Constant-temperature heat preservation cabinet

Abstract

The utility model provides a constant-temperature heat preservation cabinet which comprises a cabinet body, a lower shell is installed at an opening in the top of the cabinet body, an upper shell is arranged above the lower shell in a spliced mode, and an installation space formed by the lower shell and the upper shell is communicated with the cabinet body. A heating mechanism and a semiconductor chilling plate are distributed on the left side and the right side of the inner side of the mounting space, and the heating mechanism, the semiconductor chilling plate and the lower shell form a heating space and a cooling space; according to the utility model, the top of the cabinet body is provided with the upper shell and the lower shell, the heating mechanism and the semiconductor chilling plate are distributed left and right in the space formed by the upper shell and the lower shell, and the heating mechanism, the semiconductor chilling plate and the air pump respectively form an air circulation channel; and air can be pumped to the heating space or the cooling space through the air pump according to requirements, so that the temperature of the inner side of the cabinet body is at a certain numerical value, heat preservation treatment of food is realized, and the practicability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of thermal insulation equipment technology, and in particular to a constant temperature thermal insulation cabinet. Background Technology

[0002] As living standards improve, people's demand for temperature-controlled preservation of various items is increasing. This demand is particularly prominent in the food industry, where maintaining the appropriate temperature is crucial for preserving the taste, nutrition, and even freshness of food.

[0003] Currently, water-heated warming cabinets are widely used in the market for keeping hot processed foods warm. These warming cabinets typically consist of a heating element and a cabinet for holding the food. Electric soup warming cabinets also have a water tank. The heating element is immersed in the water tank, and by heating the water in the tank and then using the heat transfer between the hot water and the cabinet, the food inside is kept at a certain temperature. This is very suitable for keeping hot food warm in cold seasons and meets people's needs for hot food temperature.

[0004] However, this type of water-heated warming cabinet has significant functional limitations. From a thermodynamic perspective, its circulating heating system relies on water temperature conduction and can only achieve unidirectional temperature control between 30-75℃. This leads to a dual technical bottleneck in summer: firstly, when the ambient temperature exceeds 35℃, effective heat exchange cannot occur inside the cabinet, and even when the heating device is turned off, the internal temperature continues to rise with the external environment. Actual test data shows that in a 40℃ high-temperature environment, the internal temperature of a warming cabinet storing mung bean soup rose from an initial 25℃ to 38℃ within one hour, causing the mung bean soup to undergo starch retrogradation, resulting in a coarser texture, and the total number of microbial colonies surged by 200% within 12 hours.

[0005] Even more concerning is that for ready-to-eat foods like salads and sushi that require refrigeration, these warming cabinets lack a cooling module, making it impossible to stop the growth chain of thermophilic and mesophilic bacteria. For example, salmon sashimi stored at 30℃ for 4 hours showed TVB-N (volatile basic nitrogen) levels exceeding food safety standards by 2.3 times, and nitrite levels reaching 1.8 times the initial value. Furthermore, traditional water-heated warming cabinets typically have a temperature control accuracy of ±5℃, which cannot meet the storage requirements of temperature-sensitive items such as dairy products, further limiting their application scenarios and failing to meet the increasingly sophisticated demand for constant temperature preservation of food across all scenarios in modern society.

[0006] Equipping food businesses with refrigeration equipment during the hot summer months increases operating costs. Utility Model Content

[0007] This utility model discloses a constant temperature insulation cabinet, which mainly solves the problem that existing insulation cabinets only have heating or cooling functions.

[0008] To achieve the aforementioned objective, the technical solution of this utility model is implemented as follows:

[0009] This utility model provides a constant temperature insulation cabinet, including a cabinet body, a lower shell installed at the opening at the top of the cabinet body, and an upper shell spliced ​​above the lower shell. The installation space formed by the lower shell and the upper shell is connected to the cabinet body. A heating mechanism and a semiconductor cooling chip are distributed on the left and right sides inside the installation space. The heating mechanism and the semiconductor cooling chip, together with the lower shell, form a heating space and a cooling space. An air pump located in the installation space blows gas through the heating space or the cooling space into the cabinet body.

