Efficient electronic component welding platform
By designing an efficient electronic component welding platform, heat exchange and purification structures are used to solve the problems of high temperature and harmful gases during welding, thereby achieving circuit board cooling and environmental purification, and avoiding damage and pollution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN NEWCOS TECH CO LTD
- Filing Date
- 2025-05-15
- Publication Date
- 2026-05-12
AI Technical Summary
The high temperatures and fumes generated during the soldering of electronic components cause the circuit board temperature to rise rapidly, making it prone to damage, and the harmful gases produced during soldering pollute the working environment.
A high-efficiency electronic component welding platform was designed, comprising a support plate, positioning block, transmission belt, rotating roller, heat dissipation groove, heat exchange structure and circulation structure. The heat exchange structure cools the transmission belt, and a purification structure is set up to remove harmful gases.
It effectively prevents circuit board damage due to high temperature, maintains a low temperature environment, and the purification structure ensures a clean working environment and prevents pollution from harmful gases.
Smart Images

Figure CN224222914U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic component processing technology, and in particular relates to a high-efficiency electronic component welding platform. Background Technology
[0002] Electronic components are the building blocks of electronic devices and small machines and instruments. They are usually composed of several parts and can be used interchangeably in similar products. When electronic components are used, they are often soldered onto circuit boards. However, the soldering process generates high temperatures and fumes, which causes the circuit board temperature to rise rapidly. If the circuit board cannot be kept cool quickly, it will be prone to damage.
[0003] Therefore, how to provide an efficient electronic component welding platform is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0004] The purpose of this invention is to provide a high-efficiency electronic component welding platform, which aims to solve the problems mentioned in the background art.
[0005] This utility model is implemented as follows: a high-efficiency electronic component welding platform, comprising;
[0006] Support plate;
[0007] A positioning block, which is fixedly installed in the middle of the support plate;
[0008] A transmission belt is movably sleeved on the surface of the positioning block;
[0009] The rotating rollers, the array of rotating rollers, are arranged on both sides of the positioning block and are connected to the transmission belt for transmission.
[0010] A heat dissipation groove is formed in the middle of the positioning block;
[0011] A heat exchange structure is provided at the top of the heat dissipation groove to cool the transmission belt at its top.
[0012] A circulating structure is provided, which is located in the middle of the heat dissipation tank, to circulate and cool the heat exchange structure.
[0013] Preferably, a positioning frame is symmetrically arranged on the top of the support plate, a welding machine mounting bracket is fixedly installed in the middle of the positioning frame, and a purification structure is also provided on the positioning frame. The purification structure includes a fan, an air duct, an air collection pipe and a filter box. The air duct is opened at the outer end of the positioning frame, the air collection pipe is fixedly installed on the rear side of the support plate and is fixedly connected to the air duct, the filter box is movably installed at the bottom of the air collection pipe, and the fan is movably installed at the bottom of the filter box.
[0014] Preferably, the heat exchange structure includes a heat exchange plate, a water tank, and heat exchange fins. The heat exchange plate is fixedly installed on the top of the heat dissipation groove, the water tank is fixedly installed on the bottom of the heat exchange plate, the heat exchange fin array is installed on the bottom of the heat exchange plate and inserted into the inside of the water tank, and the circulation structure is located below the water tank.
[0015] Preferably, the circulation structure includes a booster pump, a hot water exchange pipe, and a temporary storage tank. The booster pump is fixedly installed at the bottom right side of the water tank, the temporary storage tank is fixedly installed at the bottom of the booster pump, the hot water exchange pipe array is installed on the side of the high end of the water tank and at the bottom of the temporary storage tank, a fan is movably installed in the middle of the heat dissipation groove, a water outlet is provided at the bottom of the water tank, and a water inlet is provided at the top of the temporary storage tank.
[0016] Preferably, the position of the water outlet corresponds to the position of the top of the booster pump, and the position of the water inlet corresponds to the position of the bottom of the booster pump.
[0017] Preferably, the surface of the transmission belt is provided with raised plates, and the transmission belt is a thermally conductive adhesive transmission belt.
