Forming die for BOSS column of computer shell

Abstract

The utility model discloses a computer shell BOSS column forming die which comprises a lower die body and an upper die body matched with the lower die body and located above the lower die body. The lower die comprises a lower die assembly provided with a bearing face used for bearing the computer shell, a plurality of positioning pins arranged on the bearing face and used for positioning the position of the computer shell and a first heating assembly arranged in the lower die assembly and capable of heating the bearing face. The upper die comprises an upper die assembly, a plurality of punches arranged at the lower end of the upper die assembly and a second heating assembly arranged on the upper die assembly and used for heating the upper die assembly. After the upper die and the lower die are assembled, the multiple punches at the lower end of the upper die assembly can punch and form BOSS columns at the corresponding positions of the computer shell, the BOSS columns are integrally punched at the corresponding positions of the computer shell through the punches of the upper die, additional plastic parts do not need to be bonded, and the light and thin requirements of a notebook computer can be met; and the processing technology can be reduced and materials can be saved.

Description

Technical Field

[0001] This utility model belongs to the field of notebook computer parts processing technology, specifically relating to a computer shell BOSS pillar forming mold. Background Technology

[0002] The laptop casing cushions external impacts, preventing damage to internal hardware such as the motherboard, hard drive, and memory from collisions or scratches from sharp objects. It's a crucial component protecting the laptop. Traditional laptops house numerous critical components, including the motherboard, hard drive, and heatsink. These components require screws for secure mounting, necessitating the bonding of metal parts (such as aluminum alloy or aluminum-magnesium alloy) to plastic parts with screw posts to complete assembly with other components. However, bonding metal and plastic parts increases the casing thickness, making it impossible to meet the demands for thinner and lighter laptops. Utility Model Content

[0003] In view of the technical problems existing in the prior art, this utility model provides a computer shell BOSS pillar forming mold.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A mold for forming a BOSS pillar for a computer casing, comprising:

[0006] The lower mold includes a lower mold assembly having a bearing surface for supporting a computer casing, a plurality of positioning pins disposed on the bearing surface for positioning the computer casing, and a first heating assembly disposed within the lower mold assembly and capable of heating the bearing surface.

[0007] The upper die cooperates with the lower die and is located above the lower die. The upper die includes an upper die assembly, a plurality of punches disposed at the lower end of the upper die assembly, and a second heating assembly disposed on the upper die assembly for heating the upper die assembly.

[0008] When the upper mold and the lower mold are closed, several punches at the lower end of the upper mold assembly can stamp out the BOSS pillar at the corresponding position on the computer shell.

[0009] Furthermore, the upper die assembly has a plurality of mounting cavities for mounting the punch on the die surface near the lower die assembly, and a plurality of flow-blocking protrusions are provided on the die surface corresponding to the mounting cavities and arranged concentrically; the punch includes a punch body installed in the mounting cavity and a punch insert embedded in the punch body.

[0010] After the mold is closed, the punch body is used to punch out the internal cavity of the BOSS column, and the punch insert can cooperate with the flow-blocking protrusion to punch out the columnar body of the BOSS column.

[0011] Furthermore, the punch body includes a first rod and a stamping head integrally formed on the lower end of the first rod, wherein the outer diameter of the stamping head is smaller than the outer diameter of the first rod.

[0012] The punch insert includes a second rod and an annular boss integrally formed on the lower end of the second rod. The inner cavity of the second rod and the inner cavity of the annular boss form an insert cavity for inserting the punch body. After the punch body is inserted into the insert cavity, the punching head is exposed outside the annular boss. The axis of the punching head coincides with the axis of the annular boss, and the lower end face of the annular boss has a height difference with the lower end face of the first rod. The inner sidewall of the insert cavity, the lower end face of the first rod, and the outer sidewall of the punching head together form a pressing area for punching out the columnar body.

[0013] Furthermore, the upper mold assembly includes an upper mold base, an upper heat insulation plate, an upper pad, an upper clamping plate, and an upper ejector plate arranged sequentially from top to bottom. One end of the mounting cavity is distributed on the upper clamping plate, and the other end is distributed on the upper ejector plate. When the mold is not closed, the end of the punch that contacts the workpiece is housed in the mounting cavity. The upper clamping plate is provided with a plurality of first mounting holes, and a first spring is installed in each of the plurality of mounting holes. The end of the first spring away from the upper pad is in contact with the upper ejector plate.