[0010] Preferably, a second partition is provided inside the installation space. The second partition includes a horizontal plate and a vertical plate installed at the lower end of the horizontal plate. The horizontal plate and the vertical plate together with the lower housing form a heating space.

[0011] Preferably, a first partition is provided on the inner side of the heating space. The first partition is configured as an L-shaped structure and divides the heating space into two areas that are connected vertically. Multiple dispersion holes are evenly provided on the horizontal section of the first partition.

[0012] Preferably, the heating mechanism includes a heating wire and an end device installed at the end of the heating wire. The heating wire is configured with an L-shaped structure, and the main body of the heating wire is located in the lower region of the heating space. Meanwhile, the end of the heating wire passes through the first partition and the second partition, and the end device is located above the second partition.

[0013] Preferably, the thermoelectric cooler is arranged parallel to the side of the horizontal plate, and the upper side of the thermoelectric cooler is flush with the upper side of the horizontal plate; a heat sink is arranged above the thermoelectric cooler, and a fan is arranged above the heat sink.

[0014] Preferably, multiple mounting holes are provided on the top surface of the upper housing, and air vents are provided on the vertical sidewalls of the upper housing; the fan is located at the mounting holes; and the air vents are positioned directly opposite the heat sink.

[0015] Preferably, two gas supply pipes are provided above the second partition, and the two gas supply pipes are distributed on both sides of the vertical plate and are respectively connected to the heating space and the cooling space; each of the two gas supply pipes is connected to the output end of the gas pump through a solenoid valve.

[0016] Preferably, a dispersion chamber is attached to the bottom of the thermoelectric cooler. The dispersion chamber includes a second side plate that is parallel to and adjacent to the vertical plate and a bottom plate that is vertically installed on the side of the second side plate. Two first side plates and multiple isolation plates are arranged in parallel between the bottom plate and the thermoelectric cooler. The two first side plates are located at the ends of the bottom plate.

[0017] Preferably, the length of the first side plate is greater than the width of the bottom plate, and the end of the first side plate is connected to the end wall of the lower housing. At the same time, there is a gap between the bottom plate and the end wall of the lower housing. In addition, the upper and lower ends of the second side plate are connected to the semiconductor cooling chip and the bottom wall of the lower housing, respectively. An air inlet is provided on the second side plate opposite the gap between the two isolation plates.

[0018] Preferably, multiple through holes are evenly distributed on the bottom wall of the lower shell; a cabinet door is provided at the opening on the front side of the cabinet, and multiple brackets are distributed vertically on the inner side of the cabinet.

[0019] The advantages or beneficial effects of the above technical solutions include at least the following:

[0020] 1. This utility model has an upper shell and a lower shell on the top of the cabinet, and a heating mechanism and a semiconductor cooling chip are arranged on the left and right sides in the space formed by the upper shell and the lower shell. At the same time, the heating mechanism and the semiconductor cooling chip and the air pump each form a gas flow channel. As needed, the air pump can be used to pump gas to the heating space or the cooling space to keep the temperature inside the cabinet at a certain value, so as to achieve the heat preservation treatment of food and improve the practicality of the device.

[0021] 2. This utility model provides a dispersion chamber below the semiconductor refrigeration chip, and provides multiple gas channels on the dispersion chamber. The gas entering the space formed by the semiconductor refrigeration chip and the dispersion chamber is divided into multiple streams, which increases the contact area between the gas and the semiconductor refrigeration chip and effectively reduces the temperature of the gas. Attached Figure Description

[0022] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0023] Figure 1 This is a first structural schematic diagram of the entire utility model;

[0024] Figure 2 This is a second structural schematic diagram of the entire utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the upper shell, lower shell, heating mechanism, and semiconductor refrigeration chip of this utility model;

