PMOLED packaging structure and display device

Abstract

The utility model discloses a PMOLED packaging structure and a display device, and belongs to the technical field of display. The PMOLED packaging structure comprises a substrate, a packaging cover, two isolation pieces, packaging glue and a PMOLED light-emitting layer. The substrate is provided with a first press-fit area, the packaging cover is provided with a second press-fit area, and the first press-fit area and the second press-fit area are correspondingly arranged; the two separators are arranged between the first press-fit area and the second press-fit area, the separators are made of negative photoresist, the cross section of each separator is trapezoidal, the large end face of each separator faces the second press-fit area, and the small end face of each separator faces the first press-fit area; the packaging glue is arranged between the two separators and is used for bonding the first pressing area and the second pressing area, so that the substrate and the packaging cover form an accommodating space; and the PMOLED light-emitting layer is arranged in the accommodating space, so that the problem of glue overflow when the substrate and the packaging cover are hermetically connected through packaging glue is solved.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a PMOLED packaging structure and display device. Background Technology

[0002] PMOLED (Passive Matrix OLED) is widely used in portable electronic devices due to its advantages such as self-emission, high contrast, and wide viewing angle. The PMOLED packaging structure includes a PMOLED emitting layer, a substrate, and a casing. The substrate and casing are sealed together with encapsulant, and the PMOLED emitting layer is located within the space formed by the substrate and casing. However, when the substrate and casing are sealed together with encapsulant, glue overflow often occurs, leading to the following defects: 1. Affecting display effect: Glue overflow may obscure the pixel area of ​​the PMOLED emitting layer, resulting in uneven display or reduced brightness; 2. Reducing reliability: Glue overflow affects the seal between the substrate and casing, allowing moisture and oxygen to penetrate into the space, affecting the lifespan of internal components; 3. Increasing production costs: Glue overflow increases the defect rate, leading to material waste and increased production costs. Utility Model Content

[0003] The purpose of this invention is to provide a PMOLED packaging structure and display device to solve the problem of adhesive overflow when the substrate and the encapsulation cover are sealed together by encapsulation adhesive.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A PMOLED encapsulation structure, comprising:

[0006] A substrate and a package cover, wherein the substrate has a first pressing area and the package cover has a second pressing area, and the first pressing area and the second pressing area are correspondingly disposed;

[0007] Two isolation components are disposed between the first pressing area and the second pressing area. The isolation components are made of negative photoresist, and the cross-section of the isolation components is trapezoidal. The large end face of the isolation components faces the second pressing area, and the small end face of the isolation components faces the first pressing area.

[0008] An encapsulating adhesive is disposed between the two spacers to bond the first pressing area and the second pressing area, so that the substrate and the encapsulation cover form an accommodating space.

[0009] A PMOLED light-emitting layer is disposed in the accommodating space.

[0010] In some possible implementations, the height of the spacer is 5μm-10μm.

[0011] In some possible implementations, the cross-section of the spacer is an isosceles trapezoid.

[0012] In some possible implementations, the width of the spacer at the midline of the isosceles trapezoid is 15μm-30μm.

[0013] In some possible implementations, the distance between the two spacers at the midline of the isosceles trapezoid is greater than or equal to 0.7 mm.

[0014] In some possible implementations, the spacing between the spacer near the PMOLED light-emitting layer and the PMOLED light-emitting layer at the midline of the isosceles trapezoid is greater than or equal to 0.5 mm.

[0015] In some possible implementations, the encapsulating adhesive is a UV adhesive.

[0016] In some possible implementations, both the substrate and the encapsulation cover are made of glass.

[0017] A display device comprising a PMOLED encapsulation structure as described in any of the preceding claims.

[0018] The beneficial effects of this utility model are:

[0019] This utility model provides a PMOLED encapsulation structure and display device. Encapsulating adhesive is placed between two spacers. After the encapsulation cover and substrate are pressed together, the two spacers prevent the encapsulating adhesive from overflowing to both sides, i.e., preventing it from overflowing into the inner and outer sides of the containment space. This solves the problem of adhesive overflow that occurs when the substrate and encapsulation cover are sealed together using encapsulating adhesive. Furthermore, it prevents the pixel areas of the PMOLED light-emitting layer from being obscured due to adhesive overflow, ensuring display uniformity and brightness. The encapsulating adhesive bonds the glass cover to the substrate, forming a sealed containment space. The good sealing of this space, with the PMOLED light-emitting layer placed within it, effectively protects the PMOLED light-emitting layer, maintains its performance stability, and extends its lifespan. By solving the adhesive overflow problem, the product yield is improved, material waste is prevented, and production costs are reduced.

