1 to 12 and 14, 15, characterized in that, The outer periphery of the magnetic ring in a cross section perpendicular to the axial direction is rectangular, circular, elliptical, triangular, hexagonal, or pentagonal.

19. A circuit board, characterized in that, The device includes a plate, electronic components, and a magnetic ring as described in any one of claims 1 to 18, wherein the magnetic ring is attached to the plate via a connecting layer and is sleeved on the conductive portion of the electronic components.

20. A power converter, characterized in that, Includes the circuit board as described in claim 19.

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