Silicon wafer separation device and silicon wafer extraction equipment
By setting up placement tanks and water spray heads in the silicon wafer separation device, uniform force separation of silicon wafers is achieved, solving the problems of silicon wafer damage and breakage in traditional methods, and improving separation efficiency and quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TIANJIN AIKO SOLAR ENERGY TECH CO LTD
- Filing Date
- 2025-04-30
- Publication Date
- 2026-05-05
AI Technical Summary
Traditional silicon wafer separation methods are prone to causing damage and breakage of silicon wafers, affecting quality and increasing costs.
A silicon wafer separation device is designed, which adopts a placement tank and a water spray head structure. The water spray head is provided with a water flow channel on the side plate of the placement tank. The water sprayed by the water spray head acts evenly on both sides of the silicon wafer through the water flow channel to ensure uniform force distribution.
This avoids damage to silicon wafers due to excessive local stress during the separation process, improving separation efficiency and quality, and reducing material waste.
Smart Images
Figure CN224205576U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of photovoltaic manufacturing technology, and in particular relates to a silicon wafer separation device and a silicon wafer extraction equipment. Background Technology
[0002] During the production and processing of silicon wafers, multiple wafers often stick together. Traditional wafer separation methods can damage the wafers. For example, mechanical separation can easily cause defects such as cracks and scratches, affecting the quality and performance of the wafers. Moreover, uneven force applied during separation can lead to wafer breakage, resulting in material waste and increased costs. Therefore, a separation device that can apply force evenly without damaging the wafers is needed. Utility Model Content
[0003] This invention provides a silicon wafer separation device and a silicon wafer extraction equipment, aiming to solve the problem of silicon wafers being easily broken and damaged during the silicon wafer separation process.
[0004] This invention is implemented as follows: a silicon wafer separation device includes: a placement tank and a water spray head;
[0005] The placement trough includes a bottom plate, a left side plate, a right side plate, and a back plate. The left side plate, the back plate, and the right side plate are connected in sequence to form a "U" shape and are placed on the bottom plate. At least two water flow channels extending vertically are respectively provided on the left side plate and the right side plate.
[0006] The spray nozzles are respectively located on the outer side of the left side plate and the right side plate, corresponding to the water flow channel, and are used to spray water into the placement channel.
[0007] Optionally, three vertically extending water channels are provided on the left side plate and the right side plate respectively.
[0008] Optionally, the distance between the three water channels is equal.
[0009] Optionally, the spray head is provided with at least two spray holes, and the number and position of the spray holes correspond to the number and position of the water flow channels.
[0010] Optionally, the diameter of the water spray hole is 5mm to 10mm.
[0011] Optionally, the water spray pressure of the spray head is 0.05MPa~0.1MPa.
[0012] Optionally, it also includes a lifting platform, on which the placement slot is disposed.
[0013] Optionally, it also includes a immersion tank, in which the placement tank is placed.
[0014] This utility model also provides a silicon wafer extraction device, including a picking device and the aforementioned silicon wafer separation device.
[0015] The beneficial effects achieved by this invention are as follows: A placement groove is provided for placing silicon wafers. At least two water flow channels are provided on the left and right sides of the placement groove. Water spray heads are respectively located on the outer sides of the left and right sides of the left and right sides, corresponding to the water flow channels, for spraying water into the placement groove. The water sprayed from the spray heads acts evenly on both sides of the silicon wafer through the water flow channels. This uniform water flow distribution ensures that the forces acting on different parts of the silicon wafer are more balanced during separation, avoiding damage to the silicon wafer due to excessive localized stress. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the silicon wafer separation device provided by this utility model.
[0017] Explanation of reference numerals in the attached figures:
[0018] 100. Silicon wafer separation device; 110. Placement tank; 111. Base plate; 112. Left side plate; 113. Right side plate; 114. Back plate; 115. Water flow tank; 120. Spray head. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.
[0020] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0024] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0025] This invention uses a placement groove to hold silicon wafers. At least two water flow channels are provided on the left and right sides of the placement groove. Water spray heads are respectively positioned on the outer sides of the left and right sides of the left and right sides, corresponding to the water flow channels, for spraying water into the placement groove. The water sprayed from the spray heads acts evenly on both sides of the silicon wafer through the water flow channels. This uniform water distribution ensures that the forces acting on different parts of the silicon wafer are relatively balanced during separation, avoiding damage to the silicon wafer due to excessive localized stress.
[0026] Example 1
[0027] like Figure 1 As shown, this embodiment provides a silicon wafer separation device 100, including: a placement tank 110 and a water spray head 120;
[0028] The placement trough 110 includes a base plate 111, a left side plate 112, a right side plate 113 and a back plate 114. The left side plate 112, the back plate 114 and the right side plate 113 are connected in sequence to form a "U" shape and are placed on the base plate 111. At least two water flow channels 115 extending vertically are respectively provided on the left side plate 112 and the right side plate 113.
