Interconnection structure between high-speed circuit boards

Abstract

An interconnection structure between high-speed circuit boards comprises a main circuit board and an FMC socket, the FMC socket is installed at the upper end of the main circuit board, the upper end of the FMC socket is connected with an FMC plug in an inserted mode, an FMC connector is installed at the upper end of the main circuit board, and the inner wall of the outer side of the main circuit board is connected with an assembling mechanism. The lower ends of the rubber protruding blocks abut against the surface of the main circuit board, the four corners of the outer frame board are inserted into the clamping grooves of the rubber parts, after the outer frame board and the main circuit board are assembled, the auxiliary circuit board is vertically inserted into the outer frame board, and the interface in the end of the outer frame board is in electrical contact with the contact. When the circuit board works, a reserved opening can be formed between the outer frame plate and the auxiliary circuit board, working heat dissipation of the surface of the main circuit board can be achieved, the circuit boards of different sizes can be stacked and interconnected, and the phenomenon that heat generated in the working process flows slowly is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an interconnection structure between high-speed circuit boards. Background Technology

[0002] With the continuous development of high-performance embedded systems, the requirements for bandwidth, cost, flexibility, and reliability in circuit board interconnection are becoming increasingly stringent. Currently, commonly used high-speed circuit board interconnection methods include standard backplanes such as PXI, CPCI, and VPX. While these high-speed circuit board interconnection methods can meet most design requirements, they are not universally applicable.

[0003] For example, the high-speed circuit board interconnection structure disclosed in CN207834615U solves the problems of complex design and long development cycle of existing high-speed circuit board interconnection structures. It consists of a signal processing board, an FMC connector, a signal generation board, and a system structure. The signal processing board, FMC connector, and signal generation board are set inside the system structure. The FMC connector is located between the signal processing board and the signal generation board and is connected to the signal generation board by a surface mount method. Considering the existing high-speed circuit board interconnection structure, multiple signal processing boards are the same size. When the signal processing boards are stacked and interconnected, the upper signal processing board will block the entire area of ​​the lower board. Air can only circulate through the gap between the two signal processing boards, which easily leads to the inability to quickly dissipate the heat generated by the signal processing board during operation. Summary of the Invention

[0004] This invention aims to solve the problems existing in the prior art by providing an interconnection structure between high-speed circuit boards, which uses signal processing boards of different sizes but the same size for stacked interconnection to reduce the phenomenon of slow heat flow during operation.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows:

[0006] Design a high-speed interconnect structure between circuit boards, including a main circuit board and an FMC socket. The FMC socket is installed on the upper end of the main circuit board, and the upper end of the FMC socket is connected to an FMC plug. An FMC connector is installed on the upper end of the main circuit board, and an assembly mechanism is connected to the inner wall of the outer side of the main circuit board.

[0007] Further improvements include the assembly mechanism comprising a rubber ring and a protrusion. The upper end of the rubber ring is in contact with the main circuit board, the outer wall of the protrusion is in abutted against the main circuit board, the upper end of the rubber ring is fixedly connected to a rubber component, the inner wall of the rubber component is machined with a threaded hole, and the outer wall of the rubber component is fixedly connected to the protrusion.

[0008] To further improve the design, a groove is machined in the middle of the rubber part, and a splicing mechanism is connected to the inner wall of the groove.

[0009] Further improvements include an outer frame plate, the outer wall of which engages with a slot, and contacts installed on the inner wall of the outer frame plate, the outer wall of which is electrically connected to a sub-circuit board.

[0010] As a further improvement, an FMC plug is installed at the lower end of the outer frame plate.

[0011] Further improvements include an output terminal of the FMC plug electrically connected to a contact point, and an outer wall of the sub-circuit board abutting against the outer frame plate.

[0012] The beneficial effects of this utility model are as follows: In this utility model, the lower end of the rubber protrusion is pressed against the surface of the main circuit board, and the four corners of the outer frame plate are inserted into the slots of the rubber parts. After the outer frame plate and the main circuit board are assembled, the sub-circuit board is vertically inserted into the outer frame plate. The interface and contact point at the end of the outer frame plate are in electrical contact. An opening will appear between the outer frame plate and the sub-circuit board, which can play a role in heat dissipation on the surface of the main circuit board. This allows for the stacking and interconnection of circuit boards of different sizes, reducing the phenomenon of slow heat flow during operation. Attached Figure Description

[0013] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0014] Figure 2 for Figure 1 A frontal sectional view;

[0015] Figure 3 for Figure 2 A top-view sectional diagram;

[0016] Figure 4 for Figure 2 Enlarged sectional view of part A in the middle:

[0017] Figure 5 for Figure 2 Enlarged sectional view of section B:

[0018] Figure 6 for Figure 1 Enlarged sectional view of the assembly mechanism.

[0019] Explanation of reference numerals in the attached figures: 1. Main circuit board, 2. FMC socket, 3. FMC plug, 4. FMC connector, 5. Assembly mechanism, 501. Rubber ring, 502. Rubber part, 503. Threaded hole, 504. Protrusion, 6. Slot, 7. Splicing mechanism, 701. Outer frame plate, 702. Contact, 703. Sub-circuit board. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings:

[0021] Example 1:

[0022] See attached document Figure 1-6 In this embodiment, an interconnection structure between high-speed circuit boards includes a main circuit board 1 and an FMC socket 2. The FMC socket 2 is installed on the upper end of the main circuit board 1, and the upper end of the FMC socket 2 is plugged into an FMC plug 3. An FMC connector 4 is installed on the upper end of the main circuit board 1. The FMC connector 4 mainly connects the I / O interface of the FPGA and the I / O interface of the FMC daughter board. An assembly mechanism 5 is connected to the inner wall of the outer side of the main circuit board 1.

