Lifting device, wafer-level aging test device, wafer-level aging test equipment and wafer-level aging test system

Abstract

The utility model discloses a lifting device, a wafer-level aging test device, wafer-level aging test equipment and a wafer-level aging test system. The wafer-level aging test device comprises a heat sink assembly and a probe plate assembly. The lifting device comprises at least two lifting assemblies, a bearing platform and a bottom plate, the bearing platform is used for bearing the heat sink assembly and is fixed in the longitudinal position, and the bottom plate is provided with at least two distributed supporting positions; the lifting assembly comprises a connecting piece and a moving piece which are movably connected, the connecting piece is fixedly connected with the supporting position, the moving piece is fixedly connected with the probe plate assembly, and all the moving pieces can cooperatively drive the probe plate assembly to move towards the heat sink assembly so as to perform mold closing to form a wafer aging test cavity. According to the utility model, the lifting assemblies are respectively arranged on the at least two supporting positions, the stress is dispersed, the compression resistance is good, the moving parts can cooperatively drive the probe plate assembly to lift, the lifting precision and stability of the probe plate assembly are improved, and the noise is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a lifting device, a wafer-level aging test device, equipment and system. Background Technology

[0002] In existing wafer-level aging test equipment, the probe plate assembly located above and the heat sink assembly located below can be molded together to form a test cavity, and an inert gas is introduced into the test cavity between the two to form a high-pressure test environment to realize wafer aging test under high temperature and high pressure conditions; under high pressure conditions, the high pressure gas acts upward, causing the probe plate assembly to bear a large pressure, and acts downward, causing the heat sink assembly to bear a large pressure.

[0003] The existing lifting structure is located below the heat sink assembly, and it closes the mold with the probe plate assembly by lifting the heat sink assembly. However, the entire moving platform that supports the movement of the heat sink assembly has many components, and the lifting structure is subjected to high pressure. When lifting the heat sink assembly to close the mold, the operation is unstable and noisy, which greatly reduces the alignment accuracy of the probe plate assembly and the heat sink assembly when closing the mold to form the test cavity. Furthermore, during the wafer aging test, the high-pressure gas will bring even higher pressure, and the existing lifting structure is difficult to withstand the high pressure required by the wafer-level aging test equipment. The heat sink assembly and the probe plate assembly are prone to positional misalignment, which is detrimental to the overall operating accuracy, stability and safety of the equipment. Utility Model Content

[0004] To address the problems existing in the prior art, this utility model provides a lifting device, a wafer-level aging test device, equipment, and system; the technical solution is as follows:

[0005] This utility model provides a lifting device for a wafer-level aging test device, the wafer-level aging test device including a heat sink assembly and a probe plate assembly; the lifting device includes at least two lifting components, a load-bearing platform and a base plate, the load-bearing platform is used to support the heat sink assembly and is fixed in the longitudinal position, and the base plate is provided with at least two distributed support positions.

[0006] The lifting assembly includes a movably connected connector and a movable component. The connector is fixedly connected to the support position, and the movable component is fixedly connected to the probe plate assembly. Each of the movable components can work together to move the probe plate assembly toward the heat sink assembly to form a wafer aging test cavity.

[0007] Furthermore, the lifting assembly also includes a driving device and a lead screw. The driving device is driven to the lead screw, and the lead screw is transmitted to the moving part. The lead screw is vertically arranged. When the driving device drives the lead screw to rotate, it can drive the moving part and the probe plate assembly to move along the lead screw.

[0008] Furthermore, the movable component includes a first connecting portion, which is sleeved on the lead screw; the lead screw has an external thread, the first connecting portion has an internal thread, and the lead screw is threadedly connected to the first connecting portion.

[0009] Furthermore, one of the connector and the moving member is provided with a slider, and the other is provided with a linear guide rail slidably connected to the slider. The slider slides relative to the linear guide rail, which can limit the lifting direction of the moving member in conjunction with the probe plate assembly.

[0010] Furthermore, it also includes multiple limiting members located on the load-bearing platform. When the heat sink assembly and the probe plate assembly are molded together, the limiting members can abut against the side of the probe plate assembly facing the load-bearing platform.

