Prefabricated ceiling type radiant panel based on semiconductor heating
By combining decorative materials, heat-dampening aluminum plates, embedded cold water pipes, and semiconductor heating films into the radiant panel, the problems of strong thermal inertia and high cost of traditional radiant panels are solved, achieving rapid and stable heating effect and improved durability, and supporting quick installation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING TENGYUN ZHIHUI TECHNOLOGY DEVELOPMENT CO LTD
- Filing Date
- 2025-03-04
- Publication Date
- 2026-05-08
AI Technical Summary
Traditional radiant heating plates have strong thermal inertia, cannot heat up quickly when operating intermittently, and have insufficient heating capacity in extreme weather conditions. Furthermore, semiconductor heating film processes are complex and costly.
It adopts a combination structure of decorative material, heat-dampening aluminum plate, embedded cold water pipe, semiconductor heating film and insulation board. It utilizes semiconductor heating film to quickly respond and adjust the load, and combines the embedded cold water pipe to provide heat to achieve rapid and stable heating. Furthermore, it improves thermal conductivity and durability through improved material selection.
It achieves rapid and stable heating under extreme weather conditions, reduces costs, improves building durability and thermal conductivity, and supports rapid prefabricated installation.
Smart Images
Figure CN224213615U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of prefabricated ceiling-mounted radiant panel technology, and in particular to a prefabricated ceiling-mounted radiant panel based on semiconductor heating. Background Technology
[0002] Prefabricated ceiling-mounted radiant panels with semiconductor heating are an innovative product in the field of building component technology, used to provide heating for indoor places such as homes and offices. However, the radiant system of traditional radiant panels has too strong thermal inertia, and intermittent operation cannot achieve rapid heating. In extreme weather conditions, the heating capacity is insufficient. In addition, the process of individual radiant semiconductor heating film is complex and costly, so improvements are needed. Utility Model Content
[0003] The purpose of this utility model is to solve the technical problems mentioned in the background art.
[0004] The present invention adopts the following technical solution: a prefabricated ceiling-mounted radiant panel based on semiconductor heating, comprising a decorative material, a heat-spreading aluminum plate fixedly installed on the decorative material, an embedded cold water pipe fixedly installed on the heat-spreading aluminum plate, a semiconductor heating film fixedly installed on the embedded cold water pipe, and an insulation board fixedly installed on the semiconductor heating film.
[0005] Preferably, the finishing material is waterproof gypsum board, the finishing material has a B1 flame retardant rating, and the finishing material thickness is 10mm. This makes the finishing material anti-condensation and anti-mold, with lower thermal resistance, higher thermal conductivity, and greater durability. Preferably, the heat-dissipating aluminum plate is a graphite plate and an aluminum plate with heat-dissipating Ω-grooves, and the heat-dissipating aluminum plate thickness is 0.5mm. This makes the heat-dissipating aluminum plate have better thermal conductivity.
[0006] Preferably, the embedded cold water pipe is a five-layer oxygen-barrier cross-linked polyethylene pipe with a diameter of 10mm. This design makes the embedded cold water pipe resistant to oxygen permeation and scaling, thus enhancing the building's lifespan.
[0007] Preferably, the insulation board is an environmentally friendly XPS insulation board with a thickness of 25mm. This allows the insulation board to be both heat-insulating and flame-retardant.
[0008] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0009] In this invention, the addition of a semiconductor heating film enables rapid heating response. By adjusting the load fluctuation of the semiconductor heating film, the operating conditions of the heat pump outdoor unit are improved, allowing it to operate stably at a high-efficiency frequency. Ultimately, even in extreme weather conditions where heating capacity is insufficient, a rapid and stable heating effect can be achieved. Furthermore, by replacing the ordinary gypsum board surface layer of the radiant panel with a semiconductor heating film and decorative materials, rapid assembly installation is achieved. Attached Figure Description
[0010] Figure 1 A schematic diagram of a prefabricated ceiling-mounted radiant panel based on semiconductor heating is provided for this utility model;
[0011] Figure 2 This invention provides a bottom view of a prefabricated ceiling-mounted radiant panel based on semiconductor heating.
