Opposite emission type optocoupler packaging device with integrated heat dissipation structure

Abstract

The utility model relates to the technical field of correlation type optocoupler packaging, and discloses a correlation type optocoupler packaging device with an integrated heat dissipation structure, which comprises an upper cover, a lower cover, an infrared emitting diode and a photoelectric transistor, and is characterized in that positioning grooves are formed in the two sides of the bottom end of the upper cover and the two sides of the top end of the lower cover; and the infrared emitting diode is fixedly connected to the middle part of the upper surface of the lower mounting plate. According to the utility model, the lower mounting plate and the upper mounting plate can be limited through the inverted concave limiting strips, and the pins are positioned through the positioning grooves, so that the relative position of the infrared emitting diode and the photoelectric transistor can be accurately adjusted, and convenience and rapidness are realized; when the temperature of the infrared emitting diode and the temperature of the photoelectric transistor rise, the paraffin in the paraffin groove absorbs heat and is melted, the infrared emitting diode and the photoelectric transistor can be cooled, and the melted paraffin can be cooled through the cooling fins.

Description

Technical Field

[0001] This utility model relates to the field of through-beam optocoupler technology, specifically a through-beam optocoupler packaging device with an integrated heat dissipation structure. Background Technology

[0002] With the rapid development of electronic technology, through-beam optocouplers, as a key opto-isolation device, play an indispensable role in various electronic devices. They achieve electrical signal isolation through the transmission of optical signals between an infrared emitting diode and a phototransistor, effectively preventing the propagation of electrical noise and interference, and improving system stability and security.

[0003] The inventors discovered that at least the following problems remain unresolved in existing technologies: Traditional through-beam optocoupler packaging often relies on manual assembly, making it difficult to guarantee precise alignment of each internal component. Even minute deviations between components can lead to a significant decrease in optical coupling efficiency, thus affecting the overall performance and stability of the optocoupler. Furthermore, heat dissipation is often neglected in existing through-beam optocoupler packaging designs. The heat generated by the infrared emitting diode and phototransistor during operation, if not dissipated effectively and promptly, will cause a sharp rise in the internal temperature of the optocoupler. High-temperature environments not only affect the photoelectric conversion efficiency of the optocoupler and reduce its response speed but also accelerate the aging process of the components, shortening their lifespan.

[0004] Therefore, we propose a through-beam optocoupler packaging device with an integrated heat dissipation structure, which can solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a through-beam optocoupler packaging device with an integrated heat dissipation structure, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a through-beam optocoupler packaging device with an integrated heat dissipation structure, comprising an upper cover, a lower cover, an infrared emitting diode, and a phototransistor. Positioning grooves are provided on both sides of the bottom end of the upper cover and on both sides of the top end of the lower cover. The infrared emitting diode is fixedly connected to the middle of the upper surface of the lower mounting plate, and the phototransistor is fixedly connected to the middle of the bottom side of the upper mounting plate. A sealing strip is integrally formed at the bottom end of the upper cover, and a sealing groove is provided at the top end of the lower cover. The sealing strip is inserted into the sealing groove, and the dimensions of the sealing strip and the sealing groove are matched. The device also includes a positioning mechanism for positioning the infrared emitting diode and the phototransistor, and a heat dissipation mechanism for cooling the infrared emitting diode and the phototransistor.

[0007] As an optional solution to the technical solution of this application, the positioning mechanism includes two sets of limiting strips, which are respectively installed on the inner wall of the top of the upper cover and the inner wall of the bottom of the lower cover, and the ends of the lower mounting plate and the upper mounting plate away from the pin are respectively inserted into the two sets of limiting strips.

[0008] As an optional solution to the technical solution of this application, the limiting strip is inverted concave in shape, and the limiting strip matches the dimensions of the lower mounting plate and the upper mounting plate.

[0009] As an optional solution to the technical solution of this application, the heat dissipation mechanism includes a paraffin groove, which is formed inside the top of the upper cover and the bottom of the lower cover.

[0010] As an optional solution to the technical solution of this application, heat dissipation fins are installed at equal intervals on the upper surface of the upper cover and the lower surface of the lower cover, and one end of the heat dissipation fins is placed inside the paraffin wax tank.