[0026] Figure 4 This is a structural schematic diagram of the heating mechanism, semiconductor cooling chip, partition, fan, etc. of this utility model;

[0027] Figure 5 This is a structural schematic diagram of the first partition and the second partition of this utility model;

[0028] Figure 6 This is a schematic diagram of the structure of the dispersion bin of this utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Cabinet;

[0031] 11. Cabinet door; 12. Control panel; 13. Bracket; 14. Lower shell; 15. Through hole; 16. Upper shell; 17. Vent hole; 18. Mounting hole;

[0032] 2. Heating mechanism;

[0033] 21. End device; 22. Heating wire; 23. First partition plate; 24. Dispersion hole;

[0034] 3. Semiconductor cooling chip;

[0035] 31. Heat sink; 33. Dispersion compartment; 331. Base plate; 332. Isolation plate; 333. First side plate; 334. Second side plate; 335. Air intake hole; 34. Fan;

[0036] 4. Air pump;

[0037] 41. Solenoid valve; 42. Gas pipeline;

[0038] 5. Second partition;

[0039] 51. Horizontal plate; 52. Vertical plate; 53. Hole. Detailed Implementation

[0040] Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0041] It should be noted that, where there is no conflict, the embodiments and features described in these embodiments can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc., mentioned in this utility model are only used to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependencies.

[0043] It should be noted that the terms "a" and "a plurality of" used in this utility model are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0044] The names of the messages or information exchanged between the multiple devices in this embodiment of the invention are for illustrative purposes only and are not intended to limit the scope of these messages or information.

[0045] In order to enable the functions of cooling and heating, and to keep food at a suitable temperature in both winter and summer, this embodiment provides a new warming cabinet.

[0046] like Figure 1 , Figure 2 As shown, the insulated cabinet includes a cabinet body 1, a lower shell 14, and an upper shell 16. The front and top of the cabinet body 1 are both open structures, and a door 11 is provided at the front opening of the cabinet body 1. The lower shell 14 is installed on top of the cabinet body 1, and the upper shell 16 is spliced ​​above the lower shell 14. A heat insulation layer is laid on the cabinet body 1, lower shell 14, upper shell 16, and door 11. The heat insulation layer can be a combination of vacuum insulation panels and polyurethane foam. The vacuum insulation panels have extremely low thermal conductivity, which can significantly reduce heat conduction, while the polyurethane foam serves to fill and further insulate. Multiple through holes 15 are evenly distributed on the bottom wall of the lower shell 14. Therefore, the space formed by the lower shell 14 and the upper shell 16 is connected to the cabinet body 1, providing a channel for heated or cooled gas to enter the cabinet body 1.

[0047] like Figure 1 , Figure 2 As shown, multiple brackets 13 are arranged vertically on the side walls inside the cabinet 1. Mesh plates can be installed between the brackets 13 located on the same horizontal plane to hold food.

[0048] like Figure 3As shown, an installation space is formed between the lower housing 14 and the upper housing 16. A heating mechanism 2 and a semiconductor cooling chip 3 are distributed on the left and right sides of the inner side of the installation space. The heating mechanism and the semiconductor cooling chip 3, together with the lower housing 14, form a heating space and a cooling space. An air pump 4 located within the installation space blows gas through the heating space or the cooling space into the cabinet 1. Depending on the requirements, when the air pump 4 is operating, it can control the gas flow from the heating space or the cooling space, and after being heated or cooled, it flows into the space formed by the cabinet 1 and the cabinet door 11, thus maintaining the temperature of that space.

[0049] Multiple temperature sensors need to be distributed within the space formed by the cabinet body 1 and the cabinet door 11, and a control system needs to be provided for the device. This system consists of a control panel 12 installed on the top of the cabinet body 1, with a display screen and control buttons. Users can easily set the desired temperature, timer, and other parameters through the control panel. The display screen shows the current temperature inside the cabinet, the set temperature, and the operating status in real time, allowing users to understand the operation of the warming cabinet. The aforementioned temperature sensors, air pump 4, heating mechanism 2, and semiconductor cooling chip 3 are all electrically connected to the control system, thereby controlling the device to achieve food warming.

