Efficient cooling water tank for injection molding
The cooling system, which uses semiconductor cooling chips and spiral fin assemblies, solves the problem of heat affecting the cooling rate of injection molded parts in water, achieving efficient cooling and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HU NAN XIANG HUI JIN SHU ZHI PIN YOU XIAN GONG SI
- Filing Date
- 2025-06-09
- Publication Date
- 2026-05-08
AI Technical Summary
After initial external cooling, existing injection molded parts need to be further cooled in a water tank. The heat released by the parts causes the water temperature to rise, affecting the heat transfer rate and resulting in a slower cooling speed.
The cooling system, which consists of a semiconductor cooling chip and a spiral heat dissipation fin assembly, uses a circulating water pump and conduits to circulate and cool clean water. Combined with the semiconductor cooling chip to cool the fin assembly, it increases the heat exchange area and time, and keeps the clean water temperature low.
It improves the cooling speed of injection molded parts, has a simple and compact structure, occupies little space, and has low production costs.
Smart Images
Figure CN224210468U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of injection molding technology, and in particular to a high-efficiency cooling water tank for injection molding. Background Technology
[0002] In the injection molding production field, the cooling process of plastic products plays a crucial role in product quality and production efficiency. In practical applications, cooling water tanks for injection molding typically require the following technologies:
[0003] 1. Cooling circulation technology: A circulation system is constructed through components such as water pumps and pipes to ensure that the coolant flows continuously in the water tank, ensuring uniform coolant temperature and achieving effective cooling of injection molded products;
[0004] 2. Product positioning and fixing technology: With the help of fixtures, brackets and other structures, the injection molded products are accurately placed in the appropriate position in the cooling water tank and ensured to remain stable during the cooling process to avoid affecting the cooling effect due to shaking.
[0005] After the existing injection molded parts are initially cooled on the outside, they need to be placed in a water tank for further cooling to ensure that the inside is completely cooled and molded. When the parts are cooled in water, the heat released by the parts will cause the water temperature to rise gradually. When the water temperature rises, the relative temperature difference between the parts and the parts will decrease, affecting the rate of heat transfer and thus resulting in a slower cooling speed. Utility Model Content
[0006] To address the shortcomings of existing technologies, this utility model provides a high-efficiency cooling water tank for injection molding. This solves the problem that existing injection molded parts, after initial external cooling, still need to be placed in a water tank for further cooling to ensure complete internal cooling and molding. When the parts are cooled in water, the heat released by the parts causes the water temperature to gradually rise. As the water temperature rises, the relative temperature difference between the water and the parts decreases, affecting the rate of heat transfer and resulting in a slow cooling speed.
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] A high-efficiency cooling water tank for injection molding includes a water tank box, a return box fixedly installed at the bottom of the water tank box, a first heat dissipation fin assembly fixedly installed inside the return box, an end cap fixedly installed at the top of the first heat dissipation fin assembly, a bracket installed at the bottom of the return box, a semiconductor cooling chip fixedly installed on the bracket, the cold end of the semiconductor cooling chip being in contact with the first heat dissipation fin assembly, a water pump evenly fixedly installed on the return box, a conduit installed between the water pump and the water tank box, and the water tank box and the end cap being connected.
[0009] Preferably, a second heat dissipation fin assembly is installed at the hot end of the semiconductor cooling chip, and the bottom end of the second heat dissipation fin assembly is curved.
[0010] Preferred: A fan is fixedly installed on the bracket.
[0011] Preferred: A first filter screen is installed on the bracket.
[0012] Preferably, a second filter screen is installed inside the sink box.
[0013] Preferably, a nut is threaded onto the reflux box, and the nut is located at the bottom of the bracket, forming a clamp between the reflux box and the bracket.
[0014] Compared with the prior art, the present invention has the following beneficial effects:
[0015] 1. Add clean water to the water tank. Under the influence of gravity, the water will flow through the end cap into the return box. The water pump will start and send the clean water in the return box back to the water tank through the conduit for circulation. Place the pre-cooled parts after injection molding into the water tank. The clean water will circulate and cool the parts. During this process, the semiconductor cooling chip will start and cool the first heat sink fin assembly. The hot water that has been in contact with the parts will come into contact with the first heat sink fin assembly during circulation. The first heat sink fin assembly will cool the hot water. The first heat sink fin assembly is spiral-shaped, which increases the contact area with the hot water and prolongs the contact time between the hot water and the first heat sink fin assembly, improving the cooling effect of the hot water and keeping the circulating clean water at a low temperature, thus achieving the effect of improving the cooling speed.
[0016] Second, its simple and compact structure, small footprint, and low production cost make it easy to promote. Attached Figure Description
[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.
[0018] Figure 1 This is a structural diagram of the water tank box of this utility model;
[0019] Figure 2 This is a structural diagram of the bracket of this utility model;
[0020] Figure 3 This is a cross-sectional structural diagram of the present invention;
[0021] Figure 4 This is a structural diagram of the first heat dissipation fin group of this utility model;
[0022] Figure 5 This is a cross-sectional view of the reflux box structure of this utility model.
