A thermoelectric power generation device with a firepot

Abstract

A thermoelectric power generation device with a furnace includes a furnace head disposed in the middle of an upper bracket. The upper bracket includes support legs connected to a base ring. A heat-conducting structure is disposed beside the furnace head. The top of the heat-conducting structure is connected to the upper bracket, and the bottom of the heat-conducting structure extends downward and connects to a power generation component located below the furnace head. The power generation component includes a heat-absorbing plate, a heat-dissipating structure, and one or more semiconductor chips. One side of the heat-absorbing plate is tightly fitted to the heat-conducting structure, the other side of the heat-absorbing plate is tightly fitted to one side of the semiconductor chip, and the other side of the semiconductor chip is tightly fitted to the heat-dissipating structure. The heat-conducting structure includes a bracket, which includes a heat-conducting ring and heat-conducting columns surrounding the outside of the furnace head and close to the furnace head. The heat-conducting ring and the base ring are connected as a single unit by a first screw. This invention features high power generation efficiency.

Description

Technical Field

[0001] This invention relates to a thermoelectric generator, and more particularly to a thermoelectric generator with a furnace. Background Technology

[0002] Chinese Patent Document No. CN 115264539 A, published on November 1, 2022, discloses a furnace body structure including a furnace body assembly and a power generation assembly. The furnace body assembly includes a connecting plate for supporting a furnace tray, and the edge of the connecting plate has multiple folding legs. When the multiple folding legs are unfolded, an accommodating space is formed between the lower part of the connecting plate and the multiple folding legs. The power generation assembly is disposed within the accommodating space and includes a mounting plate and a semiconductor cooling chip. A first side of the mounting plate has a mounting component for connecting to the connecting plate, and a second side is connected to the hot end face of the semiconductor cooling chip. In this furnace body structure, the power generation assembly is relatively far from the furnace body assembly, and heat is transferred by thermal radiation, resulting in low heat utilization and user dissatisfaction, requiring improvement. Summary of the Invention

[0003] The purpose of this invention is to provide a thermoelectric power generation device with a furnace that has high power generation efficiency, in order to overcome the shortcomings of the prior art.

[0004] A thermoelectric generator with a furnace designed for this purpose includes a furnace head disposed in the middle of an upper bracket. The upper bracket includes a support leg connected to a base ring. The structural feature is that a heat-conducting structure is disposed beside the furnace head. The top of the heat-conducting structure is connected to the upper bracket, and the bottom of the heat-conducting structure extends downward and connects to a power generation component located below the furnace head. The power generation component includes a heat-absorbing plate, a heat dissipation structure, and one or more semiconductor chips. One side of the heat-absorbing plate is tightly fitted to the heat-conducting structure, the other side of the heat-absorbing plate is tightly fitted to one side of the semiconductor chip, and the other side of the semiconductor chip is tightly fitted to the heat dissipation structure.

[0005] Furthermore, the heat-conducting structure includes a support, the support including a heat-conducting ring and a heat-conducting column surrounding the outside of the burner head and close to the burner head, the heat-conducting ring and the base ring being connected as one unit by a first screw, one end of the heat-conducting column being connected to the heat-conducting ring, and the other end of the heat-conducting column being connected to one side of the heat-absorbing plate as one unit by a first locking screw;

[0006] Alternatively, the heat-conducting structure includes a heat-conducting column surrounding the outside of the burner head and close to the burner head, one end of the heat-conducting column being integrally connected to the base ring by a second locking screw, and the other end of the heat-conducting column being integrally connected to one side of the heat-absorbing plate by a third locking screw.

[0007] Furthermore, the thermoelectric power generation device with a furnace also includes a housing, which is disposed on the outer periphery of the power generation component and maintains a certain distance from the power generation component.

[0008] Furthermore, the heat-absorbing plate is provided with a heat insulation plate with a first assembly hole, the outer shell is provided with a second assembly hole in the middle, the outer shell is sleeved on the outside of the heat insulation plate, the top of the inner wall of the outer shell is pressed against the heat insulation plate, the first assembly hole and the second assembly hole are connected, and the other end of the heat-conducting column passes through the second assembly hole and the first assembly hole in sequence and is connected to one side of the heat-absorbing plate.