[0023] The assembly mechanism 5 includes a rubber ring 501 and a protrusion 504. The lower end of the rubber protrusion 504 abuts against the surface of the main circuit board 1, while the four corners of the outer frame plate 701 are inserted into the slots 6 of the rubber component 502, thus assembling the outer frame plate 701 with the main circuit board 1. The upper end of the rubber ring 501 is in contact with the main circuit board 1, the outer wall of the protrusion 504 abuts against the main circuit board 1, and the upper end of the rubber ring 501 is fixedly connected to the rubber component 502. The inner wall of the rubber component 502 is machined with a threaded hole 503, and the outer wall of the rubber component 502 is fixedly connected to the protrusion 504.

[0024] The rubber part 502 has a groove 6 machined in the middle. The inner wall of the groove 6 is connected to a splicing mechanism 7. The splicing mechanism 7 includes an outer frame plate 701. The outer wall of the outer frame plate 701 is engaged with the groove 6. The inner wall of the outer frame plate 701 is equipped with a contact 702. The outer wall of the contact 702 is electrically connected to the sub-circuit board 703.

[0025] The lower end of the rubber bump 504 presses against the surface of the main circuit board 1. The four corners of the outer frame plate 701 are inserted into the slots 6 of the rubber part 502. After the outer frame plate 701 and the main circuit board 1 are assembled, the sub-circuit board 703 is vertically inserted into the outer frame plate 701. The interface at the end of the outer frame plate 701 is in electrical contact with the contact point 702. An opening will appear between the outer frame plate 701 and the sub-circuit board 703, which can dissipate heat on the surface of the main circuit board 1 and achieve interconnection of circuit boards of different sizes, reducing the phenomenon of slow heat flow during operation.

[0026] An FMC plug 3 is installed at the lower end of the outer frame plate 701. The output end of the FMC plug 3 is electrically connected to the contact 702. The outer wall of the sub-circuit board 703 is pressed against the outer frame plate 701.

[0027] Working principle:

[0028] First, multiple rubber parts 502 are inserted into the four corners of the main circuit board 1. The rubber protrusions 504 on the rubber parts 502 are compressed and deformed, passing through the main circuit board 1 from the bottom, so that the lower ends of the rubber protrusions 504 press against the surface of the main circuit board 1. Simultaneously, the four corners of the outer frame plate 701 are inserted into the slots 6 of the rubber parts 502, assembling the outer frame plate 701 with the main circuit board 1. At the same time, the FMC plug 3 of the outer frame plate 701 is inserted into the FMC socket 2, establishing an electrical connection between the outer frame plate 701 and the main circuit board 1. Depending on the external installation position, external bolts are passed through the threaded holes 503 on the rubber parts 502 to secure the external... The bolts are threaded to the mounting position, and the lower end of the rubber ring 501 fits snugly against the mounting position, providing a cushioning effect during vibration. Finally, the sub-circuit board 703 is vertically inserted into the outer frame plate 701. The protruding part machined on the outside of the sub-circuit board 703 will press against the inner wall of the outer frame plate 701. The interface at the end of the outer frame plate 701 is in electrical contact with the contact point 702, realizing the electrical connection between the outer frame plate 701 and the sub-circuit board 703, so that the main circuit board 1 and the sub-circuit board 703 achieve the interconnection effect. Furthermore, there is an opening between the outer frame plate 701 and the sub-circuit board 703, which can serve to dissipate heat from the surface of the main circuit board 1.

[0029] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. An interconnection structure between high-speed circuit boards, comprising a main circuit board (1) and an FMC socket (2), wherein the FMC socket (2) is mounted on the upper end of the main circuit board (1), characterized in that: The upper end of the FMC socket (2) is connected to the FMC plug (3), the upper end of the main circuit board (1) is equipped with an FMC connector (4), and the inner wall of the outer side of the main circuit board (1) is connected to an assembly mechanism (5).

2. The interconnection structure between high-speed circuit boards according to claim 1, characterized in that: The assembly mechanism (5) includes a rubber ring (501) and a protrusion (504). The upper end of the rubber ring (501) is in contact with the main circuit board (1), and the outer wall of the protrusion (504) is in abutted against the main circuit board (1). The upper end of the rubber ring (501) is fixedly connected to a rubber component (502). The inner wall of the rubber component (502) is machined with a threaded hole (503), and the outer wall of the rubber component (502) is fixedly connected to the protrusion (504).

3. The interconnection structure between high-speed circuit boards according to claim 2, characterized in that: The rubber part (502) has a groove (6) machined in the middle, and the inner wall of the groove (6) is connected to a splicing mechanism (7).

4. The interconnection structure between high-speed circuit boards according to claim 3, characterized in that: The splicing mechanism (7) includes an outer frame plate (701), the outer wall of which is engaged with the slot (6), and a contact (702) is installed on the inner wall of the outer frame plate (701). The outer wall of the contact (702) is electrically connected to the sub-circuit board (703).

5. The interconnection structure between high-speed circuit boards according to claim 4, characterized in that: An FMC plug (3) is installed at the lower end of the outer frame plate (701).

6. The interconnection structure between high-speed circuit boards according to claim 5, characterized in that: The output end of the FMC plug (3) is electrically connected to the contact (702), and the outer wall of the sub-circuit board (703) abuts against the outer frame plate (701).

Images