[0011] Furthermore, it also includes a pressure sensing element, which is used to detect the pressure between the probe plate assembly and the load-bearing platform during the lifting and lowering process of the moving part;

[0012] The pressure sensing element can be located on the side of the probe plate assembly facing the load-bearing platform, or the pressure sensing element can be located on the side of the load-bearing platform facing the probe plate assembly.

[0013] Furthermore, it also includes a first moving component and a second moving component, wherein the first moving component is located between the base plate and the second moving component, and the load-bearing platform is connected to the second moving component;

[0014] The first moving component is movably connected to the base plate and can drive the second moving component and the load-bearing platform to move together in a first horizontal direction. The second moving component is movably connected to the first moving component and can drive the load-bearing platform to move in a second horizontal direction. The first horizontal direction and the second horizontal direction intersect.

[0015] Furthermore, it also includes a support frame, one end of which is fixedly connected to the base plate, and the other end of which is fixedly connected to the side of the connector away from the load-bearing platform.

[0016] Furthermore, the support frame includes multiple first frames and multiple second frames. The first frames are vertically arranged, and the base plate and the connector are fixedly connected through the first frames. On the same support position, two adjacent first frames are connected through the second frames.

[0017] On the other hand, the present invention also provides a wafer-level aging test device, including a probe plate assembly, a heat sink assembly, and a lifting device as described in any of the above claims. The longitudinal position of the heat sink assembly is fixed, and the lifting device is used to drive the probe plate assembly toward the heat sink assembly to form a wafer aging test cavity.

[0018] Furthermore, the probe plate assembly includes a fixed plate and a needle plate. The fixed plate is fixedly connected to the moving part, and the needle plate is detachably fixedly connected to the fixed plate. The needle plate is located on the side of the fixed plate facing the heat sink assembly, and the heat sink assembly can be molded with the needle plate.

[0019] On the other hand, the present invention also provides a wafer-level aging test device, including a plurality of wafer-level aging test devices as described in any of the preceding claims.

[0020] On the other hand, this utility model also provides a wafer-level aging test system, including wafer-level loading and unloading equipment, wafer-level transport equipment, and wafer-level aging test equipment as described above.

[0021] Implementing this utility model has the following beneficial effects:

[0022] This invention features lifting components installed on at least two support positions distributed on the base plate. Connectors in each lifting component are fixedly connected to the support positions, while movable components are fixedly connected to the probe plate assembly. Each movable component can move up and down relative to its connecting component to collaboratively drive the probe plate assembly to rise and fall. This lifting device significantly improves the lifting accuracy and stability of the probe plate assembly during lifting, while reducing noise. Simultaneously, during the lifting of the probe plate assembly, the longitudinal positions of the load-bearing platform and the heat sink assembly remain fixed. Combined with the liftable probe plate assembly, this greatly improves the mold-closing accuracy and stability between the probe plate assembly and the heat sink assembly. Furthermore, the pressure on the probe plate assembly can be distributed to at least two support positions through the distributed lifting components, resulting in good compressive strength and improving the positional accuracy and stability of the probe plate assembly under high air pressure. Attached Figure Description

[0023] To more clearly illustrate the technical solution of this utility model, the accompanying drawings used in the embodiments will be briefly described below, wherein the same components are represented by the same reference numerals. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0024] Figure 1 A three-dimensional structural diagram of a lifting device provided in an embodiment of this utility model;

[0025] Figure 2 This is a schematic diagram of a heat sink assembly and its motion structure provided in an embodiment of the present utility model;

[0026] Figure 3 A bottom view of a probe plate assembly provided in an embodiment of this utility model;

[0027] Figure 4 A schematic diagram of the assembly structure of a probe plate assembly and a support frame provided for an embodiment of this utility model;

[0028] Figure 5 A schematic diagram of the transmission structure of a drive device provided in an embodiment of this utility model;

[0029] Figure 6 A schematic diagram of a lifting assembly provided in an embodiment of this utility model;

[0030] Figure 7 This is a schematic diagram of the internal assembly structure of a lifting component provided in an embodiment of the present utility model.

