Storage module and electronic device
By creating a recessed space on the carrier board and vertically arranging the communication interface, the problem of storage modules occupying a large amount of horizontal space in portable electronic devices is solved, achieving efficient space utilization and cost control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LEXAR ELECTRONICS (SHENZHEN) CO LTD
- Filing Date
- 2025-04-21
- Publication Date
- 2026-05-05
AI Technical Summary
Existing storage modules occupy a large horizontal space in portable electronic devices, and high-bandwidth flash memory technology suffers from complex processes and high costs.
Design a storage module by forming a recessed space on a carrier board, setting multiple communication interfaces, and coupling the storage units with the communication interfaces, so that the communication interfaces are arranged in the vertical direction and the storage units are stacked in the vertical direction.
This effectively reduces the size of electronic devices, improves space utilization, and avoids significantly increasing costs.
Smart Images
Figure CN224203844U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of storage, and in particular to storage modules and electronic devices. Background Technology
[0002] With the development of microelectronic assembly technology, storage modules are trending towards higher density, higher integration, and smaller size. In particular, with the development of portable electronic devices such as mobile phones, digital cameras, and smart bracelets / watches, storage modules are also becoming smaller and smaller in line with the development trend of portable electronic devices.
[0003] In related technologies, the storage module is mounted on a carrier board and electrically connected to other electronic modules mounted on the carrier board. Because the communication interfaces are arranged horizontally (lateral and / or longitudinally) on the carrier board, the storage module and other electronic modules are also arranged horizontally, significantly increasing the area occupied by the portable electronic device in the horizontal plane. To improve this, some related technologies use storage modules manufactured using High Bandwidth Flash (HBF) technology. While this can improve the area occupied in the horizontal plane to some extent, it suffers from drawbacks such as complex manufacturing processes and high costs. Utility Model Content
[0004] This application provides storage modules and electronic devices.
[0005] One technical solution adopted in this application is to provide a storage module, which includes:
[0006] The carrier plate includes a base plate, a first side plate, and a second side plate. The first side plate and the second side plate are disposed opposite each other on the first surface of the base plate to form a recessed space. A first communication interface is provided on the first surface within the recessed space, and a second communication interface is provided on the surface of the first side plate and / or the second side plate. A third communication interface is provided on the second surface of the base plate opposite to the first surface. The first communication interface is electrically connected to the second communication interface and the third communication interface, respectively.
[0007] The storage unit is disposed within the recessed space and is coupled to the first communication interface.
[0008] Optionally, the storage unit includes a package, storage particles, and a main control chip, with the storage particles and the main control chip respectively disposed on a first surface within the recessed space; the storage particles are coupled to a first communication interface via leads, and the main control chip is coupled to the first communication interface; both the main control chip and the storage particles are packaged within the package.
[0009] Optionally, the bottom of the first side plate is disposed on the first surface, and the top of the first side plate is opposite to the bottom of the first side plate; the bottom of the second side plate is disposed on the first surface, and the top of the second side plate is opposite to the bottom of the second side plate.
[0010] A second communication interface is provided on the top of the first side panel and / or the top of the second side panel.
[0011] Optionally, the top of the storage unit does not exceed the top of the first side panel, and the top of the storage unit does not exceed the top of the second side panel.
[0012] Optionally, the carrier plate further includes a third side plate and a fourth side plate, which are disposed opposite to each other on the first surface at intervals; the third side plate is connected to the first side plate and the second side plate respectively, and the fourth side plate is connected to the first side plate and the second side plate respectively, and the first side plate, the second side plate, the third side plate and the fourth side plate together form a recessed space.
[0013] Optionally, the first communication interface is electrically connected to the second communication interface through a first set of wiring, and the first communication interface is electrically connected to the third communication interface through a second set of wiring.
[0014] Optionally, the first communication interface is electrically connected to the second communication interface through a first set of wiring, and the second communication interface is electrically connected to the third communication interface through a second set of wiring.
