Quick positioning welding device

Abstract

The utility model relates to the technical field of power supply PCB (Printed Circuit Board) welding, and discloses a welding device capable of quickly positioning, which comprises a welding substrate, the top of the welding substrate is in threaded connection with four fixed-distance screws which are symmetrically distributed, and the fixed-distance screws are in threaded connection with the top of the welding substrate. Two kidney-shaped sliding holes are formed in each sliding base plate, the sliding base plates are connected with the two distance screws through the two kidney-shaped sliding holes to form limiting, a containing groove used for containing a PCB without pins welded is formed in the top of the welding substrate, and the two sliding base plates sliding along the containing groove are arranged at the top of the welding substrate. An identification groove is formed in the top of the sliding base plate, the identification groove points to the sliding direction of the sliding base plate in a bidirectional arrow shape, and an adsorption piece which is matched with the sliding base plate and can limit the position of the sliding base plate is arranged on the top of the welding base plate. The welding device capable of rapidly positioning has the advantage of being capable of conveniently carrying out heightening welding on the two-layer PCB.

Description

Technical Field

[0001] This utility model relates to the field of power PCB circuit board welding technology, specifically a welding device for rapid positioning. Background Technology

[0002] In power module production, PCBA soldering is a key process for firmly connecting electronic components to printed circuit boards (PCBs) to ensure stable electrical connections. For example, plug-in component soldering is typically used for larger components such as plugs and relays, or components whose pins need to be inserted into holes.

[0003] In some cases where two PCB layers need to be soldered to the same pin, in order to ensure the consistency of the gap between the two PCB layers, it is usually necessary to support the second PCB layer to be soldered. The existing support method usually uses shims to raise multiple pins for multiple soldering, which requires changing the position of the shims multiple times, which is inconvenient. Therefore, a fast positioning soldering device is proposed to solve the above-mentioned problems. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a rapid positioning welding device that can conveniently perform elevated welding on two-layer PCB boards. It solves the problem that existing support methods typically use shims to elevate and weld multiple pins multiple times, requiring repeated changes to the position of the shims, which is inconvenient.

[0006] (II) Technical Solution

[0007] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A welding device for rapid positioning includes a welding substrate. The top of the welding substrate is provided with a placement groove for placing an unwelded PCB board. The top of the welding substrate is provided with two sliding pads that slide along the placement groove. The top of the welding substrate is provided with an adsorption member that cooperates with the sliding pads and can restrict their position. An auxiliary limiting groove is fixedly installed between the opposite sides of the two sliding pads.

[0008] The beneficial effects of this utility model are:

[0009] This rapid positioning welding device has the advantage of being able to easily elevate and weld two-layer PCB boards.

[0010] Based on the above technical solution, the present invention can be further improved as follows.

[0011] Furthermore, the top of the welding substrate is connected by four symmetrically distributed spacer screws via threads, and the interior of each sliding pad has two waist-shaped sliding holes, which are connected to the two spacer screws to form a limit.

[0012] The beneficial effect of adopting the above-mentioned further solution is that the movement direction of the sliding pad can be effectively restricted by the fixed-distance screw in conjunction with the waist-shaped sliding hole.

[0013] Furthermore, the top of the sliding pad is provided with an identification groove, which is shaped like a double-headed arrow pointing tangentially to the sliding direction of the sliding pad.

[0014] Furthermore, the width of the auxiliary limiting groove is smaller than the width of the placement groove, the length and width of the placement groove are adapted to the PCB board, and the width of the auxiliary limiting groove is adapted to the pin arrangement width.

[0015] The advantages of adopting the above-mentioned further solution are that it facilitates the connection of the PCB board and allows for auxiliary positioning of the pins after the initial pin soldering, preventing shaking during the second layer soldering.

[0016] Furthermore, the adsorption component includes a magnetic block and an adsorption block, which are respectively arranged inside the sliding pad and the welding substrate. Each magnetic block is arranged with two adsorption blocks, and the two adsorption blocks are respectively positioned for support and initial positioning.

[0017] The beneficial effect of adopting the above-mentioned further solution is that the adsorption component is designed so that it will not shift due to shaking or impact after the support is completed, thus ensuring the stability of the connection.

[0018] Furthermore, the sliding pad has an adsorption hole inside, and the magnetic block is arranged inside the adsorption hole and extends above it. The length of the magnetic block is adapted to the thickness of the sliding pad.

[0019] The beneficial effect of adopting the above-mentioned further solution is that this arrangement enables good assembly performance among multiple sliding pads, and after assembly, positioning and adsorption connection can be completed through adsorption holes and magnetic blocks.

[0020] Furthermore, the depth of the placement groove is adapted to the thickness of the PCB board, and the thickness of the sliding pad is adapted to the soldering gap of the PCB board.

[0021] The advantage of adopting the above-mentioned further solution is that, through this setting, the PCB board below can be locked after the sliding pad slides, preventing it from shaking during the soldering process. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is a diagram showing the connection between the welding substrate and the spacer screw of this utility model;

[0024] Figure 3 This is a schematic diagram illustrating the use of this utility model.

[0025] In the diagram: 1. Welding substrate; 2. Sliding pad; 3. Adsorption component; 31. Magnetic block; 32. Adsorption block; 4. Spacing screw. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the embodiments, by Figure 1-3 The present invention provides a welding device for rapid positioning. The welding substrate 1 has a placement groove on its top for placing unwelded PCB boards. Two sliding pads 2 are provided on the top of the welding substrate 1 and slide along the placement groove. An adsorption member 3 is provided on the top of the welding substrate 1 and cooperates with the sliding pads 2 to restrict their position. An auxiliary limiting groove is fixedly installed between the opposite sides of the two sliding pads 2.

