Semiconductor refrigeration wireless charging bracket

Abstract

The utility model relates to a semiconductor refrigeration wireless charger support which comprises a wireless charger body, an annular support arranged on the outer side of the wireless charger body in a surrounding mode and a charging control circuit board used for arranging a control circuit of a wireless charger. The charging control circuit board comprises a switching circuit board and an external circuit board which are respectively arranged in the wireless charger main body and the annular bracket; the wireless charging assembly, the magnetic assembly and the semiconductor refrigeration assembly are arranged in the wireless charger body, the wireless charger body is attracted to the mobile terminal through the magnetic assembly, and when the wireless charging assembly charges the mobile terminal, the semiconductor refrigeration assembly provides a good heat dissipation function. And the service lives of the wireless charger main body and the mobile terminal are prolonged. The annular support rotates by a preset angle, so that the mobile terminal is obliquely supported on a table top and other planes, the mobile terminal can be normally used during charging, the annular support is annularly arranged on the outer side of the wireless charger body when folded, the occupied space is reduced, and storage is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of wireless charging technology, specifically to a semiconductor cooling wireless charging bracket. Background Technology

[0002] With the development of technology, mobile devices such as smartphones and tablets have become an indispensable part of our lives. Wireless chargers are devices that use the principle of electromagnetic induction to charge devices. They convert electrical energy into radio signals and transmit them to the electronic device being charged, thus enabling wireless charging. Using wireless chargers to charge mobile devices is more convenient, safe, and reliable.

[0003] Existing wireless chargers require mobile devices to be placed horizontally on top of the charger, which is inconvenient for users. Furthermore, the heat generated during charging is not conducive to heat dissipation when the mobile device and charger are placed horizontally. Utility Model Content

[0004] Therefore, it is necessary to provide a semiconductor cooling wireless charging bracket that can quickly dissipate heat and has a simple structure.

[0005] A semiconductor-cooled wireless charging stand includes a wireless charger body, an annular support surrounding the outside of the wireless charger body, and a charging control circuit board. The charging control circuit board houses the control circuitry of the wireless charger and includes an adapter circuit board and an external circuit board. The adapter circuit board is located within the wireless charger body, and the external circuit board is located within the annular support. The wireless charger body contains a wireless charging component, a magnetic component, and a semiconductor cooling component. The magnetic component is used to attach the wireless charger body to a mobile terminal. The wireless charging component wirelessly charges the mobile terminal, and the semiconductor cooling component dissipates heat from the wireless charging component. The annular support has a rotating shaft connected to one side of the wireless charger body. The annular support rotates around the rotating shaft, creating a predetermined angle between the annular support and the wireless charger body. When the wireless charger body charges the mobile terminal, the annular support supports the mobile terminal, giving it a predetermined tilt angle.

[0006] Preferably, the wireless charger body includes a housing, the housing includes a top surface, a bottom surface and an annular sidewall, the top surface, the bottom surface and the annular sidewall form a closed space, the wireless charging component, the magnetic component and the semiconductor cooling component are disposed in the closed space; the annular sidewall has a plurality of evenly distributed heat dissipation holes.

[0007] Preferably, the wireless charging component includes a charging coil and a coil bracket. The charging coil and the adapter circuit board are respectively fixedly installed on both sides of the coil bracket. The charging coil is electrically connected to the adapter circuit board. The external circuit board and the adapter circuit board are connected by a wire, which passes through the rotating shaft.

[0008] Preferably, the annular bracket includes an upper housing and a lower housing, and the external circuit board is disposed between the upper housing and the lower housing. The upper housing and the lower housing are made of a plastic material with thermal conductivity. The external circuit board has a wireless charging control chip and a power interface. The external circuit board is electrically connected to the adapter circuit board. The power interface is used to connect to an external power source. The wireless charging control chip is used to control the wireless charging component to charge the mobile terminal.

[0009] Preferably, the magnetic component includes a plurality of magnetic elements, which are arranged in a ring around the outside of the charging coil. The magnetic component is mounted on the coil support and is located on the inner side of the bottom surface.