[0031] The corresponding reference numerals in the figure are as follows:

[0032] 1-Heat sink assembly, 2-Probe plate assembly, 21-Fixing plate, 22-Needle plate, 3-Lifting assembly, 31-Connector, 310-Linear guide rail, 311-Second connecting part, 32-Moving part, 320-First connecting part, 321-Slider, 33-Drive device, 330-Transmission part, 34-Screw, 4-Bearing platform, 5-Base plate, 6-First moving assembly, 7-Second moving assembly, 8-Support frame, 81-First frame, 82-Second frame. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "both ends," "one end," and "the other end," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing the present utility model and do not indicate or imply that the device or structure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present utility model. Furthermore, the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0034] In existing wafer-level aging test equipment, the lifting structure for closing the probe plate assembly and heat sink assembly has poor pressure resistance, unstable operation, high noise, poor overall closing accuracy, and poor safety. Furthermore, the spring-floating mechanism between the probe plate and the fixed plate inside the probe plate assembly aims to achieve self-parallelism between the probe plate and the heat sink assembly, but the self-parallelism effect is poor, leading to instability in the probe plate position and reducing the contact accuracy between the probes in the probe plate and the wafers placed in the heat sink assembly. In addition, the use of four-corner cylindrical fixing to the probe plate assembly results in low overall strength and poor deformation resistance, which also affects the accuracy and stability of closing and overall operation.

[0035] To solve at least one of the above technical problems, such as Figure 1 As shown, this utility model provides a lifting device, a wafer-level aging test device, equipment and system. The wafer-level aging test device includes a heat sink assembly 1, a probe plate assembly 2 and a lifting device. The longitudinal position of the heat sink assembly 1 is fixed. The lifting device is used to drive the probe plate assembly 2 to move toward the heat sink assembly 1 to form a wafer aging test cavity.

[0036] Specifically, such as Figure 1As shown, the lifting device includes a heat sink assembly, at least two lifting assemblies 3, a load-bearing platform 4, and a base plate 5. The load-bearing platform 4 supports the heat sink assembly 1, and the longitudinal position of the load-bearing platform 4 and the heat sink assembly is fixed. The base plate 5 has at least two distributed support positions located on one side of the load-bearing platform 4. The heat sink assembly 1 is positioned on the side of the load-bearing platform 4 facing the probe plate assembly 2. Each lifting assembly 3 includes a movably connected connector 31 and a movable component 32. The connector 31 is fixedly connected to the support positions, providing overall support for the lifting assembly 3. The strength is enhanced by the fixed connection between the moving part 32 and the probe plate assembly 2. During the movement of the moving part 32 relative to the connecting part 31, each moving part 32 can work together to move the probe plate assembly 2 toward the heat sink assembly 1 to form a wafer aging test cavity, thereby improving the moving accuracy and stability of the probe plate assembly 2 during the lifting process. Furthermore, during the lifting process of the lifting device, the longitudinal position of the heat sink assembly 1 is fixed, which, in conjunction with the liftable probe plate assembly 2, further improves the accuracy and stability of the mold closing between the heat sink assembly 1 and the probe plate assembly 2.

[0037] Among them, such as Figure 2 As shown, the side of the heat sink assembly 1 facing the probe plate assembly 2 is a cavity for accommodating the wafer to be tested. After the heat sink assembly 1 and the probe plate assembly 2 are molded together, the cavity forms a sealed wafer aging test cavity. Furthermore, the heat sink assembly 1 is equipped with a heating wire, which can heat the wafer aging test cavity to simulate a high-temperature environment.

[0038] Specifically, the heat sink assembly 1 is provided with an inflation port, which can be located on the side wall of the heat sink assembly 1 or at the bottom of the heat sink assembly 1. The inflation port can be connected to an external air pipe for introducing gas into the wafer aging test chamber when the probe plate assembly 2 and the heat sink assembly 1 are closed, in order to simulate high pressure conditions and perform aging tests on the wafer placed in the heat sink assembly 1. For example, the other end of the air pipe can be connected to an inert gas storage device, and the inert gas can be selected as nitrogen or the like, so that the inert gas is introduced into the wafer aging test chamber through the air pipe and the inflation port, thereby increasing the pressure in the wafer aging test chamber and forming a high-pressure test environment.