[0028] Furthermore, the top of the welding substrate 1 is connected by four symmetrically distributed spacer screws 4 via threads, and the interior of a single sliding pad 2 has two waist-shaped sliding holes, which are connected to two positioning screws 4 to form a limit.

[0029] The two waist-shaped sliding holes in a single sliding pad 2 are arranged in parallel. During the movement, the waist-shaped sliding holes, together with the spacer bolts, can effectively restrict its movement direction, so that it can only move towards or away from the placement slot, thereby facilitating the support of the second-layer PCB.

[0030] Furthermore, the top of the sliding pad 2 is provided with an marking groove, which is shaped like a double arrow pointing in the sliding direction of the sliding pad 2.

[0031] The indicator slots provide a helpful prompt for those without prior experience, lowering the barrier to entry for using the tool.

[0032] Furthermore, the width of the auxiliary limiting groove is smaller than the width of the placement groove, the length and width of the placement groove are adapted to the PCB board, and the width of the auxiliary limiting groove is adapted to the pin arrangement width.

[0033] The auxiliary limiting groove of this type of design is narrower than the placement groove, which allows it to effectively support the two-layer PCB through the four corners, making it convenient to support the two-layer PCB board.

[0034] Furthermore, the adsorption component 3 includes a magnetic block 31 and an adsorption block 32. The magnetic block 31 and the adsorption block 32 are respectively arranged inside the sliding pad 2 and the welding substrate 1. Each magnetic block 31 is corresponding to two adsorption blocks 32, and the two adsorption blocks 32 are respectively corresponding to the support limit and the initial limit.

[0035] Under normal conditions, the magnetic block 31 is attracted to the initial limiting adsorption block 32. At this time, the distance between the two sliding pads 2 is sufficient to allow the first layer PCB to pass through. The first layer PCB can then be placed directly inside the placement slot. Then, the sliding pads 2 are slid down again to attract the adsorption block 32 at the support limiting position, thus completing the fixation of the first layer PCB.

[0036] Furthermore, the sliding pad 2 has an adsorption hole inside, and the magnetic block 31 is arranged inside the adsorption hole and extends above it. The length of the magnetic block 31 is adapted to the thickness of the sliding pad 2.

[0037] Specifically, the number of sliding pads 2 should be multiple and in pairs, and the thickness of each pair of sliding pads 2 should be different, so that the gap between the two PCB boards can be changed by replacing the sliding pads 2.

[0038] When the design gap between two sets of PCB boards is greater than the thickness of the maximum sliding pad 2, two sliding pads 2 of different thicknesses can be stacked on top of each other and attracted by the magnetic block 31. The magnetic block 31 is used to limit the position through the attraction hole, so as to achieve support for a higher gap.

[0039] Furthermore, the depth of the placement groove is adapted to the thickness of the PCB board, and the thickness of the sliding pad 2 is adapted to the soldering gap of the PCB board.

[0040] Working principle:

[0041] When the PCB board needs to be soldered, the sliding pad 2 can be moved first to accommodate the first layer PCB board. The first layer PCB board can be placed inside the placement slot and the pin soldering of the first layer PCB board can begin.

[0042] After the pins are soldered, the sliding pad 2 can be moved again to restrict the PCB board inside the placement slot. At this time, the second PCB board can be placed through the pins. During the placement process, the sliding pad 2 provides support for the second PCB board, which facilitates the soldering of the second PCB board.

[0043] After the soldering of the second-layer PCB is completed, move the sliding pad 2 back to its original position, and the soldered workpiece can be removed as a whole through the second-layer PCB.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid positioning welding apparatus, comprising a welding substrate (1), characterized in that: The top of the welding substrate (1) is provided with a placement groove for placing unwelded pin PCB boards. The top of the welding substrate (1) is provided with two sliding pads (2) that slide along the placement groove. The top of the welding substrate (1) is provided with an adsorption member (3) that cooperates with the sliding pads (2) and can restrict their position. An auxiliary limiting groove is fixedly installed between the opposite sides of the two sliding pads (2).

2. The rapid positioning welding device according to claim 1, characterized in that: The top of the welding substrate (1) is connected by four symmetrically distributed spacer screws (4) through a thread. The interior of each sliding pad (2) has two waist-shaped sliding holes and is connected to the two spacer screws (4) through the two waist-shaped sliding holes to form a limit.

3. The rapid positioning welding device according to claim 1, characterized in that: The top of the sliding pad (2) is provided with an identification groove, which is shaped like a double arrow pointing in the sliding direction of the sliding pad (2).

4. The rapid positioning welding device according to claim 1, characterized in that: The width of the auxiliary limiting groove is smaller than the width of the placement groove, the length and width of the placement groove are adapted to the PCB board, and the width of the auxiliary limiting groove is adapted to the pin arrangement width.

5. The rapid positioning welding device according to claim 1, characterized in that: The adsorption component (3) includes a magnetic block (31) and an adsorption block (32). The magnetic block (31) and the adsorption block (32) are respectively arranged inside the sliding pad (2) and the welding substrate (1). Each magnetic block (31) is arranged with two adsorption blocks (32). The two adsorption blocks (32) are respectively positioned to support the limit and the initial limit.

6. The rapid positioning welding device according to claim 5, characterized in that: The sliding pad (2) has an adsorption hole inside, and the magnetic block (31) is arranged inside the adsorption hole and extends above it. The length of the magnetic block (31) is adapted to the thickness of the sliding pad (2).

7. The rapid positioning welding device according to claim 1, characterized in that: The depth of the placement groove is adapted to the thickness of the PCB board, and the thickness of the sliding pad (2) is adapted to the welding gap of the PCB board.

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