Photoresist spin-coating device with pre-drying function

Abstract

The utility model discloses a photoresist spin coating device with a pre-drying function. Comprising a vacuum spin-coating box provided with a sealing door, the two ends of the vacuum spin-coating box are connected with a coating unit and a vacuumizing system respectively, a bottom plate is fixedly connected to the inner bottom of the vacuum spin-coating box, the top of the vacuum spin-coating box is connected with a pre-drying mechanical arm, and an electrostatic adsorption supporting table used for mounting a wafer is connected to the bottom plate. According to the photoresist spin-coating device with the pre-drying function, the technical problem that an existing device cannot realize integrated control of vacuum gluing and pre-drying is solved.

Description

Technical Field

[0001] This application relates to the field of photoresist technology, specifically a photoresist spin coating apparatus with a pre-baking function. Background Technology

[0002] In the field of semiconductor micro-nano fabrication, photoresist coating is a critical step that determines device performance. The coating quality of photoresist directly affects pattern transfer accuracy and device reliability, and its uniformity requirements meet stringent standards in advanced processes. Traditional coating processes mainly employ spin coating technology, but it has significant drawbacks: the open working environment is susceptible to contamination by airborne dust particles, leading to pinhole defects in the photoresist film; after coating, it needs to be transferred to an independent oven for pre-baking, resulting in poor process continuity and a high risk of introducing secondary contamination; the centrifugal force generated by high-speed rotation causes uneven distribution of the resist, resulting in overall film thickness deviation and affecting pattern transfer accuracy.

[0003] While existing technologies attempt to address the shortcomings of traditional processes through structural improvements, such as alternating pre-baking and adhesive spraying units to reduce environmental exposure time, open-air operations still cannot completely eliminate airborne particulate contamination. Alternatively, vacuum environments can improve adhesive coating quality, but independent pre-baking processes result in poor process continuity and are prone to introducing secondary contamination. More critically, existing devices fail to achieve integrated control of adhesive coating and pre-baking, particularly lacking dynamic control mechanisms for adhesive flow during high-speed rotation.

[0004] These technological bottlenecks restrict the application of high-end photoresists, and there is an urgent need to develop a new spin coating device that integrates vacuum environment control, dynamic pre-baking, and a dynamic balance electrostatic adsorption support stage. By eliminating contaminant interference through vacuum-sealed operation, suppressing disordered solvent evaporation through dynamic energy regulation, and effectively suppressing centrifugal flow of the adhesive liquid by utilizing the stable rotation control of the dynamic balance electrostatic adsorption support stage, high-precision coating can be achieved. Summary of the Invention

[0005] In view of the above-mentioned problems in the prior art, the purpose of this application is to provide a photoresist spin coating apparatus with a pre-baking function to solve the problems mentioned in the background art.

[0006] The technical solution adopted by this application to solve its technical problem is: a photoresist spin coating device with pre-baking function, including a vacuum spin coating box with a sealed door, the two ends of the vacuum spin coating box are respectively connected to a coating unit and a vacuum system, a base plate is fixedly connected to the bottom of the vacuum spin coating box, the pre-baking robotic arm is connected to the top, and an electrostatic adsorption support platform for mounting wafers is connected to the base plate.

[0007] The pre-baking robotic arm has a lampshade with a filter at its outermost end fixedly connected to its execution end. Several heating light sources are electrically connected inside the lampshade. The heating light sources are located between the bottom wall of the lampshade and the filter. The pre-baking robotic arm is used to move the lampshade to directly above the wafer. The heating light sources transmit radiation energy of a predetermined wavelength to the wafer through the filter.

[0008] Furthermore, the coating unit includes a glue-applying robotic arm mounted on a base plate. The execution end of the glue-applying robotic arm is fixedly connected to a connecting plate, and a coating assembly for applying glue is fixedly connected to the connecting plate. The upper end of the coating assembly is connected to a glue delivery pipe.

[0009] Furthermore, the upper end of the coating assembly is a buffer chamber connected to the adhesive delivery pipe, and the lower end is a nozzle threadedly connected to the buffer chamber.

[0010] Furthermore, the coating unit also includes a metering pump installed on one side of the outer wall of the vacuum spin coater and a storage chamber for storing photoresist. The photoresist delivery pipe is connected to the top of the storage chamber, and both ends of the metering pump are connected to the photoresist delivery pipe.

[0011] Furthermore, a motor is fixedly connected to the bottom of the base plate, and an annular retainer is fixedly connected to the output end of the motor. A bearing is provided between the output end of the motor and the base plate. The top of the retainer is fixedly connected to the bottom of the electrostatic adsorption support platform. A shielding cylinder is detachably connected to the outer peripheral wall of the electrostatic adsorption support platform along the circumferential direction. The wafer is mounted on the electrostatic adsorption support platform, and the retainer and the electrostatic adsorption support platform are concentrically arranged.

[0012] Furthermore, the vacuum system includes a vacuum tube connected to the vacuum spin coating chamber, one end of which is connected to the suction end of a vacuum pump.

[0013] The beneficial effects of this application are: the photoresist spin coating apparatus with pre-baking function provided by this application, by setting a pre-baking robotic arm in the vacuum spin coating box, and installing a heating light source and a filter at its execution end, the heating light source can transmit the radiation energy of a predetermined wavelength through the filter to the wafer, so that the pre-baking energy is precisely matched with the photoresist solvent type and film thickness requirements, and the integrated control of coating and pre-baking can be completed in the same environment, while the heating efficiency can be improved in a vacuum environment;

[0014] By installing a vacuum pump, the coating environment inside the vacuum spin coater is changed to a vacuum, making the entire working environment a closed operation, eliminating contact with outside air, and thus preventing pollution.

[0015] By setting up an electrostatic adsorption support platform, the motor drives its stable rotation, which works in conjunction with electrostatic adsorption to significantly improve film thickness uniformity and eliminate pinhole defects. Furthermore, a shielding cylinder is installed on the outer peripheral wall of the electrostatic adsorption support platform to effectively prevent photoresist from splashing.

[0016] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0018] In the attached diagram:

[0019] Figure 1 This is an overall schematic diagram of the present application;

[0020] Figure 2 This is a side view of the entire application;

[0021] Figure 3 This is a frontal view of the entire application;

[0022] Figure 4 This is a schematic diagram of the interior of the vacuum spin coating chamber of this application;

[0023] Figure 5 This is a schematic diagram of the pre-baking robotic arm of this application;

[0024] Figure 6 This is a schematic diagram of the electrostatic adsorption support platform of this application;

[0025] The following are the labeling elements in the figure:

[0026] 1. Vacuum spin coating box; 11. Base plate; 2. Adhesive coating robot arm; 21. Connecting plate; 3. Pre-baking robot arm; 31. Lamp cover; 32. Heating light source; 33. Filter; 4. Masking cylinder; 41. Motor; 42. Fixture; 43. Electrostatic adsorption support platform; 5. Coating assembly; 51. Nozzle; 52. Buffer chamber; 6. Metering pump; 7. Storage chamber; 71. Adhesive delivery pipe; 8. Vacuum pump; 81. Vacuum tube; 9. Wafer. Detailed Implementation

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0029] like Figure 1-6 As shown, this application provides a technical solution: a photoresist spin coating device with pre-baking function, including a vacuum spin coating box 1 with a sealed door, a coating unit and a vacuum system connected to both ends of the vacuum spin coating box 1 respectively, a base plate 11 fixedly connected to the bottom of the vacuum spin coating box 1, a pre-baking robotic arm 3 connected to the top, and an electrostatic adsorption support stage 43 for mounting wafers 9 connected to the base plate 11.

[0030] The pre-baking robotic arm 3 has a lampshade 31 with a filter 33 at its outermost end fixedly connected to its execution end. Several heating light sources 32 are electrically connected inside the lampshade 31. The heating light sources 32 are located between the bottom wall of the lampshade 31 and the filter 33. The pre-baking robotic arm 3 is used to move the lampshade 31 directly above the wafer 9. The heating light sources 32 can transmit radiation energy of a predetermined wavelength to the wafer 9 through the filter 33. The heating light sources 32 include, but are not limited to, halogen tungsten lamps, xenon lamps, deuterium lamps, and carbon arc lamps.

