Conductive connection structure

Abstract

The utility model relates to the technical field of conductive parts, and provides a conductive connection structure. The conductive connection structure comprises a conducting bar, and a positioning piece and an insulating shell which are arranged on the conducting bar, the insulating shell is formed on the conducting bar in an injection molding manner, and at least covers the part of the positioning piece on the conducting bar; the positioning piece is provided with a mounting part arranged on a main board of the conducting bar and a positioning part arranged on the mounting part, and the positioning part is arranged in the vertical direction of the main board and used for limiting the injection molding thickness of the insulating shell. The conductive connection structure of the utility model can solve the problems that the thickness of the insulation housing is not uniform and the product qualification rate is not easy to improve in the traditional injection molding mode.

Description

conductive connection structure Technical Field

[0001] This utility model relates to the field of conductive components technology, and in particular to a conductive connection structure. Background Technology

[0002] Currently, U-shaped aluminum busbars (conductive busbars) are widely used in power, chemical, and metallurgical industries as conductive connecting components. The structure of a U-shaped aluminum busbar is typically as shown in Figure 8, including an inner aluminum busbar a and an injection-molded insulating layer b located outside the inner aluminum busbar a. In existing technologies, the injection-molded insulating layer b is usually applied to the inner aluminum busbar a using injection molding to achieve insulation protection. However, this method suffers from poor positioning during the aluminum busbar injection molding process, leading to uneven insulation layer thickness, resulting in a low product yield and hindering production efficiency. Summary of the Invention

[0003] In view of this, the present invention aims to propose a conductive connection structure that is beneficial to improving production efficiency.

[0004] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0005] A conductive connection structure includes a conductive bus, a positioning element disposed on the conductive bus, and an insulating housing;

[0006] The insulating housing is injection molded onto the conductive busbar, and the insulating housing at least covers a portion of the positioning element located on the conductive busbar;

[0007] The positioning member has a mounting portion disposed on the main board of the conductive bar, and a positioning portion disposed on the mounting portion, the positioning portion being arranged along the vertical direction of the main board and used to define the injection molding thickness of the insulating shell.

[0008] Furthermore, along the vertical direction of the motherboard, the projected profile of the positioning portion is larger than the projected profile of the mounting portion.

[0009] Furthermore, the positioning part includes a first step connected to the mounting part, and a second step disposed on the side of the first step away from the mounting part; along the vertical direction of the motherboard, the projected outline of the first step is larger than the projected outline of the mounting part, and the projected outline of the first step is larger than the projected outline of the second step.

[0010] Furthermore, along the vertical direction of the motherboard, the projected outline of the mounting portion is larger than the projected outline of the second step; and / or, the mounting portion, the first step, and the second step are all cylindrical and coaxially arranged.

[0011] Furthermore, the positioning element is injection molded onto the conductive busbar.

[0012] Furthermore, the motherboard is provided with a through hole, and the mounting part of the positioning member is injection molded into the through hole.

[0013] Furthermore, there are multiple through holes, and each through hole is injection molded with the positioning element; along the vertical direction of the motherboard, each positioning element is injection molded from both sides of the motherboard into the corresponding through hole.

[0014] Furthermore, the positioning element is made of PBT material; and / or, the insulating housing is made of TPV material.

[0015] Furthermore, the motherboard includes a main body segment and extension segments disposed at both ends of the main body segment; the conductive bus includes a connecting plate disposed on each of the extension segments, each of the connecting plates extending toward one side of the motherboard, and each of the connecting plates is used to connect with other conductive connectors.

[0016] Furthermore, the insulating housing at least covers the main body segment and each of the extension segments, as well as a portion of each of the connecting plates; and / or, the main body segment, each of the extension segments, and each of the connecting plates are integrally formed.

[0017] Compared with the prior art, this utility model has the following advantages:

[0018] The conductive connection structure described in this utility model, by setting a positioning element on the conductive busbar and then limiting the injection molding thickness of the insulating shell by the positioning element, can help solve the problem of uneven insulation shell thickness in traditional injection molding methods, which is not conducive to improving product qualification rate. This can help improve product production efficiency and consistency.

