High-stability lead frame structure

Abstract

The utility model discloses a high-stability lead frame structure, which comprises a frame main body, the frame main body comprises an upper edge rib, a lower edge rib and a plurality of vertical ribs, and the side surface of each vertical rib is provided with a vertically arranged glue blocking rib strip; the side surface of each vertical rib is provided with a plurality of packaging units which are arranged in the same row, and each packaging unit is internally provided with a first pin fixing position, a second pin fixing position and a third pin fixing position which are distributed in the shape of a Chinese character'pin '; the second pin fixing position and the third pin fixing position are connected to the glue blocking connecting rib strip through the first connecting rib; and the first pin fixing positions in the same column of packaging units are connected in series through a second connecting rib which is vertically arranged and are connected to the upper edge rib and the lower edge rib. According to the utility model, the first pin fixing position is directly connected to the frame through the second connecting rib and does not need to be supported to the glue-blocking connecting rib strip through the connecting rib, so that the bending caused by too long and too thin connecting rib or the deformation caused by gravity is avoided, and the stability is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a highly stable lead frame structure. Background Technology

[0002] In the field of electronic component packaging, the stability and space utilization of the frame structure directly affect product performance and applicability. Existing technologies, traditional frames suffer from the following technical problems:

[0003] 1. Existing framework such as Figure 5 , Figure 6 As shown, the frame has three pin fixing positions arranged in a triangular pattern: the first pin fixing position A61, the second pin fixing position B62, and the third pin fixing position C63. All three pin fixing positions are connected to the adhesive resist connecting strip 4 via connecting ribs. The first pin fixing position A61 is relatively far from the adhesive resist connecting strip 4, requiring a longer connecting rib 64 to extend to connect to the adhesive resist connecting strip 4. The longer connecting rib 64 also means that it is more susceptible to bending and deformation due to gravity. Furthermore, the second pin fixing position B62 and the third pin fixing position C63 also need to make way for the connecting rib of the first pin fixing position A61, resulting in a reduction in the area of ​​the second pin fixing position B62 and the third pin fixing position C63. This makes it impossible to adapt to large-size chips. If large-size chips are to be adapted, the size of the molding compound needs to be increased, thereby increasing the space pressure on the circuit board.

[0004] 2. The support points of the existing frame are concentrated on the adhesive-resistant connecting strips. In subsequent processing, the pin fixing positions are prone to deformation, which affects the stability of the production process and product quality. Utility Model Content

[0005] To address the aforementioned issues, this invention provides a highly stable lead frame structure, resolving the problems of easy deformation of the pin fixing position and inability to adapt to large chips in the prior art.

[0006] Therefore, the technical solution of this utility model is: a highly stable lead frame structure, including a frame body, the frame body including an upper rib, a lower rib and several vertical ribs, each vertical rib having a vertically arranged adhesive-resistant connecting rib strip on its side; several encapsulation units arranged in the same row are installed on the side of each vertical rib, and the encapsulation unit has a first pin fixing position, a second pin fixing position and a third pin fixing position arranged in a triangular pattern; the second pin fixing position and the third pin fixing position are connected to the adhesive-resistant connecting rib strip through the first connecting rib; the first pin fixing positions in the encapsulation units in the same row are connected together in series through the vertically arranged second connecting ribs and connected to the upper rib and the lower rib.

[0007] Based on the above scheme and as a preferred embodiment of the above scheme: in the packaging unit at the middle position, both ends of its first pin fixing position are connected to the first pin fixing positions of the adjacent packaging unit through the second connecting rib.

[0008] Based on the above scheme and as a preferred embodiment of the above scheme: in the packaging unit at the edge position, one end of its first pin fixing position is connected to the first pin fixing position of the adjacent packaging unit through the second connecting rib, and the other end is connected to the upper or lower side rib through the second connecting rib.

[0009] Based on the above scheme and as a preferred embodiment of the above scheme: the first pin fixing position and the second connecting rib are integrally formed, the second connecting rib and the adhesive-resistant connecting rib are parallel to each other, and both are connected to the upper rib and the lower rib.

[0010] Based on the above scheme and as a preferred embodiment of the above scheme: the second connecting ribs on both sides of the first pin fixing position and the adhesive-resistant connecting rib strips are all located outside the black glue encapsulation area, that is, the cutting area in the rib cutting process.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The first pin fixing position is directly connected to the frame through the second connecting rib, without the need for the connecting rib to support the adhesive-resistant connecting rib strip. The second connecting rib does not interfere with other components, and its thickness can be set as needed to avoid bending or deformation caused by gravity due to the connecting rib being too long or too thin, thus improving stability.

[0013] 2. After the connecting rib of the first pin fixing position no longer needs to pass between the second and third pin fixing positions, the area of ​​the second and third pin fixing positions is significantly increased, which can be adapted to large-size chips.

[0014] 3. After the molding process is completed, the adhesive-blocking connecting strips and the second connecting strips are removed through the rib cutting process, and then black glue molding is performed to ensure that the appearance is consistent with the traditional solution, achieving high stability and large fixation area within the same molding space. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the two-column packaging unit of this utility model;

[0017] Figure 3 for Figure 2 A magnified view of a portion of the image;

[0018] Figure 4 This is a schematic diagram of the packaging of this utility model;

[0019] Figure 5This is a schematic diagram of the existing framework;

[0020] Figure 6 for Figure 5 A magnified view of a portion of the image.