[0023] Legend: 1. Water tank; 2. Return box; 3. First heat dissipation fin group; 4. End cap; 5. Bracket; 6. Semiconductor cooling chip; 7. Water pump; 8. Conduit; 9. Second heat dissipation fin group; 11. Fan; 12. First filter; 13. Second filter; 14. Nut. Detailed Implementation
[0024] This application provides a high-efficiency cooling water tank for injection molding, effectively solving the problem that existing injection molded parts, after initial external cooling, require further cooling in a water tank to ensure complete internal cooling and molding. However, when the parts are cooled in water, the heat released by the parts causes the water temperature to gradually rise, reducing the relative temperature difference between the water and the parts and affecting the heat transfer rate, resulting in slow cooling. By adding clean water to the water tank, the water flows under gravity through the end cap into a return box. A water pump then returns the water from the return box to the water tank via a conduit, circulating the cooled parts. After initial cooling, the parts are placed in a water tank. Clean water circulates and cools the parts. During this process, the semiconductor cooling chip activates, cooling the first heat sink fin assembly. The hot water that has been in contact with the parts will come into contact with the first heat sink fin assembly during circulation. The first heat sink fin assembly cools the hot water. The first heat sink fin assembly is spiral-shaped, which increases the contact area with the hot water and prolongs the contact time between the hot water and the first heat sink fin assembly, improving the cooling effect of the hot water. This keeps the circulating clean water at a low temperature, thus increasing the cooling speed. The structure is simple and compact, occupies little space, and has low production costs, making it easy to promote.
[0025] Example
[0026] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the technical solution in this application effectively solves the problem that existing injection-molded parts, after initial external cooling, still need to be placed in a water tank for further cooling to ensure complete internal cooling and molding. When the parts are cooled in water, the heat released by the parts causes the water temperature to gradually rise. As the water temperature rises, the relative temperature difference between the water and the parts decreases, affecting the heat transfer rate and resulting in a slow cooling speed. The overall approach is as follows:
[0027] To address the problems existing in the prior art, this utility model provides a high-efficiency cooling water tank for injection molding, including a water tank box 1, a return box 2 fixedly installed at the bottom of the water tank box 1, a first heat dissipation fin group 3 fixedly installed inside the return box 2, an end cap 4 fixedly installed at the top of the first heat dissipation fin group 3, and a bracket 5 installed at the bottom of the return box 2.
[0028] A thermoelectric cooler 6 is fixedly installed on the bracket 5. The cold end of the thermoelectric cooler 6 is in contact with the first heat dissipation fin group 3. A water pump 7 is evenly fixedly installed on the return box 2. A conduit 8 is installed between the water pump 7 and the water tank box 1. The water tank box 1 and the end cover 4 are connected. The hot end of the thermoelectric cooler 6 is equipped with a second heat dissipation fin group 9.
[0029] The bottom of the second heat dissipation fin group 9 is arc-shaped. A fan 11 is fixedly installed on the bracket 5. A first filter 12 is installed on the bracket 5. A second filter 13 is installed inside the water tank box 1. A nut 14 is threaded on the return box 2. The nut 14 is located at the bottom of the bracket 5 and forms a clamp with the return box 2 on the bracket 5.
[0030] Water tank 1: As the main place for cooling injection molded parts, it contains clean water to provide a cooling space for the parts after the initial cooling of injection molding. It is connected to the return box 2 to realize the circulation of coolant to continuously dissipate heat and cool the parts.
[0031] Return box 2: Located at the bottom of water tank box 1, it is used to collect the coolant (clean water) flowing in from water tank box 1 and to provide installation space for components such as the first heat dissipation fin group 3 and water pump 7. It is an important part of the coolant circulation system.
[0032] The first heat dissipation fin group 3 is fixedly installed inside the return box 2 and is spiral in shape. Its function is to increase the contact area and contact time with hot water. After the semiconductor cooling chip 6 cools it down, it effectively reduces the temperature of the hot water returning from the water tank box 1, keeps the circulating clean water at a lower temperature, and thus improves the cooling speed of the injection molded parts.
[0033] End cap 4: Installed on the top of the first heat dissipation fin group 3, it serves to seal the top of the return box 2 on the one hand, and guide the clean water in the water tank 1 into the return box 2 under the action of gravity on the other hand. It is a key connecting component of the coolant circulation path.
[0034] Bracket 5: Installed at the bottom of the return box 2, it provides a fixed position for components such as the semiconductor cooling chip 6, the fan 11, and the first filter 12, ensuring the relative position of each component is stable and ensuring the normal operation of the device;
[0035] Semiconductor cooling chip 6: Fixed on bracket 5, with cold end in contact with first heat dissipation fin group 3. After starting, it cools the first heat dissipation fin group 3, thereby reducing the temperature of the returning hot water, realizing the cooling of the coolant and improving the cooling efficiency. The hot end is connected to second heat dissipation fin group 9, transferring the generated heat to second heat dissipation fin group 9.
[0036] Water pump 7: It is evenly and fixedly installed on the return box 2. It sends the clean water in the return box 2 back to the water tank box 1 through the conduit 8 to realize the circulation of coolant and ensure that the clean water in the water tank box 1 can continuously exchange heat with the injection molded parts and maintain the continuity of the cooling process.
