Feeding mechanism and ceramic substrate laser drilling machine

Abstract

The utility model discloses a feeding mechanism and a ceramic substrate laser drilling machine. The feeding mechanism comprises a rack, a translation module arranged on the rack, a mounting platform arranged on the translation module, a mounting plate arranged on the mounting platform, a stock bin detachably connected to the mounting plate and a first material taking manipulator arranged on the rack. The translation module is used for driving the mounting platform to translate along a straight line, a plurality of positioning pins are arranged on the mounting plate, the stock bin comprises a bottom plate and a plurality of limiting columns arranged on the bottom plate, the limiting columns are used for limiting the periphery of a ceramic substrate, a plurality of positioning holes are formed in the bottom plate, and the positioning pins are arranged on the positioning holes. The multiple positioning holes are matched with the multiple positioning pins in a one-to-one correspondence mode, and the first material taking mechanical arm is used for grabbing the ceramic substrates in the stock bin to the next station. According to the utility model, the downtime caused by remodeling can be reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate processing technology, specifically to a feeding mechanism and a ceramic substrate laser drilling machine. Background Technology

[0002] Ceramic substrates are widely used as packaging and heat dissipation substrates for electronic components due to their excellent insulation, heat resistance, thermal conductivity, and thermal expansion coefficient that matches that of chips. As electronic components move towards miniaturization and high-density integration, it is necessary to process a large number of tiny through-holes or blind holes on ceramic substrates to achieve interlayer electrical interconnection.

[0003] Due to the high hardness and brittleness of ceramic materials, traditional mechanical drilling methods not only result in severe tool wear and low processing efficiency, but also easily lead to defects such as chipping and cracking of the substrate, making it difficult to meet the precision requirements of micro-hole processing. Laser processing, as a non-contact processing method, has advantages such as high processing accuracy, small heat-affected zone, and no limitation by material hardness, and has become the mainstream technology for micro-hole processing of ceramic substrates.

[0004] In automated laser drilling production lines, ceramic substrates are typically fed by placing stacked ceramic substrates in a hopper, and then having them picked up one by one by a robotic arm and moved to the processing station.

[0005] However, when processing ceramic substrates of different specifications, it is necessary to stop the machine, disassemble the old hopper and replace it with a new one. The disassembly and assembly operations are carried out in a small space and are cumbersome, which reduces the continuous running time of the equipment and affects production efficiency. Utility Model Content

[0006] In order to overcome the shortcomings of the existing technology, this utility model provides a feeding mechanism and a laser drilling machine for ceramic substrates, which can reduce downtime caused by model changeover and improve production efficiency.

[0007] The technical solution adopted by this utility model to solve its technical problem is:

[0008] A feeding mechanism includes a frame, a translation module mounted on the frame, a mounting platform mounted on the translation module, a mounting plate mounted on the mounting platform, a hopper detachably connected to the mounting plate, and a first picking robot mounted on the frame. The translation module drives the mounting platform to translate along a straight line. The mounting plate is provided with a plurality of positioning pins. The hopper includes a base plate and a plurality of limiting posts mounted on the base plate. The limiting posts are used to limit the perimeter of a ceramic substrate. The base plate has a plurality of positioning holes, each of which corresponds to and engages with a plurality of positioning pins. The first picking robot is used to pick up the ceramic substrate from the hopper and move it to the next work station.

[0009] As a further improvement to the above technical solution, a lifting assembly is provided on the mounting plate. The lifting assembly includes a lifting block and a driving component for driving the lifting block to rise and fall. The driving component is installed at the bottom of the mounting plate, and the lifting block is located above the mounting plate. The output end of the driving component passes through the mounting plate and is connected to the lifting block. A first clearance opening for avoiding the driving component is provided on the mounting platform, and a second clearance opening for avoiding the lifting block is provided on the bottom plate.

[0010] As a further improvement to the above technical solution, a mounting rod is provided on at least one side of the mounting plate, and a photoelectric sensor is mounted on the mounting rod. The photoelectric sensor is used to sense the height position of the ceramic substrate.

