Card seat assembly and electronic equipment

Abstract

The utility model provides a card seat assembly and electronic equipment. The card seat assembly comprises a card support; the card holder support comprises a cover plate and a side wall, the cover plate and the side wall form a concave space, the card support is arranged in the concave space, the cover plate and the card support are arranged in a stacked mode, one side, opposite to the card support, of a partial area of the cover plate protrudes, and the side, opposite to the card support, of the cover plate protrudes. The protruding area of the cover plate serves as a grounding elastic piece and is electrically connected with the public ground.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a card slot assembly and electronic device. Background Technology

[0002] With the development of mobile communication technology, electronic devices are integrating more and more components, making internal space extremely scarce. Currently, voice calls in electronic devices are primarily achieved through Subscriber Identity Module (SIM) cards. The SIM card is placed in a card tray, which is then inserted into the card slot of the electronic device to establish a communication connection. However, interference can affect antenna performance due to interference issues. Related technologies address this by adding an additional grounding structure to ground the card tray to reduce interference; however, this additional grounding structure hinders the miniaturization of electronic devices. Summary of the Invention

[0003] This application provides a card slot assembly and an electronic device that can solve the problem in related technologies where the addition of an extra grounding structure is not conducive to the miniaturization of electronic devices.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide a card holder assembly, the card holder assembly comprising:

[0006] Cato;

[0007] A card holder bracket includes a cover plate and a side wall. The cover plate and the side wall form a concave space. The card holder is disposed in the concave space, and the cover plate and the card holder are stacked. A portion of the cover plate protrudes from the side opposite to the card holder. The protruding portion of the cover plate serves as a grounding spring and is connected to the common ground.

[0008] Optionally, the protruding area of ​​the cover plate has a bridge-like structure.

[0009] Optionally, the protruding area of ​​the cover plate has a cantilever structure.

[0010] Optionally, the cover plate is provided with a notch, and the protruding area is located in the notch.

[0011] Optionally, the card holder includes a metal portion, and the side of the cover plate containing the protruding area is perpendicular to the side of the metal portion.

[0012] Optionally, the protruding area of ​​the cover plate is located at the edge of the cover plate.

[0013] Secondly, embodiments of this application provide an electronic device, which includes the card slot assembly described in the first aspect.

[0014] Optionally, the electronic device further includes a mid-frame that deforms by pressing the protruding area of ​​the cover plate toward one side of the card tray;

[0015] The middle frame has a contact area on a side parallel to the cover plate, and the protruding area of ​​the cover plate is connected to the common ground through the contact area of ​​the middle frame.

[0016] Optionally, the electronic device further includes: a printed circuit board (PCB), a first user identity recognition SIM card, and a second SIM card stacked together;

[0017] The PCB is provided with a first contact spring that is connected to the first SIM card and a second contact spring that is connected to the second SIM card;

[0018] The second contact spring is connected to the card holder bracket via plastic;

[0019] Both the first SIM card and the second SIM card are disposed in the card tray.

[0020] Optionally, the contact area is a laser-engraved area.

[0021] In this embodiment, the card holder assembly includes: a card tray; and a card holder bracket. The card holder bracket includes a cover plate and a side wall, the cover plate and the side wall forming a concave space. The card tray is disposed within the concave space, and the cover plate and the card tray are stacked on top of each other. A portion of the cover plate protrudes from the side opposite to the card tray, and this protruding portion of the cover plate serves as a grounding spring connected to the common ground. Thus, by having a portion of the cover plate protrude from the side opposite to the card tray, grounding this protruding portion reduces interference without requiring an additional grounding structure, which is beneficial for the miniaturization of electronic devices. Attached Figure Description

[0022] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0023] Figure 1 This is one of the structural schematic diagrams of a card holder assembly provided in the embodiments of this application;

[0024] Figure 2 This is a second structural schematic diagram of a card holder assembly provided in an embodiment of this application;

[0025] Figure 3 This is the third structural schematic diagram of a card holder assembly provided in the embodiments of this application;

[0026] Figure 4 This is the fourth structural schematic diagram of a card holder assembly provided in the embodiments of this application;

[0027] Figure 5 This is one of the structural schematic diagrams of a card slot assembly in related technologies;