[0020] By setting the material of the spacer to negative photoresist, the spacer has a trapezoidal cross-section, with the larger end facing the second bonding area and the smaller end facing the first bonding area. This provides good blocking effect against the encapsulating adhesive. Furthermore, by using a photolithography machine to fabricate two spacers in the first bonding area of ​​the substrate, a single exposure process can be employed. Utilizing the diffraction effect of light, the inverted trapezoidal photoresist structure (i.e., the trapezoidal cross-section spacer) can be created, simplifying the process. Moreover, the process flow of the PMOLED packaging structure in this embodiment is consistent with that of existing PMOLED packaging structures, meaning it is applicable to existing processes. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the PMOLED packaging structure provided in a specific embodiment of this utility model.

[0022] In the picture:

[0023] 100. Substrate; 110. First bonding area;

[0024] 200. Encapsulation cover; 210. Second pressing area;

[0025] 300. Isolation components;

[0026] 400. Encapsulating adhesive;

[0027] 500, PMOLED light-emitting layer; 510, cathode layer; 520, anode layer; 530, organic light-emitting layer; 540, isolation pillar layer; 550, insulating layer;

[0028] 600. Desiccant. Detailed Implementation

[0029] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] like Figure 1 As shown, this embodiment provides a PMOLED packaging structure, including a substrate 100, a packaging cover 200, two spacers 300, an encapsulant 400, and a PMOLED light-emitting layer 500. The substrate 100 has a first bonding region 110, and the packaging cover 200 has a second bonding region 210, which are correspondingly disposed. Two spacers 300 are disposed between the first bonding region 110 and the second bonding region 210. The spacers 300 are made of negative photoresist, have a trapezoidal cross-section, with the larger end face of the spacer 300 facing the second bonding region 210 and the smaller end face facing the first bonding region 110. The encapsulant 400 is disposed between the two spacers 300 to bond the first bonding region 110 and the second bonding region 210, forming an accommodating space between the substrate 100 and the packaging cover 200. The PMOLED light-emitting layer 500 is disposed within the accommodating space.

[0033] The encapsulating adhesive 400 is positioned between the two spacers 300. After the encapsulation cover 200 and the substrate 100 are pressed together, the two spacers 300 prevent the encapsulating adhesive 400 from overflowing to both sides, i.e., prevent the encapsulating adhesive 400 from overflowing to the inner and outer sides of the accommodating space. This solves the problem of adhesive overflow that occurs when the substrate 100 and the encapsulation cover 200 are sealed together by the encapsulating adhesive 400. Furthermore, it prevents the pixel area of ​​the PMOLED light-emitting layer 500 from being obscured due to adhesive overflow, ensuring display uniformity and brightness. The encapsulating adhesive 400 bonds the glass cover to the substrate 100, forming a sealed accommodating space. The good sealing of the accommodating space, with the PMOLED light-emitting layer 500 placed within it, effectively prevents external moisture and oxygen from entering and reacting with the PMOLED light-emitting layer 500. By creating a sealed accommodating space, the PMOLED light-emitting layer 500 is well protected, its performance is maintained stably, and its lifespan is extended. By solving the problem of glue overflow, the yield rate of products was improved, material waste was prevented, and production costs were reduced.

[0034] By setting the material of the spacer 300 to negative photoresist, the spacer 300 has a trapezoidal cross-section, with its large end facing the second bonding region 210 and its small end facing the first bonding region 110. On one hand, the spacer 300 provides good blocking effect against the encapsulant 400. On the other hand, two spacers 300 are formed on the first bonding region 110 of the substrate 100 using a photolithography machine. Photoresist is coated on the substrate 100, and during exposure, light diffracts after passing through the light-transmitting holes of the photomask. Ideally, for negative photoresist, the diffracted light will cause the photoresist to have a larger exposure range in the upper part near the photomask than in the lower part, thus forming an inverted trapezoidal structure after development. Using a single exposure process, the inverted trapezoidal structure of the photoresist, i.e., the spacer 300 with a trapezoidal cross-section, can be fabricated using the diffraction effect of light, simplifying the process. Furthermore, the process flow of the PMOLED packaging structure in this embodiment is consistent with the existing PMOLED packaging structure process flow, meaning it is applicable to existing processes. Optionally, the cross-section of the spacer 300 is an isosceles trapezoid.

[0035] In one embodiment, the height of the spacer 300 is 5μm-10μm, and the height of the spacer 300 is the dimension in the pressing direction between the first pressing region 110 and the second pressing region 210. Exemplarily, the height of the spacer 300 can be 5μm, 6μm, 7μm, 8μm, 9μm, or 10μm, etc., without limitation. This avoids the spacer 300 being too high or too low, which would affect the encapsulation effect. In one embodiment, the width of the spacer 300 at the midline of the isosceles trapezoid is 15μm-30μm. Exemplarily, the width can be 15μm, 20μm, 25μm, or 30μm, etc., without limitation. This avoids the spacer 300 being too wide or too narrow, which would affect the encapsulation effect.

