Die pressing mechanism, upper die jig and pressing equipment

Abstract

The utility model relates to a pressing die mechanism, an upper die jig and pressing equipment. The mold pressing mechanism is provided with a sleeving assembly, a mold pressing assembly, a lower fixing piece and a temperature sensing piece. The sleeve connection assembly is provided with a shaft rod and a lining arranged on the shaft rod in a sleeved mode. The shaft rod is provided with a through hole. The pressing die assembly is arranged at the bottom end of the shaft rod and provided with a pressing seat. The lower fixing piece is provided with a first channel communicated with the through hole. The pressing seat is fixed in the through hole through the lower fixing piece. The first channel is used for the temperature sensing member to pass through. The upper die jig is provided with at least one die pressing mechanism and an upper die base. The pressing equipment is provided with the upper die jig and a lower die jig which is matched with the upper die jig to press at least one pressed object. According to the utility model, by means of the design of the sleeving assembly, the pressing die mechanism can press the at least one pressed object downwards in a straight line.

Description

Technical Field

[0001] This utility model relates to a device suitable for chip packaging processes, and in particular to a molding mechanism, an upper mold fixture, and a pressing device. Background Technology

[0002] Known lamination equipment for chip packaging processes includes a lower mold fixture for arranging a plurality of pressable materials in a matrix, and an upper mold fixture that can be driven to move up and down to cooperate with the lower mold fixture to press the pressable materials. Each pressable material has a rectangular horizontal cross-section, and from bottom to top, consists of a substrate, a die, a thermal interface material, and a heat sink. The upper mold fixture has the same number of molding units as the pressable materials. These molding units correspond vertically to the pressable materials. Ideally, the molding units should press the pressable materials vertically downwards in a straight line to achieve good lamination quality and good packaging quality in subsequent processes. Examples of such molding units include those disclosed in Taiwan Patent No. I804790.

[0003] The molding unit in Patent No. I804790 places a molding die at the bottom of a pressure rod and uses a temperature sensor that passes through the pressure rod and is inserted into the center of the molding die to sense the temperature of the object being pressed. This design requires that the fixing member that secures the molding die to the pressure rod be placed around the temperature sensor, avoiding its position. Since the size of the molding die changes according to the size of the object being pressed, a smaller molding die is required when pressing miniaturized objects. However, the space provided by the smaller molding die is insufficient to allow the fixing member to be placed around the temperature sensor, which still needs improvement. Utility Model Content

[0004] Therefore, one object of this utility model is to provide a molding mechanism, upper mold fixture and pressing equipment that can overcome at least one disadvantage of the prior art.

[0005] The molding mechanism includes a sleeve assembly, a molding assembly, a lower fixing member, and a temperature sensing element. The sleeve assembly includes a shaft and a bushing fitted onto the shaft. The shaft has a through hole extending vertically. The bushing has a shaft hole through which the shaft passes. The molding assembly is located at the bottom end of the shaft and includes a pressure seat. The lower fixing member has a first channel communicating with the through hole. The pressure seat is fixed to the through hole by the lower fixing member. The temperature sensing element passes through the first channel.

[0006] The upper mold fixture includes at least one pressing mechanism and an upper mold base. The upper mold base has the same number of mounting areas as the at least one pressing mechanism, for mounting the at least one pressing mechanism. The at least one pressing mechanism is engaged in the mounting area by the bushing. The shaft can be driven to cause the pressing assembly to move linearly up and down relative to the upper mold base.

[0007] The pressing equipment includes an upper mold fixture and a lower mold fixture that cooperates with the upper mold fixture to press at least one object to be pressed.

[0008] The beneficial effects of this invention are as follows: it integrates the first channel through which the temperature sensing element passes with the lower fixing member used to fix the pressure seat to the shaft. Besides structural optimization, it also simplifies the structure. Furthermore, since the upper mold fixture of the pressing device is provided with at least one pressing mechanism, the upper mold fixture can cooperate with the lower mold fixture to press the object corresponding to the at least one pressing mechanism, thereby achieving the purpose of the pressing device. Attached Figure Description

[0009] Other features and beneficial effects of this utility model will be clearly presented in the embodiments with reference to the drawings, wherein:

[0010] Figure 1 This is a perspective view of a molding mechanism, which is an embodiment of the molding mechanism, upper mold fixture, and pressing equipment of this utility model.

