Semiconductor wafer automatic transmission device

Abstract

The utility model discloses a semiconductor wafer automatic transmission device, which comprises a carrying manipulator mechanism and a linear module, a wafer carrier is arranged at a rotor of the linear module, the wafer carrier comprises a frame body, the side wall of the frame body is provided with an arc opening, the arc opening is vertically, uniformly and fixedly connected with a plurality of annular frames, and the annular frames are fixedly connected with the carrier body. A bottom supporting circular truncated cone is arranged at the bottom of each annular frame, and each annular frame is in a semi-circular ring shape; according to the wafer carrier, the annular frame is used for supporting the edge of the wafer, then the bottom supporting circular truncated cone is used for supporting the back of the wafer, all supporting force is prevented from being concentrated on the edge, the wafer is prevented from being deformed, the bottom supporting circular truncated cone can vertically move, and when the wafer is carried, the bottom supporting circular truncated cone is located at a low position and cannot block the carrying arm to send the wafer into the annular frame, so that the wafer carrying efficiency is improved. The practicability is higher; the carrying manipulator mechanism can drive the carrying arm to rotate through the first servo gear motor, so that the wafer can be overturned conveniently, and different transmission requirements can be met.

Description

Technical Field

[0001] This utility model relates to the field of wafer transfer technology, specifically to an automatic semiconductor wafer transfer device. Background Technology

[0002] Automated wafer transfer systems are critical equipment in semiconductor manufacturing, used to automate the transfer, positioning, and storage of wafers during wafer processing, ensuring efficient and safe transfer of wafers between different process equipment. Key components include robotic arms for handling wafers, conveyor lines for moving wafers, and wafer carriers. These structures work together to achieve path-based transfer. Current wafer carriers, designed to facilitate wafer insertion by robotic arms, do not have obstructions and primarily use racks with wafer slots. The wafer edge is inserted into the slot, supported by the bottom of the slot. For example, Chinese utility model application CN206947308U discloses a wafer carrier. This carrier allows equipment suitable for processing single large-diameter wafers to process wafers of multiple diameters. The carrier includes a wafer bin, two widened side lugs, and raised leg supports. However, current automated wafer transfer devices have the following drawbacks:

[0003] To facilitate the robotic arm's placement of wafers into the carrier, the wafer carrier only uses edge support to fix the wafer. This means that there is no support on the back of the wafer, and the edge is subjected to greater force, which can easily cause the wafer to deform and warp, making it unsuitable for use.

[0004] Therefore, we propose an automated semiconductor wafer transfer device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide an automatic semiconductor wafer transfer device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an automatic semiconductor wafer transfer device, comprising a handling robot mechanism and a linear module. A wafer carrier is provided at the mover of the linear module. The wafer carrier includes a frame, with an arc-shaped opening on the side wall of the frame. Multiple annular frames are vertically and uniformly fixed to the arc-shaped opening. A bottom support truncated cone is provided at the bottom of each annular frame. The annular frame is semi-circular in shape, and the diameter of the bottom support truncated cone is the same as the inner diameter of the annular frame. Multiple side sliding openings are provided on the side wall of the arc-shaped opening between the multiple annular frames. A side sliding plate is vertically slidably connected in each side sliding opening. A carrier plate is fixed to the end of the side sliding plate, and the end of the carrier plate is fixed to the bottom surface of the bottom support truncated cone.

[0007] Preferably, the handling robot mechanism includes a base platform, a lifting turntable is movably sleeved on the top of the base platform, one end of a first arm is rotatably connected to the top of the lifting turntable, one end of a second arm is rotatably connected to the other end of the first arm, a rotating column is rotatably connected to the top surface of the other end of the second arm, and a carrier is fixedly connected to the top surface of the rotating column.

[0008] Preferably, a transport arm is rotatably provided on the side wall of the platform, a transport head is fixedly connected to the end of the transport arm, and a plurality of Bernoulli suction cups are fixedly connected to the surface of the transport head.

[0009] Preferably, a horizontally rotatable shaft is sleeved on the platform, the end of the shaft is fixedly connected to the end of the transport arm, the end of the platform is fixedly sleeved with a first servo reduction motor, the shaft end of the first servo reduction motor is located inside the platform and fixedly connected to a drive gear, a driven gear is fixedly sleeved on the shaft, and the drive gear meshes with the driven gear.