[0039] Specifically, such as Figure 3As shown, the probe plate assembly 2 includes a fixed plate 21 and a needle plate 22. The needle plate 22 is located on the side of the fixed plate 21 facing the heat sink assembly 1. The heat sink assembly 1 can be molded with the needle plate 22, thereby effectively improving the alignment accuracy between the needle plate 22 and the heat sink assembly 1. A probe is installed on the needle plate 22. After the probe plate assembly 2 and the heat sink assembly 1 are molded, that is, after the needle plate 22 and the heat sink assembly 1 are aligned and molded, the probe can make high-precision contact with the wafer and the probe is embedded in the wafer. The fixed plate 21 is fixedly connected to the moving part 32. During the process of the moving part 32 moving relative to the connecting part 31, it can stably drive the fixed plate 21 to move up and down. The needle plate 22 and the fixed plate 21 are detachably fixedly connected. Compared with the needle plate 22 and the fixed plate 21, the fixed plate 22 is fixedly connected. A spring floating mechanism is also provided to enable the two to adapt to the parallel structure. The needle plate 22 and the fixed plate 21 are directly fixedly connected, which can effectively improve the positional accuracy of the needle plate 22, avoid the swaying of the needle plate 22 relative to the fixed plate 21 in the horizontal and vertical directions, and form a more efficient force transmission path. The force generated by the high pressure in the wafer aging test chamber on the needle plate 22 is effectively dispersed to the larger area of ​​the fixed plate 21, so that the probe plate assembly 2 as a whole can resist the high pressure of the wafer aging test chamber without deformation, prevent the relative movement between the probe and the wafer caused by deformation, and greatly improve the alignment accuracy. In some optional embodiments, the needle plate 22 and the fixed plate 21 are connected by bolts, which has a good locking effect.

[0040] In some exemplary embodiments, at least two support positions are symmetrically arranged about the center of the probe plate assembly 2, that is, at least two lifting components 3 are symmetrically arranged about the center of the probe plate assembly 2. In other exemplary embodiments, at least two support positions are symmetrically arranged about the center of the load-bearing platform 4 or the heat sink assembly 1, that is, at least two lifting components 3 are symmetrically arranged about the center of the heat sink assembly 1. In some preferred embodiments, at least two support positions are symmetrically arranged about both the center of the probe plate assembly 2 and the center of the heat sink assembly 1, resulting in good overall support balance, which is beneficial to improving the accuracy and stability during the lifting process and in the mold closing state. For example, in some specific embodiments, the base plate 5 is provided with two support positions, located on both sides of the probe plate assembly 2 and / or the heat sink assembly 1, and the two support positions are symmetrically arranged about the probe plate assembly 2. Correspondingly, the two lifting components 3 provided on the support positions are also symmetrically arranged about the probe plate assembly 2, which can effectively improve the movement accuracy and stability of the probe plate assembly 2 during the lifting process, and is also beneficial to improving the mold closing accuracy and stability between the probe plate assembly 2 and the heat sink assembly 1 under high air pressure.

[0041] Specifically, such as Figure 4As shown, the lifting device also includes a support frame 8. One end of the support frame 8 is fixedly connected to the base plate 5, and the other end of the support frame 8 is fixedly connected to the side of the connector 31 away from the load-bearing platform 4, so as to provide good support for the connector 31. The structure has good stability and is not easy to deform, which effectively improves the deformation resistance of the connector 31 and indirectly improves the deformation resistance of the probe plate assembly 2. It is beneficial to improve the lifting accuracy and lifting stability of the probe plate assembly 2 during the lifting process of each moving part 32 working together, and it is also beneficial to improve the mold closing accuracy and mold closing stability of the probe plate assembly 2 and the heat sink assembly 1 under high air pressure.

[0042] In some exemplary embodiments, the lifting device includes multiple support frames 8, which are symmetrically arranged about the center of the probe plate assembly 2 to improve the support balance and thus enhance the overall structural and operational stability of the lifting device.

[0043] Specifically, such as Figure 4 As shown, the support frame 8 includes multiple first frames 81 and multiple second frames 82. The first frames 81 are vertically arranged, and the base plate 5 and the connector 31 are fixedly connected through the first frames 81. At the same support position, two adjacent first frames 81 are connected through the second frames 82, that is, the first frames 81 and the second frames 82 form an interlaced structure, which can be a horizontal and vertical interlaced structure or an oblique cross structure, thereby improving the support strength of the first frames 81 and the second frames 82 for the connector 31 and the lifting assembly 3, and providing good stability.