[0011] As a further improvement to the above technical solution, a number of sliding rods are fixedly connected to the bottom of the lifting block. The sliding rods are vertically arranged, and a number of linear bearings are installed on the mounting plate. The sliding rods are slidably engaged with the linear bearings one by one, and a stop is provided at the bottom of the sliding rod.

[0012] As a further improvement to the above technical solution, a support plate is stacked on top of the base plate, and the support plate is used to support the ceramic substrate.

[0013] As a further improvement to the above technical solution, handles are provided on both sides of the top of the base plate.

[0014] As a further improvement to the above technical solution, the first material handling robot includes a support, a first lifting module disposed on the support, a second lifting module disposed at the output end of the first lifting module, and an adsorption module disposed at the output end of the second lifting module. The support is mounted on the frame, and the adsorption module is used to adsorb or release ceramic substrates.

[0015] As a further improvement to the above technical solution, the first lifting module includes a first upright plate and a first sliding cylinder mounted on the first upright plate, the first upright plate being mounted on the bracket; the second lifting module includes a second upright plate and a second sliding cylinder mounted on the second upright plate, the second upright plate being mounted on the output end of the first sliding cylinder, and the adsorption module being mounted on the output end of the second sliding cylinder.

[0016] As a further improvement to the above technical solution, the adsorption module includes a mounting frame, a first mounting strip, a second mounting strip, a third sliding cylinder, and four vacuum suction cups. The first mounting strip and the third sliding cylinder are mounted on the mounting frame, and the second mounting strip is mounted on the telescopic end of the third sliding cylinder. The first mounting strip and the second mounting strip are parallel to each other. The first mounting strip has an oblong hole, and two of the vacuum suction cups are adjustablely mounted on the oblong hole via a first support. The second mounting strip has several mounting holes, and the other two vacuum suction cups are adjustablely mounted on the mounting holes via a second support.

[0017] A laser drilling machine for ceramic substrates includes the aforementioned feeding mechanism, pre-shaping mechanism, second unloading robot, laser drilling mechanism, and unloading mechanism.

[0018] The beneficial effects of this utility model are as follows: This utility model provides a feeding mechanism and a ceramic substrate laser drilling machine. When processing ceramic substrates of other specifications, the mounting platform and its mounting plate are moved to an open external location by a translation module. The original hopper is first lifted and moved away, and then another hopper pre-loaded with ceramic substrates is aligned with the positioning pin on the mounting plate through the positioning hole on the bottom plate, achieving rapid changeover. This reduces downtime caused by changeover and improves production efficiency. Simultaneously, the precise positioning of the hopper is ensured through the cooperation of the positioning pin and the positioning hole, ensuring the consistency of the positional relationship between the hopper and the first picking robot, thus improving the success rate of picking up materials. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the structure of a feeding mechanism provided in an embodiment of this utility model;

[0021] Figure 2 yes Figure 1 A structural diagram of the translation module, installation platform, and hopper in the diagram;

[0022] Figure 3 yes Figure 2 A schematic diagram of the mounting plate and hopper structure;

[0023] Figure 4 yes Figure 3 A sectional view;

[0024] Figure 5 yes Figure 3 A schematic diagram of the structure of the hopper in the retrieval state;

[0025] Figure 6 yes Figure 1A schematic diagram of the structure of the first material handling robot in the process;

[0026] Figure 7 This is a schematic diagram of the structure of a laser drilling machine for ceramic substrates provided in an embodiment of this utility model.

