Cleaning device for blowing type semiconductor production

Abstract

The utility model discloses a blowing type cleaning device for semiconductor production, relates to the technical field of semiconductor production, and provides the following scheme for solving the problems proposed in the background technology: the blowing type cleaning device comprises a processing table, the upper surface of the processing table is provided with a circular groove, and the inner wall of the circular groove is fixedly connected with a circular electrostatic sticker; and the inner bottom wall of the circular groove is fixedly connected with a cleaning assembly, the cleaning assembly comprises a circular frame, the upper surface of the circular frame is fixedly connected with four clamping assemblies, and the inner bottom wall of the circular frame is fixedly connected with a driving motor. Through the arrangement of the cleaning assembly, the cleaning assembly can be matched with the clamping assembly during use, wind power blown out by the fan is used for blowing to the surfaces of all semiconductors, dust on the upper surfaces and the lower surfaces of the semiconductors can be blown off completely, and the dust is blown to the surfaces of the circular electrostatic pasters so that the dust cannot be raised and attached to the surfaces of the semiconductors again. And the semiconductor does not need to be cleaned again after being turned over, so that the cleaning efficiency of the semiconductor is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a blower-type cleaning device for semiconductor manufacturing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, and other fields. For example, diodes are devices made of semiconductors. Common semiconductor materials include silicon, germanium, and gallium arsenide. Silicon is the most influential of all semiconductor materials and is a relatively common material.

[0003] Currently, after semiconductor production, the semiconductor surface needs to be cleaned to ensure that no dust remains and affects subsequent use. However, semiconductors cannot come into direct contact with water during the cleaning process, so airflow is required for cleaning. Most existing methods of cleaning semiconductors involve blowing air directly onto the semiconductor surface placed in a fixed position. However, once the semiconductor is placed in a certain position, only one side faces upwards, so only the same side can be cleaned at a time. This necessitates flipping the semiconductor over for another cleaning process, which affects cleaning efficiency and indicates room for improvement. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a blower-type cleaning device for semiconductor manufacturing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A blower-type cleaning device for semiconductor manufacturing includes a processing table. A circular groove is formed on the upper surface of the processing table. A circular electrostatic sticker is fixedly connected to the inner wall of the circular groove. A cleaning assembly is fixedly connected to the inner bottom wall of the circular groove. The cleaning assembly includes a circular frame. Four clamping components are fixedly connected to the upper surface of the circular frame. A drive motor is fixedly connected to the inner bottom wall of the circular frame. A first threaded connecting sleeve is fixedly connected to the output end of the drive motor. A circular blower frame is threadedly connected to the surface of the first threaded connecting sleeve. A plurality of air outlets are formed on the surface of the circular blower frame. A support rod is fixedly connected to the upper surface of the processing table. A strip frame is fixedly connected to the top of the strut. A fan is fixedly connected to the inner bottom wall of the strip frame. An air inlet is connected to the input end of the fan. A filter screen is fixedly connected to the inner wall of the air inlet. A positioning tube is connected to the output end of the fan. A fixed frame is fixedly connected to the lower surface of the strip frame. Slide grooves are provided on the left and right inner walls of the fixed frame. A locking rod is fixedly connected to the inner bottom wall of the slide groove. Movable plates are slidably connected to the inner walls of the two slide grooves. A round hole is provided on the upper surface of the movable plate. A movable sleeve is fixedly connected to the inner wall of the round hole. A rotating block is fixedly connected to the bottom end of the movable sleeve. A second threaded connecting sleeve is rotatably connected to the lower surface of the rotating block.

[0007] Preferably, the bottom end of the positioning tube extends into the interior of the movable sleeve, and the upper and lower surfaces of the fixing frame are provided with circular through holes that are compatible with the movable sleeve.

[0008] Preferably, the movable plate is slidably connected to the surfaces of the two locking rods, and the two locking rods can lock the position of the movable sleeve through the movable plate, thereby ensuring that the movable sleeve will not rotate.

[0009] Preferably, the movable sleeve, the rotating block, and the second threaded connecting sleeve are all hollow structures, and the second threaded connecting sleeve is threadedly connected to the top of the circular blower frame. The air blown out by the fan can be transported to the inside of the circular blower frame through the positioning tube, the movable sleeve, the rotating block, and the second threaded connecting sleeve, and then blown out through each air outlet.