[0010] Preferably, an inner groove is formed at the end of multiple side sliding openings inside the frame. A power plate is vertically slidably sleeved in the inner groove. The ends of multiple side sliding plates are fixed to the sidewalls of the power plate. A rack groove is formed in the sidewall of the inner groove. A gear cavity is formed inside the frame near the rack groove. The gear cavity communicates with the rack groove. A long rack is fixed to the sidewall of the power plate. The long rack is located inside the rack groove. Multiple synchronous gears are uniformly rotatably connected in the gear cavity. The multiple synchronous gears mesh with the long rack. Two synchronous pulleys are fixed to the shaft end of each synchronous gear. A synchronous belt is sleeved on the synchronous pulleys of two adjacent synchronous gears. A second servo reduction motor is fixed to the sidewall of the frame. The shaft end of the second servo reduction motor is fixed to the shaft of the synchronous gear located in the middle.

[0011] Preferably, the inner sidewall of the annular frame has an annular opening, the bottom surface of the annular opening is fixed to an air cushion, the bottom surface of the frame is fixed to a base, the base is fixed to the surface of the linear module mover, multiple guide posts are vertically fixed inside the side sliding opening, and multiple guide holes are vertically opened on the side sliding plate, with the guide holes slidably sleeved with the guide posts.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] In this invention, the wafer carrier utilizes a ring frame to support the edge of the wafer, and then uses a bottom support platform to support the back of the wafer, avoiding the concentration of all supporting force at the edge and preventing wafer deformation. Furthermore, the bottom support platform can move vertically, and when transporting the wafer, the bottom support platform is in a low position, so it will not obstruct the transport arm from sending the wafer into the ring frame position, making it more practical. The transport robot mechanism can drive the transport arm to rotate through a first servo reduction motor, which facilitates wafer flipping and adapts to different transport requirements. Attached Figure Description

[0014] Figure 1These are schematic diagrams of the main structure in the first and second embodiments of this utility model;

[0015] Figure 2 These are schematic diagrams of the cross-sectional structure at the wafer carrier in the first and second embodiments of this utility model;

[0016] Figure 3 This utility model Figure 2 Enlarged structural diagram of point A in the middle;

[0017] Figure 4 This is a schematic diagram of the cross-sectional structure at the platform in the second embodiment of the present invention;

[0018] Figure 5 This is a cross-sectional view of the frame in the second embodiment of the present invention.

[0019] In the diagram: 1. Handling robot mechanism; 2. Linear module; 3. Wafer carrier; 11. Base platform; 12. Lifting turntable; 13. First arm; 14. Second arm; 15. Rotating column; 16. Platform; 17. Handling arm; 18. Handling head; 19. Bernoulli suction cup; 110. Shaft column; 111. First servo geared motor; 112. Drive gear; 113. Driven gear; 31. Frame; 32. Arc opening; 33. 34. Ring frame; 35. Support truncated cone; 36. Side slide opening; 37. Side slide plate; 38. Carrier plate; 39. Inner groove; 30. Power plate; 310. Rack groove; 311. Gear cavity; 312. Long rack; 313. Synchronous gear; 314. Synchronous pulley; 315. Synchronous belt; 316. Second servo geared motor; 317. Ring opening; 318. Air cushion; 319. Guide post; 320. Guide hole; 321. Base. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1:

[0022] Please see Figure 1-3This utility model provides a technical solution: an automatic semiconductor wafer transfer device, including a handling robot mechanism 1 and a linear module 2. A wafer carrier 3 is provided at the actuator of the linear module 2. The wafer carrier 3 includes a frame 31, with an arc-shaped opening 32 on the side wall of the frame 31. Multiple annular frames 33 are vertically and uniformly fixed to the arc-shaped opening 32. Each annular frame 33 has a supporting truncated cone 34 at its bottom. The annular frame 33 is semi-circular in shape, and the diameter of the supporting truncated cone 34 is the same as the inner diameter of the annular frame 33. Multiple side-sliding openings 35 are provided on the side wall of the arc-shaped opening 32 between the multiple annular frames 33. A side slide plate 36 is vertically slidably connected inside the side slide opening 35. The end of the side slide plate 36 is fixedly connected to the carrier plate 37. The end of the carrier plate 37 is fixedly connected to the bottom surface of the bottom support platform 34 to fix the bottom support platform. The wafer carrier 3 uses the ring frame 33 to support the edge of the wafer, and then uses the bottom support platform 34 to support the back of the wafer, avoiding all the supporting force from being concentrated at the edge and preventing the wafer from deforming. In addition, the bottom support platform 34 can move vertically. When transporting the wafer, the bottom support platform 34 is in a low position, that is, away from the ring opening 317, so it will not block the transport arm 17 from sending the wafer into the ring frame 33, making it more practical.