[0044] In some exemplary embodiments, the first frame 81 and the second frame 82 are welded together, resulting in high overall structural strength; in other embodiments, the first frame 81 and the second frame 82 are bolted together, providing good connection reliability, high stability, and good support strength and stability.

[0045] In some exemplary embodiments, the first frame 81 includes an integrally connected first support portion and second support portion. The first support portion is fixedly connected to the side of the connector 31 away from the heat sink assembly 1, and the second support portion is fixedly connected to the base plate 5. The second support portion extends horizontally in the direction away from the heat sink assembly 1, making the first frame 81 an L-shaped part, which further improves the support strength and support stability of the moving part 32.

[0046] Specifically, such as Figure 5 and Figure 6As shown, the lifting assembly 3 also includes a drive device 33 and a lead screw 34. The drive device 33 is driven to the lead screw 34, and the lead screw 34 is driven to the moving part 32. The lead screw 34 is vertically set and does not move in the vertical direction. When the drive device 33 drives the lead screw 34 to rotate, it can drive the moving part 32 and the probe plate assembly 2 to move along the lead screw 34 to achieve lifting and lowering. The movement is controllable and the movement accuracy is high.

[0047] In some alternative implementations, the drive device 33 is a motor, and further, the drive device 33 is a servo motor, which has high precision and is beneficial to improving the lifting accuracy of the moving part 32 and the probe plate assembly 2.

[0048] In some exemplary embodiments, the drive device 33 is located on the side of the connector 31 facing the moving member 32, and the output end of the drive device 33 is drively connected to one end of the lead screw 34; in other exemplary embodiments, such as Figure 5 As shown, the output end of the drive device 33 is connected to one end of the lead screw 34 through the transmission part 330 to drive the lead screw 34 to rotate. The drive device 33 is located on the side of the connector 31 away from the moving part 32, which can save the vertical space occupied by the lifting assembly 3 and the support frame 8 and improve the space utilization rate.

[0049] Optionally, the transmission part 330 is a synchronous belt, which can rotate with the rotation of the output end of the drive device 33, thereby driving one end of the lead screw 34 to rotate; alternatively, the transmission part 330 is a transmission shaft, and the drive device 33 and the lead screw 34 respectively mesh with the transmission shaft to achieve effective transmission.

[0050] Specifically, such as Figure 7 As shown, the moving part 32 includes a first connecting part 320, which is located on the side of the moving part 32 facing the connecting part 31. The first connecting part 320 is sleeved on the lead screw 34, and the lead screw 34 is rotatably connected to the first connecting part 320. The lead screw 34 has an external thread, and the first connecting part 320 has an internal thread. The lead screw 34 and the first connecting part 320 are threadedly connected. When the driving device 33 outputs power, the lead screw 34 can rotate, driving the first connecting part 320, which is threadedly connected to the lead screw 34, to move along the extension direction of the lead screw 34. Since the lead screw 34 is vertically set, it drives the first connecting part 320 and the moving part 32 to move together in the vertical direction, resulting in high transmission accuracy and good transmission stability. Thus, the moving parts 32 in the multiple lifting assemblies 3 can lift and lower synchronously, driving the probe plate assembly 2 to lift and lower. The cooperation of each moving part 32 can effectively improve the accuracy and stability of the lifting and lowering of the probe plate assembly 2.

[0051] Specifically, such as Figure 7As shown, the connector 31 includes at least one second connecting portion 311, which is located on the side of the connector 31 facing the moving member 32. The second connecting portion 311 is rotatably connected to the lead screw 34 to limit the longitudinal position of the lead screw 34 and prevent the lead screw 34 from shaking during rotation. In some optional embodiments, the connector 31 includes one second connecting portion 311. In other optional embodiments, the connector 31 includes multiple second connecting portions 311, which effectively improves the smoothness and reliability of the rotation of the lead screw 34. In some preferred embodiments, the connector 31 includes two second connecting portions 311, which are located at both ends of the lead screw 34. On the one hand, this provides good limiting stability and can effectively prevent the lead screw 34 from shaking. On the other hand, it saves parts, reduces the structural complexity of the lifting assembly 3, reduces the risk of structural interference, and also reduces costs.