[0010] Preferably, the coil support includes a support plate and a plurality of support feet, the support plate having a central mounting through hole, and the plurality of support feet being evenly arranged on one side of the support plate.

[0011] Preferably, the semiconductor cooling assembly includes a semiconductor cooling chip and a heat sink. The semiconductor cooling chip is disposed within the mounting through hole of the coil bracket. The semiconductor cooling chip is electrically connected to the adapter circuit board. Both sides of the semiconductor cooling chip are respectively attached to the charging coil and the heat sink. The cooling surface of the semiconductor cooling chip is attached to the bottom surface of the charging coil, and the heat dissipation surface of the semiconductor cooling chip is attached to the top surface of the heat sink.

[0012] Preferably, the top surface of the heat sink is a plane, and the bottom surface of the heat sink has a plurality of parallel fins, which are used to increase the heat dissipation area of ​​the heat sink.

[0013] Preferably, the rotating shaft includes a fixed component and a movable component. The fixed component is fixedly connected to the wireless charger body, and the movable component is fixedly connected to the annular bracket. The movable component is sleeved on the outside of the fixed component and rotates around the fixed component as an axis.

[0014] Preferably, it further includes a handle having a connecting end that is connected to the pivot.

[0015] In the aforementioned semiconductor-cooled wireless charging stand, the wireless charger body is attached to the mobile terminal via the magnetic component. While the wireless charging component charges the mobile terminal, the semiconductor cooling component provides excellent heat dissipation, improving the lifespan of both the wireless charger body and the mobile terminal. Furthermore, the ring-shaped stand rotates at a predetermined angle, allowing the mobile terminal to be tilted and supported on a flat surface such as a desktop, ensuring normal use even while charging and providing a better user experience. When folded, the ring-shaped stand surrounds the outside of the wireless charger body, reducing space occupation and facilitating storage. This invention has a simple structure, is easy to implement, has low cost, and is easy to promote. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the semiconductor cooling wireless charging bracket (folded up) according to an embodiment of this utility model.

[0017] Figure 2 This is a schematic diagram of the structure (support state) of the semiconductor cooling wireless charging bracket according to an embodiment of this utility model.

[0018] Figure 3 This is an exploded view of the structure of the semiconductor cooling wireless charging bracket according to an embodiment of this utility model. Detailed Implementation

[0019] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings.

[0020] Please see Figures 1 to 3 This paper illustrates a semiconductor-cooled wireless charging stand 100, including a wireless charger body 10 and an annular support 30 surrounding the outside of the wireless charger body 10, as well as a charging control circuit board. The charging control circuit board is used to house the control circuitry of the wireless charger. The charging control circuit board includes an adapter circuit board 54 and an external circuit board 31. The adapter circuit board 54 is disposed within the wireless charger body 10, and the external circuit board 31 is disposed within the annular support 30. The wireless charger body 10 contains a wireless charging component, a magnetic component 55, and a semiconductor cooling component. The magnetic component 55 is used to... The wireless charger body 10 is attached to the mobile terminal. The wireless charging component is used to wirelessly charge the mobile terminal, and the semiconductor cooling component is used to dissipate heat from the wireless charging component. The annular bracket 30 is provided with a rotating shaft 20, which is connected to one side of the wireless charger body 10. The annular bracket 30 rotates about the rotating shaft 20, so that the annular bracket 30 and the wireless charger body 10 form a predetermined angle. When the wireless charger body 10 charges the mobile terminal, the annular bracket 30 supports the mobile terminal, so that the mobile terminal has a predetermined tilt angle.

[0021] Preferably, the wireless charger body 10 includes a housing, which includes a top surface 11, a bottom surface 12, and an annular sidewall 13. The top surface 11, the bottom surface 12, and the annular sidewall 13 form a closed space, and the wireless charging component, the magnetic component 55, and the semiconductor cooling component are disposed within the closed space. The annular sidewall 13 has a plurality of evenly distributed heat dissipation holes.