[0050] like Figure 4 , Figure 5 As shown, to separate the installation space, a second partition 5 is provided inside the installation space. The second partition 5 includes a horizontal plate 51 and a vertical plate 52 installed vertically at the lower end of the horizontal plate 51. The horizontal plate 51 and the vertical plate 52, together with the lower housing 14, form a heating space. The heating mechanism 2 is disposed within the heating space, and the semiconductor cooling chip 3 is disposed parallel to the side of the horizontal plate 51, with the upper side of the semiconductor cooling chip 3 flush with the upper side of the horizontal plate 51.

[0051] like Figure 4 , Figure 5 As shown, a first partition 23 is provided on the inner side of the heating space. The first partition 23 is configured as an L-shaped structure and divides the heating space into two areas that are connected vertically. At the same time, multiple dispersion holes 24 are evenly provided on the horizontal section of the first partition 23 to realize the connection between the upper and lower areas.

[0052] like Figure 4 As shown, the heating mechanism 2 includes a heating wire 22 and an end device 21 installed at the end of the heating wire 22. The end device 21 includes a temperature control device, wiring terminals, etc. The wiring terminals connect the leads of the heating wire 22 to the interface component of the external power supply, facilitating the connection and disconnection of the heating mechanism 2 from the power supply. The temperature control device may include a temperature sensor and a thermostat, which can monitor the operating temperature of the heating rod and automatically cut off the power or adjust the power when the temperature reaches the set value, preventing overheating and improving safety and energy efficiency.

[0053] like Figure 4 As shown, to install the heating mechanism 2 in the heating space, the heating wire 22 is configured with an L-shaped structure, and the main body of the heating wire 22 is located in the lower region of the heating space. Meanwhile, other parts of the heating wire 22 sequentially pass through the first partition 23 and the second partition 5 and protrude from the second partition 5. Additionally, the end device 21 is located above the second partition 5. Because the main body of the heating wire 22 is located in the lower region, the gas in the lower region can be heated when the heating wire 22 is operating.

[0054] like Figure 4 As shown, two gas supply pipes 42 are connected above the second partition 5. The bottom of each gas supply pipe 42 is sealed and inserted into the hole 53 of the second partition 5. The two gas supply pipes 42 are distributed on both sides of the vertical plate 52 and are connected to the heating space and cooling space respectively. Each gas supply pipe 42 is connected to the output end of the air pump 4 via a solenoid valve 41. When the temperature inside the cabinet 1 needs to be raised to a certain value, the solenoid valve 41 connecting to the heating space is open, and the other solenoid valve 41 is closed. With the air pump 4 operating, external gas is pumped to the upper area of ​​the heating space, then passes through the dispersion hole 24 into the lower area, and finally the heated gas passes through the through hole 15 into the cabinet 1. When the temperature inside the cabinet 1 needs to be lowered to a certain value, the solenoid valve 41 connecting to the cooling space is open, and the air pump 4 operates to pump external gas to the area below the semiconductor cooling chip 3. Under the action of the semiconductor cooling chip 3, the gas temperature is reduced before it flows into the cabinet 1.

[0055] like Figure 3 , Figure 4 As shown, in order to dissipate the heat of the thermoelectric cooler 3 in a timely manner, a heat sink 31 is provided above the thermoelectric cooler 3, and a fan 34 is provided above the heat sink 31. Multiple mounting holes 18 are provided on the top surface of the upper housing 16, and vents 17 are provided on the vertical sidewalls of the upper housing 16. The fan 34 is positioned at the mounting holes 18, and the vents 17 are positioned directly opposite the heat sink 31, so that when the fan 34 is operating, it can draw air to carry away the heat of the thermoelectric cooler 3.