[0010] Preferably, the clamping assembly includes a U-shaped frame, the inner bottom wall of the U-shaped frame is provided with a movable groove, the inner bottom wall of the movable groove is slidably connected with two movable blocks, the side of the U-shaped frame is rotatably connected with a positive and negative threaded rod, the upper surface of the two movable blocks is fixedly connected with a clamping plate, the opposite surfaces of the two clamping plates are provided with slots, and the inner walls of the two slots are fixedly connected with rubber pads.

[0011] Preferably, one end of the positive and negative threaded rod is rotatably connected to the inner wall of the moving groove, and the two movable blocks are respectively threaded to the positive and negative threads on the surface of the positive and negative threaded rod. After the positive and negative threaded rod is rotated, it can drive the two movable blocks to move towards the opposite face or the opposite back face respectively.

[0012] The beneficial effects of this utility model are as follows:

[0013] 1. By setting up the cleaning component, it can work together with the clamping component during use. The air blown by the fan can blow the dust off the top and bottom surfaces of the semiconductor and blow the dust to the circular electrostatic sticker surface so that it will not be stirred up and re-adhere to the semiconductor surface. There is no need to turn the semiconductor over and clean it again, which greatly improves the cleaning efficiency of the semiconductor.

[0014] 2. By setting up the clamping components, the two rubber pads can reduce the squeezing force on the semiconductor body during use, thereby improving the protection effect of the semiconductor. In addition, the two clamping plates can clamp semiconductors of different sizes according to the actual situation, which is highly flexible. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a blower-type cleaning device for semiconductor manufacturing proposed in this utility model.

[0016] Figure 2 This is a frontal cross-sectional view of a blower-type cleaning device for semiconductor manufacturing proposed in this utility model;

[0017] Figure 3 This utility model proposes a blower-type cleaning device for semiconductor manufacturing. Figure 2 Enlarged schematic diagram of the structure at point A in the middle;

[0018] Figure 4 This is a three-dimensional structural diagram of the clamping component of a blower-type cleaning device for semiconductor manufacturing proposed in this utility model.

[0019] In the diagram: 1. Processing table; 2. Circular electrostatic sticker; 3. Circular frame; 4. Drive motor; 5. First threaded connecting sleeve; 6. Circular blower frame; 7. Support rod; 8. Strip frame; 9. Fan; 10. Air inlet; 11. Filter screen; 12. Positioning tube; 13. Fixed frame; 14. Locking rod; 15. Movable plate; 16. Movable sleeve; 17. Rotating block; 18. Second threaded connecting sleeve; 19. U-shaped frame; 20. Movable block; 21. Positive and negative threaded rod; 22. Clamping plate; 23. Rubber pad. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Example 1, referring to Figure 1 , Figure 2 and Figure 3A blowing-type cleaning device for semiconductor production includes a processing table 1. A circular groove is formed on the upper surface of the processing table 1. A circular electrostatic sticker 2 is fixedly connected to the inner wall of the circular groove. A cleaning component is fixedly connected to the inner bottom wall of the circular groove. The cleaning component includes a circular frame 3. Four clamping components are fixedly connected to the upper surface of the circular frame 3. A drive motor 4 is fixedly connected to the inner bottom wall of the circular frame 3. A first threaded connecting sleeve 5 is fixedly connected to the output end of the drive motor 4. A circular blowing frame 6 is threadedly connected to the surface of the first threaded connecting sleeve 5. A plurality of air outlets are formed on the surface of the circular blowing frame 6.

[0022] A support rod 7 is fixedly connected to the upper surface of the processing table 1. A strip frame 8 is fixedly connected to the top of the support rod 7. A fan 9 is fixedly connected to the inner bottom wall of the strip frame 8. An air inlet 10 is connected to the input end of the fan 9. A filter screen 11 is fixedly connected to the inner wall of the air inlet 10. A positioning tube 12 is connected to the output end of the fan 9. A fixed frame 13 is fixedly connected to the lower surface of the strip frame 8. Slide grooves are provided on the left and right inner walls of the fixed frame 13. Locking rods 14 are fixedly connected to the inner bottom wall of the slide grooves. Movable plates 15 are slidably connected to the inner walls of the two slide grooves. The movable plates 15 are slidably connected to the surfaces of the two locking rods 14 respectively.