[0009] Furthermore, the first mounting hole is located in the middle of the second mounting hole.

[0010] Furthermore, the heat dissipation structure includes a heat sink and a cooling fan. The other side of the semiconductor chip is tightly attached to one side of the heat sink, the other side of the heat sink is connected to the air inlet of the cooling fan, and the air outlet of the cooling fan is connected to the outside.

[0011] Furthermore, the cooling fan is mounted on the lower support plate, and the lower support plate is provided with an air outlet. The bottom of the outer shell is connected to the lower support plate to form a cavity. The outer wall of the outer shell is provided with one or more ventilation holes, which are located on the outside of the radiator. The radiator is provided with a heat dissipation channel. The ventilation holes of the outer shell, the heat dissipation channel of the radiator, the air inlet of the cooling fan, the air outlet of the cooling fan, and the air outlet of the lower support plate are sequentially connected.

[0012] Furthermore, the thermoelectric power generation device with a furnace is characterized by further including a support plate, through which the cooling fan is connected to the other side of the radiator.

[0013] Furthermore, the outer shell has a circular cross-section, and the lower support plate is correspondingly arranged therewith. A lower support leg is arranged below the lower support plate and connected thereto; the lower support leg is inserted into or hinged to the lower support plate.

[0014] Furthermore, the connection point between the lower support leg and the lower support plate is located on the outside of the cooling fan.

[0015] Furthermore, the support leg is hinged to the base ring, and the folded support leg is housed on the base ring. An outer cover is provided on the outer shell. The base ring, the folded support leg, the furnace head, and the heat-conducting structure are located within the outer cover. The bottom of the outer cover is pressed against the top of the outer shell. The bottom of the outer cover is provided with one or more locking feet, and the top of the outer shell is provided with one or more corresponding insertion slots. The locking feet are inserted into the insertion slots and locked in the insertion slots. The lower support leg, which is hinged to the lower support plate, is folded and housed within the outer shell.

[0016] Furthermore, a water-cooling box is provided on the inner side of the outer shell, one side of the outer wall of the water-cooling box is in close contact with the inner wall of the outer shell, and the other side of the outer wall of the water-cooling box is in close contact with the outer wall of the radiator. An opening is provided at the top of the water-cooling box, and a water injection hole connected to the upper opening of the water-cooling box is provided at the top of the outer shell and at the position outside the outer cover.

[0017] In this invention, a burner head is located in the middle of the upper bracket, and a heat-conducting structure is located next to the burner head. The top of the heat-conducting structure is connected to the upper bracket, and the bottom of the heat-conducting structure extends downward and connects to a power generation component located below the burner head. The power generation component includes a heat-absorbing plate, a heat dissipation structure, and one or more semiconductor chips. One side of the heat-absorbing plate is tightly attached to the heat-conducting structure, the other side of the heat-absorbing plate is tightly attached to one side of the semiconductor chip, and the other side of the semiconductor chip is tightly attached to the heat dissipation structure. The heat is absorbed by the upper bracket through direct contact with the heat-conducting structure, and then directly transferred to the heat-absorbing plate connected to it. The heat transfer from the upper bracket to the heat-conducting structure, and then from the heat-conducting structure to the heat-absorbing plate, is mainly carried out by heat conduction, thus greatly improving the heat transfer efficiency compared to heat radiation. Due to the improved heat transfer efficiency, the power generation efficiency is also correspondingly improved.

[0018] The heat-conducting structure of this invention includes a support frame, which comprises a heat-conducting ring and a heat-conducting column surrounding the outside of the burner head and close to the burner head. The heat-conducting ring and the base ring are integrally connected by a first screw. One end of the heat-conducting column is connected to the heat-conducting ring, and the other end of the heat-conducting column is integrally connected to one side of the heat-absorbing plate by a first locking screw. Alternatively, the heat-conducting structure includes a heat-conducting column surrounding the outside of the burner head and close to the burner head. One end of the heat-conducting column is integrally connected to the base ring by a second locking screw, and the other end of the heat-conducting column is integrally connected to one side of the heat-absorbing plate by a third locking screw. By using two different combinations of heat-conducting structures, it is possible to better adapt to different user environments, thereby improving the application scenarios of this product.