[0056] like Figure 4 As shown, in order to accelerate the cooling of the gas by the thermoelectric cooler 3, a dispersion chamber 33 is attached to the bottom of the thermoelectric cooler 3. The dispersion chamber 33 diverts the gas, increases the contact area between the gas and the thermoelectric cooler 3, and achieves rapid cooling.

[0057] like Figure 6As shown, specifically, the dispersion chamber 33 includes a second side plate 334 arranged parallel to and adjacent to the vertical plate 52 and a bottom plate 331 vertically installed on the side of the second side plate 334. Two first side plates 333 and multiple isolation plates 332 are arranged parallel between the bottom plate 331 and the thermoelectric cooler 3. The two first side plates 333 are located at the ends of the bottom plate 331. The length of the first side plate 333 is greater than the width of the bottom plate 331, and the ends of the first side plates 333 are connected to the end wall of the lower housing 14. At the same time, there is a gap between the bottom plate 331 and the end wall of the lower housing 14. In addition, the upper and lower ends of the second side plate 334 are connected to the thermoelectric cooler 3 and the bottom wall of the lower housing 14, respectively. Furthermore, an air inlet 335 is provided on the second side plate 334 directly opposite the gap between the two isolation plates 332. Therefore, the gas output from the gas supply pipe 42 first flows into the space formed by the second side plate 334, the vertical plate 52, the semiconductor cooling chip 3 and the lower shell 14, and then flows through the air inlet 335 into the channel formed by the multiple isolation plates 332. Finally, it flows through the gap formed by the bottom plate 331 and the lower shell 14 into the space formed by the bottom plate 331, the lower shell 14 and the second side plate 334, and enters the cabinet 1 through the through hole 15.

[0058] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0059] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications can be made based on the above-described invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A constant temperature insulation cabinet, characterized in that, The system includes a cabinet, with a lower shell installed at the opening at the top of the cabinet, and an upper shell spliced ​​above the lower shell. The installation space formed by the lower shell and the upper shell is connected to the cabinet. Heating mechanisms and semiconductor cooling chips are distributed on the left and right sides inside the installation space. The heating mechanisms and semiconductor cooling chips, together with the lower shell, form a heating space and a cooling space. An air pump located in the installation space blows gas through the heating space or the cooling space into the cabinet.

2. The constant temperature insulation cabinet as described in claim 1, characterized in that, A second partition is provided inside the installation space. The second partition includes a horizontal plate and a vertical plate installed at the lower end of the horizontal plate. The horizontal plate and the vertical plate together with the lower shell form a heating space.

3. The constant temperature insulation cabinet as described in claim 2, characterized in that, A first partition is provided on the inner side of the heating space. The first partition is configured as an L-shaped structure and divides the heating space into two areas that are connected vertically. Multiple dispersion holes are evenly distributed on the horizontal section of the first partition.

4. The constant temperature insulation cabinet as described in claim 3, characterized in that, The heating mechanism includes a heating wire and an end device installed at the end of the heating wire. The heating wire is configured as an L-shaped structure, and the main body of the heating wire is located in the lower area of ​​the heating space. Meanwhile, the end of the heating wire passes through the first partition and the second partition, and the end device is located above the second partition.

5. The constant temperature insulation cabinet as described in claim 2, characterized in that, The thermoelectric cooler is arranged parallel to the side of the horizontal plate, and the upper side of the thermoelectric cooler is flush with the upper side of the horizontal plate; a heat sink is arranged above the thermoelectric cooler, and a fan is arranged above the heat sink.

6. The constant temperature insulation cabinet as described in claim 5, characterized in that, Multiple mounting holes are provided on the top surface of the upper housing, and air vents are provided on the vertical sidewall of the upper housing; the fan is located at the mounting holes; the air vents are positioned directly opposite the heat sink.

7. The constant temperature insulation cabinet as described in claim 5, characterized in that, Two gas supply pipes are connected above the second partition plate. The two gas supply pipes are distributed on both sides of the vertical plate and are respectively connected to the heating space and the cooling space. