Cleaning device for semiconductor production and processing

Abstract

The utility model relates to the technical field of semiconductor processing and cleaning, and discloses a cleaning device for semiconductor production and processing, which comprises a cleaning mechanism, a drainage pipeline is fixedly arranged at the lower part of one side of the cleaning mechanism, a filtering mechanism is fixedly arranged at one side of the drainage pipeline, and an after-filtering storage box is fixedly arranged at one side of the filtering mechanism. An adjusting mechanism is fixedly arranged on one side of the cleaning mechanism, a clamping mechanism is arranged between the inner sides of the adjusting mechanism, the clamping mechanism comprises multiple sections of lifting rods, connecting rods are fixedly arranged between every two sections of lifting rods up and down, and C-shaped screw rods are fixedly arranged on the front and back sides of one sides of the multiple sections of lifting rods; according to the semiconductor cleaning device, the immersion depth of a semiconductor in the clamping mechanism is adjusted through the adjusting mechanism, so that the semiconductor cleaning device can adapt to the optimal cleaning wettability of different semiconductors, and the cleaning effect is improved while the adaptability is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing and cleaning technology, specifically to a cleaning device for semiconductor production and processing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Their resistivity is extremely sensitive to external conditions such as temperature, light, and doping. Semiconductor technology is the cornerstone of the information society, and its development has driven the leap from consumer electronics to quantum computing. Therefore, semiconductors play an irreplaceable role in fields such as electronics, communications, energy, and medicine.

[0003] Existing semiconductor processing and cleaning methods typically involve placing the semiconductor directly into the cleaning solution using a clamping mechanism and then cleaning the semiconductor surface with ultrasound. However, this method makes it difficult to precisely adjust the tension and wetting level between the semiconductor and the cleaning solution for different semiconductor surfaces, resulting in low semiconductor cleaning efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a cleaning device for semiconductor manufacturing and processing to solve the above-mentioned problems. By adjusting the height of the clamping mechanism through the adjustment mechanism, the height of the clamping mechanism can be adjusted inside the cleaning mechanism after the semiconductor is clamped and fixed, so that different semiconductors can adapt to different surface tensions at different surface depths, thereby achieving the appropriate wettability of the semiconductor material and improving the cleaning effect.

[0005] This utility model achieves the above objectives through the following technical solutions:

[0006] A cleaning apparatus for semiconductor manufacturing includes: a cleaning mechanism, a drainage pipe fixedly disposed on one side of the cleaning mechanism at a lower position, a filtering mechanism fixedly disposed on one side of the drainage pipe, a filter storage box fixedly disposed on one side of the filtering mechanism, an adjusting mechanism fixedly disposed on one side of the cleaning mechanism, and a clamping mechanism disposed between the inner sides of the adjusting mechanism.

[0007] The clamping mechanism includes multiple lifting rods, with connecting rods fixedly installed between each pair of lifting rods at the top and bottom. C-shaped screws are fixedly installed on the front and back of one side of each lifting rod, and threaded elliptical sleeves are threaded onto the shafts of the multiple C-shaped screws.

[0008] Furthermore, the adjustment mechanism includes two support transmission plates, one of which passes through the cleaning mechanism and extends to the outside, and the other is fixedly installed on one side of the inner wall of the cleaning mechanism, with the two support transmission plates at the same height.

[0009] Furthermore, threaded rods are rotatably provided on the top sides of both of the support transmission plates, a motor is fixedly provided on the top side of one of the support transmission plates, and a separator plate is fixedly provided on the upper end of the two threaded rods.

[0010] Furthermore, a clamping ring is fixedly provided at the middle of the upper end of each of the two separator discs, a synchronous belt is provided between the two clamping rings, and one of the two threaded rods is connected to the motor output end.

[0011] Furthermore, the filtration mechanism includes a filtration pipe and a connecting ring, and a particle filter screen, a metal filter screen and an grease filter screen are respectively fixedly arranged laterally on the bottom side of the connecting ring.

[0012] Furthermore, the lengths of the particle filter, metal filter, and grease filter are slightly shorter than those of the filter pipe. One end of the filter pipe is connected to the drainage pipe, and the other end is connected to the post-filter storage tank.

[0013] Furthermore, the cleaning mechanism includes a cleaning frame, and a drain outlet is provided through one side of the cleaning frame at the bottom.

[0014] Furthermore, an inclined plate is fixedly installed on the bottom surface of the cleaning frame, and the inclined plate extends from high to low from the side away from the drain outlet to the side close to the drain outlet.

[0015] Furthermore, the drainage pipe is inclined from one end connected to the cleaning mechanism toward one side of the post-filter storage tank and connected to the filtering mechanism.