[0021] The markings in the diagram are as follows: Top rib 1, Bottom rib 2, Vertical rib 3, Adhesive-resistant connecting rib 4, Encapsulation unit 5, First pin fixing position 51, Second pin fixing position 52, Third pin fixing position 53, First connecting rib 54, Second connecting rib 55, First pin fixing position A 61, Second pin fixing position B 62, Third pin fixing position C 63, Longer connecting rib 64, Molding area 7. Detailed Implementation

[0022] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0024] See the attached drawings. The lead frame structure described in this embodiment includes a frame body, which includes an upper rib 1, a lower rib 2, and several vertical ribs 3. Each vertical rib 3 has a vertically arranged adhesive-resistant connecting rib 4 on its side. Each vertical rib 3 has 8 encapsulation units 5 installed on its side, and the 8 encapsulation units are arranged in a row.

[0025] The packaging unit 5 has a first pin fixing position 51, a second pin fixing position 52, and a third pin fixing position 53 arranged in a triangular pattern. The second pin fixing position 52 and the third pin fixing position 53 are arranged side by side and are closer to the adhesive resisting connecting strip 4. The first pin fixing position 51 is located on the side of the second pin fixing position 52 and the third pin fixing position 53 away from the adhesive resisting connecting strip 4. The second pin fixing position 52 and the third pin fixing position 53 are connected to the adhesive resisting connecting strip 4 through the first connecting strip 54.

[0026] The first pin fixing position 51 is connected in series with the vertically arranged second connecting rib 55 and connected to the upper rib 1 and the lower rib 2, rather than connected to the adhesive-resistant connecting rib 4. The first pin fixing position 51 and the second connecting rib 55 are integrally formed. The second connecting rib 55 and the adhesive-resistant connecting rib 4 are parallel to each other and are both connected to the upper rib 1 and the lower rib 2.

[0027] Specifically, in a row of multiple packaging units, the packaging unit in the middle position has its first pin fixing position 51 connected to the first pin fixing position 51 of the adjacent packaging unit at both ends via the second connecting rib 55. In the packaging unit at the upper edge position, one end of its first pin fixing position 51 is connected to the first pin fixing position 51 of the adjacent packaging unit via the second connecting rib 55, and the other end is connected to the upper rib 1 via the second connecting rib 55; in the packaging unit at the lower edge position, one end of its first pin fixing position 51 is connected to the first pin fixing position 51 of the adjacent packaging unit via the second connecting rib 55, and the other end is connected to the lower rib 2 via the second connecting rib 55.

[0028] During the molding process, the second connecting ribs 55 on both sides of the first pin fixing position 51 and the adhesive resist connecting ribs 4 are located outside the black adhesive molding area 7. After molding, a rib-cutting process is performed, in which the adhesive resist connecting ribs 4 and the second connecting ribs 55 on both sides of the first pin fixing position 51 are removed, so that the appearance of the product after black adhesive molding is consistent with the appearance of the product after processing with the existing frame structure. This means that within the same molding space, this embodiment can achieve high stability of the first pin fixing position 51, making it less prone to deformation, while increasing the area of ​​the second pin fixing position 52 and the third pin fixing position 53. In mini-package requirements, larger-sized chips can be selected, improving product quality and compatibility with more types of chips.

[0029] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A highly stable lead frame structure, comprising a frame body, the frame body including an upper rib, a lower rib, and a plurality of vertical ribs, each vertical rib having a vertically arranged adhesive-resistant connecting strip on its side; each vertical rib having a plurality of encapsulation units arranged in the same row mounted on its side, each encapsulation unit having a first pin fixing position, a second pin fixing position, and a third pin fixing position arranged in a triangular pattern; the second pin fixing position and the third pin fixing position being connected to the adhesive-resistant connecting strip via the first connecting rib; characterized in that: The first pin fixing positions in the same column package unit are connected together by a vertically arranged second connecting rib and connected to the upper and lower ribs.

2. The highly stable lead frame structure as described in claim 1, characterized in that: In the middle packaging unit, both ends of its first pin fixing position are connected to the first pin fixing positions of adjacent packaging units through the second connecting rib.

3. The highly stable lead frame structure as described in claim 2, characterized in that: In the packaging unit at the edge position, one end of its first pin fixing position is connected to the first pin fixing position of the adjacent packaging unit through the second connecting rib, and the other end is connected to the upper or lower edge rib through the second connecting rib.

4. The highly stable lead frame structure as described in claim 1, characterized in that: The first pin fixing position is integrally formed with the second connecting rib. The second connecting rib and the adhesive-resistant connecting rib are parallel to each other and are both connected to the upper and lower ribs.

5. The highly stable lead frame structure as described in claim 1, characterized in that: The second connecting ribs on both sides of the first pin fixing position and the adhesive-resistant connecting ribs are located outside the black glue encapsulation area, that is, the cutting area in the rib cutting process.

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