[0052] In some optional embodiments, the second connecting part 311 is connected to the bearing of the lead screw 34. On the one hand, it can effectively limit the lead screw 34 and prevent the lead screw 34 from shaking. On the other hand, it avoids hindering the rotation of the lead screw 34, improves the flexibility and stability of the rotation of the lead screw 34, and is conducive to improving the accuracy and stability of the lifting of the probe plate assembly 2.

[0053] Specifically, such as Figure 7 As shown, in the same lifting assembly 3, one of the connecting member 31 and the moving member 32 is provided with a slider 321, and the other is provided with a linear guide rail 310 that is slidably connected to the slider 321. The linear guide rail 310 extends in the vertical direction, and the slider 321 slides relative to the linear guide rail 310, which can limit the lifting direction of the moving member 32 and the probe plate assembly 2. The linear guide rail 310 has high guiding accuracy, which can greatly improve the guiding accuracy and guiding stability of the moving member 32 and the probe plate assembly 2.

[0054] In some exemplary embodiments, the linear guide 310 is fixedly connected to the connector 31, and the linear guide 310 is located on the side of the connector 31 facing the moving member 32. The slider 321 is fixedly connected to the moving member 32, and the slider 321 is located on the side of the moving member 32 facing the connector 31. In other exemplary embodiments, the linear guide 310 is fixedly connected to the moving member 32, and the linear guide 310 is located on the side of the moving member 32 facing the connector 31. The slider 321 is fixedly connected to the connector 31, and the slider 321 is located on the side of the connector 31 facing the moving member 32. This configuration is flexible and convenient, and provides good guiding stability.

[0055] In some exemplary embodiments, the same lifting assembly 3 is provided with multiple sliders 321 and multiple linear guides 310. Each linear guide 310 can be slidably connected to at least one slider 321 to improve the stability of the guide. For example, in some specific embodiments, in the same lifting assembly 3, the connecting member 31 is provided with two linear guides 310 extending in the vertical direction, and the moving member 32 is provided with four sliders 321. Two sliders 321 are arranged in the vertical direction and slidably connected to the same linear guide 310, and the other two sliders 321 are arranged in the vertical direction and slidably connected to another linear guide 310. The two linear guides 310 and the four sliders 321 cooperate with each other to improve the guiding accuracy and guiding stability of the moving member 32 relative to the connecting member 31. Furthermore, the cooperation of each linear guide 310 and each slider 321 in the multiple lifting assemblies 3 can synergistically improve the stability and accuracy of the entire probe plate assembly 2, while greatly reducing noise.

[0056] Specifically, such as Figure 2 As shown, the lifting device also includes multiple limiting members located on the load-bearing platform 4. When the heat sink assembly 1 and the probe plate assembly 2 are molded together, the limiting members can abut against the side of the probe plate assembly 2 facing the load-bearing platform 4. In some exemplary embodiments, the limiting members can also be located on the side of the probe plate assembly 2 facing the load-bearing platform 4. When the heat sink assembly 1 and the probe plate assembly 2 are molded together, the limiting members can abut against the side of the load-bearing platform 4 facing the probe plate assembly 2. In this way, it can effectively prevent the lifting assembly 3 from pressing down too much, causing excessive pressure between the heat sink assembly 1 and the probe plate assembly 2 and damaging them to each other, thereby improving the overall stability and reliability of the lifting device.

[0057] Furthermore, it should be noted that the first vertical distance between the heat sink assembly 1 and the probe plate assembly 2 is smaller than the second vertical distance between the limiting member and the probe plate assembly 2, so that the heat sink assembly 1 and the probe plate assembly 2 can be effectively and reliably molded to form a wafer aging test cavity. However, the first vertical distance and the second vertical distance are only slightly different, so as to effectively play a limiting role without affecting the mold closing between the heat sink assembly 1 and the probe plate assembly 2. For example, in some exemplary embodiments, the vertical distance between the end face of the heat sink assembly 1 near the probe plate assembly 2 and the end face of the limiting member near the probe plate assembly 2 is 0.01mm to 0.03mm.