[0027] Reference numerals: 100-Frame, 200-Translation module, 300-Mounting platform, 310-Mounting plate, 311-Positioning pin, 312-Mounting rod, 313-Photoelectric sensor, 320-Lifting assembly, 321-Lifting block, 322-Drive component, 323-Slide rod, 324-Linear bearing, 325-Stop block, 400-Hopper, 410-Base plate, 411-Positioning hole, 420-Limiting post, 430-Support plate, 440-Handle, 500-First material handling robot, 510-Bracket, 520-First lifting module 521-First upright plate, 522-First slide cylinder, 530-Second lifting module, 531-Second upright plate, 532-Second slide cylinder, 540-Adsorption module, 541-Mounting bracket, 542-First mounting strip, 5421-Oval hole, 543-Second mounting strip, 5431-Mounting hole, 544-Third slide cylinder, 545-Vacuum suction cup, 546-First support, 547-Second support, 600-Pre-shaping mechanism, 700-Second material handling robot, 800-Laser drilling mechanism, 900-Unloading mechanism. Detailed Implementation

[0028] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0029] Reference Figures 1 to 6This utility model provides a feeding mechanism, including a frame 100, a translation module 200 mounted on the frame 100, a mounting platform 300 mounted on the translation module 200, a mounting plate 310 mounted on the mounting platform 300, a hopper 400 detachably connected to the mounting plate 310, and a first picking robot 500 mounted on the frame 100. The translation module 200 is used to drive the mounting platform 300 to translate in a straight line. The mounting plate 310 is provided with a plurality of positioning pins 311. The hopper 400 includes a base plate 410 and a plurality of limiting posts 420 provided on the base plate 410. The limiting posts 420 are used to limit the perimeter of the ceramic substrate. The base plate 410 is provided with a plurality of positioning holes 411, which correspond one-to-one with the plurality of positioning pins 311. The first picking robot 500 is used to pick up the ceramic substrate in the hopper 400 and move it to the next work station.

[0030] Before loading, the operator places multiple stacked ceramic substrates into the hopper 400, where several limiting posts 420 limit the movement of the ceramic substrates around their perimeter. Next, the translation module 200 drives the mounting platform 300 and its mounting plate 310 to an open area. The operator then aligns the hopper 400, loaded with ceramic substrates, through the positioning holes 411 on the base plate 410 and inserts the positioning pins 311 on the mounting plate 310, quickly positioning the hopper 400 on the mounting plate 310. Subsequently, the translation module 200 drives the mounting platform 300, its mounting plate 310, and the hopper 400 together to the loading station. Finally, the first picking mechanism grabs the top ceramic substrate and moves it to the next station, repeating the picking action until all ceramic substrates in the hopper 400 are removed.

[0031] When processing ceramic substrates of other specifications, the translation module 200 drives the mounting platform 300 and its mounting plate 310 to a spacious external location. First, the original material bin 400 is lifted and removed. Then, another material bin 400 pre-loaded with ceramic substrates is aligned with and inserted into the positioning pin 311 on the mounting plate 310 through the positioning hole 411 on the base plate 410, achieving rapid material changeover. This reduces downtime caused by material changeovers and improves production efficiency. Simultaneously, the precise positioning of the material bin 400 is ensured through the cooperation of the positioning pin 311 and the positioning hole 411, guaranteeing the consistency of the positional relationship between the material bin 400 and the first picking robot 500, thus improving the success rate of material picking.

[0032] In some preferred embodiments, a lifting assembly 320 is provided on the mounting plate 310. The lifting assembly 320 includes a lifting block 321 and a driving member 322 for driving the lifting block 321 to rise and fall. The driving member 322 is installed at the bottom of the mounting plate 310, and the lifting block 321 is located above the mounting plate 310. The output end of the driving member 322 passes through the mounting plate 310 and is connected to the lifting block 321. A first clearance opening for avoiding the driving member 322 is provided on the mounting platform 300, and a second clearance opening for avoiding the lifting block 321 is provided on the base plate 410.

[0033] Understandably, before installing the hopper 400, the drive unit 322 drives the lifting block 321 to descend. Then, the hopper 400 is installed, so that the lifting block 321 is lower than or flush with the upper surface of the base plate 410. At this time, the height of the ceramic substrates stacked in the hopper 400 remains unchanged. When one ceramic substrate is removed from the hopper 400, the height of the top ceramic substrate will decrease. At this time, the control system of the equipment activates the drive unit 322, which drives the lifting block 321 to rise. The lifting block 321 passes through the second clearance opening on the base plate 410 and lifts the remaining ceramic substrates, so that the top ceramic substrate is always kept at a constant gripping height of the first picking robot 500. Thus, the first picking robot 500 does not need to frequently adjust its descent depth when picking up materials, simplifying the control logic and improving the stability and success rate of picking up materials.