[0011] As an optional solution to the technical solution of this application, both the lower mounting plate and the upper mounting plate have pins integrally formed at the ends near the positioning groove. The pins are movably connected to the positioning groove, and the dimensions of the pins and the positioning groove are matched.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: the combination of sealing groove and sealing strip facilitates the sealing of the upper and lower covers; the concave limiting strip can limit the lower and upper mounting plates; the positioning groove positions the pins, enabling precise adjustment of the relative positions of the infrared emitting diode and phototransistor, which is convenient and quick; and the paraffin grooves inside the top of the upper cover and the bottom of the lower cover allow the paraffin in the paraffin grooves to absorb heat and melt when the temperature of the infrared emitting diode and phototransistor rises, thereby cooling the infrared emitting diode and phototransistor. Attached Figure Description

[0013] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0014] Figure 1 This is a top view of a through-beam optocoupler packaging device with an integrated heat dissipation structure according to the present invention;

[0015] Figure 2 This is a bottom side view of a through-beam optocoupler packaging device with an integrated heat dissipation structure according to the present invention;

[0016] Figure 3 This is a schematic diagram of the heat dissipation mechanism of a through-beam optocoupler packaging device with an integrated heat dissipation structure according to the present invention;

[0017] Figure 4This is a schematic diagram of the installation of the upper and lower covers of a through-beam optocoupler packaging device with an integrated heat dissipation structure according to this utility model.

[0018] In the diagram: 1. Top cover; 11. Bottom cover; 12. Positioning groove; 13. Lower mounting plate; 14. Upper mounting plate; 15. Infrared emitting diode; 16. Phototransistor; 17. Pin; 18. Limiting strip; 2. Sealing strip; 21. Sealing groove; 22. Paraffin wax groove; 23. Heat dissipation fins. Detailed Implementation

[0019] Please see Figures 1-4 This utility model provides a technical solution: a through-beam optocoupler packaging device with an integrated heat dissipation structure, including an upper cover 1, a lower cover 11, an infrared emitting diode 15, and a phototransistor 16. Positioning grooves 12 are provided on both sides of the bottom end of the upper cover 1 and on both sides of the top end of the lower cover 11. The infrared emitting diode 15 is fixedly connected to the middle of the upper surface of the lower mounting plate 13, and the phototransistor 16 is fixedly connected to the middle of the bottom side of the upper mounting plate 14. Leads 17 are integrally formed on one end of both the lower mounting plate 13 and the upper mounting plate 14 near the positioning grooves 12. Pin 17 is movably connected to positioning groove 12, and the dimensions of pin 17 and positioning groove 12 are matched. It also includes a positioning mechanism for positioning infrared emitting diode 15 and phototransistor 16. The positioning mechanism includes two sets of limiting strips 18. The limiting strips 18 are concave. The two sets of limiting strips 18 are respectively installed on the inner wall of the top end of the upper cover 1 and the inner wall of the bottom end of the lower cover 11. The ends of the lower mounting plate 13 and the upper mounting plate 14 away from pin 17 are respectively inserted into the two sets of limiting strips 18, and the dimensions of the limiting strips 18 are matched with those of the lower mounting plate 13 and the upper mounting plate 14.

[0020] In this technical solution, inserting the end of the lower mounting plate 13 away from the pin 17 into the concave limiting strip 18 on the inner wall of the bottom of the lower cover 11 can limit the infrared emitting diode 15 on the upper surface of the lower mounting plate 13. The positioning groove 12 opened at the top of the lower cover 11 can position the pin 17 at one end of the lower mounting plate 13. Inserting the end of the upper mounting plate 14 away from the pin 17 into the concave limiting strip 18 on the inner wall of the top of the upper cover 1 can limit the phototransistor 16 on the lower surface of the upper mounting plate 14. The positioning groove 12 opened at the bottom of the upper cover 1 can position the pin 17 at one end of the upper mounting plate 14. Closing the upper cover 1 and the lower cover 11 together can align the infrared emitting diode 15 and the phototransistor 16, which is convenient and quick.

[0021] In this embodiment, a heat dissipation mechanism for heat dissipation of infrared emitting diode 15 and phototransistor 16 includes a paraffin groove 22, which is formed inside the top of the upper cover 1 and the bottom of the lower cover 11. Heat dissipation fins 23 are equidistantly installed on the upper surface of the upper cover 1 and the lower surface of the lower cover 11, and one end of the heat dissipation fin 23 is placed inside the paraffin groove 22.

[0022] In this technical solution, paraffin wax tanks 22 are provided inside the top of the upper cover 1 and the bottom of the lower cover 11. When the temperature of the infrared emitting diode 15 and the phototransistor 16 rises, the paraffin wax in the paraffin wax tank 22 absorbs heat and melts, which can cool the infrared emitting diode 15 and the phototransistor 16. The heat dissipation fins 23 can dissipate heat from the melted paraffin wax. It should be noted that a fan can be added to dissipate heat from the heat dissipation fins 23.