[0019] In this invention, the support leg is hinged to the base ring, and the folded support leg is stored on the base ring. An outer cover is provided on the outer shell, and the base ring, the folded support leg, the burner head, and the heat-conducting structure are located within the outer cover. The bottom of the outer cover is pressed against the top of the outer shell, and the bottom of the outer cover is provided with one or more locking feet. The top of the outer shell is provided with one or more corresponding insertion slots, and the locking feet are inserted into and locked in the insertion slots. The lower support leg, which is hinged to the lower support plate, is folded and stored within the outer shell. When not in use, the outer cover can be used to fit the base ring, the folded support leg, the burner head, and the heat-conducting structure together, and the outer cover and the outer shell can be locked together as one unit, thereby facilitating the user's carrying and storage of this product.

[0020] The present invention can also provide a water-cooling box inside the outer shell. Water can be injected into the water-cooling box through the water injection hole on the outer shell, which can reduce the temperature of the heat sink when the product is working, thereby improving the power generation efficiency of the product.

[0021] In summary, this invention features high power generation efficiency. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the first embodiment of the present invention.

[0023] Figure 2 This is an exploded structural diagram of the present invention.

[0024] Figure 3 This is a three-dimensional structural diagram of the present invention after the outer shell has been removed.

[0025] Figure 4 This is a schematic diagram of the disassembled and enlarged structure of the power generation component.

[0026] Figure 5 This is a three-dimensional enlarged structural diagram of the heat sink.

[0027] Figure 6 This is a front-view stereoscopic structural diagram of the second embodiment of the present invention.

[0028] Figure 7 This is a bottom-view three-dimensional structural diagram of the second embodiment of the present invention.

[0029] Figure 8 This is an exploded structural diagram of the second embodiment of the present invention.

[0030] In the diagram: 1 is the upper bracket, 1.1 is the base ring, 1.2 is the support foot, 2 is the furnace head, 3 is the first screw, 4 is the charging interface end, 5 is the bracket, 5.1 is the heat-conducting ring, 5.2 is the heat-conducting column, 6 is the second screw, 7 is the outer shell, 7.1 is the second mounting hole, 7.2 is the ventilation hole, 8 is the lower support leg, 9 is the gas pipe, 10 is the gas tank, 11 is the heat insulation plate, 11.1 is the first mounting hole, 12 is the heat absorption plate, 13 is the heat sink, 14 is the bracket plate, 15 is the cooling fan, 16 is the lower support plate, 16.1 is the air outlet, and 17 is the semiconductor chip.

[0031] In the diagram: 1 is the upper bracket, 1.1 is the base ring, 1.2 is the support foot, 2 is the furnace head, 3 is the first screw, 4 is the charging interface end, 5 is the bracket, 5.1 is the heat-conducting ring, 5.2 is the heat-conducting column, 6 is the second screw, 7 is the outer shell, 7.1 is the second mounting hole, 7.2 is the ventilation hole, 7.3 is the water filling hole, 7.4 is the insertion slot, 8 is the lower support leg, 9 is the gas pipe, 10 is the gas tank, 11 is the heat insulation plate, 11.1 is the first mounting hole, 12 is the heat absorption plate, 13 is the heat sink, 14 is the bracket plate, 15 is the cooling fan, 16 is the lower support plate, 16.1 is the air outlet, 17 is the semiconductor chip, 20 is the outer cover, 20.1 is the clip, and 21 is the water cooling box. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0033] First Embodiment

[0034] See Figures 1-5 A thermoelectric generator with a furnace includes a furnace head 2 disposed in the middle of an upper bracket 1. The upper bracket 1 includes a support leg 1.2 connected to a base ring 1.1. A heat-conducting structure is disposed next to the furnace head 2. The top of the heat-conducting structure is connected to the upper bracket 1, and the bottom of the heat-conducting structure extends downward and is connected to a power generation component located below the furnace head 2. The power generation component includes a heat-absorbing plate 12, a heat dissipation structure, and one or more semiconductor chips 17. One side of the heat-absorbing plate 12 is tightly attached to the heat-conducting structure, the other side of the heat-absorbing plate 12 is tightly attached to one side of the semiconductor chip 17, and the other side of the semiconductor chip 17 is tightly attached to the heat dissipation structure.