[0019] Furthermore, by making the projected contour of the positioning part larger than that of the mounting part along the vertical direction of the motherboard, it can prevent incorrect injection positioning of the positioning part during injection molding. By setting a first step and a second step, and by ensuring that the projected contour of the first step is larger than that of the mounting part and the second step along the vertical direction of the motherboard, not only can it prevent incorrect injection positioning of the positioning part during injection molding, but it also ensures that the insulating shell at least completely covers the first step after injection molding, preventing the positioning part from falling off. Making the mounting part, the first step, and the second step all cylindrical and coaxially arranged facilitates the fabrication of the positioning part.

[0020] Furthermore, the positioning components are injection molded onto the busbar, which can cooperate with the injection-molded insulating shell to improve the overall manufacturing efficiency of the conductive connection structure and reduce costs. The mounting portion of the positioning component is injection molded into the through-hole on the main board, which facilitates the positioning injection molding and forming of the positioning component on the busbar. By setting multiple through-holes and multiple positioning components, and along the vertical direction of the main board, each positioning component is injection molded from both sides of the main board into its corresponding through-hole, the uniformity of the overall injection molding thickness of the insulating shell can be ensured, thus ensuring the product qualification rate.

[0021] In addition, the positioning components are made of PBT material, which has higher heat resistance, toughness, and fatigue resistance, facilitating rapid positioning during the injection molding of the insulating shell and withstanding the ejector pin pressure during the secondary injection molding process. The insulating shell is made of TPV material, which has higher fluidity, resistance to high and low temperatures, UV resistance, and chemical solvent resistance, facilitating rapid flow during the secondary injection molding of the insulating shell, achieving uniform injection molding, and good insulation performance after injection molding. The insulating shell at least covers the main body section, each extension section, and each connecting plate, which helps to improve the insulation effect of the conductive connection structure, thereby improving its safety in use. Attached Figure Description

[0022] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0023] Figure 1 is a schematic diagram of the conductive connection structure according to an embodiment of the present invention;

[0024] Figure 2 is a structural schematic diagram of the structure shown in Figure 1 from another perspective;

[0025] Figure 3 is a schematic diagram of the structure of the conductive bus described in an embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of the positioning component injection molding onto the conductive busbar according to an embodiment of the present invention;

[0027] Figure 5 is a structural schematic diagram of the structure shown in Figure 4 from another perspective;

[0028] Figure 6 is a structural schematic diagram of the positioning component according to an embodiment of the present utility model;

[0029] Figure 7 is a structural schematic diagram of the structure shown in Figure 6 from another perspective;

[0030] Figure 8 is a schematic diagram of the structure of the traditional U-shaped aluminum busbar according to an embodiment of the present invention;

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Conductive busbar; 10. Through hole; 11. Main board; 111. Main body section; 112. Extension section; 12. Connecting plate; 120. Connecting hole;

[0033] 2. Positioning component; 21. Mounting part; 22. Positioning part; 221. First step; 222. Second step;

[0034] 3. Insulating shell; a. Internal aluminum busbar; b. Injection-molded insulation layer. Detailed Implementation

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0036] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0037] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" appear, indicating orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, if terms such as "first" or "second" appear, they are also used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] Furthermore, in the description of this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model in light of the specific circumstances.

[0039] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] This embodiment relates to a conductive connection structure that can solve the problem of uneven thickness of the insulating shell 3 in traditional injection molding methods, which is not conducive to improving the product qualification rate.

[0041] As shown in Figures 1 to 7, the conductive connection structure of this embodiment includes a conductive busbar 1, a positioning member 2 and an insulating shell 3 disposed on the conductive busbar 1. The insulating shell 3 is injection molded onto the conductive busbar 1, and at least covers a portion of the positioning member 2 located on the conductive busbar 1. Furthermore, the positioning member 2 has a mounting portion 21 disposed on the main board 11 of the conductive busbar 1, and a positioning portion 22 disposed on the mounting portion 21. The positioning portion 22 is arranged along the vertical direction of the main board 11 and is used to limit the injection molding thickness of the insulating shell 3.

[0042] At this time, with the above settings, the positioning element 2 can be set on the conductive busbar 1, and the injection molding thickness of the insulating shell 3 can be limited by the positioning element 2. This helps to solve the problem of uneven thickness of the insulating shell 3 in the traditional injection molding method, which is not conducive to improving the product qualification rate. This can help improve the product production efficiency and consistency.