[0011] Figure 2 This is an exploded perspective view of the molding mechanism in this embodiment;

[0012] Figure 3 The molding mechanism of this embodiment is along Figure 1 A sectional view taken by line Ⅲ-Ⅲ in the diagram;

[0013] Figure 4 The molding mechanism of this embodiment is along Figure 1 A cross-sectional view taken by line IV-IV in the diagram;

[0014] Figure 5 A set of components of the molding mechanism in this embodiment is along Figure 3 A cross-sectional view taken by the VV line in the diagram;

[0015] Figure 6 This is a perspective view of a pressing device according to this embodiment;

[0016] Figure 7 This is a front view of the pressing device in this embodiment;

[0017] Figure 8 This is a partial exploded perspective view of an upper mold fixture according to this embodiment;

[0018] Figure 9 This is a partial exploded perspective view of the upper mold fixture in this embodiment;

[0019] Figure 10 This is an incomplete top view of the upper mold fixture in this embodiment;

[0020] Figure 11 This is an incomplete perspective view of a guide frame of the upper mold fixture in this embodiment;

[0021] Figure 12 A cross-sectional view of a jig drive member of the pressing device in this embodiment drives the upper mold jig downward so that one of the pressing mechanisms presses against a press object; and

[0022] Figure 13 In this embodiment, a mold drive component of the pressing device drives the corresponding mold mechanism to press the object downward.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1: Socket component

[0025] 11: Shaft

[0026] 110: Through hole

[0027] 111: Groove

[0028] 12: Bushing

[0029] 120: Shaft hole

[0030] 121: Second side

[0031] 122: Second Axis

[0032] 13: Sealing ring

[0033] 2: Compression molding assembly

[0034] 21: Pressure seat

[0035] 210: Lower fixing hole

[0036] 22: Thermal insulation components

[0037] 220: Second channel

[0038] 23: Press mold

[0039] 230: Third Channel

[0040] 3: Lower fixing component

[0041] 30: First Channel

[0042] 4: Temperature sensing element

[0043] 5: Pressure sensing component

[0044] 51: Seating

[0045] 510: Opening

[0046] 511: Loading section

[0047] 512: Socket part

[0048] 513: First side

[0049] 514: First Axis

[0050] 52: Pressure sensing component

[0051] 6: Upper fastener

[0052] 7: Pads

[0053] 70: carving

[0054] 8: Upper mold base

[0055] 81: Settings Area

[0056] 82: Conductor frame

[0057] 821: Sidewall

[0058] 822: Bottom wall

[0059] 823: Cable Tray

[0060] 824: Wire Hole

[0061] 9: Lower mold fixture

[0062] 91: Lower mold

[0063] A0: Pressurized object

[0064] B0: Compression molding drive component

[0065] C0: Fixture driver

[0066] D0: Gap

[0067] O1: Compression molding mechanism

[0068] O2: Upper mold fixture

[0069] O3: Pressing equipment. Detailed Implementation

[0070] See Figure 1 , Figure 2 and Figure 3 This utility model relates to a molding mechanism O1, an upper mold fixture O2, and a pressing device O3 (auxiliary reference). Figure 6In one embodiment, the molding mechanism O1 includes a sleeve assembly 1, a molding assembly 2 disposed at the bottom of the sleeve assembly 1, a lower fixing member 3 connecting the sleeve assembly 1 and the molding assembly 2, a temperature sensing member 4 passing through the top of the sleeve assembly 1, the sleeve assembly 1 and the molding assembly 2 to the bottom of the molding assembly 2, a pressure sensing member 5 disposed at the top of the sleeve assembly 1, an upper fixing member 6 connecting the sleeve assembly 1 and the pressure sensing member 5, and a pad 7 sandwiched between the sleeve assembly 1 and the pressure sensing member 5.