[0037] Pipe 8: Connects water pump 7 and water tank 1, and is the channel for coolant to return from return box 2 to water tank 1, ensuring smooth flow of coolant in the circulation system;
[0038] The second heat dissipation fin group 9 is installed at the hot end of the thermoelectric cooler 6, receives the heat transferred by the thermoelectric cooler 6, and dissipates the heat through its large surface area. Its bottom end is arc-shaped, which is conducive to air flow. Together with the fan 11, it improves the heat dissipation effect of the thermoelectric cooler 6 and ensures that the thermoelectric cooler 6 can work stably at a suitable temperature.
[0039] Fan 11: Fixedly installed on bracket 5, it accelerates airflow after starting to dissipate heat from the second heat dissipation fin group 9, helping the thermoelectric cooler 6 to maintain the temperature required during operation, and ensuring the cooling effect and stability of the thermoelectric cooler 6;
[0040] First filter 12: Installed on bracket 5, it prevents external dust from entering the second heat dissipation fin group 9 with the air flow when the fan 11 is running, thus preventing dust accumulation from affecting the heat dissipation effect and extending the service life of the device.
[0041] Second filter 13: Installed inside water tank 1, it lifts up the parts placed in water tank 1 to prevent them from falling directly into the bottom of water tank 1 and blocking the return port, thus ensuring smooth circulation of coolant; on the other hand, it intercepts plastic debris that falls off the parts to prevent debris from entering the circulation fluid path and causing blockage, thus maintaining the normal operation of the circulation system.
[0042] Nut 14: Threaded onto the return box 2, located at the bottom of the bracket 5, together with the return box 2, it clamps the bracket 5, thus fixing the bracket 5 and ensuring the stability of the entire device structure.
[0043] Working principle:
[0044] The first step involves adding clean water to the water tank 1 during use. Under gravity, the water flows along the end cap 4 into the return box 2. The water pump 7 starts and sends the clean water from the return box 2 back to the water tank 1 through the conduit 8 for circulation. After the injection-molded parts have been initially cooled, they are placed into the water tank 1. The clean water circulates and cools the parts. During this process, the semiconductor cooling chip 6 starts and cools the first heat sink fin assembly 3. The hot water that has been in contact with the parts will come into contact with the first heat sink fin assembly 3 during circulation. The first heat sink fin assembly 3 cools the hot water. The first heat sink fin assembly 3 is spiral-shaped, which increases the contact area with the hot water and prolongs the contact time between the hot water and the first heat sink fin assembly 3, improving the cooling effect of the hot water and keeping the circulating clean water at a low temperature, thus achieving the effect of increasing the cooling speed.
[0045] In the second step, during use, the temperature of the hot end of the thermoelectric cooler 6 will be transferred to the second heat dissipation fin assembly 9. After the fan 11 is started, it will dissipate heat from the second heat dissipation fin assembly 9, keeping the thermoelectric cooler 6 at the temperature required for operation. The bottom of the second heat dissipation fin assembly 9 is curved, which is conducive to airflow and improves the heat dissipation effect of the thermoelectric cooler 6. The first filter 12 can prevent external dust from entering the second heat dissipation fin assembly 9 when the air flows. After the parts are placed in the water tank box 1, they will be lifted by the second filter 13. The second filter 13 can prevent the parts from falling directly into the bottom of the water tank box 1 and blocking the return port at the bottom of the water tank box 1. At the same time, the second filter 13 can intercept plastic debris that falls off the parts, preventing the debris from entering the circulating fluid path and causing blockage.
[0046] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A high-efficiency cooling water tank for injection molding, comprising a tank box (1), characterized in that, A return box (2) is fixedly installed at the bottom of the water tank (1). A first heat dissipation fin group (3) is fixedly installed inside the return box (2). An end cap (4) is fixedly installed at the top of the first heat dissipation fin group (3). A bracket (5) is installed at the bottom of the return box (2). A semiconductor cooling chip (6) is fixedly installed on the bracket (5). The cold end of the semiconductor cooling chip (6) is in contact with the first heat dissipation fin group (3). A water pump (7) is evenly fixedly installed on the return box (2). A conduit (8) is installed between the water pump (7) and the water tank (1). The water tank (1) and the end cap (4) are connected.
2. The high-efficiency cooling water tank for injection molding as described in claim 1, characterized in that, The hot end of the semiconductor cooling chip (6) is equipped with a second heat dissipation fin group (9).
3. The high-efficiency cooling water tank for injection molding as described in claim 1, characterized in that, A fan (11) is fixedly installed on the bracket (5).
4. The high-efficiency cooling water tank for injection molding as described in claim 1, characterized in that, The first filter screen (12) is installed on the bracket (5).
5. The high-efficiency cooling water tank for injection molding as described in claim 1, characterized in that, A second filter (13) is installed inside the water tank box (1).
6. The high-efficiency cooling water tank for injection molding as described in claim 1, characterized in that, A nut (14) is threaded onto the return box (2).