[0043] Based on the above description, in detail, in this embodiment, the insulating shell 3 can be injection molded onto the conductive busbar 1 by an injection molding machine. As for the specific structure of the injection molding machine, it can refer to injection molding equipment well known to those skilled in the art, such as a thermosetting plastic injection molding machine with ejector pins.

[0044] Meanwhile, the conductive busbar 1 in this embodiment can be an aluminum busbar or a copper busbar. A traditional non-circular conductive busbar 1, such as a U-shaped aluminum busbar, as shown in Figure 8, includes an inner aluminum busbar a (equivalent to the conductive busbar 1 in this embodiment) and an injection-molded insulating layer b (equivalent to the insulating shell 3 in this embodiment) disposed outside the inner aluminum busbar a. The injection-molded insulating layer b is usually disposed on the aluminum busbar by injection molding to achieve insulation protection. However, this method has the problem of poor positioning during the injection molding process of the inner aluminum busbar a, resulting in uneven insulation layer thickness and a low product qualification rate. The conductive connection structure in this embodiment solves the above problems by setting a positioning element 2 and limiting the injection molding thickness of the insulating shell 3 based on the positioning element 2.

[0045] Furthermore, it should be noted that the direction-related descriptions in this embodiment are merely illustrative examples. In actual implementation, the direction descriptions in this embodiment will vary depending on the orientation of the conductive busbar 1; that is, each direction in this embodiment refers to a relative coordinate system based on the conductive busbar 1.

[0046] Furthermore, in this embodiment, Figures 1 and 2 are schematic diagrams of the conductive connection structure from different perspectives. After the insulating shell 3 is injection molded, it at least covers the periphery of each positioning element 2. Figures 1 and 2 illustrate each positioning element 2 after the injection molding of the insulating shell 3, so as to clearly show each positioning element 2. Figures 4 and 5 are schematic diagrams of the structure of each positioning element 2 injection molded on the conductive busbar 1. At this time, each through hole is injection molded with a positioning element 2 (that is, the mounting part 21 in the positioning 2 is injection molded).

[0047] In this embodiment, as a preferred implementation, referring to Figures 4, 6, and 7, the projected outline of the positioning part 22 is larger than the projected outline of the mounting part 21 along the vertical direction of the main board 11. This arrangement can prevent errors in the injection orientation of the positioning part 2 during injection molding.

[0048] In a specific implementation, in this embodiment, as a preferred embodiment, the positioning part 22 includes a first step 221 connected to the mounting part 21, and a second step 222 disposed on the side of the first step 221 away from the mounting part 21. Meanwhile, along the vertical direction of the main board 11, the projected outline of the first step 221 is larger than the projected outline of the mounting part 21, and the projected outline of the first step 221 is larger than the projected outline of the second step 222.

[0049] It is understandable that by setting the first step 221 and the second step 222, and along the vertical direction of the main board 11, the projected outline of the first step 221 is larger than the projected outline of the mounting part 21, and the projected outline of the first step 221 is larger than the projected outline of the second step 222. This not only prevents the positioning of the positioning part 2 from being misaligned during injection molding, but also ensures that the insulating shell 3 completely covers the first step 221 after injection molding, thus preventing the positioning part 2 from falling off.

[0050] Furthermore, in this embodiment, as a preferred embodiment, the projected outline of the mounting portion 21 is larger than the projected outline of the second step 222 along the vertical direction of the motherboard 11. Also as a preferred embodiment, the mounting portion 21, the first step 221, and the second step 222 in this embodiment are all cylindrical and coaxially arranged to facilitate the preparation of the positioning member 2.

[0051] It should be mentioned that the axial direction of the coaxial arrangement here is the same as the vertical direction of the motherboard 11. In this embodiment, the axial dimension of the positioning part 22 along the vertical direction of the motherboard 11 is the injection molding thickness of the insulating shell 3, and along the vertical direction of the motherboard 11, the outer end face of the second step 222 is flush with the injection-molded insulating shell 3 to ensure the aesthetic appearance of the conductive connection structure.

[0052] In a preferred embodiment, the axial dimensions of the mounting part 21 and the positioning part 22 along the vertical direction of the main board 11 can be set to be equal to the thickness of the main board 11. This not only facilitates the stable injection molding of the positioning member 2 onto the main board 11, but also prevents the injection molding thickness of the insulating shell 3 from becoming too thick.