[0029] Water spray heads 120 are respectively installed on the outside of the left side plate 112 and the right side plate 113, corresponding to the water flow channel 115, and are used to spray water into the placement channel 110.
[0030] The placement slot 110 consists of a base plate 111, a left side plate 112, a right side plate 113, and a back plate 114. The base plate 111 is placed at the bottom and serves as a support plate for placing silicon wafers. The left side plate 112, back plate 114, and right side plate 113 are connected in sequence to form a U-shaped structure, which is placed on the base plate 111. The U-shaped structure is a structure with three walls and one open side. The enclosed space is adapted to the size of the silicon wafer. The three enclosed sides provide restraint for the silicon wafer, and the open side facilitates the placement of the silicon wafer.
[0031] At least two vertically extending water channels 115 are respectively provided on the left side plate 112 and the right side plate 113. The water channels 115 are through channels, penetrating the left side plate 112 and the right side plate 113 along the thickness direction. Water spray heads 120 are respectively provided on the outer side of the left side plate 112 and the right side plate 113, and are correspondingly arranged with respect to the water channels 115. The water sprayed from the water spray heads 120 passes through the water channels 115 and is sprayed into the placement tank 110. The separation of silicon wafers is achieved by the impact force generated by the water spray.
[0032] The water flow channel 115 extends vertically, and the water spray head 120 can be displaced relative to the placement channel 110 in the vertical direction. That is, the water spray head 120 can be displaced relative to the extension direction of the water flow channel 115, which makes it easier for the water spray head 120 to spray water on silicon wafers at various height positions.
[0033] Because multiple vertically extending water channels 115 are provided on the left side plate 112 and the right side plate 113, the water sprayed from the spray head 120 acts evenly on both sides of the silicon wafer through the water channels 115. This uniform water flow distribution ensures that the forces acting on various parts of the silicon wafer are relatively balanced during the separation process, avoiding damage to the silicon wafer due to excessive local stress.
[0034] In this embodiment, a placement groove 110 is used to place silicon wafers. At least two water flow channels 115 are provided on the left side plate 112 and right side plate 113 of the placement groove 110. Water spray heads 120 are respectively located on the outer sides of the left side plate 112 and right side plate 113, corresponding to the water flow channels 115, and are used to spray water into the placement groove 110. The water sprayed from the water spray heads 120 acts evenly on both sides of the silicon wafer through the water flow channels 115. This uniform water flow distribution ensures that the forces acting on different parts of the silicon wafer are relatively balanced during separation, avoiding damage to the silicon wafer due to excessive localized force.
[0035] Example 2
[0036] In some embodiments, three water channels 115 extending vertically are respectively provided on the left side plate 112 and the right side plate 113.
[0037] The layout of the three water flow channels 115 allows for the application of water flow to the two side edges and the middle section of the silicon wafer. During the silicon wafer separation process, the two side edges and the middle section are critical areas where the silicon wafer structure is subjected to stress. Traditional separation methods often struggle to simultaneously address the stress conditions at these different locations, easily leading to localized excessive or insufficient stress. However, this device, by simultaneously discharging water from the three water flow channels 115, can precisely apply force to the two side edges and the middle section of the silicon wafer, ensuring that the entire silicon wafer receives a uniform water flow impact.
[0038] This multi-position water flow impact method can also effectively eliminate potential stress dead zones on the silicon wafer surface. Between actually bonded silicon wafers, there may be tiny gaps or areas with varying bonding strength. Relying solely on water flow impact at a single location may not be sufficient to completely break down these bonding points, leading to incomplete wafer separation or damage during the separation process due to uneven local stress. The design of three water flow channels ensures that all parts of the silicon wafer surface are affected by the water flow, achieving omnidirectional and uniform stress, significantly improving the success rate of silicon wafer separation.
[0039] In this embodiment, three vertically extending water channels 115 are respectively provided on the left side plate 112 and the right side plate 113. By achieving the beneficial effects of uniform force on the silicon wafer in all directions, avoiding damage to the silicon wafer, and improving separation efficiency and quality, it brings significant improvement to silicon wafer separation technology and has extremely high practical value and promotion significance.
[0040] In some embodiments, the distance between the three water channels 115 is equal.
[0041] The equal spacing between the three water channels 115 ensures a more precise and uniform distribution of water force on the silicon wafer surface. From a mechanical perspective, the equidistant spacing of the water channels 115 ensures that the two sides, the middle, and the area between these three parts of the silicon wafer all receive water flow impacts of similar intensity. For example, when the spray head 120 sprays water into the water channels 115, the magnitude and direction of the force exerted on the silicon wafer by each stream are highly consistent, avoiding situations where some areas experience excessive or insufficient force due to uneven spacing of the water channels 115. This extremely uniform force allows the silicon wafer to remain stable during separation, reducing internal stress caused by uneven force, thereby minimizing the risk of damage such as cracks and breakage of the silicon wafer.
