Semiconductor high-speed trimming and forming equipment

Abstract

The utility model relates to the technical field of semiconductor chip production, in particular to semiconductor high-speed rib cutting and forming equipment which comprises a machine shell, a machine table large plate is fixedly connected to the rear side of an inner cavity of the machine shell, a feeding large plate is fixedly connected to the front side of the machine table large plate, and a material sheet gripper is arranged at the top of the feeding large plate. A feeding rail is arranged on the left side of the top of the large feeding plate, two material piece clips are fixedly connected to the bottom of the large feeding plate, and two material jacking motors are fixedly connected to the rear side of the bottom of the large feeding plate. The automatic feeding device has the advantages of being high in automation degree, accurate in feeding and compact in structure, in the actual using process, the whole process from material piece clip feeding, material piece grabbing, feeding track feeding, stepping type feeding, punching forming and product and waste separation is automatically operated, manual intervention is reduced, production efficiency is improved, labor cost is reduced, and the production efficiency is improved. Meanwhile, errors possibly caused by manual operation are avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip manufacturing technology, specifically to a high-speed semiconductor lead cutting and forming equipment. Background Technology

[0002] Semiconductors are materials with specific electrical properties, whose conductivity lies between that of conductors and insulators. They are an indispensable basic material for electronic devices. The conductivity of semiconductors can be controlled by applying external conditions such as current, voltage, or light. This property enables semiconductors to play a key role in electronic devices. Adding trace amounts of impurities to pure semiconductor materials can significantly change their conductivity. Utilizing this property, various semiconductor devices for different purposes can be manufactured.

[0003] Many aspects of the existing production process still heavily rely on manual operation. Steps such as feeding materials and adjusting feeding parameters require manual intervention. However, manual operation has inherent limitations. It is relatively slow, and prolonged repetitive work can easily lead to fatigue, resulting in frequent operational errors. This not only significantly reduces production efficiency and makes it difficult to meet the stringent requirements of high-efficiency output in large-scale production, but also makes it difficult for existing technology to precisely control the feeding position and speed of materials in the material conveying process. This lack of control precision makes it easy for the materials to deviate from their position when they are conveyed to the processing position. Once the material is deviated, the processing accuracy will inevitably be affected, ultimately leading to a significant increase in the product defect rate. In addition, the existing equipment structure layout lacks compactness, and the cooperation between components is not tight and orderly, resulting in an excessively large overall equipment footprint. In the limited space of the production workshop, the installation and use of the equipment are greatly restricted, which not only increases the difficulty of workshop layout but may also affect the smoothness and efficiency of the entire production process. Utility Model Content

[0004] The purpose of this invention is to provide a high-speed semiconductor lead cutting and forming equipment, which has the advantages of high automation, precise feeding and compact structure, and solves the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-speed semiconductor bead cutting and forming device, comprising a housing, a large platform fixedly connected to the rear side of the inner cavity of the housing, a feeding plate fixedly connected to the front side of the large platform, a material gripper provided on the top of the feeding plate, a feeding track provided on the left side of the top of the feeding plate, two material clips fixedly connected to the bottom of the feeding plate, two ejector motors fixedly connected to the rear side of the bottom of the feeding plate, a bead cutting and forming mold fixedly connected to the top of the large platform, two support columns fixedly connected to the left side of the top of the large platform, a stamping head fixedly connected to the top of the two support columns, a placement frame fixedly connected to the bottom of the large platform, and a receiving box slidably connected to the inner cavity of the placement frame.

[0006] Furthermore, as a preferred embodiment of this utility model, a door is rotatably connected to the front surface of the housing, and a handle is fixedly connected to the front surface of the door.

[0007] Furthermore, as a preferred embodiment of this utility model, a through hole is provided at the bottom of the front surface of the housing, and a fan is fixedly connected to the inner cavity of the through hole.

[0008] Furthermore, as a preferred embodiment of this utility model, each of the four corners of the bottom of the housing is fixedly connected to a support leg, and the four support legs are arranged symmetrically.

[0009] Furthermore, as a preferred embodiment of this utility model, four casters are fixedly connected to the four corners of the bottom of the housing.

[0010] Beneficial effects: The technical solution of this application has the following technical effects: This utility model has the advantages of high automation, precise feeding and compact structure. In actual use, from feeding the sheet into the clip, picking up the sheet, feeding along the feeding track, step feeding to punching and forming and separation of products and waste, the whole process is automated, reducing manual intervention, improving production efficiency, reducing labor costs, and avoiding errors that may be caused by manual operation. By using a servo motor to drive the belt feeding and subsequent precise control of the servo motor to achieve step feeding, it can ensure that the sheet is accurately and stably delivered to the processing position of the rebar forming mold, ensuring processing accuracy and improving the product yield. The layout of each component of the equipment is reasonable, and the components such as the machine base plate, feeding plate, rebar forming mold, stamping head, and receiving box are closely matched, making the overall structure of the equipment compact, occupying a small area, and easy to install and use in the production workshop.

[0011] It should be understood that all combinations of the foregoing concepts and the additional concepts described in more detail below can be considered as part of the utility model subject matter of this disclosure, provided that such concepts do not contradict each other. Attached Figure Description

[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a side view of the structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the internal structure of this utility model.