[0035] In this embodiment, there are four semiconductor chips 17, such as... Figure 4 As shown, it is laid flat on the heat dissipation structure.

[0036] In this embodiment, the upper bracket 1 can be made of stainless steel.

[0037] In this embodiment, the heat-conducting structure includes a support 5, which includes a heat-conducting ring 5.1 and a heat-conducting column 5.2 surrounding the outside of the burner head 2 and close to the burner head 2. The heat-conducting ring 5.1 is connected to the base ring 1.1 by a first screw 2. One end of the heat-conducting column 5.2 is connected to the heat-conducting ring 5.1, and the other end of the heat-conducting column 5.2 is connected to one side of the heat-absorbing plate 12 by a first locking screw. Alternatively, the heat-conducting structure includes a heat-conducting column 5.2 surrounding the outside of the burner head 2 and close to the burner head 2. One end of the heat-conducting column 5.2 is connected to the base ring 1.1 by a second locking screw, and the other end of the heat-conducting column 5.2 is connected to one side of the heat-absorbing plate 12 by a third locking screw.

[0038] In this embodiment, the heat-conducting pillar 5.2 can be made of copper, and the heat-conducting ring 5.1 can be made of copper plate or aluminum plate.

[0039] The thermoelectric generator with a furnace also includes a housing 7, which is disposed on the outer periphery of the power generation component and maintains a certain distance from the power generation component.

[0040] The heat-absorbing plate 12 is provided with a heat insulation plate 11 having a first mounting hole 11.11. The outer shell 7 is provided with a second mounting hole 7.1 in the middle. The outer shell 7 is sleeved on the outside of the heat insulation plate 11. The top of the inner wall of the outer shell 7 is pressed against the heat insulation plate 11. The first mounting hole 11.11 is connected to the second mounting hole 7.1. The other end of the heat-conducting column 5.2 passes through the second mounting hole 7.1 and the first mounting hole 11.11 in sequence and then connects to one side of the heat-absorbing plate 12.

[0041] In this embodiment, the heat insulation board 11 can be made of mica board.

[0042] In this embodiment, the heat absorption plate 12 can be made of copper or aluminum.

[0043] In practice, when the heat-conducting column 5.2 is made of copper, it can be brazed to the heat-absorbing plate 12, or it can be connected to the plate using the third locking screw.

[0044] The first mounting hole 11.11 is located in the middle of the second mounting hole 7.1.

[0045] The heat dissipation structure includes a heat sink 13 and a cooling fan 15. The other side of the semiconductor chip 17 is tightly attached to one side of the heat sink 13. The other side of the heat sink 13 is connected to the air inlet of the cooling fan 15. The air outlet of the cooling fan 15 is connected to the outside.

[0046] In this embodiment, the heat sink 13 is provided with strip-shaped...

[0047] The cooling fan 15 is mounted on the lower support plate 16, which has an air outlet 16.1. The bottom of the outer casing 7 is connected to the lower support plate 16 to form a cavity. The outer wall of the outer casing 7 has one or more ventilation holes 7.2 located on the outside of the radiator 13. The radiator 13 has a heat dissipation channel. The ventilation hole 7.2 of the outer casing 7, the heat dissipation channel of the radiator 13, the air inlet of the cooling fan 15, the air outlet of the cooling fan 15, and the air outlet 16.1 of the lower support plate 16 are sequentially connected.

[0048] In this embodiment, the heat sink 13 is provided with strip-shaped heat dissipation channels, such as... Figure 5 As shown.