[0015] Another technical solution adopted in this application is to provide an electronic device, which includes a first electronic module, a storage module as described above, and a second electronic module stacked together; wherein,
[0016] The first electronic module is disposed on the first side of the base plate close to the storage module, and the first electronic module is coupled to the second communication interface of the storage module.
[0017] The second electronic module is located on the second side of the base plate near the storage module, and the second electronic module is coupled to the third communication interface of the storage module.
[0018] Optionally, the first electronic module is a processing module, and the second electronic module is a sensing module.
[0019] Optionally, the electronic device further includes a memory module disposed within a recessed space of the storage module, and the memory module is coupled to a first communication interface of the storage module.
[0020] The beneficial effects of this application are as follows: the first side plate and the second side plate are spaced apart and opposite to each other on the first surface of the base plate, forming a recessed space; at least one of the first side plate and the second side plate is provided with a second communication interface, and the second surface of the base plate opposite to the first surface is provided with a third communication interface; the first communication interface is electrically connected to the second communication interface; the storage unit is disposed in the recessed space, and the storage unit is coupled to the first communication interface. Through the above arrangement, the first communication interface, the second communication interface, and the third communication interface can be arranged in the vertical direction.
[0021] Furthermore, the electronic device provided in this application uses the storage module as described above. Since the communication interface is arranged in the vertical direction, the electronic module can be stacked with the storage unit in the vertical direction, increasing the space utilization of the electronic device and effectively reducing the size of the electronic device without significantly increasing the cost. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the structure of an embodiment of the storage module provided in this application;
[0024] Figure 2 This is a schematic diagram of another embodiment of the storage module provided in this application;
[0025] Figure 3 This is a schematic diagram of the structure of an embodiment of an electronic device in the related art;
[0026] Figure 4 This is a schematic diagram of the structure of an embodiment of the electronic device provided in this application. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0028] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, or apparatuses.
[0029] like Figure 1 As shown, the storage module 1 provided in this embodiment includes a carrier board 11 and a storage unit 12.
[0030] The carrier plate 11 includes a base plate 111, a first side plate 112, and a second side plate 113. The first side plate 112 and the second side plate 113 are disposed opposite each other on the first surface (not shown) of the base plate 111. Furthermore, the first side plate 112, the second side plate 113, and the base plate 111 form a recessed space A.
[0031] In some embodiments, the first side plate 112 and the second side plate 113 are disposed opposite each other along the lateral direction x on the first surface of the base plate 111.
[0032] In some embodiments, the base plate 111, the first side plate 112, and the second side plate 113 are all lead frames (substrate), which are mainly composed of a substrate (specifically, a rigid substrate, a flexible thin film substrate, or a co-fired ceramic substrate, etc.) and copper foil located on the substrate (the thickness of which can be between 1.5μm and 18μm).
[0033] None of the following components are flexible copper-clad laminates (rigid-flex boards): base plate 111, first side plate 112, and second side plate 113.
[0034] In some possible embodiments, a single carrier plate 11 may be etched to form a base plate 111, a first side plate 112, and a second side plate 113. In some possible embodiments, the first side plate 112 and the second side plate 113 are pre-processed and then fixed onto the base plate 111 to form the carrier plate 11.
[0035] Within the recessed space A, a first communication interface 13 is provided on the first surface of the base plate 111, a second communication interface 14 is provided on the surface of the first side plate 112 and / or the second side plate 113, and a third communication interface 15 is provided on the second surface of the base plate 111 opposite to the first surface. Furthermore, the first communication interface 13 is electrically connected to the second communication interface 14 and the third communication interface 15, respectively.
[0036] Furthermore, the storage unit 12 is disposed within the recessed space A, and the storage unit 12 is coupled to the first communication interface 13.
[0037] In some embodiments, the storage cell 12 is fabricated using a wire bonding (WB) process.