[0023] Example 2:

[0024] Please see Figure 1-5 This is the second embodiment of the present invention. Based on the previous embodiment, the handling robot mechanism 1 includes a base platform 11. A lifting turntable 12 is movably sleeved on the top of the base platform 11. The top of the lifting turntable 12 is rotatably connected to one end of a first arm 13. The other end of the first arm 13 is rotatably connected to one end of a second arm 14. The top surface of the other end of the second arm 14 is rotatably connected to a rotating column 15. The top surface of the rotating column 15 is fixedly connected to a platform 16.

[0025] A transport arm 17 is rotatably mounted on the side wall of the stage 16. A transport head 18 is fixedly connected to the end of the transport arm 17. Multiple Bernoulli chucks 19 are fixedly attached to the surface of the transport head 18. The wafer is fixed by the Bernoulli chucks 19 to achieve non-contact adsorption. The Bernoulli chucks are existing technology and will not be described in detail here.

[0026] A horizontally rotatable column 110 is mounted on the stage 16. The end of the column 110 is fixedly connected to the end of the transport arm 17. A first servo geared motor 111 is fixedly mounted on the end of the stage 16. The shaft end of the first servo geared motor 111 is located inside the stage 16 and is fixedly connected to the drive gear 112. A driven gear 113 is fixedly mounted on the column 110. The drive gear 112 meshes with the driven gear 113. The first servo geared motor 111 can drive the transport arm 17 to rotate, which facilitates wafer flipping and adapts to different transmission requirements.

[0027] Inside the frame 31, an inner groove 38 is formed at the ends of multiple side sliding openings 35. A power plate 39 is vertically slidably sleeved within the inner groove 38. The ends of multiple side sliding plates 36 are fixed to the sidewalls of the power plate 39. A rack groove 310 is formed on the sidewall of the inner groove 38. A gear cavity 311 is formed inside the frame 31 near the rack groove 310, and the gear cavity 311 connects to the rack groove 310. A long rack 312 is fixed to the sidewall of the power plate 39 and is located inside the rack groove 310. Multiple synchronous gears 313 are uniformly rotatably connected within the gear cavity 311. The multiple synchronous gears 313 mesh with the long rack 312. The shaft end of each synchronous gear 313... Two synchronous pulleys 314 are fixedly connected, and synchronous belts 315 are sleeved on the synchronous pulleys 314 of two adjacent synchronous gears 313. A second servo reduction motor 316 is fixedly connected to the side wall of the frame 31. The shaft end of the second servo reduction motor 316 is fixedly connected to the shaft of the synchronous gear 313 located in the middle. The second servo reduction motor 316 drives multiple synchronous gears 313 to rotate, thereby changing the height position of the power plate 39, and thus changing the height position of the bottom support platform 34. In this way, when transporting wafers, the bottom support platform 34 moves to a low position and will not block the view. After the transport is completed, the bottom support platform 34 is raised to contact the back of the wafer for support.

[0028] An annular opening 317 is opened on the inner side wall of the annular frame 33. An air cushion 318 is fixed to the bottom surface of the annular opening 317. A base 321 is fixed to the bottom surface of the frame 31. The base 321 is fixed to the surface of the mover of the linear module 2. Multiple guide posts 319 are vertically fixed inside the side sliding opening 35. Multiple guide holes 320 are vertically opened on the side sliding plate 36. The guide holes 320 are slidably sleeved with the guide posts 319.