[0049] The thermoelectric generator with a furnace is characterized in that it further includes a support plate 14, and the cooling fan 15 is connected to the other side of the radiator 13 through the support plate 14.

[0050] The outer casing 7 has a circular cross-section, and the lower support plate 16 is correspondingly arranged therewith. A lower support leg 8 is arranged below the lower support plate 16 and connected thereto.

[0051] The lower support leg 8 is inserted into or hinged to the lower support plate 16.

[0052] The lower support leg 8 and the lower support plate 16 are located on the outside of the cooling fan 15.

[0053] In this embodiment, the outer shell 7 and the lower support leg 8 can be made of stainless steel or carbon steel.

[0054] Second Embodiment

[0055] See Figures 6-8 In this embodiment, the support leg 1.2 is hinged to the base ring 1.1, and the folded support leg 1.2 is housed on the base ring 1.1. An outer cover 20 is provided on the outer shell 7. The base ring 1.1, the folded support leg 1.2, the furnace head 2, and the heat-conducting structure are located within the range of the outer cover 20. The bottom of the outer cover 20 is pressed against the top of the outer shell 7. The bottom of the outer cover 20 is provided with one or more locking feet 20.1, and the top of the outer shell 7 is provided with one or more insertion slots 7.4. The locking feet 20.1 are inserted into the insertion slots 7.4 and locked in the insertion slots 7.4. The lower support leg 8, which is hinged to the lower support plate 16, is folded and housed within the range of the outer shell 7.

[0056] A water-cooling box 21 is provided on the inner side of the outer casing 7. One side of the outer wall of the water-cooling box 21 is in close contact with the inner wall of the outer casing 7, and the other side of the outer wall of the water-cooling box 21 is in close contact with the outer wall of the radiator 13. An opening is provided at the upper part of the water-cooling box 21. A water injection hole 7.3 is provided at the top of the outer casing 7 and at a position outside the outer cover 20, which is connected to the upper opening of the water-cooling box 21.

[0057] In this embodiment, the water-cooled box 21 can be fixed to the inner wall of the outer shell 7 by welding, riveting or screwing.

[0058] When using this product, water can be pre-filled into the water-cooling box 21 through the water inlet 7.3, or water can be added into the water-cooling box 21 during use using a small-diameter bottle, cup, or syringe through the water inlet 7.3. When there is water in the water-cooling box 21, it is equivalent to both air cooling and water cooling existing simultaneously for the heat sink during operation. When there is no water in the water-cooling box 21, only air cooling is available.

[0059] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0060] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A thermoelectric generator with a furnace, comprising a furnace head (2) disposed in the middle of an upper bracket (1), wherein the upper bracket (1) includes a support leg (1.2) connected to a base ring (1.1), characterized in that... A heat-conducting structure is provided next to the burner head (2). The top of the heat-conducting structure is connected to the upper bracket (1). The bottom of the heat-conducting structure extends downward and is connected to the power generation component located below the burner head (2). The power generation component includes a heat-absorbing plate (12), a heat dissipation structure, and one or more semiconductor chips (17). One side of the heat-absorbing plate (12) is tightly attached to the heat-conducting structure. The other side of the heat-absorbing plate (12) is tightly attached to one side of the semiconductor chip (17). The other side of the semiconductor chip (17) is tightly attached to the heat dissipation structure.

2. The thermoelectric power generation device with a furnace according to claim 1, characterized in that: The heat-conducting structure includes a bracket (5), which includes a heat-conducting ring (5.1) and a heat-conducting column (5.2) surrounding the outside of the burner head (2) and close to the burner head (2). The heat-conducting ring (5.1) is connected to the base ring (1.1) by a first screw (2). One end of the heat-conducting column (5.2) is connected to the heat-conducting ring (5.1), and the other end of the heat-conducting column (5.2) is connected to one side of the heat-absorbing plate (12) by a first locking screw. Alternatively, the heat-conducting structure includes a heat-conducting column (5.2) surrounding the outside of the burner head (2) and close to the burner head (2), one end of the heat-conducting column (5.2) being connected to the base ring (1.1) by a second locking screw, and the other end of the heat-conducting column (5.2) being connected to one side of the heat-absorbing plate (12) by a third locking screw.