[0031] The coating unit includes a glue-applying robotic arm 2 mounted on a base plate 11. The execution end of the glue-applying robotic arm 2 is fixedly connected to a connecting plate 21. A coating assembly 5 for applying glue is fixedly connected to the connecting plate 21. The upper end of the coating assembly 5 is connected to a glue delivery pipe 73.

[0032] The upper end of the coating assembly 5 is a buffer chamber 52 connected to the glue delivery pipe 73, and the lower end is a nozzle 51 threadedly connected to the buffer chamber 52.

[0033] The coating unit also includes a metering pump 6 installed on one side of the outer wall of the vacuum spin coater 1 and a storage chamber 7 for storing photoresist. The photoresist delivery pipe 73 is connected to the top of the storage chamber 7, and both ends of the metering pump 6 are connected to the photoresist delivery pipe 73. The photoresist delivery pipe 73, which is close to the side of the vacuum spin coater 1, passes through the outer wall of the vacuum spin coater 1.

[0034] The outer surface of the storage chamber 7 is opaque. Opaqueness includes, but is not limited to, covering the storage chamber 7 with a light-shielding cloth, or using metal materials to make the storage chamber 7 to prevent the photosensitive material in the photoresist from deteriorating when exposed to light.

[0035] A motor 41 is fixedly connected to the bottom of the base plate 11. An annular retainer 42 is fixedly connected to the output end of the motor 41. A bearing is provided between the output end of the motor 41 and the base plate 11. The top of the retainer 42 is fixedly connected to the bottom of the electrostatic adsorption support platform 43. A shielding cylinder 4 is detachably connected to the outer peripheral wall of the electrostatic adsorption support platform 43. The wafer 9 is mounted on the electrostatic adsorption support platform 43. The retainer 42 and the electrostatic adsorption support platform 43 are concentrically arranged. The detachable connection methods include, but are not limited to, threaded connection and snap-fit ​​connection.

[0036] The vacuum system includes a vacuum tube 82 connected to the vacuum spin coating box 1, and one end of the vacuum tube 82 is connected to the suction end of the vacuum pump 8.

[0037] In one embodiment, the device operates on the following principle.

[0038] Specifically, when using this photoresist spin coating apparatus, the sealed door of the vacuum spin coating chamber 1 is closed to form a closed space. The vacuum pump 8 is turned on to extract the air in the vacuum spin coating chamber 1 through the vacuum tube 82. After the vacuum level reaches the standard, the operation state is entered. Before opening the sealed door, the pressure in the vacuum spin coating chamber 1 is released through the vacuum breaker valve. The wafer 9 is placed in the center area of ​​the electrostatic adsorption support platform 43. After closing the sealed door, the vacuum pump 8 is restarted to establish a vacuum environment. Then, the coating assembly 5 is moved directly above the wafer 9 by the coating robot arm 2 to perform photoresist spraying and coating. The metering pump 6 pumps the photoresist in the storage chamber 7 into the buffer chamber 52 through the adhesive delivery pipe 73. After stabilizing the pressure, it is evenly sprayed onto the surface of the wafer 9 through the nozzle 51. The motor 41 is started at low speed to initially cover the surface of the wafer 9 with the adhesive, and then accelerated to high speed to further spread the adhesive evenly.

[0039] The coating robotic arm 2 drives the coating assembly 5 to the wafer 9. Then, the pre-baking robotic arm 3 moves the lamp cover 31 directly above the wafer 9. The heating light source 32 emits an energy beam, which is filtered by the filter 33 and then irradiates the photoresist layer, causing the organic solvent to evaporate. At the same time, the heating efficiency is improved in a vacuum environment. Finally, the motor 41 gradually slows down and stops rotating, the power of the electrostatic adsorption support platform 43 is turned off, and the wafer 9 is released. The vacuum pump 8 maintains the vacuum state and purifies the solvent waste gas generated during pre-baking. After the vacuum is broken and the wafer 9 is removed, the shielding cylinder 4 and the nozzle 51 are disassembled for cleaning and maintenance. During the operation, it is necessary to maintain a stable vacuum environment and avoid air leakage to prevent contamination. Ensure rotation synchronization to prevent uneven centrifugal force from causing film thickness differences. Make sure that the pre-baking energy is precisely matched with the type of photoresist solvent and the film thickness requirements to avoid over-drying or residue.