[0018] Preferably, the positioning block is generally convex, and the two sides of the positioning block are inclined.
[0019] Compared with the prior art, the beneficial effects of this utility model are: when in use, by setting a heat exchange structure in the middle of the positioning block, the transmission belt at the top of the positioning block can be cooled, thereby indirectly cooling the circuit board, thus avoiding damage to the circuit board due to high temperature. Furthermore, a circulation structure is provided to keep the heat exchange structure at a low temperature, thereby maintaining the cooling effect of the heat exchange structure.
[0020] Meanwhile, by setting up purification structures on both sides of the positioning frame, the harmful gases generated during welding can be drawn into the filter box and then discharged after purification, thus avoiding the overflow of harmful gases generated during welding and the resulting pollution of the working environment. Attached Figure Description
[0021] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0022] Figure 1 A schematic diagram of the overall appearance structure of a high-efficiency electronic component welding platform provided in this embodiment of the present invention;
[0023] Figure 2 A front cross-sectional view of a high-efficiency electronic component welding platform provided in this embodiment of the present invention;
[0024] Figure 3 A right-side cross-sectional view of a high-efficiency electronic component welding platform provided for an embodiment of this utility model;
[0025] Figure 4 A bottom view cross-sectional structural diagram of a high-efficiency electronic component welding platform provided for an embodiment of this utility model;
[0026] Figure 5 This is a left-side cross-sectional view of a high-efficiency electronic component welding platform provided in an embodiment of the present invention.
[0027] In the diagram: 1-Support plate, 2-Positioning block, 3-Rotating roller, 4-Transmission belt, 5-Protruding plate, 6-Heat exchange plate, 7-Water tank, 8-Heat exchange fins, 9-Heat dissipation groove, 10-Temporary storage box, 11-Hot water pipe, 12-Fan, 13-Water outlet, 14-Booster pump, 15-Water inlet, 16-Positioning frame, 17-Welding machine mounting bracket, 18-Air duct, 19-Air collection pipe, 20-Filter box, 21-Fan. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0029] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.
[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The diagram shown is a structural schematic of a high-efficiency electronic component welding platform provided in one embodiment of the present invention, comprising:
[0031] Support plate 1;
[0032] Positioning block 2 is fixedly installed in the middle of support plate 1;
[0033] The transmission belt 4 is movably sleeved on the surface of the positioning block 2;
[0034] Rotary rollers 3 are arranged in an array on both sides of the positioning block 2 and are connected to the transmission belt 4 for transmission.
[0035] Heat dissipation groove 9 is located in the middle of positioning block 2;
[0036] The heat exchange structure is located at the top of the heat dissipation tank 9 and cools the transmission belt 4 at its top.
[0037] A circulation structure is set in the middle of the heat dissipation tank 9 to circulate and cool the heat exchange structure.
[0038] In this embodiment of the utility model, when in use, a heat exchange structure is provided in the middle of the positioning block 2, which can cool the transmission belt 4 at the top of the positioning block 2, thereby indirectly cooling the circuit board, thus preventing the circuit board from being damaged by high temperature. A circulation structure is provided to keep the heat exchange structure at a low temperature, thereby maintaining the cooling effect of the heat exchange structure.
[0039] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, in a preferred embodiment of the present invention, a positioning frame 16 is symmetrically arranged on the top of the support plate 1, and a welding machine mounting bracket 17 is fixedly installed in the middle of the positioning frame 16. A purification structure is also provided on the positioning frame 16. The purification structure includes a fan 21, an air duct 18, an air collecting pipe 19, and a filter box 20. The air duct 18 is opened at the outer end of the positioning frame 16, the air collecting pipe 19 is fixedly installed on the rear side of the support plate 1 and is fixedly connected to the air duct 18, the filter box 20 is movably installed at the bottom of the air collecting pipe 19, and the fan 21 is movably installed at the bottom of the filter box 20.
[0040] In this embodiment of the invention, when in use, the fan 21 is started, and then the harmful gases generated by welding are drawn into the filter box 20 through the cooperation of the air duct 18 and the air collection pipe 19. After purification, the gases are discharged, thereby avoiding the overflow of harmful gases generated by welding and the resulting pollution of the working environment.