[0071] See Figure 3 , Figure 4 and Figure 5 The sleeve assembly 1 includes a shaft 11, a bushing 12 sleeved on the shaft 11, and two sealing rings 13 respectively disposed on the top and bottom sides of the bushing 12 adjacent to the shaft 11. The shaft 11 has a through hole 110 and a groove 111 located at the top end and communicating with the through hole 110 (auxiliary reference). Figure 2 The shaft 11 can move vertically up and down relative to the bushing 12. The bushing 12 has a shaft hole 120 for the shaft 11 to pass through. The shaft 11 is splined to the bushing 12.

[0072] See Figure 2 , Figure 3 and Figure 4 The molding assembly 2 is detachably mounted on the bottom end of the shaft 11. The molding assembly 2 includes a pressure seat 21 detachably fixed to the bottom end of the through hole 110 by the lower fixing member 3, a heat insulation member 22 connected to the bottom end of the pressure seat 21, and a pressure object A0 (auxiliary reference) connected to the bottom end of the heat insulation member 22 and capable of pressing against it. Figure 12 A pressure mold 23 is provided. The central portion of the pressure base 21 has a lower fixing hole 210 for the lower fixing member 3 to pass through. The pressure mold 23 is made of non-metallic material and has pressure resistance and high temperature resistance. The object being pressed, A0, can be an assembly formed after the heat sink process in semiconductor manufacturing, and the assembly can be, from bottom to top, a substrate, a die, a thermal interface material, and a heat sink, but the object being pressed, A0, is not limited to these. The pressure base 21, the heat insulation member 22, and the pressure mold 23 can be assembled together using screws not shown in the figure.

[0073] The lower fixing member 3 has a first channel 30 communicating with the through hole 110. The first channel 30 allows the temperature sensing element 4 to pass through. The central portion of the heat insulation member 22 has a second channel 220 communicating with the first channel 30. The central portion of the mold 23 has a third channel 230 communicating with the second channel 220. The shaft hole 120, the through hole 110, the first channel 30, the second channel 220, and the third channel 230 are coaxial.

[0074] The temperature sensing element 4 is linear. The temperature sensing element 4 passes through the groove 111 from the outside of the shaft 11, and sequentially passes through the through hole 110, the first channel 30, the second channel 220 and the third channel 230 to the bottom end of the mold 23.

[0075] The pressure sensing component 5 is connected to the top end of the shaft 11 and has a seat 51 connected to the shaft 11, and a pressure sensing element 52 mounted on the top of the seat 51. The seat 51 has a supporting portion 511 for supporting the pressure sensing element 52 and a sleeve portion 512 that fits onto the shaft 11. The width of the supporting portion 511 is larger than the width of the sleeve portion 512. The sleeve portion 512 is fixed to the top end of the through hole 110 by the upper fixing member 6. The sleeve portion 512 has a slit 510 corresponding to the groove 111, so when the sleeve portion 512 is fitted onto the top end of the shaft 11, it will not obstruct the groove 111 (auxiliary reference). Figure 1 ).

[0076] It should be noted that the base 51 has two parallel first sides 513, and the bushing 12 has two parallel second sides 121. The projections of a first axis 514 passing through the first side 513 and a second axis 122 passing through the second side 121 on the horizontal plane are not parallel. In this embodiment, the projections of the first axis 514 and the second axis 122 on the horizontal plane intersect at a 45-degree angle.

[0077] The pad 7 is disposed between the seat 51 and the bushing 12, and has a cutout 70 for the shaft 11 to pass through.

[0078] See Figure 6 , Figure 7 and Figure 8 The upper mold fixture O2 is provided with fifty pressing mechanisms O1 as described above, an upper mold base 8 supporting the pressing mechanisms O1, and fifty pressing drive members B0 located above the pressing mechanisms O1 for driving the pressing mechanisms O1 to move downward. The pressing drive member B0 is, for example, but not limited to, a pneumatic cylinder drive member.

[0079] See Figure 8 , Figure 9 and Figure 10 The upper mold base 8 has fifty setting areas 81 for the molding mechanism O1, and eleven guide rails 82 arranged in pairs on both sides of five of the setting areas 81 in a row. The five setting areas 81 are located in a row between any two adjacent guide rails 82. Each setting area 81 is a circular hole that passes through the upper mold base 8.