3. The thermoelectric generator with a furnace according to claim 1 or 2, characterized in that: It also includes a housing (7), which is disposed on the outer periphery of the power generation component and maintains a certain distance from the power generation component.

4. The thermoelectric generator with a furnace according to claim 4, characterized in that: The heat-absorbing plate (12) is provided with a heat insulation plate (11) having a first mounting hole (11.11). The outer shell (7) has a second mounting hole (7.1) in the middle. The outer shell (7) is sleeved on the outside of the heat insulation plate (11). The top of the inner wall of the outer shell (7) is pressed against the heat insulation plate (11). The first mounting hole (11.11) and the second mounting hole (7.1) are connected. The other end of the heat-conducting column (5.2) passes through the second mounting hole in sequence. 7.1) and the first assembly hole (11.11) are connected to one side of the heat absorption plate (12); the first assembly hole (11.11) is located in the middle of the second assembly hole (7.1).

5. The thermoelectric generator with a furnace according to claim 4, characterized in that: The heat dissipation structure includes a heat sink (13) and a cooling fan (15). The other side of the semiconductor chip (17) is tightly attached to one side of the heat sink (13). The other side of the heat sink (13) is connected to the air inlet of the cooling fan (15). The air outlet of the cooling fan (15) is connected to the outside.

6. The thermoelectric generator with a furnace according to claim 5, characterized in that: The cooling fan (15) is mounted on the lower support plate (16), which has an air outlet (16.1). The bottom of the outer shell (7) is connected to the lower support plate (16) to form a cavity. The outer wall of the outer shell (7) has one or more ventilation holes (7.2). The ventilation holes (7.2) are located on the outside of the radiator (13). The radiator (13) has a heat dissipation channel. The ventilation holes (7.2) of the outer shell (7), the heat dissipation channel of the radiator (13), the air inlet of the cooling fan (15), the air outlet of the cooling fan (15), and the air outlet (16.1) of the lower support plate (16) are connected in sequence.

7. The thermoelectric generator with a furnace according to claim 6, characterized in that: It also includes a bracket plate (14), through which the cooling fan (15) is connected to the other side of the radiator (13).

8. The thermoelectric generator with a furnace according to claim 6, characterized in that: The outer casing (7) has a circular cross-section, and the lower support plate (16) is correspondingly arranged thereto. A lower support leg (8) is arranged below the lower support plate (16) and connected thereto. The lower support leg (8) is inserted into or hinged to the lower support plate (16). The connection between the lower support leg (8) and the lower support plate (16) is located on the outside of the cooling fan (15).

9. The thermoelectric generator with a furnace according to claim 8, characterized in that: The support foot (1.2) is hinged to the base ring (1.1), and the folded support foot (1.2) is stored on the base ring (1.1). The outer shell (7) is provided with an outer cover (20). The base ring (1.1), the folded support foot (1.2), the furnace head (2) and the heat-conducting structure are located within the range of the outer cover (20). The bottom of the outer cover (20) is pressed against the top of the outer shell (7). The bottom of the outer cover (20) is provided with one or more locking feet (20.1). The top of the outer shell (7) is provided with one or more insertion slots (7.4). The locking feet (20.1) are inserted into the insertion slots (7.4) and locked in the insertion slots (7.4). The lower support leg (8) hinged to the lower support plate (16) is folded and stored within the range of the outer shell (7).

10. The thermoelectric generator with a furnace according to claim 9, characterized in that: A water-cooling box (21) is provided on the inner side of the outer shell (7). One side of the outer wall of the water-cooling box (21) is in close contact with the inner wall of the outer shell (7). The other side of the outer wall of the water-cooling box (21) is in close contact with the outer wall of the radiator (13). An opening is provided at the top of the water-cooling box (21). A water injection hole (7.3) is provided at the top of the outer shell (7) and at the position outside the outer cover (20), which is connected to the opening at the top of the water-cooling box (21).

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