[0028] Figure 6 This is the second structural schematic diagram of a card slot assembly in related technologies;

[0029] Figure 7 This is the third structural schematic diagram of a card slot assembly in related technologies;

[0030] Figure 8 This is the fifth structural schematic diagram of a card holder assembly provided in the embodiments of this application. Detailed Implementation

[0031] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0033] In the description of this application, it should be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] The card holder assembly and electronic device provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0036] like Figures 1 to 4 As shown in the figure, this application embodiment provides a card holder assembly, the card holder assembly including:

[0037] Cato 11;

[0038] Card holder bracket 12 includes a cover plate 121 and a side wall. The cover plate 121 and the side wall form a concave space. The card holder 11 is disposed in the concave space, and the cover plate 121 and the card holder 11 are stacked. A portion of the cover plate 121 protrudes from the side opposite to the card holder 11. The protruding portion 1211 of the cover plate 121 serves as a grounding spring and is connected to the common ground.

[0039] The protruding area 1211 of the cover plate 121 can be a bridge structure; or, the protruding area 1211 of the cover plate 121 can be a cantilever structure; or, the protruding area 1211 of the cover plate 121 can be other structures, which are not limited in this embodiment.

[0040] In addition, the cover plate 121 may be provided with a notch, and the protruding area 1211 may be located in the notch; or, the cover plate 121 may extend a portion of its area as the protruding area 1211.

[0041] Additionally, the card holder 11 includes a metal portion 112, and the side where the protruding area 1211 of the cover plate 121 is located is perpendicular to the side where the metal portion 112 is located; or, the side where the protruding area 1211 of the cover plate 121 is located is parallel to the side where the metal portion 112 is located; or, the side where the protruding area 1211 of the cover plate 121 is located is the same side as the side where the metal portion 112 is located; etc., this embodiment does not limit this.

[0042] In addition, the protruding area 1211 of the cover plate 121 is located at the edge of the cover plate 121, or the protruding area 1211 of the cover plate 121 is located near the center of the cover plate 121, etc. In this embodiment, the specific location of the protruding area 1211 of the cover plate 121 is not limited.

[0043] In one embodiment, the card holder bracket 12 can be made of a metal sheet of aluminum alloy, magnesium-aluminum alloy or steel by a stamping process. After stamping, the metal sheet can form a cover plate 121 and a side wall. The cover plate 121 and the side wall form a concave space, and a part of the cover plate 121 protrudes from the side opposite to the card tray 11.

[0044] Currently, electronic devices (such as mobile phones) are indispensable products in people's lives, playing a significant role in personal life and work. Call services on electronic devices (such as mobile phones) are primarily achieved through SIM cards. Taking mobile phones as an example, the SIM card is typically placed in an external SIM card tray. After the tray is inserted into the phone's SIM card slot, the SIM card's feed point makes contact with the spring contacts of the SIM card holder. The SIM card holder is soldered onto the printed circuit board (PCB) using surface mount technology (SMT). The SIM card tray or holder is usually located at the bottom right corner of the device. This location is also a common design area for the antenna feed point and antenna radiators, resulting in significant interference issues.

[0045] The following two solutions exist for reducing interference in related technologies:

[0046] Option one involves soldering a spring clip into the mid-frame (bottom area of ​​the card slot) to establish contact between the card slot and the metal mid-frame for grounding, with the metal mid-frame serving as a zero-potential point. Since the grounding location is relatively close to areas with strong antenna interference, this is advantageous for mitigating interference. However, a drawback is the need for reserved space in the Z-axis (Z-axis is the overall thickness direction) to accommodate the spring clip. This option is impractical in environments with limited thickness or PCB height. Figure 5 and Figure 6 As shown, the electronic device in Scheme 1 includes a card tray 11, a PCB 21, a steel sheet support 30, a plastic sheet 31, contact springs, contact springs 32 (i.e., feed points) for SIM 2, a first SIM 33, a second SIM 34, a grounding spring 35, and a mid-frame 20. Scheme 1 additionally manufactures stamped steel springs (i.e., welded springs 35), which are fixed to the mid-frame by spot welding. The metal thickness at the spot welding location needs to be at least 0.4 mm in the manufacturing process. Adding the thickness of the stamped spring body (0.1–0.15 mm) and the 0.2 mm clearance of the spring arm, a large layout space is required. The connection between the metal mid-frame and the SIM card tray is achieved through the stamped springs.