[0058] In some exemplary embodiments, when the mold is closed, a height adjustment component, such as a gap plate, can also be provided between the limiting component and the probe plate assembly 2 to adjust the longitudinal distance between the load-bearing platform 4 and the probe plate assembly 2, so that the sealing between the needle plate 22 and the heat sink assembly 1 is good when the mold is closed, while avoiding damage to the heat sink assembly 1, thus ensuring good reliability.

[0059] Specifically, in some exemplary embodiments, the lifting device further includes a pressure sensing element, which is used to detect the pressure between the probe plate assembly 2 and the load-bearing platform 4 during the lifting process of the moving part 32. The pressure sensing element is located on the side of the probe plate assembly 2 facing the load-bearing platform 4, or the pressure sensing element is located on the side of the load-bearing platform 4 facing the probe plate assembly 2. This can effectively prevent the probe plate assembly 2 from being excessively displaced during the lifting process, thereby damaging the heat sink assembly 1 and other structures. This is beneficial for extending the overall life of the lifting device and also for improving the accuracy and reliability of the aging test.

[0060] Specifically, such as Figure 2 As shown, the lifting device also includes a first moving component 6 and a second moving component 7. The first moving component 6 is located between the base plate 5 and the second moving component 7, and the load-bearing platform 4 is connected to the second moving component 7. The first moving component 6 is movably connected to the base plate 5, enabling the second moving component 7, the load-bearing platform 4, and the heat sink component 1 to move collaboratively along a first horizontal direction. The second moving component 7 is movably connected to the first moving component 6, enabling the load-bearing platform 4 and the heat sink component 1 to move along a second horizontal direction. The first horizontal direction intersects with the second horizontal direction. Through the first moving component 6 and the second moving component 7, the heat sink component 1 can be moved freely in the horizontal direction, providing good mobility. In some exemplary embodiments, the first horizontal direction can be the X direction, and the second horizontal direction can be the Y direction; or, in other exemplary embodiments, the first horizontal direction can be the Y direction, and the second horizontal direction can be the X direction, to improve the flexibility of the setting of the first moving component 6 and the second moving component 7.

[0061] Specifically, the heat sink assembly 1 and the load-bearing platform 4 are fixed in the longitudinal direction. The heat sink assembly 1 is rotatably connected to the load-bearing platform 4, meaning that the heat sink assembly 1 can rotate relative to the load-bearing platform 4. In conjunction with the first moving assembly 6 and the second moving assembly 7, the heat sink assembly 1 can rotate and translate in the horizontal direction, driving the wafer placed in the heat sink assembly 1 to move below the needle plate 22 for high-precision alignment. Then, the lifting assembly 3 can drive the probe plate assembly 2 to move vertically up and down, realizing the relative movement of four degrees of freedom between the heat sink assembly 1 and the probe plate assembly 2, which greatly improves the mold closing accuracy and mold closing stability. This lifting device can achieve a high needle insertion accuracy of 10μm, that is, the positional accuracy between the probe and the wafer is within 10μm, so as to facilitate wafer testing under high temperature and high pressure environment, with good stability and strong resistance to deformation.

[0062] On the other hand, the wafer-level aging test equipment provided by this utility model includes multiple wafer-level aging test devices. These multiple wafer-level aging test devices can be arranged horizontally or vertically, which is beneficial for improving aging efficiency and the convenience of loading and unloading. Alternatively, the multiple wafer-level aging test devices can be arranged in an array, which can further save space and improve space utilization. For example, in a specific embodiment, the aging test equipment includes nine wafer-level aging test devices, which can be arranged in three columns in the vertical direction and three columns in the horizontal direction, improving aging efficiency while effectively saving space.

[0063] On the other hand, the wafer-level aging test system provided by this utility model includes a wafer-level loading and unloading device, a wafer-level transport device, and a wafer-level aging test device as described above. The wafer-level transport device is arranged in the loading and unloading path between the wafer-level loading and unloading device and the wafer-level aging test device to facilitate the transport of wafers between the wafer-level loading and unloading device and the wafer-level aging test device.