[0034] It should be noted that the drive unit 322 can be one of the following power devices: electric cylinder, pneumatic cylinder, hydraulic cylinder, etc., and is not specifically limited in this embodiment.

[0035] Furthermore, at least one side of the mounting plate 310 is provided with a mounting rod 312, and a photoelectric sensor 313 is mounted on the mounting rod 312. The photoelectric sensor 313 is used to sense the height position of the ceramic substrate.

[0036] Understandably, based on the descent depth of the first picking robot 500 during material picking, the height of the photoelectric sensor 313 on the mounting rod 312 is adjusted so that the light path of the photoelectric sensor 313 is aligned with the uppermost ceramic substrate. When the lifting assembly 320 lifts the entire ceramic substrate in the hopper 400, the uppermost ceramic substrate blocks or reflects the light path of the photoelectric sensor 313, causing the photoelectric sensor 313 to emit a signal. The control system of the equipment determines based on the signal that the ceramic substrate has reached the preset height and controls the lifting assembly 320 to stop operating. This ensures that the uppermost ceramic substrate is accurately positioned at the set picking height, avoiding accumulated errors.

[0037] Furthermore, the bottom of the lifting block 321 is fixedly connected with several sliding rods 323, which are vertically arranged. Several linear bearings 324 are installed on the mounting plate 310. The sliding rods 323 slide in cooperation with the linear bearings 324 one by one. A stop block 325 is provided at the bottom of the sliding rods 323.

[0038] When the drive unit 322 drives the lifting block 321 to rise or fall, the lifting block 321 drives several sliding rods 323 to slide in the corresponding linear bearings 324, providing precise guidance for the lifting movement of the lifting block 321. This prevents the lifting block 321 from shaking or deflecting during the lifting process, ensuring that the ceramic substrate remains stable when being lifted, and further guaranteeing the success rate of gripping.

[0039] In addition, by providing a stop 325 at the bottom of the slide bar 323, the slide bar 323 can be prevented from disengaging from the linear bearing 324 when sliding upward, thereby improving the safety of the equipment.

[0040] Furthermore, a support plate 430 is stacked on top of the base plate 410, and the support plate 430 is used to support the ceramic substrate.

[0041] Understandably, when the driving component 322 drives the lifting block 321 to rise, the lifting block 321 lifts the support plate 430 above it and all the ceramic substrates, thus preventing the bottom ceramic substrate from directly contacting the lifting block 321. Since the area of ​​the support plate 430 is larger than the area of ​​the top of the lifting block 321, the support area of ​​the lowest ceramic substrate is increased, pressure is distributed, and the ceramic substrate is prevented from cracking due to localized stress, thereby improving safety.

[0042] In some preferred embodiments, handles 440 are provided on both sides of the top of the base plate 410.

[0043] Understandably, when it is necessary to remove the entire hopper 400 from the mounting plate 310, or when it is necessary to move the hopper 400 filled with ceramic substrates onto the mounting plate 310, the operator can simply lift the two handles 440 on the top plate with both hands to easily lift or lower the entire hopper 400. This provides a point of leverage for the handling and replacement of the hopper 400, reduces the difficulty of operation, and improves the convenience of equipment operation.

[0044] In some preferred embodiments, the first material handling robot 500 includes a support 510, a first lifting module 520 disposed on the support 510, a second lifting module 530 disposed at the output end of the first lifting module 520, and an adsorption module 540 disposed at the output end of the second lifting module 530. The support 510 is mounted on the frame 100, and the adsorption module 540 is used to adsorb or release ceramic substrates.