[0016] Furthermore, a water transmission pipe is fixedly installed between the cleaning mechanism and the rear side of the filtered storage tank, and a transparent plate is fixedly installed on the side of the filtered storage tank away from the cleaning mechanism.

[0017] In summary, the beneficial effects of this utility model are as follows: by adjusting the height of the clamping mechanism, the semiconductor fixed in the clamping mechanism can be completely immersed in the cleaning liquid, increasing the contact area between the semiconductor and the cleaning liquid. The different depths of immersion of the semiconductor in the cleaning liquid also result in different levels of tension on the semiconductor, thereby adjusting the surface wettability of the semiconductor to improve the cleaning effect. Since different semiconductors can be affected by different tensions, the product can be used to clean different semiconductors by adjusting the mechanism. The fixing by the clamping mechanism also facilitates subsequent removal, improving the cleaning efficiency of the semiconductor.

[0018] Through the cooperation between the drainage pipe and the filtration mechanism, when the cleaning fluid enters the filtration mechanism through the drainage pipe, the inclination of the drainage pipe increases the flow speed of the cleaning fluid, thereby improving the filtration effect of the filtration mechanism on the cleaning fluid. This filters out impurities that are easily generated during the semiconductor cleaning process, making the cleaning fluid reusable and improving its utilization rate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a front view of the present invention;

[0021] Figure 2 This is a side view of the filter storage tank of this utility model;

[0022] Figure 3 This is a side view of the present invention close to the motor shaft;

[0023] Figure 4 This is an axonometric view of the present invention after explosion;

[0024] Figure 5 This is a utility model Figure 4 Enlarged view of point A;

[0025] Figure 6 This is an isometric view of the cleaning mechanism of this utility model when it is not fully installed;

[0026] Figure 7 This is a utility model Figure 6 Enlarged view of point C;

[0027] Figure 8 This is a utility model Figure 6 Enlarged view of point B.

[0028] The annotations in the attached figures are explained as follows:

[0029] 1. Cleaning mechanism; 101. Cleaning frame; 102. Drain outlet; 103. Inclined plate; 2. Drainage pipe; 3. Filtration mechanism; 301. Filtration pipe; 302. Connecting ring; 303. Particle filter screen; 304. Metal filter screen; 305. Grease filter screen; 4. Filtered storage box; 5. Transparent plate; 6. Transmission water pipe; 7. Adjustment mechanism; 701. Support transmission plate; 702. Motor; 703. Threaded rod; 704. Divider plate; 705. Clamping ring; 706. Synchronous belt; 8. Clamping mechanism; 801. Lifting rod; 802. Connecting rod; 803. C-type screw; 804. Threaded oval sleeve. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0031] See Figures 1-6 As shown, this utility model provides a cleaning device for semiconductor manufacturing and processing, including: a cleaning mechanism 1, a drainage pipe 2 fixedly disposed on one side of the cleaning mechanism 1 at a lower position, a filter mechanism 3 fixedly disposed on one side of the drainage pipe 2, a filter storage tank 4 fixedly disposed on one side of the filter mechanism 3, an adjustment mechanism 7 fixedly disposed on one side of the cleaning mechanism 1, a clamping mechanism 8 disposed between the inner sides of the adjustment mechanism 7, the drainage pipe 2 inclined from one end connected to the cleaning mechanism 1 toward one side of the filter storage tank 4 and connected to the filter mechanism 3, a transmission water pipe 6 fixedly disposed between the rear sides of the cleaning mechanism 1 and the filter storage tank 4, and a transparent plate 5 fixedly disposed on the side of the filter storage tank 4 away from the cleaning mechanism 1;

[0032] Using the above technical solution, the cleaning mechanism 1 stores the cleaning fluid and ultrasonic machine, facilitating the cleaning of the semiconductors fixed inside the clamping mechanism 8. The height of the clamping mechanism 8 can be adjusted by the adjustment mechanism 7, allowing different semiconductors to be immersed at different depths in the cleaning fluid. This changes the tension and wettability of the semiconductors after contact with the cleaning fluid, thereby enabling different semiconductors to be cleaned at the optimal immersion depth and improving the cleaning effect. The inclined angle of the drainage pipe 2 makes it easier for the cleaning fluid to flow downwards into the filter pipe 301. The filter pipe 301 filters out particulate matter, metals, and grease that are easily generated during semiconductor cleaning. The filtered fluid is then sent into the post-filter storage tank 4. The cleaning fluid can be observed through the transparent plate 5 to see if it can be reused. If it can be reused, the filtered cleaning fluid is sent back into the cleaning mechanism 1 through the transmission water pipe 6. If it cannot be reused, the cleaning fluid is stored in the post-filter storage tank 4 for centralized processing.