[0064] The above description is only some embodiments of the present utility model and is not intended to limit the present utility model. Those skilled in the art should understand that the present utility model may have various changes and improvements. Any modifications, equivalent substitutions and improvements made in accordance with the present utility model fall within the scope of protection claimed by the present utility model.

Claims

1. A lifting device for a wafer-level aging test apparatus, the wafer-level aging test apparatus comprising a heat sink assembly and a probe plate assembly; characterized in that, The lifting device includes at least two lifting components, a load-bearing platform and a base plate. The load-bearing platform is used to support the heat sink component and is fixed in the longitudinal position. The base plate is provided with at least two distributed support positions. The lifting assembly includes a movably connected connector and a movable component. The connector is fixedly connected to the support position, and the movable component is fixedly connected to the probe plate assembly. Each of the movable components can work together to move the probe plate assembly toward the heat sink assembly to form a wafer aging test cavity.

2. The lifting device according to claim 1, characterized in that, The lifting assembly also includes a driving device and a lead screw. The driving device is driven to the lead screw, and the lead screw is transmitted to the moving part. The lead screw is vertically arranged. When the driving device drives the lead screw to rotate, it can drive the moving part and the probe plate assembly to move along the lead screw.

3. The lifting device according to claim 2, characterized in that, The movable component includes a first connecting part, which is sleeved on the lead screw; the lead screw has an external thread, the first connecting part has an internal thread, and the lead screw is threadedly connected to the first connecting part.

4. The lifting device according to claim 1, characterized in that, One of the connector and the moving member is provided with a slider, and the other is provided with a linear guide rail that is slidably connected to the slider. The slider slides relative to the linear guide rail, which can limit the lifting direction of the moving member in conjunction with the probe plate assembly.

5. The lifting device according to any one of claims 1-4, characterized in that, It also includes multiple limiting members located on the load-bearing platform. When the heat sink assembly and the probe plate assembly are molded together, the limiting members can abut against the side of the probe plate assembly facing the load-bearing platform.

6. The lifting device according to any one of claims 1-4, characterized in that, It also includes a pressure sensing element, which is used to detect the pressure between the probe plate assembly and the load-bearing platform during the lifting and lowering of the moving part; The pressure sensing element can be located on the side of the probe plate assembly facing the load-bearing platform, or the pressure sensing element can be located on the side of the load-bearing platform facing the probe plate assembly.

7. The lifting device according to any one of claims 1-4, characterized in that, It also includes a first moving component and a second moving component, wherein the first moving component is located between the base plate and the second moving component, and the load-bearing platform is connected to the second moving component; The first moving component is movably connected to the base plate and can drive the second moving component and the load-bearing platform to move together in a first horizontal direction. The second moving component is movably connected to the first moving component and can drive the load-bearing platform to move in a second horizontal direction. The first horizontal direction and the second horizontal direction intersect.

8. The lifting device according to claim 1, characterized in that, It also includes a support frame, one end of which is fixedly connected to the base plate, and the other end of which is fixedly connected to the side of the connector away from the load-bearing platform.

9. The lifting device according to claim 8, characterized in that, The support frame includes multiple first frames and multiple second frames. The first frames are vertically arranged, and the base plate and the connector are fixedly connected through the first frames. On the same support position, two adjacent first frames are connected through the second frames.

10. A wafer-level aging test apparatus, characterized in that, The device includes a probe plate assembly, a heat sink assembly, and a lifting device as described in any one of claims 1-9, wherein the longitudinal position of the heat sink assembly is fixed, and the lifting device is used to move the probe plate assembly toward the heat sink assembly to form a wafer aging test cavity.

11. The wafer-level aging test apparatus according to claim 10, characterized in that, The probe plate assembly includes a fixed plate and a needle plate. The fixed plate is fixedly connected to the moving part, and the needle plate is detachably fixedly connected to the fixed plate. The needle plate is located on the side of the fixed plate facing the heat sink assembly, and the heat sink assembly can be molded with the needle plate.

12. A wafer-level aging test device, characterized in that, It includes multiple wafer-level aging test devices as described in any one of claims 10-11.

13. A wafer-level aging test system, characterized in that, It includes wafer-level loading and unloading equipment, wafer-level transport equipment, and wafer-level aging test equipment as described in claim 12.

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