[0047] like Figure 7 As shown, the electronic device in Scheme 2 includes a card tray, PCB 21, contact springs, steel bracket 30, first SIM 33, second SIM 34, grounding spring 35, plastic 31, and mid-frame 20. Scheme 2 involves surface-mounting a spring on the PCB near the SIM, with the spring directly contacting the metal of the mid-frame (ground, i.e., the 0 potential point) to achieve grounding and interference suppression. Scheme 2 can achieve grounding functionality under conditions of limited thickness space. Its disadvantage is that the interference suppression capability at the grounding location is inferior to Scheme 1, and it requires additional stacking space for springs on the PCB, thus limiting the PCB stacking layout. Figure 7 As shown, a boss is set on the middle frame metal, and the contact surface of the middle frame metal is grounded by contacting the spring contact of the SMT.

[0048] It should be noted that the above scheme one has limitations on the Z-axis space of the whole machine or the distance between the PCB and the screen module, and the above scheme two has limitations on the stacking space and layout flexibility of the PCB; moreover, both scheme one and scheme two will increase costs. Scheme one adds the cost of a spring and soldering process; scheme two adds the cost of an SMT spring.

[0049] Taking the card holder bracket 12 as a steel sheet bracket as an example, the grounding spring in this embodiment reuses the steel sheet bracket of the card holder bracket 12 itself without adding additional materials. On the other hand, the steel sheet itself has a stamping process, so only the stamping die needs to be adjusted, without adding new processes (such as welding or SMT). At the same time, the implementation of this grounding spring does not require additional space, which can save costs while optimizing the layout space.

[0050] For example, a proprietary bridge-type or single-cantilever spring is created on the insert steel sheet of the SIM card holder 12 using a stamping process, allowing the bridge-type spring to contact the laser-engraved metal surface of the mid-frame to achieve grounding. This design eliminates the need for additional springs and occupies no extra space, and the grounding location is also where the antenna tends to be positioned, thus improving grounding performance.

[0051] It should be understood that the bottom of the card holder bracket 12 (i.e., the cover plate) is a flat surface, such as... Figure 3 The outer surface of the steel sheet shown.

[0052] As one implementation method, a bridge-shaped spring can be protruded from a local area of ​​the bottom plane of the card holder bracket 12 (such as a stamped steel sheet). Simultaneously, laser engraving is performed on the corresponding position of the middle frame metal. After the card holder bracket 12 is installed in place, the arm of the bridge-shaped spring will contact the laser-engraved surface of the middle frame, achieving a grounding function.

[0053] As one implementation method, a partial protrusion of the bottom plane of the card holder bracket 12 (such as a stamped steel sheet) can be made into a single cantilever spring, such as... Figure 2 As shown. Simultaneously, laser engraving is performed at the corresponding positions on the metal mid-frame. After the card holder bracket 12 is installed in place, the cantilever of the spring contact will contact the laser-engraved surface of the mid-frame, achieving grounding.

[0054] In this embodiment, the card holder assembly includes: a card tray 11; and a card holder bracket 12. The card holder bracket 12 includes a cover plate 121 and a sidewall. The cover plate 121 and the sidewall form a concave space. The card tray 11 is disposed within the concave space, and the cover plate 121 and the card tray 11 are stacked. A portion of the cover plate 121 protrudes from the side opposite to the card tray 11. The protruding portion 1211 of the cover plate 121 serves as a grounding spring connected to the common ground. Thus, by having a portion of the cover plate 121 protrude from the side opposite to the card tray 11, the protruding portion 1211 of the cover plate 121 is grounded to reduce interference, eliminating the need for an additional grounding structure and facilitating the miniaturization of electronic devices.

[0055] Optionally, such as Figure 1 and Figure 2 As shown, the protruding area 1211 of the cover plate 121 has a bridge-like structure.