[0033] See Figure 7 As shown, the clamping mechanism 8 includes multiple lifting rods 801, with connecting rods 802 fixedly arranged between each pair of lifting rods 801 at the top and bottom, and C-shaped screws 803 fixedly arranged on one side of each lifting rod 801 at the front and back, and each of the C-shaped screws 803 having a threaded elliptical sleeve 804 threadedly fitted onto its body.

[0034] In use, the gaps between the multiple lifting rods 801 provide space for the C-shaped screws 803. The multiple lifting rods 801 are connected together by two connecting rods 802, and can be lifted and lowered together. The multiple C-shaped screws 803 and the threaded settings on their surfaces are threadedly engaged with the threaded oval sleeves 804 on the rod body. This allows the operator to directly rotate the threaded oval sleeves 804 to hold the semiconductor inside the two threaded oval sleeves 804, thus improving the speed of semiconductor installation.

[0035] See Figure 3 , Figure 6 and Figure 8 As shown, the adjustment mechanism 7 includes two support transmission plates 701. One of the two support transmission plates 701 passes through the cleaning mechanism 1 and extends to the outside, while the other is fixedly installed on one side of the inner wall of the cleaning mechanism 1. The two support transmission plates 701 are at the same height. A threaded rod 703 is rotatably provided on the top side of each of the two support transmission plates 701. A motor 702 is fixedly installed on the top side of one of the support transmission plates 701. A separator plate 704 is fixedly installed on the upper end of each of the two threaded rods 703. A clamping ring 705 is fixedly installed in the middle of the upper end of each of the two separator plates 704. A synchronous belt 706 is provided between the two clamping rings 705. One of the two threaded rods 703 is connected to the output end of the motor 702.

[0036] In the above embodiment, one of the two support transmission plates 701 passes through the cleaning mechanism 1 and extends to the outside, supporting the motor 702 on the outside and supporting one of the two threaded rods 703 on the inside. The other support transmission plate 701 supports the other of the two threaded rods 703. The motor 702 drives one of the threaded rods 703 through the support transmission plate 701. The synchronous belt 706 inside the clamping ring 705 on the top side of the threaded rod 703 causes the two threaded rods 703 to rotate in the same direction, which facilitates the driving of the lifting rod 801 that is threadedly engaged with the threaded rod 703. The height of the lifting rod 801 is adjusted to adapt to the cleaning wettability required by different semiconductors. The threaded rod 703 and the clamping ring 705 are separated by a dividing plate, which also limits the height of the lifting rod 801 on the body of the threaded rod 703.

[0037] See Figures 4-6As shown, the cleaning mechanism 1 includes a cleaning frame 101, with a drain outlet 102 extending through one side of the cleaning frame 101. An inclined plate 103 is fixedly installed on the bottom surface of the cleaning frame 101, extending from high to low from the side away from the drain outlet 102 to the side near the drain outlet 102. The filtering mechanism 3 includes a filtering pipe 301 and a connecting ring 302. A particle filter screen 303, a metal filter screen 304, and a grease filter screen 305 are fixedly installed laterally on the bottom side of the connecting ring 302. The front-to-back length of the particle filter screen 303, the metal filter screen 304, and the grease filter screen 305 is slightly less than that of the filtering pipe 301. One end of the filtering pipe 301 is connected to the drainage pipe 2, and the other end is connected to the filtered storage tank 4.

[0038] In use, the cleaning solution is stored in the cleaning frame 101. The impurities after semiconductor cleaning are tilted to one side by the inclined plate 103, so that the impurities can be transported out through the drain port 102. The three filters in the filtration mechanism 3 adsorb and filter the particulate matter, metals and grease that are easily generated during semiconductor cleaning, thereby improving the filtration effect of the cleaning solution. Finally, it is sent into the filter storage tank 4. The transparent plate 5 on one side of the filter storage tank 4 can be used to check whether it can be recycled.

[0039] Using the above structure, when it is necessary to clean the semiconductor surface, firstly, the output end of the motor 702 in the adjustment mechanism 7 drives one of the threaded rods 703 to rotate, and through the synchronous belt 706 between the clamping rings 705 on the top side of the two threaded rods 703, the two threaded rods 703 rotate in the same direction. During this process, the height of the lifting rod 801 is raised by the thread engagement, and it floats out of the surface of the cleaning mechanism 1. Then, the operator rotates the threaded elliptical sleeve 804 on the surface of the C-shaped screw 803 to separate the distance between the two threaded elliptical sleeves 804, so that the operator can place the semiconductor between the two threaded elliptical sleeves 804. After the semiconductor is placed inside the two threaded elliptical sleeves 804, the motor 702 rotates in the opposite direction, so that the entire clamping mechanism 8 sinks back into the lower position inside the cleaning mechanism 1, so that the semiconductor is completely submerged in the water inside the cleaning mechanism 1, and the semiconductor is cleaned by the commonly used ultrasonic cleaning machine.