[0022] Specifically, the top surface 11 and the bottom surface 12 are arranged opposite to each other. In this embodiment, the bottom surface 12 is the side that is in contact with the mobile terminal, and the top surface 11 is the side that is away from the mobile terminal.

[0023] Specifically, decorative patterns or heat dissipation holes may be provided on the top surface 11 and the bottom surface 12 to improve heat dissipation efficiency and enhance aesthetics.

[0024] Specifically, in this embodiment, the heat dissipation holes on the annular sidewall 13 are strip-shaped holes; in other embodiments, the heat dissipation holes can be regularly distributed circular holes. The top surface 11 is preferably made of aluminum sheet and has uniformly distributed heat dissipation holes to facilitate heat dissipation during wireless charging.

[0025] Specifically, a filling sheet 14 is provided on the inner side of the bottom surface 12. The filling sheet 14 is attached to the inner side of the bottom surface 12 to make the bottom surface 12 flatter and prevent the bottom surface 12 from being concave.

[0026] Preferably, the wireless charging assembly includes a charging coil 51 and a coil bracket 53. The charging coil 51 and the adapter circuit board 54 are respectively fixedly installed on both sides of the coil bracket 53. The charging coil 51 is electrically connected to the adapter circuit board 54. The external circuit board 31 is connected to the adapter circuit board 54 by a wire, and the wire passes through the rotating shaft 20.

[0027] Specifically, a magnetic shielding sheet 52 is provided on the back of the charging coil 51. The magnetic shielding sheet 52 has the functions of enhancing the magnetic induction intensity of the charging coil 51, preventing electromagnetic signal attenuation, and improving charging efficiency.

[0028] Preferably, the annular bracket 30 includes an upper housing 33 and a lower housing 34, and the external circuit board 31 is disposed between the upper housing 33 and the lower housing 34. The upper housing 33 and the lower housing 34 are made of a plastic material with thermal conductivity. The external circuit board 31 is provided with a wireless charging control chip and a power interface 32. The external circuit board 31 is electrically connected to the adapter circuit board 54. The power interface 32 is used to connect to an external power source. The wireless charging control chip is used to control the wireless charging component to charge the mobile terminal.

[0029] Specifically, the external circuit board 31 is ring-shaped, and the upper housing 33 and the lower housing 34 are fastened to the upper and lower sides of the external circuit board 31 to protect the external circuit board 31. The power interface 32 passes through the upper housing 33 and the lower housing 34.

[0030] Specifically, the charging control circuit board is used to set up the charging control circuit of the wireless charger and the power supply circuit of the semiconductor cooling component. High-power components that operate at higher temperatures are located on the external circuit board 31, while low-power components that operate at lower temperatures are located on the adapter circuit board 54. The upper shell 33 and lower shell 34 of the annular bracket 30 are made of a plastic material with good thermal conductivity, enabling it to quickly dissipate the heat generated by the components on the external circuit board 31 into the air.

[0031] When the mobile terminal is charging, the ring bracket 30 is rotated by a predetermined angle, and there is a predetermined distance between the wireless charger body 10 and the ring bracket 30, so that both the wireless charger body 10 and the ring bracket 30 can have sufficient heat dissipation space.

[0032] Preferably, the magnetic component 55 includes a plurality of magnetic elements, which are arranged in a ring around the outside of the charging coil 51. The magnetic component 55 is mounted on the coil support 53 and is located on the inner side of the bottom surface 12.

[0033] Preferably, the coil support 53 includes a support plate and a plurality of support feet, the support plate having a central mounting through hole, and the plurality of support feet being evenly arranged on one side of the support plate.