[0014] After the mold is closed, the upper clamping plate moves toward the upper ejector plate, which allows the punch to extend out of the mounting cavity to punch the workpiece.

[0015] Furthermore, the upper pad is equipped with a leveling sleeve that is connected to the upper release plate to limit the travel of the upper release plate.

[0016] Furthermore, the upper clamping plate is equipped with a number of inner guide pillars distributed at various corners of the upper clamping plate for guiding during mold closing or opening. The end of the inner guide pillar away from the upper clamping plate passes through the upper ejector plate and protrudes outside the upper ejector plate.

[0017] Furthermore, the second heating assembly includes a plurality of first heating coils arranged on the upper end face of the upper clamping plate, a plurality of second heating coils arranged on the lower end face of the upper clamping plate, and a plurality of third heating coils arranged on the upper end face of the upper release plate. The upper clamping plate is embedded with a plurality of first temperature sensing wires corresponding one-to-one with the first heating coils for sensing the temperature of the first heating coils, and the upper release plate is embedded with a plurality of second temperature sensing wires corresponding one-to-one with the third heating coils for sensing the temperature of the third heating coils.

[0018] Furthermore, the lower die assembly includes a lower template, a lower clamping plate, a lower pad, a lower die base, several lower pads, and a lower support plate arranged sequentially from top to bottom. The upper end face of the lower template is defined as a bearing surface, and several inner limiters are provided on the bearing surface to contact the upper die during die closing, thereby controlling the stamping depth of the punch.

[0019] Furthermore, the positioning pin includes a pin rod with one end located inside the lower clamping plate and the other end extending outside the bearing surface, a constant diameter section fixed to the upper end of the pin rod with an outer diameter smaller than that of the pin rod, and a variable diameter section fixed to the upper end of the constant diameter section. The lower end of the pin rod is connected to a second spring, and the end of the variable diameter section with the largest cross-sectional area is connected to the constant diameter section.

[0020] Furthermore, the first heating assembly includes a plurality of fourth heating coils disposed on the upper end face of the lower clamping plate and a plurality of fifth heating coils disposed on the lower end face of the lower clamping plate. The lower template is embedded with a plurality of third temperature sensing wires that correspond one-to-one with the fourth heating coils for sensing the temperature of the fourth heating coils.

[0021] In summary, the beneficial effects of this utility model are as follows: 1. The BOSS pillar is directly stamped and formed on the corresponding position of the computer shell using the upper die punch, eliminating the need for additional plastic parts and avoiding the thickness increase caused by bonding. This helps to achieve the thinner and lighter design of products such as laptops, meeting the market demand for lightweight and portable devices. 2. By using a stamping forming method, the BOSS pillar can be formed in one stamping. Compared with the bonding process, this reduces multiple cumbersome processes such as surface treatment, gluing, and curing, significantly shortening the production cycle and improving production efficiency. Furthermore, it eliminates the need for hot-melt processing of plastic parts, saving materials and process costs. 3. The punch body and punch insert respectively form the internal cavity and columnar body of the BOSS pillar, enabling each part of the BOSS pillar to achieve high precision requirements, ensuring product quality and consistency. The punch insert, in conjunction with the flow-blocking protrusion, restricts and guides the flow of material during the stamping process, causing the material to flow more concentratedly to the area where it needs to be formed into a columnar body, avoiding unnecessary material flow and waste, and improving material utilization. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a computer casing in the existing technology.

[0023] Figure 2 This is a structural schematic diagram of a computer shell BOSS pillar forming mold provided by this utility model.

[0024] Figure 3 yes Figure 2 A schematic diagram of the three-dimensional structure of the lower and middle molds.

[0025] Figure 4 yes Figure 3 A magnified view of part A in the middle.

[0026] Figure 5 yes Figure 3 Top view of the lower middle panel.

[0027] Figure 6 This is a schematic diagram of a computer shell BOSS pillar forming mold in the mold-opening state provided by this utility model.

[0028] Figure 7 yes Figure 6 A schematic diagram of the three-dimensional structure of the upper and middle molds.

[0029] Figure 8 yes Figure 6 A magnified view of a section at point B in the middle.

[0030] Figure 9 This is a cross-sectional view of the punching end of the punch in this utility model.

[0031] Figure 10 This is a schematic diagram of the structure of the stamping end of the punch in this utility model.