[0040] After cleaning is completed, the motor 702 drives the clamping mechanism 8 to rise, making it easier for workers to remove the cleaned semiconductor. After the semiconductor cleaning operation is completed, the discharge of cleaning fluid from the cleaning mechanism 1 can be controlled by whether the inlet of the filter storage tank 4 is open. When the cleaning fluid needs to be filtered, the inlet of the filter storage tank 4 is opened. At this time, the cleaning fluid inside the cleaning mechanism 1 is transported to the filter storage tank 4 through the filtration mechanism 3 via the inclined drainage pipe 2. When the cleaning fluid passes through the filtration mechanism 3, the particle filter 303, metal filter 304 and grease filter 305 in the filtration mechanism 3 filter the impurities that are easy to clean and generate in the semiconductor. After the cleaning fluid enters the filter storage tank 4, the state of the cleaning fluid can be directly checked through the transparent plate 5 to see if it can still be used. When the cleaning fluid can be recycled, it is transported back to the cleaning mechanism 1 through the transmission water pipe 6. When it cannot be reused, the cleaning fluid in the filter storage tank 4 is centrally processed.

[0041] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A cleaning apparatus for semiconductor manufacturing and processing, characterized in that, include: A cleaning mechanism (1) is provided with a drainage pipe (2) fixedly installed on one side of the cleaning mechanism (1) at a lower position. A filter mechanism (3) is fixedly installed on one side of the drainage pipe (2). A filter storage box (4) is fixedly installed on one side of the filter mechanism (3). An adjustment mechanism (7) is fixedly installed on one side of the cleaning mechanism (1). A clamping mechanism (8) is provided between the inner sides of the adjustment mechanism (7). The clamping mechanism (8) includes multiple lifting rods (801), with connecting rods (802) fixedly installed between each pair of lifting rods (801) at the top and bottom, and C-shaped screws (803) fixedly installed on the front and back sides of one side of the multiple lifting rods (801), with threaded elliptical sleeves (804) threadedly fitted onto the shafts of the multiple C-shaped screws (803). The adjustment mechanism (7) includes two support transmission plates (701), one of which passes through the cleaning mechanism (1) and extends to the outside, and the other is fixedly set on one side of the inner wall of the cleaning mechanism (1). The two support transmission plates (701) are at the same height. Both of the support transmission plates (701) are rotatably provided with threaded rods (703) on their top sides, and a motor (702) is fixedly provided on the top side of one of the support transmission plates (701). A separator plate (704) is fixedly provided on the upper end of the rod of both of the threaded rods (703). A clamping ring (705) is fixedly provided at the middle of the upper end of each of the two separators (704), and a synchronous belt (706) is provided between the two clamping rings (705). One of the two threaded rods (703) is connected to the output end of the motor (702).

2. The cleaning apparatus for semiconductor manufacturing and processing according to claim 1, characterized in that: The filtration mechanism (3) includes a filtration pipe (301) and a connecting ring (302). A particle filter (303), a metal filter (304), and an grease filter (305) are respectively fixedly arranged on the bottom side of the connecting ring (302).

3. The cleaning apparatus for semiconductor manufacturing and processing according to claim 2, characterized in that: The lengths of the particle filter (303), metal filter (304) and grease filter (305) are slightly shorter than those of the filter pipe (301). One end of the filter pipe (301) is connected to the drainage pipe (2), and the other end is connected to the filter storage box (4).

4. The cleaning apparatus for semiconductor manufacturing and processing according to claim 1, characterized in that: The cleaning mechanism (1) includes a cleaning frame (101), and a drain outlet (102) is provided through one side of the cleaning frame (101) at the bottom.

5. The cleaning apparatus for semiconductor manufacturing and processing according to claim 4, characterized in that: An inclined plate (103) is fixedly installed on the bottom surface of the cleaning frame (101). The inclined plate (103) extends from high to low from the side away from the drain outlet (102) to the side close to the drain outlet (102).

6. The cleaning apparatus for semiconductor manufacturing and processing according to claim 1, characterized in that: The drainage pipe (2) is inclined from one end connected to the cleaning mechanism (1) toward one side of the filter storage tank (4) and connected to the filter mechanism (3).

7. The cleaning apparatus for semiconductor manufacturing and processing according to claim 1, characterized in that: A water pipe (6) is fixedly installed between the cleaning mechanism (1) and the rear side of the filter storage box (4), and a transparent plate (5) is fixedly installed on the side of the filter storage box (4) away from the cleaning mechanism (1).

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