[0034] Preferably, the semiconductor cooling assembly includes a semiconductor cooling chip 56 and a heat sink 57. The semiconductor cooling chip 56 passes through the mounting through hole of the coil bracket 53. The semiconductor cooling chip 56 is electrically connected to the adapter circuit board 54. Both sides of the semiconductor cooling chip 56 are respectively attached to the charging coil 51 and the heat sink 57. The cooling surface of the semiconductor cooling chip 56 is attached to the bottom surface 12 of the charging coil 51, and the heat dissipation surface of the semiconductor cooling chip 56 is attached to the top surface 11 of the heat sink 57. The top surface 11 of the heat sink 57 is flat, and the bottom surface 12 of the heat sink 57 has multiple parallel fins, which are used to increase the heat dissipation area of ​​the heat sink 57.

[0035] Specifically, the thermoelectric cooler 56 and the heat sink 57 are disposed above the adapter circuit board 54. The thermoelectric cooler 56 is electrically connected to the adapter circuit board 54, and the adapter circuit board 54 is used to provide operating power to the thermoelectric cooler 56.

[0036] Specifically, the cooling surface of the thermoelectric cooler 56 is in close contact with the bottom surface 12 of the charging coil 51 to facilitate the heat transfer of the charging coil 51 to the thermoelectric cooler 56.

[0037] Specifically, the top surface 11 of the heat sink 57 is flat, allowing it to fully contact the heat dissipation surface of the thermoelectric cooler 56 for rapid heat conduction. The fins on the bottom surface 12 of the heat sink 57 not only increase the heat dissipation area of ​​the heat sink 57 but also create a gap between the heat sink 57 and the adapter circuit board 54 to facilitate ventilation and heat dissipation.

[0038] Preferably, the rotating shaft 20 includes a fixed member 21 and a movable member 22. The fixed member 21 is fixedly connected to the wireless charger body 10, and the movable member 22 is fixedly connected to the annular bracket 30. The movable member 22 is sleeved on the outside of the fixed member 21 and rotates about the fixed member 21 as an axis.

[0039] Specifically, the fixing member 21 and the movable member 22 of the rotating shaft 20 are respectively connected to the wireless charger body 10 and the ring bracket 30. The ring bracket 30 rotates around the rotating shaft 20. When the angle between the ring bracket 30 and the wireless charger body 10 is zero, that is, the ring bracket 30 is arranged around the outside of the wireless charger body 10, the mobile terminal is in a horizontal position. When the angle between the ring bracket 30 and the wireless charger body 10 is a predetermined angle, the ring bracket 30 and one side of the mobile terminal are supported on the plane, so that the mobile terminal is tilted at a predetermined angle.

[0040] Specifically, a wire is threaded through the rotating shaft 20, which is used to electrically connect the external circuit board 31 and the adapter circuit board 54, and to provide working power to the adapter circuit board 54.

[0041] Preferably, it further includes a handle 40, the handle 40 having a connecting end connected to the rotating shaft 20.

[0042] Specifically, the handle 40 is ring-shaped to facilitate picking up the wireless charging bracket. The handle 40 is typically made of a flexible material.

[0043] Specifically, the wireless charger body 10 and the ring bracket 30 can be any shape, such as circular, elliptical or square.

[0044] In the aforementioned semiconductor-cooled wireless charging stand 100, the wireless charger body 10 is attached to the mobile terminal via the magnetic component 55. While the wireless charging component charges the mobile terminal, the semiconductor cooling component provides excellent heat dissipation, improving the lifespan of both the wireless charger body 10 and the mobile terminal. Furthermore, the ring-shaped bracket 30 rotates at a predetermined angle, allowing the mobile terminal to be tilted and supported on a flat surface such as a desktop, ensuring normal use even while charging and providing a better user experience. When retracted, the ring-shaped bracket 30 surrounds the outside of the wireless charger body 10, reducing space occupation and facilitating storage. This invention has a simple structure, is easy to implement, has low cost, and is easy to promote.

[0045] It should be noted that this utility model is not limited to the above-described embodiments. Based on the inventive spirit of this utility model, those skilled in the art can make other changes, and these changes made based on the inventive spirit of this utility model should be included within the scope of protection claimed by this utility model.