[0023] In this embodiment, the bottom end of the upper cover 1 is integrally formed with a sealing strip 2, and the top end of the lower cover 11 is provided with a sealing groove 21. The sealing strip 2 is inserted into the sealing groove 21, and the dimensions of the sealing strip 2 and the sealing groove 21 are matched.

[0024] In this technical solution, when the upper cover 1 and the lower cover 11 are closed, the sealing strip 2 at the bottom of the upper cover 1 is inserted into the sealing groove 21 opened at the top of the lower cover 11, which can improve the encapsulation effect of the upper cover 1 and the lower cover 11. It should be noted that potting compound can be used to completely wrap the internal components and connecting lines of the through-beam optocoupler to form a solid protective layer. The upper cover 1 and the lower cover 11 can be bonded together with glue.

[0025] When using a through-beam optocoupler package with an integrated heat dissipation structure, the end of the lower mounting plate 13 furthest from the pin 17 is inserted into the concave limiting strip 18 on the inner wall of the bottom of the lower cover 11, which limits the infrared emitting diode 15 on the upper surface of the lower mounting plate 13. The pin 17 at one end of the lower mounting plate 13 is positioned by the positioning groove 12 at the top of the lower cover 11. The end of the upper mounting plate 14 furthest from the pin 17 is inserted into the concave limiting strip 18 on the inner wall of the top of the upper cover 1, which limits the phototransistor 16 on the lower surface of the upper mounting plate 14. The pin 17 at one end of the upper mounting plate 14 is positioned by the positioning groove 12 at the bottom of the upper cover 1. When the upper cover 1 and the lower cover 11 are closed together, the infrared emitting diode 15 and the phototransistor 16 are aligned. The top of the upper cover 1 and the bottom of the lower cover 11 have paraffin wax tanks 22. When the temperature of the infrared emitting diode 15 and the phototransistor 16 rises, the paraffin wax in the paraffin wax tank 22 absorbs heat and melts, which can cool the infrared emitting diode 15 and the phototransistor 16. The heat dissipation fins 23 can dissipate heat from the melted paraffin wax.

Claims

1. A through-beam optocoupler packaging device with an integrated heat dissipation structure, comprising an upper cover (1), a lower cover (11), an infrared emitting diode (15), and a phototransistor (16), characterized in that, Positioning grooves (12) are provided on both sides of the bottom end of the upper cover (1) and both sides of the top end of the lower cover (11). The infrared emitting diode (15) is fixedly connected to the middle of the upper surface of the lower mounting plate (13). The phototransistor (16) is fixedly connected to the middle of the bottom side of the upper mounting plate (14). The bottom end of the upper cover (1) is integrally formed with a sealing strip (2). The top end of the lower cover (11) is provided with a sealing groove (21). The sealing strip (2) is inserted into the sealing groove (21), and the dimensions of the sealing strip (2) and the sealing groove (21) are matched. The upper cover (1) also includes a positioning mechanism for positioning the infrared emitting diode (15) and the phototransistor (16), and a heat dissipation mechanism for heat dissipation of the infrared emitting diode (15) and the phototransistor (16).

2. The through-beam optocoupler packaging device with an integrated heat dissipation structure according to claim 1, characterized in that: The positioning mechanism includes two sets of limiting strips (18), which are respectively installed on the inner wall of the top of the upper cover (1) and the inner wall of the bottom of the lower cover (11), and the ends of the lower mounting plate (13) and the upper mounting plate (14) away from the pin (17) are respectively inserted into the two sets of limiting strips (18).

3. The through-beam optocoupler packaging device with an integrated heat dissipation structure according to claim 2, characterized in that: The limiting strip (18) is concave, and the dimensions of the limiting strip (18) are matched with those of the lower mounting plate (13) and the upper mounting plate (14).

4. A through-beam optocoupler packaging device with an integrated heat dissipation structure according to claim 3, characterized in that: The heat dissipation mechanism includes a paraffin groove (22), which is located inside the top of the upper cover (1) and the bottom of the lower cover (11).

5. A through-beam optocoupler packaging device with an integrated heat dissipation structure according to claim 4, characterized in that: Heat dissipation fins (23) are installed at equal intervals on the upper surface of the upper cover (1) and the lower surface of the lower cover (11), and one end of the heat dissipation fins (23) is placed inside the paraffin groove (22).

6. A through-beam optocoupler packaging device with an integrated heat dissipation structure according to claim 1, characterized in that: Both the lower mounting plate (13) and the upper mounting plate (14) have pins (17) integrally formed at the end near the positioning groove (12). The pins (17) are movably connected to the positioning groove (12), and the dimensions of the pins (17) and the positioning groove (12) are matched.

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