[0042] In this embodiment, the design of equal distances between the three water flow channels 115 achieves beneficial effects such as extreme uniformity of force on the silicon wafer, enhanced stability and repeatability of the separation effect, and optimized water flow dynamics characteristics, thereby further improving the performance and reliability of the silicon wafer separation device 100.
[0043] Example 3
[0044] In some embodiments, the spray head 120 is provided with at least two spray holes, the number and position of which correspond to the number and position of the water flow channels 115.
[0045] The spray head 120 is provided with at least two spray holes, and the number and position of the spray holes correspond to the number and position of the water flow channels 115. For example, when three vertically extending water flow channels 115 are provided on the left side plate 112 and the right side plate 113 respectively, the spray head 120 is provided with three spray holes, each spray hole facing one water flow channel 115. The spray head 120 is installed on the outside of the left side plate 112 and the right side plate 113, and is connected to a water source through a pipe. When the water source is turned on, water is sprayed out from the spray holes and accurately enters the corresponding water flow channel 115.
[0046] The number and position of the water spray holes correspond to those of the water flow channels 115, ensuring that water is accurately sprayed into the channels 115. This prevents water from being sprayed outside the placement tank 110, thus avoiding water waste, and ensures that the water flow acts on the silicon wafer surface with maximum efficiency, improving the silicon wafer separation effect. Understandably, the width of the water flow channels 115 is larger than the diameter of the water spray holes to avoid obstructing the water flow.
[0047] Multiple water jets spraying simultaneously apply water flow force to different locations on the silicon wafer, resulting in more uniform stress distribution during separation. Compared to a single water jet design, multiple jets cover a larger area, reducing blind spots on the wafer surface and further mitigating the risk of wafer damage. Simultaneous water supply to the water flow channel 115 through multiple jets increases the total water flow and pressure acting on the silicon wafer, thereby accelerating wafer separation and improving production efficiency.
[0048] Example 4
[0049] In some embodiments, the diameter of the spray nozzle is 5mm to 10mm.
[0050] A 5mm-10mm orifice diameter ensures that the water jet from the 120mm nozzle has appropriate intensity. If the orifice diameter is too small, the water pressure will be too high, but the flow rate may be insufficient, resulting in an overly concentrated water force on the silicon wafer, which can easily damage it. If the orifice diameter is too large, the water pressure will be too low, failing to generate sufficient impact force to separate the silicon wafer. This orifice diameter range balances the water pressure and flow rate, ensuring that the water jet has sufficient impact force to separate the silicon wafer without causing excessive damage.
[0051] Different degrees of silicon wafer adhesion may require water flow of varying intensities for separation. The 5mm-10mm aperture range provides flexibility, allowing for the selection of an appropriate aperture to suit different degrees of silicon wafer adhesion and separation requirements.
[0052] Example 5
[0053] In some embodiments, the water spray pressure of the spray head 120 is 0.05MPa to 0.1MPa.
[0054] In the actual operation of the silicon wafer separation device 100, the spray pressure of the spray head 120 is set within the range of 0.05MPa - 0.1MPa. For example, when encountering silicon wafers with light adhesion, the spray pressure can be set to 0.05MPa; while for silicon wafers with heavy adhesion, the spray pressure is adjusted to 0.1MPa. Specifically, a pressure valve can be installed on the spray head 120, and the spray pressure can be controlled by adjusting the valve opening, so that water is sprayed from the spray head 120 at the set pressure. Alternatively, the spray pressure can be achieved by adjusting the power of the water pump connected to the spray pipe.
[0055] Example 6
[0056] In some embodiments, the silicon wafer separation device 100 further includes a lifting platform, and a placement slot 110 is disposed on the lifting platform.
[0057] The silicon wafer separation device 100 also includes a lifting platform, on which the placement slot 110 is mounted. The lifting platform can achieve its lifting function through electric, hydraulic, or pneumatic means. For example, using an electric lifting platform, a motor drives a lead screw to rotate, thereby moving the placement slot 110 up and down.
[0058] The lifting platform plays a crucial role in adjusting the height of the placement slot 110. Its lifting process is intermittent, with each lift maintaining a consistent distance. For example, the lifting distance is set to 0.1 cm per lift, which matches the diameter of the water spray nozzles to ensure uniform impact on the silicon wafers within that area. After each lift, the platform holds the newly reached height for a certain period, such as 30 seconds. During these 30 seconds, the water spray pipes activate, spraying water onto several silicon wafers placed on the top layer, using the impact force of the water flow to separate the wafers. Once the silicon wafers are completely removed within the preset time (30 seconds), the lifting platform will lift again by the same distance (0.1 cm), and this cycle repeats.