[0032] Figure 11 This is a top view of the upper clamping plate in this utility model.

[0033] In the diagram, 100 is the computer casing, 110 is a metal part, 111 is the first area, 112 is the second area, 113 is a columnar body, and 120 is a plastic part.

[0034] 200-Upper mold assembly, 200A-Screw, 200B-Pin, 210-Upper mold base, 220-Upper heat insulation plate, 230-Upper pad, 231-Equal height sleeve, 240-Upper clamping plate, 241-First spring, 242-Inner guide post, 243-First temperature sensing wire, 250-Upper release plate, 251-Flow-blocking protrusion, 252-Second temperature sensing wire;

[0035] 300-Lower mold assembly, 310-Lower template, 311-Bearing surface, 3110-Guide cavity, 312-Third temperature sensing line, 313-Inner limit, 320-Lower clamping plate, 330-Lower pad, 340-Lower mold base, 350-Lower foot, 360-Lower support plate;

[0036] 400 - Locating pin, 410 - Pin rod, 411 - Second spring, 420 - Equal diameter section, 430 - Variable diameter section;

[0037] 500 - First heating element, 510 - Fourth heating coil, 520 - Fifth heating coil;

[0038] 600-Punch, 610-Punch body, 611-First rod, 6110-Limiting section, 612-Punching head, 620-Punch insert, 621-Second rod, 622-Annular boss, 630-Extrusion area;

[0039] 700 - Second heating element, 710 - First heating coil, 720 - Second heating coil, 730 - Third heating coil;

[0040] 800-plug. Detailed Implementation

[0041] Please see Figure 1 In the prior art, the computer casing 100 includes a metal part 110 and a plastic part 120 bonded to the metal part 110.

[0042] The present invention will be further illustrated below with reference to specific figures.

[0043] Please see Figure 2This utility model provides a mold for forming BOSS pillars on a computer casing, including a lower mold and an upper mold that cooperates with and is located above the lower mold. The lower mold includes a lower mold assembly 300 having a bearing surface 311 for supporting the computer casing, a plurality of positioning pins 400 disposed on the bearing surface 311 for positioning the computer casing, and a first heating assembly 500 disposed within the lower mold assembly and capable of heating the bearing surface 311. The upper mold includes an upper mold assembly 200, a plurality of punches 600 disposed at the lower end of the upper mold assembly 200, and a second heating assembly 700 disposed on the upper mold assembly 200 for heating the upper mold assembly 200. Both the first heating assembly 500 and the second heating assembly 700 are connected to a power source via a plug 800. When the upper mold and the lower mold are closed, the plurality of punches 600 at the lower end of the upper mold assembly 200 can stamp and form BOSS pillars at corresponding positions on the computer casing. This stamping die uses the punch 600 in the upper die to directly stamp the BOSS pillar at the corresponding position on the computer casing, eliminating the need for additional glued plastic parts. This avoids the thickness increase caused by glued plastic parts, contributing to the thinner and lighter design of laptops and making them more in line with market demands for lightweight and portable devices. The stamping process allows for the formation of the BOSS pillar in a single stamping operation. Compared to bonding processes, this reduces several cumbersome steps (surface treatment, gluing, curing, etc.), shortens the production cycle, and improves production efficiency.