[0041] like Figure 2 , Figure 3 and Figure 4 As shown, in a preferred embodiment of the present invention, the heat exchange structure includes a heat exchange plate 6, a water tank 7, and heat exchange fins 8. The heat exchange plate 6 is fixedly installed on the top of the heat dissipation groove 9, the water tank 7 is fixedly installed on the bottom of the heat exchange plate 6, the heat exchange fins 8 are arrayed and installed on the bottom of the heat exchange plate 6 and inserted into the inside of the water tank 7, and the circulation structure is set below the water tank 7.
[0042] In this embodiment of the invention, when in use, the heat exchange plate 6 and the heat exchange fins 8 located at its bottom in the water tank 7 keep the temperature of the transmission belt 4 above it low, thereby indirectly cooling the circuit board and preventing the circuit board from being damaged by high temperature.
[0043] like Figure 2 , Figure 3 and Figure 4 As shown, in a preferred embodiment of the present invention, the circulation structure includes a booster pump 14, a hot water exchange pipe 11, and a temporary storage tank 10. The booster pump 14 is fixedly installed at the bottom right side of the water tank 7, and the temporary storage tank 10 is fixedly installed at the bottom of the booster pump 14. The hot water exchange pipe 11 is arrayed on the side of the high end of the water tank 7 and the bottom of the temporary storage tank 10. A fan 12 is movably installed in the middle of the heat dissipation groove 9. A water outlet 13 is opened at the bottom of the water tank 7, and a water inlet 15 is opened at the top of the temporary storage tank 10.
[0044] In this embodiment of the utility model, when in use, the booster water pump 14 is started, which then transfers the water in the water tank 7 to the temporary storage tank 10 through the water outlet 13 at its bottom, and then to the water tank 7 through the hot water exchange pipe 11 at its bottom. At the same time, the fan 12 in the middle of the heat dissipation slot 9 is started, which lowers the temperature of the hot water exchange pipe 11, thereby keeping the temperature of the water in the water tank 7 at a low temperature, and thus maintaining the cooling effect of the heat exchange plate 6.
[0045] like Figure 3 As shown, in a preferred embodiment of the present invention, the position of the water outlet 13 corresponds to the position of the top of the booster pump 14, and the position of the water inlet 15 corresponds to the position of the bottom of the booster pump 14.
[0046] In this embodiment of the utility model, when in use, the position of the water outlet 13 is set to correspond to the position of the top of the booster pump 14, and the position of the water inlet 15 is set to correspond to the position of the bottom of the booster pump 14, thereby facilitating the movement of water flow.
[0047] like Figure 1 , Figure 2 and Figure 3 As shown, in a preferred embodiment of the present invention, the surface of the transmission belt 4 is provided with convex plates 5, and the transmission belt 4 is a thermally conductive adhesive transmission belt.
[0048] In this embodiment of the utility model, when in use, the circuit board is facilitated to move by the array of protrusions 5 on the surface of the transmission belt 4, and the heat exchange and cooling are facilitated by using a thermally conductive adhesive transmission belt for the transmission belt 4.
[0049] like Figure 1 , Figure 2 and Figure 3 As shown, in a preferred embodiment of the present invention, the positioning block 2 is generally convex in shape, and the two sides of the positioning block 2 are inclined.
[0050] In this embodiment of the utility model, when in use, the positioning block 2 is arranged in a convex shape and the two sides of the positioning block 2 are inclined, so that the circuit board can be moved to a high place for soldering, thereby facilitating cooling and purification of flue gas.
[0051] The above embodiments of this utility model provide an efficient electronic component welding platform. When in use, the welding machine is installed on the welding machine mounting frame 17 preset at the top positioning frame 16 of the support plate 1, so that the circuit board passing below can be welded.
[0052] Then, the rotating roller 3 is started, so that the transmission belt 4 rotates around the positioning block 2 under the drive of the rotating roller 3. Then, the circuit board containing electronic components is placed on the transmission belt 4, and under the constraint of the protruding plate 5, the circuit board moves from bottom to top, and then moves to the bottom of the welding machine for welding.