[0059] The intermittent lifting and pausing design allows sufficient time for the water spray pipes to separate the top-layer silicon wafers. During this pause, the water flow acts continuously and stably on the wafers, effectively breaking down the adhesion between them. If the lifting platform continues to rise, the water flow time on the wafers will be too short, potentially leading to incomplete separation and some wafers remaining stuck together, affecting subsequent production processes.
[0060] The consistent lifting distance ensures uniformity in the relative position and operating conditions between the water spray pipe and the top silicon wafer. This allows each batch of silicon wafers to be subjected to water flow impact under similar conditions, improving the stability and reliability of the silicon wafer separation effect and reducing differences in separation quality caused by inconsistent operating conditions.
[0061] Example 7
[0062] In some embodiments, a water immersion tank is also included, in which the placement tank 110 is placed.
[0063] The immersion tank is filled with liquid, which can be water or other reagents, and is not limited here. When the placement tank 110 is placed in the immersion tank, the silicon wafer placed in the placement tank 110 is submerged in the liquid.
[0064] On the one hand, the liquid acts as a lubricant between the silicon wafers, significantly reducing the friction between their contact surfaces. When the wafers are stuck together, the lower friction makes it easier for the water flow to slide and separate them. Compared to separation in a dry environment, separating silicon wafers in a liquid requires less water impact force, thus reducing the risk of damage to the wafers due to excessive impact.
[0065] On the other hand, liquids have fluidity, and when water is sprayed onto silicon wafers, the water flow spreads and diffuses over a wider area within the liquid. The water flow not only directly impacts the silicon wafer surface but also, through the conduction of the liquid, transmits the impact force to various parts of the wafer, including gaps and corners that are difficult to reach directly. This helps to more comprehensively and thoroughly separate adhered silicon wafers, improving the integrity of the separation effect.
[0066] Example 8
[0067] This embodiment provides a silicon wafer extraction device, including a picking device and the aforementioned silicon wafer separation device 100.
[0068] The picking device is used to pick up the separated silicon wafers and move them to a preset position. Specifically, the picking device can be a robotic arm, programmed with a set motion trajectory and actions. When the lifting platform in the silicon wafer separation device 100 rises to a designated height and stops, and the water spray pipe completes the water separation of the top layer of silicon wafers, the robotic arm extends according to the preset program. Its end gripper or suction cup precisely grasps the separated silicon wafers and then transports them to a designated collection area. The picking device can also be a slide rail assembly arranged above the silicon wafer separation device 100. After the silicon wafers are separated, the slider on the slide rail moves the gripping component above the silicon wafers. The gripping component descends to grasp the silicon wafers, and then the movement of the slider on the slide rail transports the silicon wafers away. The picking device can also be other common picking structures, which are not limited here.
[0069] The beneficial effects of the silicon wafer extraction device in this embodiment are similar to those of the silicon wafer separation device 100, and will not be described in detail here.
[0070] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A silicon wafer separation device, characterized in that, include: Placement tank and spray head; The placement trough includes a bottom plate, a left side plate, a right side plate, and a back plate. The left side plate, the back plate, and the right side plate are connected in sequence to form a "U" shape and are placed on the bottom plate. At least two water flow channels extending vertically are respectively provided on the left side plate and the right side plate. The spray nozzles are respectively located on the outer side of the left side plate and the right side plate, corresponding to the water flow channel, and are used to spray water into the placement channel.
2. The silicon wafer separation device as described in claim 1, characterized in that, Three water channels extending vertically are respectively provided on the left side plate and the right side plate.
3. The silicon wafer separation device as described in claim 1, characterized in that, The distances between the three water channels are equal.
4. The silicon wafer separation apparatus as described in claim 1, characterized in that, The spray head is provided with at least two spray holes, and the number and position of the spray holes correspond to the number and position of the water flow channels.
5. The silicon wafer separation apparatus as described in claim 4, characterized in that, The diameter of the water spray hole is 5mm~10mm.
6. The silicon wafer separation apparatus as described in claim 1, characterized in that, The water pressure of the spray head is 0.05MPa~0.1MPa.
7. The silicon wafer separation apparatus as described in claim 1, characterized in that, It also includes a lifting platform, on which the placement slot is disposed.
8. The silicon wafer separation apparatus as described in claim 1, characterized in that, It also includes a immersion tank, in which the placement tank is placed.
9. A silicon wafer extraction device, characterized in that, Includes a pickup device and a silicon wafer separation device as described in any one of claims 1-8.