[0044] Please see Figure 3 The lower mold assembly 300 includes, from top to bottom, a lower template 310, a lower clamping plate 320, a lower pad plate 330, a lower mold base 340, several lower support feet 350, and a lower support plate 360. The upper end surface of the lower template 310 is defined as a bearing surface 311. The lower template 310, lower clamping plate 320, lower pad plate 330, lower mold base 340, several lower support feet 350, and lower support plate 360 ​​are connected together by screws 200A and pins 200B, facilitating easy assembly and disassembly. Please refer to [link / reference]. Figure 4The positioning pin 400 includes a pin 410 with one end located inside the lower clamping plate 320 and the other end extending outside the bearing surface 311, a constant diameter section 420 fixed to the upper end of the pin 410 with an outer diameter smaller than that of the pin 410, and a variable diameter section 430 fixed to the upper end of the constant diameter section 420. The end of the variable diameter section 430 with the largest cross-sectional area is connected to the constant diameter section 420. The metal part 110 is provided with a corresponding pin hole for cooperating with the positioning pin 400, and the size of the pin hole is adapted to the outer diameter of the constant diameter section 420. When the workpiece to be stamped (metal part 100, and the computer shell processed below refers to the metal part 110 in the prior art) needs to be loaded onto the lower die, the outer diameter of the variable diameter section 430 is a structure that gradually increases from away from the constant diameter section 420 to close to the outer diameter of the constant diameter section 420. The variable diameter section 430 can act as a guide structure to guide the workpiece to be quickly loaded onto the positioned computer shell, and its bottom surface abuts against the upper end surface of the pin 410. A second spring 411 is connected to the lower end of the pin 410. After mold closing, the second spring 411 is compressed, the lower end face of the workpiece contacts the bearing surface 311, and the upper end face is held by the upper mold surface. The compression of the spring absorbs part of the impact force, preventing the computer casing from being damaged by excessive instantaneous impact, thus protecting the computer casing to be stamped and improving the product yield. Please also refer to... Figure 6 When the mold is opened, the second spring 411 returns to its original position, which in turn drives the positioning pin 400 to return to its original position. After returning to its original position, part of the pin 410 is exposed outside the bearing surface 311, so that there is a gap between the workpiece and the bearing surface 311 for easy material removal.

[0045] The bearing surface 311 is provided with a plurality of inner limiters 313 for contacting the upper die during mold closing, thereby controlling the stamping depth of the punch 600. The stamping depth of the punch 600 is crucial to the dimensional accuracy of structures such as BOSS pillars formed by stamping. After the inner limiters 313 contact the upper die, they prevent the upper die from continuing to descend, thereby limiting the maximum stamping stroke of the punch 600 and ensuring that the stamping depth of the punch 600 is consistent each time it is stamped.

[0046] Please see Figure 2 and Figure 5 The first heating component 500 includes a plurality of fourth heating coils 510 disposed on the upper end face of the lower clamping plate 320 and a plurality of fifth heating coils 520 disposed on the lower end face of the lower clamping plate 320. A plurality of third temperature sensing lines 312 are embedded on the lower template 310, corresponding one-to-one with the fourth heating coils 510 for sensing the temperature of the fourth heating coils 510, thereby obtaining the temperature information of the heating area of ​​the lower mold in real time, and the operator can accurately understand the temperature status of the lower mold.

[0047] The upper die assembly 200 has several mounting cavities on its die surface near the lower die assembly 300 for mounting the punch 600, and several flow-blocking protrusions 251 arranged concentrically with the mounting cavities on the die surface. The punch 600 includes a punch body 610 mounted in the mounting cavity and a punch insert 620 embedded in the punch body 610. When the die is closed, the punch body 610 is used to punch out the internal cavity of the BOSS pillar, and the punch insert 620 can cooperate with the flow-blocking protrusions 251 to punch out the columnar body 113 of the BOSS pillar. The punch body 610 and the punch insert 620 respectively form different parts of the BOSS pillar, so that the internal cavity and the columnar body 113 of the BOSS pillar can achieve high precision requirements, ensuring the quality and consistency of the product.

[0048] Please see Figure 7 The upper mold assembly 200 includes, from top to bottom, an upper mold base 210, an upper heat insulation plate 220, an upper pad 230, an upper clamping plate 240, and an upper ejector plate 250. One end of the mounting cavity is located on the upper clamping plate 240, and the other end is located on the upper ejector plate 250. The upper mold base 210, upper heat insulation plate 220, upper pad 230, upper clamping plate 240, and upper ejector plate 250 are connected together by screws 200A and pins 200B, facilitating easy assembly and disassembly. When the mold is not closed, the end of the punch 600 that contacts the workpiece is housed within the mounting cavity. The upper clamping plate 240 has several first mounting holes, each corresponding to a first spring 241. The end of the first spring 241 furthest from the upper pad 230 contacts the upper ejector plate 250. After the mold closes, the upper clamping plate 240 moves towards the upper ejector plate 250, allowing the punch 600 to extend from the mounting cavity to punch the workpiece. Meanwhile, the first spring 241 is compressed. After the mold opens, the first spring 241 causes the upper ejector plate 250 to return to its original position, facilitating the next processing cycle. Please continue reading. Figure 6 When the mold is in the open state, the punch 600 is housed in the mounting cavity, so that the punch 600 will not extend arbitrarily and interfere with the lower mold assembly 300 or the workpiece to be processed during the opening and closing process of the upper mold assembly 200.