[0036] The distance between the two spacers 300 at the midline of the isosceles trapezoid is L, where L is greater than or equal to 0.7 mm. For example, the distance L can be 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, or 1.1 mm, etc., and can be selected according to the actual situation without limitation. For example, the encapsulating adhesive 400 is a UV adhesive. By limiting the minimum distance between the two spacers 300, sufficient width is provided for the UV adhesive, reducing poor encapsulation effect caused by insufficient UV adhesive width, thereby ensuring the encapsulation effect.

[0037] The spacing between the isolator 300 near the PMOLED light-emitting layer 500 and the PMOLED light-emitting layer 500 at the midline of the isosceles trapezoid is M, where M is greater than or equal to 0.5 mm. For example, the spacing M can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm, etc., and can be selected according to the actual situation without limitation. By limiting the minimum spacing between the PMOLED light-emitting layer 500 and the adjacent isolator 300, sufficient space is ensured between them, reducing the corrosion of the PMOLED light-emitting layer 500 by the UV adhesive and ensuring reliability.

[0038] For example, both the substrate 100 and the encapsulation cover 200 are made of glass, and the prior art can be referred to accordingly, so it will not be described in detail again.

[0039] For example, the PMOLED light-emitting layer 500 is disposed on the substrate 100, which serves as a support. The PMOLED light-emitting layer 500 includes an anode layer 520, a cathode layer 510, an organic light-emitting layer 530, an isolation pillar layer 540, and an insulating layer 550, etc., and the substrate 100, anode layer 520, organic light-emitting layer 530, and cathode layer 510 are stacked sequentially. Multiple structural layers are formed by the anode layer 520, organic light-emitting layer 530, and cathode layer 510, all of which are disposed on the substrate 100. The insulating layer 550 is disposed between adjacent structural layers and is also disposed on the substrate 100, while the isolation pillar layer 540 is disposed on the insulating layer 550. By applying an electric field, the PMOLED light-emitting layer 500 causes electrons and holes in the organic material to recombine in the organic light-emitting layer 530, releasing energy in the form of photons and emitting visible light. The function of the isolation pillar layer 540 is to divide the entire cathode layer 510 into individual cathode lines, while the function of the insulating layer 550 is mainly to divide pixels and provide insulation. The specific structure, arrangement, and working principle of the PMOLED light-emitting layer 500 are all based on existing technologies and will not be elaborated further.

[0040] Optionally, a desiccant 600 is also provided within the accommodating space to dry the devices within the accommodating space, further preventing moisture or other substances from penetrating and causing damage to the devices. For example, the desiccant 600 is located on the top of the encapsulation cover 200.

[0041] This embodiment also provides a display device including the above-described PMOLED encapsulation structure. By solving the problem of adhesive overflow that occurs when the substrate 100 and the encapsulation cover 200 are sealed and connected by the encapsulation adhesive 400, the yield of the PMOLED encapsulation structure is improved and the cost of the PMOLED encapsulation structure is reduced, thereby improving the yield of the display device including the PMOLED encapsulation structure and reducing the cost of the display device.

[0042] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A PMOLED encapsulation structure, characterized in that, include: A substrate (100) and a package cover (200) are provided, wherein the substrate (100) has a first pressing area (110) and the package cover (200) has a second pressing area (210), and the first pressing area (110) and the second pressing area (210) are correspondingly provided; Two isolation members (300) are disposed between the first pressing area (110) and the second pressing area (210). The isolation members (300) are made of negative photoresist. The cross-section of the isolation members (300) is trapezoidal. The large end face of the isolation members (300) faces the second pressing area (210), and the small end face of the isolation members (300) faces the first pressing area (110). An encapsulating adhesive (400) is disposed between the two spacers (300) for bonding the first pressing area (110) and the second pressing area (210) so that the substrate (100) and the encapsulation cover (200) form an accommodating space. A PMOLED light-emitting layer (500) is disposed in the accommodating space.

2. The PMOLED packaging structure according to claim 1, characterized in that, The height of the isolation element (300) is 5μm-10μm.

3. The PMOLED packaging structure according to claim 1, characterized in that, The cross-section of the isolation element (300) is an isosceles trapezoid.

4. The PMOLED packaging structure according to claim 3, characterized in that, The width of the spacer (300) at the midline of the isosceles trapezoid is 15μm-30μm.

5. The PMOLED packaging structure according to claim 1, characterized in that, The distance between the two spacers (300) at the midline of the isosceles trapezoid is greater than or equal to 0.7 mm.

6. The PMOLED packaging structure according to claim 1, characterized in that, The spacing between the spacer (300) near the PMOLED light-emitting layer (500) and the PMOLED light-emitting layer (500) at the midline of the isosceles trapezoid is greater than or equal to 0.5 mm.

7. The PMOLED packaging structure according to claim 1, characterized in that, The encapsulating adhesive (400) is a UV adhesive.

8. The PMOLED encapsulation structure according to any one of claims 1-7, characterized in that, Both the substrate (100) and the encapsulation cover (200) are made of glass.

9. A display device, characterized in that, Includes the PMOLED encapsulation structure as described in any one of claims 1-8.

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