[0023] The upper surface of the movable plate 15 has a circular hole, and the inner wall of the circular hole is fixedly connected to the movable sleeve 16. The bottom end of the positioning tube 12 extends into the interior of the movable sleeve 16. The upper and lower surfaces of the fixed frame 13 are both provided with circular through holes that are compatible with the movable sleeve 16. The bottom end of the movable sleeve 16 is fixedly connected to the rotating block 17. The lower surface of the rotating block 17 is rotatably connected to the second threaded connecting sleeve 18. The movable sleeve 16, the rotating block 17, and the second threaded connecting sleeve 18 are all hollow structures, and the second threaded connecting sleeve 18 is threadedly connected to the top end of the circular blower frame 6.

[0024] After the fan 9 is started, it can draw in outside air through the air inlet 10. At the same time, the filter screen 11 can filter and block large dust particles in the outside air, thereby preventing the fan 9 from blowing dust onto the semiconductor surface. The fan 9 sends the filtered air into the positioning tube 12 and then through the positioning tube 12 to the movable sleeve 16. The movable sleeve 16 is conveyed to the circular blowing frame 6 through the rotating block 17 and the second threaded connecting sleeve 18. The air is blown onto each semiconductor surface through several air outlets on the surface of the circular blowing frame 6. The drive motor 4 drives the circular blowing frame 6 to rotate around the movable sleeve 16 through the first threaded connecting sleeve 5, which can achieve a rotating blowing effect. The dust blown off the semiconductor surface will be directly adsorbed on the surface of the circular electrostatic sticker 2 and will not be re-raised and re-attached to the semiconductor surface, further improving the cleaning efficiency of the semiconductor.

[0025] It should be noted that the upper and lower surfaces of the circular blower frame 6 are connected to the second threaded connecting sleeve 18 and the first threaded connecting sleeve 5, respectively. During normal use, the drive motor 4 drives the circular blower frame 6 to rotate in the tightening direction of the first threaded connecting sleeve 5 and the second threaded connecting sleeve 18. This will not cause the circular blower frame 6 to detach from the first threaded connecting sleeve 5 and the second threaded connecting sleeve 18. When it is necessary to remove it, simply rotate the circular blower frame 6 in the opposite direction.

[0026] Example 2: Refer to Figure 1 and Figure 4 The clamping assembly includes a U-shaped frame 19. The inner bottom wall of the U-shaped frame 19 has a moving groove. Two movable blocks 20 are slidably connected to the inner bottom wall of the moving groove. A positive and negative threaded rod 21 is rotatably connected to the side of the U-shaped frame 19. A clamping plate 22 is fixedly connected to the upper surface of each of the two movable blocks 20. A slot is opened on the opposite side of each of the two clamping plates 22. A rubber pad 23 is fixedly connected to the inner wall of each of the two slots. One end of the positive and negative threaded rod 21 is rotatably connected to the inner wall of the moving groove, and the two movable blocks 20 are threadedly connected to the positive and negative threads on the surface of the positive and negative threaded rod 21, respectively.

[0027] The two clamping plates 22 can clamp the side of the semiconductor through the slots on opposite sides, and the two rubber pads 23 can improve the protection of the semiconductor. At the same time, rotating the forward and reverse threaded rods 21 can drive the two movable blocks 20 to move towards the opposite side and drive the two clamping plates 22 to move closer to the opposite side. It can be used for semiconductors of different sizes and has high flexibility.