[0038] In some possible embodiments, the storage unit 12 is coupled to the first communication interface 13 via a connector. In some possible embodiments, the storage unit 12 is soldered to the first surface of the base plate 111 inside the recessed space A, and coupled to the first communication interface 13 via copper foil on the base plate 111. In some possible embodiments, the surface of the storage unit 12 is provided with conductive contacts or conductive pads, and coupled to the first communication interface 13 via conductive contacts or conductive pads.
[0039] In some embodiments, the first communication interface 13, the second communication interface 14, and the third communication interface 15 can all function as I / O signal interfaces.
[0040] Optionally, the storage unit 12 includes a package 121, a storage chip 122, and a main control chip 123.
[0041] Storage chip 122 and main control chip 123 are respectively disposed on the first surface of the bottom plate 111 in the recessed space A. Storage chip 122 is coupled to the first communication interface 13 through a lead wire. The main control chip 123 is coupled to the first communication interface 13. Both the main control chip 123 and storage chip 122 are encapsulated in the package 121.
[0042] In some embodiments, the storage chip 122 may be an unpackaged flash memory, such as a bare NAND Flash die, and the storage chip 122 is fixed to the first surface of the bottom plate 111 in the recessed space A by a die-attached film (DAF) or silver paste.
[0043] For example, the storage particle 122 may be one or a combination of SLC particles, MLC particles, TLC particles, QLC particles, and PLC particles.
[0044] In some possible embodiments, a carrier board soldering station is further provided on the first surface of the bottom plate 111 within the recessed space A. The carrier board soldering station is coupled to conductive contacts or conductive pads provided on the surface of the memory cell 12 via copper foil. Further, solder pads may be provided on the upper surface of the memory chip 122, and the solder pads are coupled to the carrier board soldering station via leads. Exemplarily, the leads can be wire-bonded to electrically connect the solder pads to the carrier board soldering station. In some possible embodiments, there may be multiple memory chips 122, and at least one memory chip 122 has a DAF layer or silver paste layer on its upper surface to achieve vertical arrangement of the memory chips 122. The stacked packaging structure of the memory chips is well-known in the art and will not be described in detail here.
[0045] In some embodiments, the main control chip 123 can also be a bare die, and the main control chip 123 can also be fixed to the first surface of the bottom plate 111 in the recessed space A by means of an adhesive film (DAF, Die Attach Film) or silver paste. The specific structure of the main control chip 123 is known in the art and will not be described in detail here.
[0046] In some possible embodiments, the package 121 completely fills the recessed space A.
[0047] Optionally, the first side plate 112 includes a first bottom and a first top, the first bottom being disposed on the first surface of the base plate 111, and the first top being opposite to the first bottom.
[0048] The second side plate 113 includes a second bottom and a second top. The second bottom is disposed on the first surface of the base plate 111, and the second top is opposite to the second bottom.
[0049] The first top and / or the second top are provided with a second communication interface 14, that is, the top of the first side plate 112 and / or the top of the second side plate 113 are provided with a second communication interface 14.
[0050] In some possible embodiments, the first side panel 112 further includes a first side surface, wherein the first side surface faces away from the storage unit 12.
[0051] In some embodiments, such as Figure 1 As shown, the first side can be the left surface of the first side plate 112.
[0052] Furthermore, the second side plate 113 also includes a second side surface that faces away from the storage unit 12.
[0053] In this embodiment, a second communication interface 14 is provided on the first side and / or the second side.
[0054] In some embodiments, such as Figure 1 As shown, the second side can be the right surface of the second side plate 113.
[0055] In some possible embodiments, different storage modules 1 can be coupled via a second communication interface 14 disposed on a first side and / or a second side to form a storage array. Exemplarily, a single storage array can consist of four storage modules 1. Exemplarily, a single storage array can consist of nine storage modules 1. By forming a storage array, the storage capacity is greatly increased.
[0056] In some possible embodiments, the host computer can be coupled to the storage module 1 through a second communication interface 14 provided on the first side and / or the second side.
[0057] In some possible embodiments, the passive element can be coupled to the storage module 1 via a second communication interface 14 provided on the first side and / or the second side.