[0053] Meanwhile, the axial dimensions of the first step 221 and the second step 222 in the positioning part 22 along the vertical direction of the main board 11 can be set equally. For example, if the thickness of the main board 11 is 2mm, then the axial dimension of the mounting part 21 is 2mm, and the axial dimensions of the first step 221 and the second step 222 are both 1mm. This can control the injection thickness of the insulating shell 3 and also ensure that the insulating shell 3 completely covers the first step 221, preventing the positioning part 2 from falling off.

[0054] Furthermore, in this embodiment, as a preferred implementation, the positioning element 2 is injection molded onto the conductive busbar 1. This allows it to cooperate with the injection-molded insulating shell 3, thereby improving the overall manufacturing efficiency of the conductive connection structure and reducing costs.

[0055] In this embodiment, the positioning element 2 can be injection molded onto the conductive busbar 1 first, and then the insulating shell 3 can be injection molded onto the conductive busbar 1 using the positioning element 2. Furthermore, due to the limiting effect of the positioning element 2 on the injection molding thickness, the uniformity of the thickness of the insulating shell 3 can be improved.

[0056] In a specific implementation, as a preferred embodiment, as shown in Figures 3 to 5, the main board 11 is provided with a through hole 10, and the mounting portion 21 of the positioning member 2 is injection molded into the through hole 10. The main advantage of this arrangement is that it facilitates the positioning injection molding and forming of the positioning member 2 on the conductive busbar 1.

[0057] Considering the uniformity of the injection molding thickness of the insulating shell 3, as a preferred embodiment, in this example, there are multiple through holes 10, and each through hole 10 is injection molded with a positioning element 2. Furthermore, along the vertical direction of the main board 11, each positioning element 2 is injection molded from both sides of the main board 11 into the corresponding through hole 10.

[0058] It is understandable that by setting multiple through holes 10 and multiple positioning elements 2, and by injection molding each positioning element 2 from both sides of the motherboard 11 into the corresponding through holes 10 along the vertical direction of the motherboard 11, it is beneficial to ensure the uniformity of the overall injection molding thickness of the insulating shell 3 and ensure the product qualification rate.

[0059] Of course, the control of the injection thickness of the insulating shell 3 during the injection molding process depends on the dispersion of the positioning parts 2 on the main board 11. Therefore, in this embodiment, as a preferred implementation, multiple positioning parts 2 are arranged at intervals along the extension direction of the main board 11, and the spacing between two adjacent positioning parts 2 is as equal as possible. If necessary, two adjacent positioning parts 2 can be injected from both sides of the main board 11 into the corresponding through holes 10, so as to achieve a relatively better effect of limiting the injection thickness of the insulating shell 3, so that the injection thickness of the insulating shell 3 after injection is more uniform and meets the product requirements.

[0060] In addition, in this embodiment, as a preferred implementation, the positioning element 2 is made of PBT (polybutylene terephthalate) material, so that the positioning element 2 has higher heat resistance, toughness and fatigue resistance, which is conducive to achieving rapid positioning of the insulating shell 3 during injection molding and to withstanding the ejector pin pressure during the secondary injection molding of the insulating shell 3.

[0061] As a preferred embodiment, the insulating shell 3 in this embodiment is made of TPV (thermoplastic vulcanizate) material, which has advantages such as high fluidity, resistance to high and low temperatures, resistance to ultraviolet rays and chemical solvents. This facilitates rapid flow during secondary injection molding of the insulating shell 3, achieving uniform injection molding and good insulation effect after injection molding.

[0062] In addition, in this embodiment, as a preferred implementation, referring to Figures 1 to 3, the main board 11 includes a main body segment 111 and extension segments 112 disposed at both ends of the main body segment 111. Furthermore, the conductive busbar 1 includes connecting plates 12 disposed on each extension segment 112, each connecting plate 12 extending towards one side of the main board 11, and each connecting plate 12 is used to connect to other conductive connectors. Specifically, each connecting plate 12 preferably has connecting holes 120 for connecting to other surrounding components.