[0045] Understandably, during material retrieval, the first lifting module 520 drives the entire second lifting module 530 and adsorption module 540 to descend rapidly. When the adsorption module 540 approaches the ceramic substrate in the hopper 400, the second lifting module 530 drives the adsorption module 540 to descend with high precision until the adsorption module 540 contacts the surface of the uppermost ceramic substrate. Then, the adsorption module 540 generates vacuum suction, firmly adsorbing the uppermost ceramic substrate. Next, the second lifting module 530 and the first lifting module 520 sequentially drive the adsorption module 540 to rise, removing the ceramic substrate from the hopper 400 and transferring it to the next workstation. Finally, the adsorption module 540 releases the ceramic substrate. Therefore, through a two-stage lifting stroke, the first lifting module 520 achieves rapid, large-stroke movement, saving material retrieval time; the second lifting module 530 achieves slow, small-stroke fine-tuning, ensuring the positional accuracy of the adsorption module 540, thereby improving production efficiency and material handling accuracy. At the same time, it enables the overall structure to be compact and saves vertical installation space.

[0046] Furthermore, the first lifting module 520 includes a first upright plate 521 and a first slide cylinder 522 mounted on the first upright plate 521, with the first upright plate 521 mounted on the bracket 510; the second lifting module 530 includes a second upright plate 531 and a second slide cylinder 532 mounted on the second upright plate 531, with the second upright plate 531 mounted at the output end of the first slide cylinder 522, and the adsorption module 540 mounted at the output end of the second slide cylinder 532.

[0047] During material loading and unloading, the first sliding cylinder 522 drives the second lifting module 530 and the adsorption module 540 to move up and down as a whole, while the second sliding cylinder 532 drives the adsorption module 540 to move up and down. The first sliding cylinder 522 and the second sliding cylinder 532 have good guiding accuracy, thus ensuring smooth operation and positional accuracy. At the same time, they simplify the assembly process and facilitate installation and subsequent maintenance.

[0048] In some preferred embodiments, the adsorption module 540 includes a mounting frame 541, a first mounting strip 542, a second mounting strip 543, a third slide cylinder 544, and four vacuum suction cups 545. The first mounting strip 542 and the third slide cylinder 544 are mounted on the mounting frame 541, and the second mounting strip 543 is mounted on the telescopic end of the third slide cylinder 544. The first mounting strip 542 and the second mounting strip 543 are parallel to each other. The first mounting strip 542 has an oblong hole 5421, and two vacuum suction cups 545 are adjustablely mounted on the oblong hole 5421 through a first support 546. The second mounting strip 543 has several mounting holes 5431, and the other two vacuum suction cups 545 are adjustablely mounted on the mounting holes 5431 through a second support 547.

[0049] When the first lifting module 520 and the second lifting module 530 drive the adsorption module 540 to descend to the material picking position, the four vacuum suction cups 545 simultaneously contact the upper surface of the uppermost ceramic substrate in the hopper 400. Then, the four vacuum suction cups 545 simultaneously adsorb the uppermost ceramic substrate, thereby providing a stable and reliable gripping force and preventing the ceramic substrate from deforming or shaking during the transfer process.

[0050] When processing ceramic substrates of other specifications, the operator can loosen the fasteners of the first support 546, allowing it to slide within the oblong hole 5421 of the first mounting strip 542 to adjust the gap between the corresponding two vacuum suction cups 545. The operator can fix the second support 547 to different mounting holes 5431 on the second mounting strip 543 to adjust the gap between the other two vacuum suction cups 545. The second mounting strip 543 is driven to translate by the third slide cylinder 544, causing the two vacuum suction cups 545 mounted on the second mounting strip 543 to move relative to the two vacuum suction cups 545 on the first mounting strip 542. Thus, it can adapt to ceramic substrates of different specifications without replacing the entire adsorption module 540.

[0051] Reference Figure 7 This utility model embodiment also provides a ceramic substrate laser drilling machine, including the above-mentioned feeding mechanism, pre-shaping mechanism 600, second material handling robot 700, laser drilling mechanism 800 and unloading mechanism 900.