[0049] Please see Figure 8 and Figure 9The punch body 610 includes a first rod 611 and a stamping head 612 integrally formed on the lower end of the first rod 611. The outer diameter of the stamping head 612 is smaller than the outer diameter of the first rod 611. The punch insert 620 includes a second rod 621 and an annular boss 622 integrally formed on the lower end of the second rod 621. The inner cavity of the second rod 621 and the inner cavity of the annular boss 622 form an insert cavity for inserting the punch body 610. After the punch body 610 is inserted into the insert cavity, the stamping head 612 is exposed outside the annular boss 622. The top end of the punch 600 is provided with a limiting section 6110 to limit the installation position of the punch body 610 in the insert cavity. The axis of the stamping head 612 coincides with the axis of the annular boss 622, and the lower end face of the annular boss 622 has a height difference with the lower end face of the first rod 611. The inner wall of the inlay cavity, the lower end face of the first rod 611, and the outer wall of the stamping head 612 together form a pressing area 630 for stamping out the columnar body 113. For specific details regarding the stamping process, please refer to [link to relevant documentation]. Figure 10 The stamping head 612 stamps the first area 111 of the workpiece. Because the stamping head 612 has an outward convex structure, it can form the inner cavity of the BOSS column. The annular boss 622 stamps the second area 112 of the workpiece. The flow-blocking protrusion 251 is set on the end face of the upper ejector plate 250 near the lower die. Under the combined extrusion of the stamping head 612 and the annular boss 622, the material enters the extrusion area 630 and is integrally formed into the columnar body 113 of the BOSS column. The punch insert 620 and the flow-blocking protrusion 251 cooperate with each other. During the stamping process, the flow-blocking protrusion 251 can restrict and guide the flow of material, so that the material flows more concentratedly to the area that needs to be formed into the columnar body 113, avoiding material flow and waste in unnecessary places, thereby improving the material utilization rate.

[0050] Please continue reading. Figure 6 The upper pad 230 is equipped with a height equalizing sleeve 231 that is connected to the upper ejector plate 250 to limit the travel of the upper ejector plate 250. When the mold is closed, the height equalizing sleeve 231 limits the upper ejector plate 250 from moving too far downward, so as to avoid the punch 600 from applying too much pressure to the workpiece and damaging the workpiece or the punch 600. When the mold is opened, it ensures that the upper ejector plate 250 returns to the correct initial position so as to facilitate the smooth operation of the next mold closing operation, thereby ensuring the consistency and stability of each stamping operation.

[0051] Several inner guide pillars 242 are installed on the upper clamping plate 240, distributed at various corners of the upper clamping plate 240, for guiding during mold closing or opening. The end of the inner guide pillar 242 away from the upper clamping plate 240 passes through the upper ejector plate 250 and protrudes outside the upper ejector plate 250. A guide cavity 3110 is provided at the corresponding position on the bearing surface 311 to cooperate with the inner guide pillar 242. The inner guide pillar 242 and the guide cavity 3110 cooperate with each other to ensure that the upper mold assembly 200 moves up and down along the correct path, so that the punch 600 can accurately align with the target position on the workpiece to be processed for stamping, thereby improving the stamping accuracy.

[0052] Please see Figure 11 The second heating assembly 700 includes a plurality of first heating coils 710 arranged on the upper end face of the upper clamping plate 240, a plurality of second heating coils 720 arranged on the lower end face of the upper clamping plate 240, and a plurality of third heating coils 730 arranged on the upper end face of the upper stripper plate 250. The upper clamping plate 240 is embedded with a plurality of first temperature sensing wires 243 corresponding one-to-one with the first heating coils 710 for sensing their temperature, and the upper stripper plate 250 is embedded with a plurality of second temperature sensing wires 252 corresponding one-to-one with the third heating coils 730 for sensing their temperature. The heating coils on the same plate can provide different amounts of heat according to actual needs, making the temperature distribution of the upper mold assembly 200 more uniform and reasonable, meeting the specific temperature requirements during the stamping process, and ensuring the quality of the stamping process.