[0056] For example, the protruding area 1211 of the cover plate 121 is a bridge structure. The protruding area 1211 includes a first grounding part, a first extension part and a second extension part. The first extension part and the second extension part extend from different directions of the cover plate 121 and are connected to the first grounding part to realize the bridge structure.

[0057] In this embodiment, the protruding area 1211 of the cover plate 121 is a bridge structure, thereby grounding through the bridge structure formed by the protrusion of a part of the cover plate 121 on the side opposite to the card tray 11 to reduce interference. No additional grounding structure is required, which is beneficial to the miniaturization of electronic devices.

[0058] Optionally, such as Figure 3 and Figure 4 As shown, the protruding area 1211 of the cover plate 121 is a cantilever structure.

[0059] For example, the protruding area 1211 of the cover plate 121 is a cantilever structure. The protruding area 1211 includes a second grounding portion and a third extension portion. The third extension portion extends from the cover plate 121 and is integrated with the second grounding portion, which is suspended.

[0060] In this embodiment, the protruding area 1211 of the cover plate 121 is a cantilever structure, thereby reducing interference by grounding through the cantilever structure formed by a portion of the cover plate 121 protruding from the side opposite to the card holder 11. No additional grounding structure is required, which is beneficial to the miniaturization of electronic devices.

[0061] Optionally, the cover plate 121 is provided with a notch, and the protruding area 1211 is located in the notch.

[0062] In this embodiment, the cover plate 121 is provided with a notch, and the protruding area 1211 is located in the notch, so that grounding is achieved by the deformation of the protruding area 1211 in the notch, which can save layout space without the need to add an additional grounding structure.

[0063] Optionally, the card holder 11 includes a metal portion 112, and the side where the protruding area 1211 of the cover plate 121 is located is perpendicular to the side where the metal portion 112 is located.

[0064] In this embodiment, the card holder 11 includes a metal part 112 and a plastic part 111 connected to the metal part 112. The side of the protruding area 1211 of the cover plate 121 is perpendicular to the side of the metal part 112. Since the metal part 112 is located relatively close to the antenna, the side of the protruding area 1211 of the cover plate 121 is perpendicular to the side of the metal part 112, which allows the grounding spring to be located closer to the antenna, thereby improving the grounding effect and antenna performance.

[0065] Optionally, the protruding area 1211 of the cover plate 121 is located at the edge of the cover plate 121.

[0066] In this embodiment, the protruding area 1211 of the cover plate 121 is located at the edge of the cover plate 121, so that the design of the grounding spring does not affect the original layout of the card holder bracket 12, thus saving layout space.

[0067] This application also provides an electronic device, which includes the card slot assembly described in this application.

[0068] In this embodiment, the electronic device includes a card holder assembly, which includes a card tray 11 and a card holder bracket 12. The card holder bracket 12 includes a cover plate 121 and a sidewall. The cover plate 121 and the sidewall form a concave space. The card tray 11 is disposed within the concave space, and the cover plate 121 and the card tray 11 are stacked. A portion of the cover plate 121 protrudes from the side opposite to the card tray 11. The protruding portion 1211 of the cover plate 121 serves as a grounding spring connected to the common ground. Thus, by having a portion of the cover plate 121 protrude from the side opposite to the card tray 11, the protruding portion 1211 of the cover plate 121 is grounded to reduce interference, eliminating the need for an additional grounding structure and facilitating the miniaturization of the electronic device.

[0069] Optionally, the electronic device further includes a middle frame 20, which deforms by pressing the protruding area 1211 of the cover plate 121 toward one side of the card tray 11.

[0070] The middle frame 20 can be a metal middle frame. The middle frame 20 presses the protruding area 1211 of the cover plate 121 to deform towards one side of the card tray 11. The position where the middle frame 20 presses the protruding area 1211 serves as a grounding point to achieve grounding of the card holder bracket 12.

[0071] In this embodiment, the electronic device further includes a middle frame 20. The middle frame 20 deforms by pressing the protruding area 1211 of the cover plate 121 toward one side of the card holder 11, which enables the middle frame 20 to make good contact with the grounding spring of the cover plate 121. This can avoid poor contact caused by additional grounding structures, and can improve the grounding effect and antenna performance.