[0028] Working principle: First, the produced semiconductor is placed in the slot between two clamping plates 22. The positive and negative threaded screws 21 are rotated, causing the two movable blocks 20 to move the two clamping plates 22 towards each other until the rubber pads 23 in the two slots can clamp the semiconductor in the middle position. At this time, the blower 9 is turned on. The blower 9 draws in outside air through the air inlet 10 and the filter screen 11, and delivers it to the movable sleeve 16 through the positioning tube 12. It is then delivered to the circular blower frame 6 through the rotating block 17 and the second threaded connecting sleeve 18. The air is blown onto the surface of each semiconductor through several air outlets. Since the semiconductors are placed in parallel, the air blown out of the air outlets can blow away all the dust on the upper and lower surfaces of the semiconductors. The blown-off dust will adhere to the surface of the circular electrostatic sticker 2, preventing the dust from being stirred up again and re-adhering to the semiconductor surface. At the same time, the drive motor 4 can drive the circular blower frame 6 to rotate through the first threaded connecting sleeve 5, so that multiple air outlets can perform rotational blowing treatment on multiple semiconductor surfaces, improving the cleaning efficiency of the semiconductors.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A blower-type cleaning device for semiconductor manufacturing, comprising a processing table (1), a circular groove formed on the upper surface of the processing table (1), a circular electrostatic sticker (2) fixedly connected to the inner wall of the circular groove, and a cleaning assembly fixedly connected to the inner bottom wall of the circular groove, characterized in that, The cleaning assembly includes a circular frame (3), four clamping components are fixedly connected to the upper surface of the circular frame (3), a drive motor (4) is fixedly connected to the inner bottom wall of the circular frame (3), a first threaded connecting sleeve (5) is fixedly connected to the output end of the drive motor (4), a circular blowing frame (6) is threadedly connected to the surface of the first threaded connecting sleeve (5), a plurality of air outlets are opened on the surface of the circular blowing frame (6), a support rod (7) is fixedly connected to the upper surface of the processing table (1), a strip frame (8) is fixedly connected to the top of the support rod (7), a fan (9) is fixedly connected to the inner bottom wall of the strip frame (8), and an air inlet is connected to the input end of the fan (9). 10) A filter screen (11) is fixedly connected to the inner wall of the air inlet (10). A positioning tube (12) is connected to the output end of the fan (9). A fixed frame (13) is fixedly connected to the lower surface of the strip frame (8). Slide grooves are provided on the left and right inner walls of the fixed frame (13). A locking rod (14) is fixedly connected to the inner bottom wall of the slide groove. A movable plate (15) is slidably connected to the inner wall of the two slide grooves. A round hole is provided on the upper surface of the movable plate (15). A movable sleeve (16) is fixedly connected to the inner wall of the round hole. A rotating block (17) is fixedly connected to the bottom end of the movable sleeve (16). A second threaded connecting sleeve (18) is rotatably connected to the lower surface of the rotating block (17).

2. The air-blowing cleaning device for semiconductor manufacturing according to claim 1, characterized in that, The bottom end of the positioning tube (12) extends into the interior of the movable sleeve (16), and the upper and lower surfaces of the fixing frame (13) are provided with circular through holes that are compatible with the movable sleeve (16).

3. The air-blowing cleaning device for semiconductor manufacturing according to claim 1, characterized in that, The movable plate (15) is slidably connected to the surfaces of the two locking rods (14).

4. The air-blowing cleaning device for semiconductor manufacturing according to claim 1, characterized in that, The movable sleeve (16), the rotating block (17), and the second threaded connecting sleeve (18) are all hollow structures, and the second threaded connecting sleeve (18) is threadedly connected to the top of the circular blower frame (6).

5. The air-blowing cleaning apparatus for semiconductor manufacturing according to claim 1, characterized in that, The clamping assembly includes a U-shaped frame (19), the inner bottom wall of the U-shaped frame (19) is provided with a moving groove, the inner bottom wall of the moving groove is slidably connected with two movable blocks (20), the side of the U-shaped frame (19) is rotatably connected with a positive and negative threaded rod (21), the upper surface of the two movable blocks (20) is fixedly connected with a clamping plate (22), the opposite surfaces of the two clamping plates (22) are provided with slots, and the inner walls of the two slots are fixedly connected with rubber pads (23).

6. The air-blowing cleaning apparatus for semiconductor manufacturing according to claim 5, characterized in that, One end of the positive and negative threaded rod (21) is rotatably connected to the inner wall of the moving groove, and the two movable blocks (20) are respectively threaded to the positive and negative threads on the surface of the positive and negative threaded rod (21).

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