[0029] Please see Figure 1-5 In use, the linear module 2 transports the wafer to the wafer carrier 3. Before transport, the bottom support platform 34 on the wafer carrier 3 moves to a low position, and the wafer is transported to the ring frame 33 with its edge inserted into the ring opening 317. After all the wafers have been transported, the bottom support platform 34 moves to a high position, contacting the back of the wafer for support. The linear module 2 then drives the wafer carrier 3 to move and transport the wafer. In this invention, the wafer carrier 3 uses the ring frame 33 to support the edge of the wafer, and then uses the bottom support platform 34 to support the back of the wafer, avoiding all the supporting force from being concentrated at the edge and preventing the wafer from deforming. The bottom support platform 34 can move vertically. When transporting the wafer, the bottom support platform 34 is in a low position and will not obstruct the transport arm 17 from sending the wafer into the ring frame 33, making it more practical. The transport robot mechanism 1 can drive the transport arm 17 to rotate through the first servo reduction motor 111, which facilitates wafer flipping and adapts to different transport requirements.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated semiconductor wafer transfer device, comprising a handling robot mechanism (1) and a linear module (2), characterized in that: The linear module (2) is provided with a wafer carrier (3) at the mover. The wafer carrier (3) includes a frame (31). The frame (31) has an arc opening (32) on its side wall. The arc opening (32) is vertically and uniformly fixed to multiple ring frames (33). Each ring frame (33) has a bottom support truncated cone (34) at its bottom. The ring frame (33) is semi-circular. The diameter of the bottom support truncated cone (34) is the same as the inner diameter of the ring frame (33). The side wall of the arc opening (32) is provided with multiple side sliding openings (35) between the multiple ring frames (33). Each side sliding opening (35) is vertically and slidably connected to a side sliding plate (36). The end of the side sliding plate (36) is fixed to a carrier plate (37). The end of the carrier plate (37) is fixed to the bottom surface of the bottom support truncated cone (34).

2. The semiconductor wafer automatic transfer device according to claim 1, characterized in that: The handling robot mechanism (1) includes a base platform (11), a lifting turntable (12) is movably connected to the top of the base platform (11), the top of the lifting turntable (12) is rotatably connected to one end of a first arm body (13), the other end of the first arm body (13) is rotatably connected to one end of a second arm body (14), the top surface of the other end of the second arm body (14) is rotatably connected to a rotating column (15), and the top surface of the rotating column (15) is fixedly connected to a platform (16).

3. The semiconductor wafer automatic transfer device according to claim 2, characterized in that: The platform (16) is rotatably provided with a transport arm (17) on its side wall. The end of the transport arm (17) is fixedly connected to a transport head (18), and a plurality of Bernoulli suction cups (19) are fixedly connected to the surface of the transport head (18).

4. The semiconductor wafer automatic transfer device according to claim 3, characterized in that: A horizontally rotatable shaft (110) is mounted on the platform (16). The end of the shaft (110) is fixedly connected to the end of the transport arm (17). The end of the platform (16) is fixedly mounted with a first servo reduction motor (111). The shaft end of the first servo reduction motor (111) is located inside the platform (16) and fixedly connected with a drive gear (112). A driven gear (113) is fixedly mounted on the shaft (110). The drive gear (112) meshes with the driven gear (113).

5. The semiconductor wafer automatic transfer device according to claim 1, characterized in that: The frame (31) has an inner groove (38) at the end of multiple side sliding openings (35). A power plate (39) is vertically slidably fitted inside the inner groove (38). The ends of multiple side sliding plates (36) are fixed to the sidewalls of the power plate (39). A rack groove (310) is formed on the sidewall of the inner groove (38). A gear cavity (311) is formed inside the frame (31) near the rack groove (310). The gear cavity (311) communicates with the rack groove (310). A long rack (312) is fixed to the sidewall of the power plate (39). The long rack (312) is located in the rack groove (…). Inside the gear cavity (310), multiple synchronous gears (313) are uniformly rotatably connected. The multiple synchronous gears (313) mesh with a long rack (312). Two synchronous pulleys (314) are fixed to the shaft end of each synchronous gear (313). A synchronous belt (315) is sleeved on the synchronous pulleys (314) of two adjacent synchronous gears (313). A second servo reduction motor (316) is fixed to the side wall of the frame (31). The shaft end of the second servo reduction motor (316) is fixed to the shaft of the synchronous gear (313) located in the middle.

6. The semiconductor wafer automatic transfer device according to claim 1, characterized in that: The inner sidewall of the ring frame (33) has an opening (317), the bottom surface of the opening (317) is fixed with an air cushion (318), the bottom surface of the frame (31) is fixed with a base (321), the base (321) is fixed to the surface of the mover of the linear module (2), multiple guide posts (319) are vertically fixed inside the side slide (35), multiple guide holes (320) are vertically opened on the side slide (36), and the guide holes (320) are slidably sleeved with the guide posts (319).

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