[0053] The working process of this forming mold is as follows: The computer casing to be stamped is placed on the lower mold. The positioning pin 400 on the bearing surface 311 of the lower mold plays its role. The variable diameter section 430 of the positioning pin 400 acts as a guide structure, guiding the computer casing to be loaded quickly, so that the pin hole on the computer casing matches the equal diameter section 420 of the positioning pin 400. After being positioned, the bottom surface of the computer casing abuts against the upper end face of the pin 410. The upper mold moves downward to close with the lower mold. During this process, the inner guide post 242 of the upper mold assembly 200 cooperates with the guide cavity 3110 of the bearing surface 311 of the lower mold to ensure that the upper mold moves along the correct path, so that the punch 600 is accurately aligned with the target position of the computer casing. The upper ejector plate 250 presses against the upper end face of the computer casing. The upper clamping plate 240 and the punch 600 move toward the upper ejector plate 250, compressing the first spring 241 on the upper clamping plate 240. The punch 600 extends out of the mounting cavity, thereby stamping the computer casing. Simultaneously, the second spring 411 at the lower end of the pin 410 of the lower die positioning pin 400 is compressed, and the lower end face of the computer casing contacts the bearing surface 311 while the upper end face is held by the upper ejector plate 250. The punching head 612 of the punch 600 punches the first area 111 of the computer casing, forming the inner cavity of the BOSS pillar; the annular boss 622 of the punch 600 punches the second area 112 of the computer casing. The punch insert 620 cooperates with the flow-blocking protrusion 251 on the upper ejector plate 250. The flow-blocking protrusion 251 restricts and guides the material flow, causing the material to flow towards the extrusion area 630. Under the combined extrusion of the punching head 612 and the annular boss 622, the pillar 113 of the BOSS pillar is integrally formed. During this process, the inner limit 313 on the bearing surface 311 of the lower die contacts the upper die, preventing the upper die from continuing to descend, limiting the maximum punching stroke of the punch 600, and ensuring that the punching depth of the punch 600 is consistent. After stamping, the upper and lower dies open. The upper ejector plate 250 returns to its original position under the action of the first spring 241, and the punch 600 is housed in the mounting cavity to avoid interference with the lower die assembly 300 or the workpiece. The second spring 411 of the lower die positioning pin 400 returns to its original position, driving the positioning pin 400 to return to its original position. The pin rod 410 is partially exposed outside the bearing surface 311, creating a gap between the workpiece and the bearing surface 311 for easy material removal, facilitating the removal of the formed computer shell workpiece.

[0054] This molding die: 1. The punch 600 of the upper die directly stamps the BOSS pillar at the corresponding position on the computer shell, eliminating the need for additional plastic parts and avoiding the thickness increase caused by bonding. This facilitates the thinner and lighter design of laptops and other products, meeting the market demand for lightweight and portable devices. 2. The stamping process forms the BOSS pillar in a single stamping operation. Compared to bonding processes, this reduces multiple cumbersome steps such as surface treatment, gluing, and curing, significantly shortening the production cycle and improving production efficiency. Furthermore, it eliminates the need for hot-melt processing of plastic parts, saving materials and process costs. 3. The punch body 610 and punch insert 620 respectively form the internal cavity and columnar body 113 of the BOSS pillar, ensuring high precision in all parts of the BOSS pillar and guaranteeing product quality and consistency. The punch insert 620 works in conjunction with the flow-blocking protrusion 251 to restrict and guide the flow of material during the stamping process, so that the material flows more concentratedly to the area that needs to be formed into a column 113, avoiding material flow and waste in unnecessary places, and improving the utilization rate of material.

[0055] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structure made using the contents of this utility model specification and drawings, whether directly or indirectly applied to other related technical fields, shall also be within the patent protection scope of this utility model.

Claims

1. A mold for forming a BOSS pillar on a computer casing, characterized in that, include: The lower mold includes a lower mold assembly having a bearing surface for supporting a computer casing, a plurality of positioning pins disposed on the bearing surface for positioning the computer casing, and a first heating assembly disposed within the lower mold assembly and capable of heating the bearing surface. The upper die cooperates with the lower die and is located above the lower die. The upper die includes an upper die assembly, a plurality of punches disposed at the lower end of the upper die assembly, and a second heating assembly disposed on the upper die assembly for heating the upper die assembly. When the upper mold and the lower mold are closed, several punches at the lower end of the upper mold assembly can stamp out the BOSS pillar at the corresponding position on the computer shell.