[0080] The five molding mechanisms O1 are arranged in a straight line between any two adjacent guide frames 82. Each molding mechanism O1 is secured by a bushing 12 between its respective mounting area 81 and the guide frames 82 located on both sides. The heights of the seats 51 of each pair of adjacent molding mechanisms O1 extending upwards from their respective bushings 12 are different. Therefore, the molding mechanisms O1 can be arranged closely on the upper mold base 8 with staggered heights, allowing more molding mechanisms O1 to be installed within the limited space of the upper mold base 8, thereby minimizing the size of the upper mold base 8. Viewed from a top viewpoint (auxiliary reference) Figure 10 The mounting portion 511 of the pressure sensing component 5 of any two adjacent molding mechanisms O1 overlaps with each other.

[0081] See Figure 2 , Figure 8 and Figure 9 In this embodiment, the steps for installing the molding mechanism O1 onto the upper mold base 8 are as follows: First, the bottom of the bushing 12 of each molding mechanism O1 is placed into the corresponding setting area 81, and the top of the bushing 12 is engaged with the top surface of the setting area 81. Therefore, the top of the shaft 11 is exposed above the upper mold base 8, and the bottom of the shaft 11 is exposed below the upper mold base 8. Second, the molding component 2 of each molding mechanism O1 is fixed to the shaft 11 from the bottom to the top of the upper mold base 8. Third, after the bushing component 1 and the molding component 2 of the molding mechanism O1 are installed, the wire frame 82 is set. Finally, the pad 7 and the pressure sensing component 5 of each molding mechanism O1 are sequentially set onto the bushing component 1 from above the upper mold base 8. It should be noted that in other embodiments, the method of installing the molding mechanism O1 onto the upper mold base 8 is not limited to this and can be varied according to actual needs (e.g., different sizes of the setting area 81, the bushing 12, and the molding assembly 2).

[0082] See Figure 9 , Figure 10 and Figure 11 Each wire frame 82 has two spaced-apart sidewalls 821 and a bottom wall 822 connecting the bottom of the sidewalls 821. The sidewalls 821 and the bottom wall 822 cooperate to define a wire groove 823. The wire groove 823 allows the wires of the temperature sensing element 4 and the pressure sensing element 52 to be placed therein, so that the wires are constrained in the wire groove and do not become too messy. Each sidewall 821 has a plurality of wire holes 824. The wires of the temperature sensing element 4 and the pressure sensing element 52 can pass through the wire holes 824 and be pulled out along the corresponding wire groove 823 towards the upper mold fixture O2.

[0083] See Figure 6 , Figure 7 and Figure 12 The pressing device O3 includes an upper mold fixture O2, a lower mold fixture 9 cooperating with the upper mold fixture O2 to press the same number of the objects A0 as the pressing mechanism O1, and a fixture drive C0 for driving the upper mold fixture O2 downward so that the pressing mechanism O1 can press down on the objects A0. The pressing device O3 can be used after the heat sink installation process in semiconductor manufacturing, but is not limited thereto. The lower mold fixture 9 has the same number of lower molds 91 as the pressing mechanism O1. Each lower mold 91 is used to mount a different object A0. The fixture drive C0 is, for example, but not limited to, a pneumatic cylinder drive.

[0084] See Figure 6 , Figure 12 and Figure 13 When the pressing device O3 is to perform the pressing operation on the object A0, firstly, the fixture drive C0 drives the upper mold fixture O2 to move downwards towards the lower mold fixture 9 until the pressing mold 23 of each pressing mechanism O1 presses against the top surface of the corresponding object A0. Since the bushing 12 of each pressing mechanism O1 is fixed to the upper mold base 8, and the shaft 11 can move up and down relative to the bushing 12, the shaft 11 can be driven to move the pressing assembly 2 linearly up and down relative to the upper mold base 8. When the pressing mold 23 presses against the top surface of the corresponding object A0, the shaft 11 will move slightly upwards relative to the upper mold base 8, creating a gap D0 between the pressure sensing component 5 and the pad 7. At this time, the pressure driving component B0 corresponding to each pressure molding mechanism O1 is driven to move downward to push the pressure sensing component 5 downward and push the shaft 11 downward to eliminate the gap D0, and then drive the pressure molding component 2 to press the object A0 downward to complete the pressing operation of the pressing device O3.