[0072] Optionally, the middle frame 20 has a contact area on a side parallel to the cover plate 121, and the protruding area 1211 of the cover plate 121 is electrically connected to the common ground through the contact area of ​​the middle frame 20.

[0073] In this embodiment, the middle frame 20 has a contact area on a side parallel to the cover plate 121. The protruding area 1211 of the cover plate 121 is connected to the common ground through the contact area of ​​the middle frame 20, thereby enabling the grounding spring of the cover plate 121 to be grounded through the contact area of ​​the middle frame 20.

[0074] Optionally, the contact area is a laser-engraved area.

[0075] In this embodiment, the contact area is a laser-engraved area. The grounding spring of the cover plate 121 is grounded by the contact between the laser-engraved area of ​​the middle frame 20 and the protruding area 1211 of the cover plate 121. This enables good contact between the middle frame 20 and the grounding spring of the cover plate 121, which can improve the grounding effect and improve the antenna performance.

[0076] Optionally, the electronic device further includes: a printed circuit board 21, a first user identity recognition SIM card, and a second SIM card stacked together;

[0077] The PCB21 is provided with a first contact spring 22 connected to the first SIM card and a second contact spring 23 connected to the second SIM card;

[0078] The second contact spring 23 is connected to the card holder bracket 12 via plastic;

[0079] Both the first SIM card and the second SIM card are disposed in the card tray 11.

[0080] like Figure 8 As shown, the card slot assembly of the electronic device may include a double-layer NANO card slot. The first contact spring 22 may be an SMT contact spring on the PCB 21, containing injection-molded plastic, commonly known as a "tofu block". A push rod and conversion mechanism 24 are provided between the first contact spring 22 and the card slot bracket 12, including a push rod and a lever mechanism. The card slot bracket 12 may be an SMT stamped steel sheet support structure on the PCB. The second contact spring 23 is fixed to the card slot bracket 12 (i.e., the stamped steel sheet support structure) by injection molding. The injection-molded plastic 25 fixes the second contact spring 23 and the card slot bracket 12 together.

[0081] In the description of this specification, the references to terms such as "optionally," "an embodiment," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0082] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A card holder assembly, characterized by The card slot assembly includes: Cato (11); Card holder bracket (12), the card holder bracket (12) includes a cover plate (121) and a side wall, the cover plate (121) and the side wall form a concave space, the card holder (11) is disposed in the concave space, and the cover plate (121) and the card holder (11) are stacked, a part of the cover plate (121) protrudes from the side opposite to the card holder (11), and the protruding part (1211) of the cover plate (121) is connected to the common ground as a grounding spring.

2. The card holder assembly of claim 1, wherein, The protruding area (1211) of the cover plate (121) is a bridge structure.

3. The card seat assembly of claim 1, wherein, The protruding area (1211) of the cover plate (121) is a cantilever structure.

4. The card seat assembly of claim 1, wherein, The cover plate (121) is provided with a notch, and the protruding area (1211) is located in the notch.

5. The card seat assembly of claim 1, wherein, The card holder (11) includes a metal portion (112), and the side of the protruding area (1211) of the cover plate (121) is perpendicular to the side of the metal portion (112).

6. The card seat assembly of claim 1, wherein, The protruding area (1211) of the cover plate (121) is located at the edge of the cover plate (121).

7. An electronic device, comprising: The electronic device includes the card slot assembly according to any one of claims 1-6.

8. The electronic device according to claim 7, characterized in that, The electronic device also includes a middle frame (20) that deforms the protruding area (1211) of the cover plate (121) toward one side of the card holder (11); The middle frame (20) has a contact area on a side parallel to the cover plate (121), and the protruding area (1211) of the cover plate (121) is connected to the common ground through the contact area of ​​the middle frame (20).

9. The electronic device of claim 8, wherein, The contact area is a laser-engraved area.

10. The electronic device of claim 7, wherein, The electronic device further includes: a printed circuit board (21) stacked on top of each other, a first user identity recognition SIM card and a second SIM card; The PCB (21) is provided with a first contact spring (22) connected to the first user identity recognition SIM card and a second contact spring (23) connected to the second SIM card. The second contact spring (23) is connected to the card holder bracket (12) via plastic; Both the first user identification SIM card and the second SIM card are located in the card tray (11).

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