2. The computer casing BOSS pillar forming mold according to claim 1, characterized in that: The upper die assembly has a plurality of mounting cavities on its die surface near the lower die assembly for mounting the punch, and a plurality of flow-blocking protrusions are provided on the die surface corresponding to the mounting cavities and arranged concentrically; the punch includes a punch body installed in the mounting cavity and a punch insert embedded in the punch body. After the mold is closed, the punch body is used to punch out the internal cavity of the BOSS column, and the punch insert can cooperate with the flow-blocking protrusion to punch out the columnar body of the BOSS column.

3. The computer casing BOSS pillar forming mold according to claim 2, characterized in that: The punch body includes a first rod and a stamping head integrally formed on the lower end of the first rod, wherein the outer diameter of the stamping head is smaller than the outer diameter of the first rod. The punch insert includes a second rod and an annular boss integrally formed on the lower end of the second rod. The inner cavity of the second rod and the inner cavity of the annular boss form an insert cavity for inserting the punch body. After the punch body is inserted into the insert cavity, the punching head is exposed outside the annular boss. The axis of the punching head coincides with the axis of the annular boss, and the lower end face of the annular boss has a height difference with the lower end face of the first rod. The inner sidewall of the insert cavity, the lower end face of the first rod, and the outer sidewall of the punching head together form a pressing area for punching out the columnar body.

4. The computer casing BOSS pillar forming mold according to claim 2, characterized in that: The upper mold assembly includes, from top to bottom, an upper mold base, an upper heat insulation plate, an upper pad, an upper clamping plate, and an upper ejector plate. One end of the mounting cavity is distributed on the upper clamping plate, and the other end is distributed on the upper ejector plate. When the mold is not closed, the end of the punch that contacts the workpiece is housed in the mounting cavity. The upper clamping plate is provided with a plurality of first mounting holes, and a first spring is installed in each of the plurality of mounting holes. The end of the first spring away from the upper pad is in contact with the upper ejector plate. After the mold is closed, the upper clamping plate moves toward the upper ejector plate, which allows the punch to extend out of the mounting cavity to punch the workpiece.

5. The computer casing BOSS pillar forming mold according to claim 4, characterized in that: The upper pad is equipped with a leveling sleeve that is connected to the upper release plate to limit the travel of the upper release plate.

6. The computer casing BOSS pillar forming mold according to claim 4, characterized in that: The upper clamping plate is equipped with several inner guide pillars distributed at various corners of the upper clamping plate for guiding during mold closing or opening. The end of the inner guide pillar away from the upper clamping plate passes through the upper release plate and protrudes outside the upper release plate.

7. The computer casing BOSS pillar forming mold according to claim 4, characterized in that: The second heating assembly includes a plurality of first heating coils arranged on the upper end face of the upper clamping plate, a plurality of second heating coils arranged on the lower end face of the upper clamping plate, and a plurality of third heating coils arranged on the upper end face of the upper release plate. The upper clamping plate is embedded with a plurality of first temperature sensing wires corresponding one-to-one with the first heating coils for sensing the temperature of the first heating coils, and the upper release plate is embedded with a plurality of second temperature sensing wires corresponding one-to-one with the third heating coils for sensing the temperature of the third heating coils.

8. The computer casing BOSS pillar forming mold according to any one of claims 1-7, characterized in that: The lower die assembly includes, from top to bottom, a lower template, a lower clamping plate, a lower pad, a lower die base, several lower pads, and a lower support plate. The upper end face of the lower template is defined as a bearing surface. Several inner limiters are provided on the bearing surface to contact the upper die during die closing, thereby controlling the stamping depth of the punch.

9. The computer casing BOSS pillar forming mold according to claim 8, characterized in that: The positioning pin includes a pin rod with one end located inside the lower clamping plate and the other end extending outside the bearing surface, a constant diameter section fixed to the upper end of the pin rod with an outer diameter smaller than that of the pin rod, and a variable diameter section fixed to the upper end of the constant diameter section. The lower end of the pin rod is connected to a second spring, and the end of the variable diameter section with the largest cross-sectional area is connected to the constant diameter section.

10. The computer casing BOSS pillar forming mold according to claim 9, characterized in that: The first heating assembly includes a plurality of fourth heating coils disposed on the upper end face of the lower clamping plate and a plurality of fifth heating coils disposed on the lower end face of the lower clamping plate. A plurality of third temperature sensing wires corresponding one-to-one with the fourth heating coils are embedded on the lower template for sensing the temperature of the fourth heating coils.

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