[0085] During the pressing process of the object A0, the upper mold fixture O2 and / or the lower mold fixture 9 can apply heat to the object A0. Since the bottom of the mold 23 can contact the object A0, the molding mechanism O1 is designed to be equipped with the temperature sensor 4 to monitor the real-time temperature of the object A0, so that the heat applied to the object A0 can be adjusted according to the sensed temperature.

[0086] In summary, the pressing mechanism O1, upper mold fixture O2, and pressing device O3 of this utility model integrate the first channel 30 through which the temperature sensing element 4 passes with the lower fixing member 3 used to fix the pressing seat 21 to the shaft 11. Besides structural optimization, it also features a simplified structure. Furthermore, since the upper mold fixture O2 of the pressing device O3 is provided with at least one pressing mechanism O1, the upper mold fixture O2 can cooperate with the lower mold fixture 9 to press the object A0 corresponding to the at least one pressing mechanism O1, thus achieving the purpose of the pressing device O3.

[0087] However, the above description is merely an embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Any simple equivalent changes and modifications made in accordance with the claims and patent specification of this utility model shall still fall within the scope of this utility model patent.

Claims

1. A molding mechanism, characterized in that, include: A connecting assembly includes a shaft and a bushing fitted onto the shaft. The shaft has a through hole extending vertically, and the bushing has a shaft hole through which the shaft passes. A molding assembly is located at the bottom end of the shaft and is provided with a pressing seat; The following fastener has a first channel communicating with the through hole; and A temperature sensing element; The pressure seat is fixed to the through hole by the lower fixing member, and the first channel is through which the temperature sensing element passes.

2. The molding mechanism as described in claim 1, characterized in that, The molding assembly is detachably disposed at the bottom end of the shaft. The molding assembly also includes a heat insulation member disposed on the pressure base and a molding die disposed on the heat insulation member. The pressure base has a lower fixing hole for the lower fixing member to pass through. The heat insulation member has a second channel communicating with the first channel. The molding die has a third channel communicating with the second channel.

3. The molding mechanism as described in claim 2, characterized in that, The shaft hole, the through hole, the first channel, the second channel, and the third channel are coaxial.

4. The molding mechanism as described in claim 3, characterized in that, The temperature sensing element passes through the through hole, the first channel, the second channel, and the third channel to the mold.

5. The molding mechanism as described in claim 1, characterized in that, The top of the shaft is also provided with a groove communicating with the through hole, and the temperature sensing element passes through the groove from the outside of the shaft.

6. The molding mechanism as described in claim 1, characterized in that, Also includes: A pressure sensing component is located at the top of the shaft.

7. The molding mechanism as described in claim 6, characterized in that, The pressure sensing component includes a base and a pressure sensing element disposed on the top of the base.

8. The molding mechanism as described in claim 7, characterized in that, The mounting base has a mounting portion for supporting the pressure sensing element and a sleeve portion that is fitted onto the shaft. The width of the mounting portion is larger than the width of the sleeve portion.

9. The molding mechanism as described in claim 7, characterized in that, Also includes: An upper fixing member is used to fix the seat to the through hole.

10. The molding mechanism as described in claim 7, characterized in that, Also includes: A pad is provided between the seat and the bushing, and the pad has a slot for the shaft to pass through.

11. The molding mechanism as described in claim 7, characterized in that, The seat has two parallel first sides, and the bushing has two parallel second sides. The projections of a first axis passing through the first side and a second axis passing through the second side on the horizontal plane are not parallel.

12. The molding mechanism as described in claim 1, characterized in that, The shaft is splined to the bushing.

13. A type of upper mold fixture, characterized in that, include: At least one molding mechanism as described in any one of claims 1 to 12; and An upper mold base is provided with a number of setting areas equal to the number of the at least one pressing mechanism, and the setting areas are for the at least one pressing mechanism to set; The at least one molding mechanism is engaged in the setting area by the bushing, and the shaft is driven to cause the molding assembly to move linearly up and down relative to the upper mold base.

14. A pressing device, characterized in that, include: An upper mold fixture as described in claim 13, and a lower mold fixture that cooperates with the upper mold fixture to press at least one object to be pressed.

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