[0040] In summary, this device, by setting a pre-baking robotic arm 3 inside the vacuum spin coater 1 and installing a heating light source 32 and a filter 33 at its execution end, allows the heating light source 32 to transmit radiation energy of a predetermined wavelength to the wafer 9 through the filter 33. This enables precise matching of pre-baking energy with the type of photoresist solvent and the required film thickness, allowing integrated control of coating and pre-baking to be completed in the same environment. At the same time, the heating efficiency can be improved in a vacuum environment, solving the technical problem that existing devices cannot achieve integrated control of vacuum coating and pre-baking.

[0041] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A photoresist spin coating apparatus with pre-baking function, characterized in that: The vacuum spin coating box (1) is equipped with a sealed door. The two ends of the vacuum spin coating box (1) are respectively connected to a coating unit and a vacuum system. The bottom of the vacuum spin coating box (1) is fixedly connected to a base plate (11), and the top is connected to a pre-baking robotic arm (3). An electrostatic adsorption support platform (43) for mounting wafers (9) is connected to the base plate (11). The pre-baking robotic arm (3) is fixedly connected to a lampshade (31) with a filter (33) at its outermost end. Several heating light sources (32) are electrically connected inside the lampshade (31). The heating light sources (32) are located between the bottom wall of the lampshade (31) and the filter (33). The pre-baking robotic arm (3) is used to move the lampshade (31) to directly above the wafer (9). The heating light sources (32) transmit radiation energy of a predetermined wavelength to the wafer (9) through the filter (33).

2. The photoresist spin coating apparatus with pre-baking function according to claim 1, characterized in that: The coating unit includes a glue-applying robotic arm (2) mounted on a base plate (11). The execution end of the glue-applying robotic arm (2) is fixedly connected to a connecting plate (21). A coating assembly (5) for applying glue is fixedly connected to the connecting plate (21). The upper end of the coating assembly (5) is connected to a glue delivery pipe (71).

3. The photoresist spin coating apparatus with pre-baking function according to claim 2, characterized in that: The upper end of the coating assembly (5) is a buffer chamber (52) connected to the glue delivery pipe (71), and the lower end is a nozzle (51) threadedly connected to the buffer chamber (52).

4. The photoresist spin coating apparatus with pre-baking function according to claim 2, characterized in that: The coating unit also includes a metering pump (6) installed on the outer wall of one side of the vacuum spin coater (1) and a storage chamber (7) for storing photoresist. The photoresist delivery pipe (71) is connected to the top of the storage chamber (7), and both ends of the metering pump (6) are connected to the photoresist delivery pipe (71).

5. The photoresist spin coating apparatus with pre-baking function according to claim 1, characterized in that: A motor (41) is fixedly connected to the bottom of the base plate (11). An annular fixture (42) is fixedly connected to the output end of the motor (41). A bearing is provided between the output end of the motor (41) and the base plate (11). The top of the fixture (42) is fixedly connected to the bottom of the electrostatic adsorption support platform (43). A shielding cylinder (4) is detachably connected to the outer peripheral wall of the electrostatic adsorption support platform (43) along the circumferential direction. The wafer (9) is mounted on the electrostatic adsorption support platform (43). The fixture (42) and the electrostatic adsorption support platform (43) are concentrically arranged.

6. The photoresist spin coating apparatus with pre-baking function according to claim 1, characterized in that: The vacuum system includes a vacuum tube (81) connected to the vacuum spin coater (1), and one end of the vacuum tube (81) is connected to the suction end of a vacuum pump (8).

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