[0016] The meanings of the various labels in the diagram are as follows: 1. Machine housing; 2. Machine base plate; 3. Feed plate; 4. Material gripper; 5. Feeding track; 6. Material clip; 7. Top material motor; 8. Beam forming mold; 9. Support column; 10. Stamping head; 11. Placement rack; 12. Material receiving box; 13. Box door; 14. Handle; 15. Through hole; 16. Fan; 17. Support leg; 18. Caster wheel. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. To better understand the technical content of the present utility model, specific embodiments are provided and described in conjunction with the accompanying drawings. Various aspects of the present utility model are described in this disclosure with reference to the accompanying drawings, which show many illustrative embodiments. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0018] As attached Figure 1 To be continued Figure 3 As shown: This embodiment provides a high-speed semiconductor lead cutting and forming equipment, including a housing 1. A large machine plate 2 is fixedly connected to the rear side of the inner cavity of the housing 1. A feeding plate 3 is fixedly connected to the front side of the large machine plate 2. A material gripper 4 is provided on the top of the feeding plate 3. A feeding track 5 is provided on the left side of the top of the feeding plate 3. Two material clips 6 are fixedly connected to the bottom of the feeding plate 3. Two top-loading motors 7 are fixedly connected to the rear side of the bottom of the feeding plate 3. A lead cutting and forming mold 8 is fixedly connected to the top of the large machine plate 2. Two support columns 9 are fixedly connected to the left side of the top of the large machine plate 2. A stamping head 10 is fixedly connected to the top of the two support columns 9. A placement rack 11 is fixedly connected to the bottom of the large machine plate 2. A receiving box 12 is slidably connected to the inner cavity of the placement rack 11.

[0019] Specifically, a door 13 is rotatably connected to the front surface of the housing 1, and a handle 14 is fixedly connected to the front surface of the door 13.

[0020] In this embodiment, the cooperation between the door 13 and the handle 14 enables the door 13 to be rotated, making it easier for the user to take out the materials inside the housing 1.

[0021] Specifically, a through hole 15 is provided at the bottom of the front surface of the housing 1, and a fan 16 is fixedly connected to the inner cavity of the through hole 15.

[0022] In this embodiment, the combined use of through hole 15 and fan 16 serves to dissipate heat from the inner cavity of housing 1, thereby extending the service life of the rebar cutting and forming equipment.

[0023] Specifically, support legs 17 are fixedly connected to the four corners of the bottom of the casing 1, and the four support legs 17 are arranged symmetrically.

[0024] In this embodiment, the support leg 17 serves to support the rebar cutting and forming equipment, thereby improving the stability of the equipment during placement.

[0025] Specifically, four casters 18 are fixedly connected to the four corners of the bottom of the casing 1.

[0026] In this embodiment, the universal wheels 18 are used to move the rebar cutting and forming equipment, thereby improving the flexibility of the equipment.

[0027] The working principle and usage process of this utility model are as follows: The operator manually places the wafer clip 6 containing semiconductor wafers into the corresponding position at the bottom of the feeding plate 3 inside the equipment, completing the feeding preparation. The wafer gripper 4 at the top of the feeding plate 3 is activated, accurately grabbing a single wafer from the wafer clip 6. The wafer gripper 4 moves the grabbed wafer from the wafer clip 6 position and places it on the feeding track 5 on the top left side of the feeding plate 3. The servo motor driving the belt on the feeding track 5 stably conveys the wafer along the track until the wafer reaches the predetermined stop position. After the wafer reaches the stop position, the servo motor... Precise control enables step-by-step feeding of the sheet material, ensuring that the sheet material can be accurately and stably delivered to the processing position of the lead-cutting forming die 8. When the sheet material is delivered to the lead-cutting forming die 8, the punch head 10 at the top of the machine plate 2 moves downward in the Z-axis direction, cooperating with the lead-cutting forming die 8 to perform high-speed and precise punching operation on the sheet material, completing the lead-cutting forming of the semiconductor product. After punching and forming, the formed product enters the receiving box 12 at the bottom of the machine plate 2 through a specific channel for unified collection; while the waste frame is pushed out from the side of the equipment through the side sheet ejection mechanism of the machine plate, realizing the separation of product and waste.

[0028] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0029] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A high-speed semiconductor lead cutting and forming device, comprising a housing (1), characterized in that: The machine housing (1) is fixedly connected to the rear side of the inner cavity of the machine platform plate (2), and the machine platform plate (2) is fixedly connected to the front side of the machine platform plate (2). The top of the machine platform plate (3) is provided with a material gripper (4), and the left side of the top of the machine platform plate (3) is provided with a feeding track (5). The bottom of the machine platform plate (3) is fixedly connected with two material clips (6). The rear side of the bottom of the machine platform plate (3) is fixedly connected with two top material motors (7). The top of the machine platform plate (2) is fixedly connected with a rib forming mold (8). The left side of the top of the machine platform plate (2) is fixedly connected with two support columns (9). The top of the two support columns (9) is fixedly connected with a stamping head (10). The bottom of the machine platform plate (2) is fixedly connected with a placement rack (11). The inner cavity of the placement rack (11) is slidably connected with a receiving box (12).

2. The semiconductor high-speed lead cutting and forming equipment according to claim 1, characterized in that: A door (13) is rotatably connected to the front surface of the housing (1), and a handle (14) is fixedly connected to the front surface of the door (13).

3. The semiconductor high-speed lead cutting and forming equipment according to claim 1, characterized in that: A through hole (15) is provided at the bottom of the front surface of the housing (1), and a fan (16) is fixedly connected to the inner cavity of the through hole (15).

4. The semiconductor high-speed lead cutting and forming equipment according to claim 1, characterized in that: The four corners of the bottom of the housing (1) are fixedly connected with support legs (17), and the four support legs (17) are arranged symmetrically.

5. The semiconductor high-speed lead cutting and forming equipment according to claim 1, characterized in that: The four corners of the bottom of the housing (1) are fixedly connected with casters (18), and the number of casters (18) is four.

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