[0058] Optionally, the top of the storage unit 12 does not exceed the top of the first side plate 112, and the top of the storage unit 12 does not exceed the top of the second side plate 113.
[0059] In some possible embodiments, the top of the first side plate 112 is on the same horizontal plane as the top of the second side plate 113.
[0060] Optionally, the carrier plate 11 further includes a third side plate 114 and a fourth side plate 115, which are disposed opposite to each other on the first surface of the base plate 111. The third side plate 114 is connected to the first side plate 112 and the second side plate 113 respectively, and the fourth side plate 115 is connected to the first side plate 112 and the second side plate 113 respectively.
[0061] like Figure 2 As shown, in some embodiments, viewed from the opposite direction of the vertical direction z, the third side plate 114 and the fourth side plate 115 are disposed opposite each other along the longitudinal direction y on the first surface of the base plate 111. Further, the first surface of the base plate 111, the first side plate 112, the second side plate 113, the third side plate 114, and the fourth side plate 115 together form a recessed space A.
[0062] In some embodiments, the distance between the first side plate 112 and the second side plate 113 along the lateral direction x is x1, and the distance between the third side plate 114 and the fourth side plate 115 along the longitudinal direction y is y1. Further, the length of the storage unit 12 along the lateral direction x is x1, and the width of the storage unit 12 along the longitudinal direction y is y1.
[0063] In some embodiments, a second communication interface 14 is provided on the surface of at least one of the first side plate 112, the second side plate 113, the third side plate 114 and the fourth side plate 115.
[0064] In some embodiments, a single carrier plate 11 may be etched to form a base plate 111, a first side plate 112, a second side plate 113, a third side plate 114, and a fourth side plate 115. In some possible embodiments, the first side plate 112, the second side plate 113, the third side plate 114, and the fourth side plate 115 are pre-processed and then fixed onto the base plate 111 to form the carrier plate 11.
[0065] Optionally, the first communication interface 13 is electrically connected to the second communication interface 14 through a first set of wiring, and the first communication interface 13 is electrically connected to the third communication interface 15 through a second set of wiring.
[0066] Understandably, the first set of wiring is at least partially located inside the base plate 111.
[0067] In some embodiments, the second set of traces is at least partially located inside the second side panel 113, and / or, the second set of traces is at least partially located inside the third side panel 114.
[0068] Optionally, the first communication interface 13 is electrically connected to the second communication interface 14 through a first set of wiring, and the second communication interface 14 is electrically connected to the third communication interface 15 through a second set of wiring.
[0069] In the above scheme, the first side plate and the second side plate are spaced apart and opposite to each other on the first surface of the base plate, forming a recessed space; at least one of the first side plate and the second side plate is provided with a second communication interface, and the second surface of the base plate opposite to the first surface is provided with a third communication interface; the first communication interface is electrically connected to the second communication interface; the storage unit is disposed in the recessed space and coupled to the first communication interface. Through the above arrangement, the first communication interface, the second communication interface, and the third communication interface can be arranged in the vertical direction.
[0070] Furthermore, the electronic device provided in this application uses the storage module as described above. Since the communication interface is arranged in the vertical direction, the electronic module can be stacked with the storage unit in the vertical direction, increasing the space utilization of the electronic device and effectively reducing the size of the electronic device without significantly increasing the cost.
[0071] like Figure 3 As shown, the electronic device 2 provided by the related technology includes a circuit board 21, a storage module 22, a first electronic module 23, and a second electronic module 24. The communication interface on the circuit board 21 is arranged horizontally (both laterally and vertically). This arrangement of the storage module 22, the first electronic module 23, and the second electronic module 24 horizontally results in a relatively large area for the electronic device 2 in the horizontal direction. In some possible related technologies, the communication interface is simultaneously located on the upper and lower surfaces of the circuit board 21, which can reduce the problem of the large area of the electronic device 2 in the horizontal direction to some extent. In some possible related technologies, the circuit board 21 uses a flexible copper-clad laminate (rigid-flex board) to allow the storage module 22, the first electronic module 23, and the second electronic module 24 to be arranged vertically, further reducing the problem of the large area of the electronic device 2 in the horizontal direction. However, flexible copper-clad laminates have complex manufacturing processes and high quality control difficulties, significantly increasing the production cost of the electronic device 2. Among some possible related technologies, the storage module 22 adopts HBF (high bandwidth flash memory) packaging and testing process, which can reduce the size of the storage module 22 in the horizontal direction to a certain extent. Compared with the storage module 22 using wire bonding, it has the disadvantages of complex process and high cost, which greatly increases the production cost of electronic device 2.