[0012] Illustrations: 1. Finishing material; 2. Heat-dampening aluminum plate; 3. Embedded cold water pipe; 4. Semiconductor heating film; 5. Insulation board. Detailed Implementation
[0013] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0014] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification. Example
[0015] Please see Figure 1-2This utility model provides a technical solution: a prefabricated ceiling-mounted radiant panel based on semiconductor heating, comprising a decorative material 1, a heat-dissipating aluminum plate 2 fixedly installed on the decorative material 1, an embedded cold water pipe 3 fixedly installed on the heat-dissipating aluminum plate 2, a semiconductor heating film 4 fixedly installed on the embedded cold water pipe 3, and an insulation board 5 fixedly installed on the semiconductor heating film 4. The decorative material 1 is a waterproof gypsum board, the decorative material reaches B1 flame retardancy, and the thickness of the decorative material 1 is 10mm, making the decorative material 1 resistant to caking. It features anti-mold properties, lower thermal resistance, higher thermal conductivity, and greater robustness. The heat-dissipating aluminum plate 2 is made of graphite plate and aluminum plate with heat-dissipating Ω grooves. The thickness of the heat-dissipating aluminum plate 2 is 0.5mm, which makes the heat-dissipating aluminum plate 2 have better thermal conductivity. The embedded cold water pipe 3 is a five-layer oxygen-barrier cross-linked polyethylene pipe with a diameter of 10mm, which makes the embedded cold water pipe 3 resistant to oxygen permeation and scaling, and enhances the building's lifespan. The insulation board 5 is an environmentally friendly XPS insulation board with a thickness of 25mm, which makes the insulation board 5 flame-retardant while providing insulation.
[0016] Working principle: When the indoor temperature is too low in winter and heating is needed, hot water is first supplied to the embedded cold water pipe 3. Since the heat-dissipating aluminum plate 2 is in close contact with the embedded cold water pipe 3, it will quickly diffuse the heat inside the pipe to the entire aluminum plate surface and transfer the heat to the decorative material 1 to provide heat for the room. When extreme weather occurs in winter, in order to make up for the lack of indoor heat supply, electricity is supplied to the semiconductor heating film 4 to generate additional heat, which is then superimposed with the heat in the original embedded cold water pipe 3, thereby quickly and stably raising the indoor temperature. The heat insulation effect of the insulation board 5 reduces the loss of indoor heat, and finally meets the indoor heating needs.
[0017] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.
Claims
1. A prefabricated ceiling-mounted radiant panel based on semiconductor heating, comprising a finishing material (1), characterized in that: A heat-spreading aluminum plate (2) is fixedly installed on the surface material (1), an embedded cold water pipe (3) is fixedly installed on the surface of the heat-spreading aluminum plate (2), a semiconductor heating film (4) is fixedly installed on the surface of the embedded cold water pipe (3), and a heat insulation board (5) is fixedly installed on the surface of the semiconductor heating film (4).
2. The prefabricated ceiling-mounted radiant panel based on semiconductor heating according to claim 1, characterized in that: The finishing material (1) is a waterproof gypsum board, the finishing material (1) reaches the B1 level of flame retardancy, and the thickness of the finishing material (1) is 10mm.
3. The prefabricated ceiling-mounted radiant panel based on semiconductor heating according to claim 1, characterized in that: The heat-spreading aluminum plate (2) is a heat-conducting plate covered with a graphite plate and an aluminum plate heat-spreading Ω groove, and the thickness of the heat-spreading aluminum plate (2) is 0.5 mm.
4. The prefabricated ceiling-mounted radiant panel based on semiconductor heating according to claim 1, characterized in that: The embedded cold water pipe (3) is a five-layer oxygen-barrier cross-linked polyethylene pipe with a diameter of 10 mm.
5. The prefabricated ceiling-mounted radiant panel based on semiconductor heating according to claim 1, characterized in that: The insulation board (5) is an environmentally friendly XPS insulation board, and the thickness of the insulation board (5) is 25mm.