[0063] Furthermore, in this embodiment, as a preferred implementation, the insulating shell 3 at least covers the main body segment 111, each extension segment 112, and a portion of each connecting plate 12. This improves the insulation effect of the conductive connection structure, thereby enhancing its safety in use.

[0064] Meanwhile, as a preferred embodiment, the main body segment 111, each extension segment 112, and each connecting plate 12 are integrally formed. That is, the conductive busbar 1 is an integral structure, and the connecting plate 12 can be bent from the extension segment 112 toward the main body 11.

[0065] It is worth mentioning that in the existing technology, in addition to the insulating shell 3 being directly injection molded onto the conductive busbar 1 to form the structure shown in Figure 8, the conductive connection structure can also be prepared by splicing with heat shrink tubing. However, this method not only increases the thickness at the splice, affecting customer use and installation, but also has the problems of low product consistency and low manufacturing efficiency.

[0066] The conductive connection structure of this embodiment has the following advantages compared with the heat shrink tubing splicing method, since the injection molding thickness of the insulating shell 3 is limited by the positioning member 2: (1) It does not require manual splicing and cutting of the end, saving about 3.5 minutes / piece, and the production efficiency is high; (2) It avoids the risk of leakage due to poor splicing of heat shrink tubing, and the safety is high; (3) The insulating shell 3 is formed in one piece, without manual splicing, and avoids the risk of inconsistent splicing size or missing cutting of the end, and the product has a beautiful appearance and high consistency.

[0067] Therefore, compared with the traditional method of preparing the insulating shell 3 by splicing heat shrink tubing, the conductive connection structure of this embodiment not only has high safety and good product consistency, but also has significant advantages. At the same time, compared with the existing method of preparing the insulating shell 3 by injection molding, it also has the technical effects of uniform injection molding thickness of the insulating shell 3, high product qualification rate, high product consistency, and high production efficiency, thereby improving the production efficiency of the conductive connection structure.

[0068] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A conductive connection structure, characterized in that: The device includes a conductive bus, a positioning element and an insulating housing disposed on the conductive bus; the insulating housing is injection molded onto the conductive bus, and the insulating housing at least covers a portion of the positioning element located on the conductive bus; the positioning element has a mounting portion disposed on a main board of the conductive bus, and a positioning portion disposed on the mounting portion, the positioning portion being arranged along the vertical direction of the main board and used to define the injection molding thickness of the insulating housing.

2. The conductive connection structure according to claim 1, characterized in that: Along the vertical direction of the motherboard, the projected profile of the positioning part is larger than the projected profile of the mounting part.

3. The conductive connection structure according to claim 2, characterized in that: The positioning part includes a first step connected to the mounting part, and a second step disposed on the side of the first step away from the mounting part; along the vertical direction of the motherboard, the projected outline of the first step is larger than the projected outline of the mounting part, and the projected outline of the first step is larger than the projected outline of the second step.

4. The conductive connection structure according to claim 3, characterized in that: Along the vertical direction of the motherboard, the projected outline of the mounting portion is larger than the projected outline of the second step; and / or, the mounting portion, the first step, and the second step are all cylindrical and coaxially arranged.

5. The conductive connection structure according to claim 1, characterized in that: The positioning element is injection molded onto the conductive busbar.

6. The conductive connection structure according to claim 5, characterized in that: The motherboard has a through hole, and the mounting part of the positioning member is injection molded into the through hole.

7. The conductive connection structure according to claim 6, characterized in that: There are multiple through holes, and each through hole is injection molded with the positioning element; along the vertical direction of the motherboard, each positioning element is injection molded from both sides of the motherboard into the corresponding through hole.

8. The conductive connection structure according to claim 1, characterized in that: The positioning element is made of PBT material; and / or, the insulating housing is made of TPV material.

9. The conductive connection structure according to any one of claims 1 to 8, characterized in that: The main board includes a main body segment and extension segments at both ends of the main body segment; the conductive bus includes a connecting plate disposed on each of the extension segments, each connecting plate extends toward one side of the main board, and each connecting plate is used to connect with other conductive connectors.

10. The conductive connection structure according to claim 9, characterized in that: The insulating housing at least covers the main body segment and each of the extension segments, as well as a portion of each of the connecting plates; and / or, the main body segment, each of the extension segments, and each of the connecting plates are integrally formed.

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