[0072] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of an embodiment of the electronic device provided in this application.
[0073] like Figure 4 As shown, the electronic device 3 provided in this application includes a first electronic module 31, a storage module 33, and a second electronic module 32 stacked together. The storage module 33 corresponds to the storage module 1 mentioned above.
[0074] The storage module 33 includes a storage unit 331, a base plate 332, a first side plate 333, a second side plate 334, a first communication interface 335, a second communication interface 336, and a third communication interface 337. The first side plate 333 and the second side plate 334 are disposed opposite to each other on the first surface of the base plate 332.
[0075] In this embodiment, the first side plate 333 and the second side plate 334 are disposed opposite each other on the lower surface of the base plate 332. Further, the lower surfaces of the first side plate 333, the second side plate 334, and the base plate 332 form a recessed space B, wherein the first communication interface 335 is disposed on the lower surface of the base plate 332 within the recessed space B, and the storage unit 331 is also disposed within the recessed space B, and the storage unit 331 is coupled to the first communication interface 335.
[0076] Specifically, the first electronic module 31 is disposed on the first side near the base plate 332, and the first electronic module 31 is coupled to the second communication interface 336. In other words, the first electronic module 31 is disposed on the side near the recessed space B of the storage unit 331.
[0077] Specifically, the second electronic module is disposed on the second side of the base plate 332, and the second electronic module 32 is coupled to the third communication interface 337 disposed on the second side of the base plate 332. In other words, the second electronic module 32 is disposed on the side away from the recessed space B of the storage unit 331.
[0078] In some embodiments, the first electronic module 31 and the second electronic module 32 can be used to perform data processing functions, respectively. In some embodiments, the first electronic module 31 and the second electronic module 32 can be used to perform data acquisition functions, respectively.
[0079] In some embodiments, the electronic device 3 further includes a circuit board 34. The upper surface of the circuit board 34 is coupled to the second communication interface 336, and the lower surface of the circuit board 34 is coupled to the first electronic module 31. Understandably, the upper and lower surfaces of the circuit board 34 are electrically connected.
[0080] Optionally, the first electronic module 31 is a processing module, and the second electronic module 32 is a sensing module.
[0081] In some embodiments, the first electronic module 31 may be a microprocessor unit (MCU), a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.
[0082] In some embodiments, the first electronic module 31 may be a graphics processing unit (GPU) or a tensor processing unit (TPU).
[0083] In some embodiments, the second electronic module 32 may be a data acquisition circuit. In some embodiments, the second electronic module 32 may be a sensor.
[0084] In some embodiments, the second electronic module 32 may be a Hall sensor.
[0085] For example, the second electronic module 32 may be an image sensor.
[0086] In some possible embodiments, the first electronic module 31 is a sensing module and the second electronic module 32 is a processing module. That is, the positions of the first electronic module 31 and the second electronic module 32 can be interchanged.
[0087] Optionally, the electronic device 3 also includes a memory module 35, which is disposed in the recessed space B of the storage module 33 and is coupled to the first communication interface.
[0088] In some possible embodiments, the memory module 35 is encapsulated within the package of the storage unit 331.
[0089] For example, memory module 35 may be a DDR3, DDR4, DDR5 or DDR6 memory chip.
[0090] For example, memory module 35 can be any one of LPDDR4, LPDDR4X, LPDDR5, and LPDDR5X memory chips.