[0053] During welding, the heat exchange plate 6 and the heat exchange fins 8 set at its bottom in the water tank 7 keep the temperature of the transmission belt 4 above it low, thereby indirectly cooling the circuit board and preventing the circuit board from being damaged by high temperature.
[0054] Then, the booster pump 14 is started, which transfers the water in the water tank 7 to the temporary storage tank 10 through the water outlet 13 at its bottom, and then to the water tank 7 through the hot water exchange pipe 11 at its bottom. At the same time, the fan 12 in the middle of the heat dissipation slot 9 is started, which lowers the temperature of the hot water exchange pipe 11, thereby keeping the water temperature in the water tank 7 at a low temperature, thus maintaining the cooling effect of the heat exchange plate 6.
[0055] Meanwhile, during welding, the fan 21 is started, and through the cooperation of the air duct 18 and the air collection pipe 19, the harmful gases generated during welding are drawn into the filter box 20, and then discharged after purification, thereby avoiding the overflow of harmful gases generated during welding and the resulting pollution of the working environment.
[0056] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-efficiency electronic component welding platform, characterized in that, include; Support plate (1); Positioning block (2), which is fixedly installed in the middle of support plate (1); A transmission belt (4) is movably sleeved on the surface of the positioning block (2); The rotating rollers (3) are arranged in an array on both sides of the positioning block (2) and are connected to the transmission belt (4) for transmission. Heat dissipation groove (9) is formed in the middle of positioning block (2); A heat exchange structure is provided at the top of the heat dissipation groove (9) to cool the transmission belt (4) at its top. A circulating structure is provided in the middle of the heat dissipation tank (9) to circulate and cool the heat exchange structure.
2. The high-efficiency electronic component welding platform according to claim 1, characterized in that, A positioning frame (16) is symmetrically arranged on the top of the support plate (1). A welding machine mounting bracket (17) is fixedly installed in the middle of the positioning frame (16). A purification structure is also provided on the positioning frame (16). The purification structure includes a fan (21), an air duct (18), an air collection pipe (19), and a filter box (20). The air duct (18) is opened at the outer end of the positioning frame (16). The air collection pipe (19) is fixedly installed on the rear side of the support plate (1) and is fixedly connected to the air duct (18). The filter box (20) is movably installed at the bottom of the air collection pipe (19). The fan (21) is movably installed at the bottom of the filter box (20).
3. The high-efficiency electronic component welding platform according to claim 1, characterized in that, The heat exchange structure includes a heat exchange plate (6), a water tank (7), and heat exchange fins (8). The heat exchange plate (6) is fixedly installed on the top of the heat dissipation groove (9), the water tank (7) is fixedly installed on the bottom of the heat exchange plate (6), the heat exchange fins (8) are arrayed on the bottom of the heat exchange plate (6) and inserted into the inside of the water tank (7), and the circulation structure is located below the water tank (7).
4. The high-efficiency electronic component welding platform according to claim 1, characterized in that, The circulation structure includes a booster pump (14), a hot water exchange pipe (11), and a temporary storage tank (10). The booster pump (14) is fixedly installed at the bottom right side of the water tank (7). The temporary storage tank (10) is fixedly installed at the bottom of the booster pump (14). The hot water exchange pipe (11) array is installed on the side of the high end of the water tank (7) and at the bottom of the temporary storage tank (10). A fan (12) is movably installed in the middle of the heat dissipation groove (9). A water outlet (13) is opened at the bottom of the water tank (7), and a water inlet (15) is opened at the top of the temporary storage tank (10).
5. The high-efficiency electronic component welding platform according to claim 4, characterized in that, The position of the water outlet (13) is corresponding to the position of the top of the booster pump (14), and the position of the water inlet (15) is corresponding to the position of the bottom of the booster pump (14).
6. The high-efficiency electronic component welding platform according to claim 1, characterized in that, The surface of the transmission belt (4) is provided with protruding plates (5), and the transmission belt (4) is a thermally conductive adhesive transmission belt.
7. The high-efficiency electronic component welding platform according to claim 1, characterized in that, The positioning block (2) is generally convex, and the two sides of the positioning block (2) are inclined.