Claims

1. A semiconductor-cooled wireless charging stand, characterized in that, The device includes a wireless charger body, an annular support surrounding the outer side of the wireless charger body, and a charging control circuit board. The charging control circuit board houses the control circuitry of the wireless charger and includes an adapter circuit board and an external circuit board. The adapter circuit board is located within the wireless charger body, and the external circuit board is located within the annular support. The wireless charger body also includes a wireless charging component, a magnetic component, and a semiconductor cooling component. The magnetic component is used to attach the wireless charger body to a mobile terminal. The wireless charging component wirelessly charges the mobile terminal, and the semiconductor cooling component dissipates heat from the wireless charging component. The annular support has a rotating shaft connected to one side of the wireless charger body. The annular support rotates around the rotating shaft, creating a predetermined angle between the annular support and the wireless charger body. When the wireless charger body charges the mobile terminal, the annular support supports the mobile terminal, giving it a predetermined tilt angle.

2. The semiconductor cooling wireless charging bracket as described in claim 1, characterized in that, The wireless charger body includes a housing, which includes a top surface, a bottom surface, and an annular sidewall. The top surface, the bottom surface, and the annular sidewall form a closed space. The wireless charging component, the magnetic component, and the semiconductor cooling component are disposed within the closed space. The annular sidewall has a plurality of evenly distributed heat dissipation holes.

3. The semiconductor cooling wireless charging bracket as described in claim 2, characterized in that, The wireless charging component includes a charging coil and a coil bracket. The charging coil and the adapter circuit board are respectively fixedly installed on both sides of the coil bracket. The charging coil is electrically connected to the adapter circuit board. The external circuit board and the adapter circuit board are connected by a wire, which passes through the rotating shaft.

4. The semiconductor cooling wireless charging bracket as described in claim 1, characterized in that, The ring-shaped bracket includes an upper housing and a lower housing. The external circuit board is located between the upper housing and the lower housing. The upper housing and the lower housing are made of thermally conductive plastic. The external circuit board has a wireless charging control chip and a power interface. The external circuit board is electrically connected to the adapter circuit board. The power interface is used to connect to an external power source. The wireless charging control chip is used to control the wireless charging component to charge the mobile terminal.

5. The semiconductor cooling wireless charging bracket as described in claim 3, characterized in that, The magnetic component includes multiple magnetic elements, which are arranged in a ring around the outside of the charging coil. The magnetic component is mounted on the coil support and is located on the inside of the bottom surface.

6. The semiconductor cooling wireless charging bracket as described in claim 3, characterized in that, The coil support includes a support plate and multiple support feet. The support plate has a central mounting hole, and the multiple support feet are evenly arranged on one side of the support plate.

7. The semiconductor cooling wireless charging bracket as described in claim 6, characterized in that, The semiconductor cooling assembly includes a semiconductor cooling chip and a heat sink. The semiconductor cooling chip is disposed in the mounting through hole of the coil bracket. The semiconductor cooling chip is electrically connected to the adapter circuit board. The two sides of the semiconductor cooling chip are respectively attached to the charging coil and the heat sink. The cooling surface of the semiconductor cooling chip is attached to the bottom surface of the charging coil, and the heat dissipation surface of the semiconductor cooling chip is attached to the top surface of the heat sink.

8. The semiconductor cooling wireless charging bracket as described in claim 7, characterized in that, The top surface of the heat sink is flat, and the bottom surface of the heat sink has multiple parallel fins, which are used to increase the heat dissipation area of ​​the heat sink.

9. The semiconductor cooling wireless charging bracket as described in claim 1, characterized in that, The rotating shaft includes a fixed component and a movable component. The fixed component is fixedly connected to the wireless charger body, and the movable component is fixedly connected to the annular bracket. The movable component is sleeved on the outside of the fixed component and rotates around the fixed component as an axis.

10. The semiconductor cooling wireless charging bracket as described in claim 1, characterized in that, It also includes a handle having a connecting end that is connected to the pivot.

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