[0091] For example, memory module 35 can be any one of GDDR4, GDDR5, GDDR5X, GDDR6, GDDR6X, GDDR7, and GDDR7X memory chips.
[0092] In some possible embodiments, electronic device 3 is an edge computing device.
[0093] In the above scheme, the first side plate and the second side plate are spaced apart and opposite to each other on the first surface of the base plate, forming a recessed space; at least one of the first side plate and the second side plate is provided with a second communication interface, and the second surface of the base plate opposite to the first surface is provided with a third communication interface; the first communication interface is electrically connected to the second communication interface; the storage unit is disposed in the recessed space and coupled to the first communication interface. Through the above arrangement, the first communication interface, the second communication interface, and the third communication interface can be arranged in the vertical direction.
[0094] Furthermore, the electronic device provided in this application uses the storage module as described above. Since the communication interface is arranged in the vertical direction, the electronic module can be stacked with the storage unit in the vertical direction, increasing the space utilization of the electronic device and effectively reducing the size of the electronic device without significantly increasing the cost.
[0095] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A storage module, characterized in that, The storage module includes: A carrier plate includes a base plate, a first side plate, and a second side plate. The first side plate and the second side plate are spaced apart and opposite to each other on a first surface of the base plate, forming a recessed space. A first communication interface is provided on the first surface within the recessed space, and a second communication interface is provided on the surface of the first side plate and / or the second side plate. A third communication interface is provided on the second surface of the base plate opposite to the first surface. The first communication interface is electrically connected to the second communication interface and the third communication interface, respectively. A storage unit is disposed within the recessed space and is coupled to the first communication interface.
2. The storage module according to claim 1, characterized in that, The storage unit includes a package, storage particles, and a main control chip. The storage particles and the main control chip are respectively disposed on the first surface within the recessed space. The storage particles are coupled to the first communication interface via leads, and the main control chip is coupled to the first communication interface. Both the main control chip and the storage particles are encapsulated within the package.
3. The storage module according to claim 1, characterized in that, The bottom of the first side plate is disposed on the first surface, and the top of the first side plate is opposite to the bottom of the first side plate; the bottom of the second side plate is disposed on the first surface, and the top of the second side plate is opposite to the bottom of the second side plate. The second communication interface is provided on the top of the first side plate and / or the top of the second side plate.
4. The storage module according to claim 3, characterized in that, The top of the storage unit does not exceed the top of the first side panel, and the top of the storage unit does not exceed the top of the second side panel.
5. The storage module according to claim 1, characterized in that, The carrier plate further includes a third side plate and a fourth side plate, which are disposed opposite to each other on the first surface at intervals; the third side plate is connected to the first side plate and the second side plate respectively, and the fourth side plate is connected to the first side plate and the second side plate respectively, and the first side plate, the second side plate, the third side plate and the fourth side plate together form the recessed space.
6. The storage module according to any one of claims 1-5, characterized in that, The first communication interface is electrically connected to the second communication interface through a first set of traces, and the first communication interface is electrically connected to the third communication interface through a second set of traces.
7. The storage module according to any one of claims 1-5, characterized in that, The first communication interface is electrically connected to the second communication interface through a first set of traces, and the second communication interface is electrically connected to the third communication interface through a second set of traces.
8. An electronic device, characterized in that, The electronic device includes a first electronic module, a storage module as described in any one of claims 1-7, and a second electronic module, all stacked together; wherein, The first electronic module is disposed on the first side of the base plate of the storage module, and the first electronic module is coupled to the second communication interface of the storage module; The second electronic module is disposed on the second side of the base plate of the storage module, and the second electronic module is coupled to the third communication interface of the storage module.
9. The electronic device according to claim 8, characterized in that, The first electronic module is a processing module, and the second electronic module is a sensing module.
10. The electronic device according to claim 8, characterized in that, The electronic device further includes a memory module disposed within the recessed space of the storage module, and the memory module is coupled to the first communication interface of the storage module.