[0052] When the equipment is working, the stacked ceramic substrates are first taken out one by one by the feeding mechanism and transferred to the pre-shaping mechanism 600 for position calibration. Then, the second picking robot 700 grabs the pre-shaped ceramic substrate and accurately transfers it to the laser drilling mechanism 800 for laser drilling. After drilling is completed, the unloading mechanism 900 takes out the ceramic substrate for collection or classification, thereby improving production efficiency and ensuring processing yield.

[0053] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A feeding mechanism, characterized in that, The device includes a frame, a translation module mounted on the frame, a mounting platform mounted on the translation module, a mounting plate mounted on the mounting platform, a hopper detachably connected to the mounting plate, and a first picking robot mounted on the frame. The translation module drives the mounting platform to translate in a straight line. The mounting plate is provided with several positioning pins. The hopper includes a base plate and several limiting posts on the base plate. The limiting posts are used to limit the perimeter of the ceramic substrate. The base plate has several positioning holes, which correspond one-to-one with the positioning pins. The first picking robot is used to pick up the ceramic substrate in the hopper and move it to the next work station.

2. The feeding mechanism according to claim 1, characterized in that, The mounting plate is provided with a lifting assembly, which includes a lifting block and a driving component for driving the lifting block to move up and down. The driving component is installed at the bottom of the mounting plate, and the lifting block is located above the mounting plate. The output end of the driving component passes through the mounting plate and is connected to the lifting block. The mounting platform has a first clearance opening for avoiding the driving component, and the base plate has a second clearance opening for avoiding the lifting block.

3. The feeding mechanism according to claim 2, characterized in that, At least one side of the mounting plate is provided with a mounting rod, and a photoelectric sensor is mounted on the mounting rod. The photoelectric sensor is used to sense the height position of the ceramic substrate.

4. The feeding mechanism according to claim 2, characterized in that, The bottom of the lifting block is fixedly connected to several sliding rods, which are vertically arranged. Several linear bearings are installed on the mounting plate, and the sliding rods are slidably engaged with the linear bearings one by one. A stop block is provided at the bottom of the sliding rod.

5. A feeding mechanism according to claim 2, characterized in that, A support plate is stacked on top of the base plate, and the support plate is used to support the ceramic substrate.

6. The feeding mechanism according to claim 1, characterized in that, Handles are provided on both sides of the top of the base plate.

7. The feeding mechanism according to claim 1, characterized in that, The first material handling robot includes a support, a first lifting module mounted on the support, a second lifting module mounted at the output end of the first lifting module, and an adsorption module mounted at the output end of the second lifting module. The support is mounted on the frame, and the adsorption module is used to adsorb or release ceramic substrates.

8. A feeding mechanism according to claim 7, characterized in that, The first lifting module includes a first upright plate and a first sliding cylinder mounted on the first upright plate, with the first upright plate mounted on the bracket; the second lifting module includes a second upright plate and a second sliding cylinder mounted on the second upright plate, with the second upright plate mounted at the output end of the first sliding cylinder, and the adsorption module mounted at the output end of the second sliding cylinder.

9. A feeding mechanism according to claim 7, characterized in that, The adsorption module includes a mounting frame, a first mounting strip, a second mounting strip, a third sliding cylinder, and four vacuum suction cups. The first mounting strip and the third sliding cylinder are mounted on the mounting frame, and the second mounting strip is mounted on the telescopic end of the third sliding cylinder. The first mounting strip and the second mounting strip are parallel to each other. The first mounting strip has an oblong hole, and two of the vacuum suction cups are adjustablely mounted on the oblong hole via a first support. The second mounting strip has several mounting holes, and the other two vacuum suction cups are adjustablely mounted on the mounting holes via a second support.

10. A laser drilling machine for ceramic substrates, characterized in that, It includes the feeding mechanism, pre-shaping mechanism, second material handling robot, laser drilling mechanism and unloading mechanism as described in any one of claims 1 to 9.

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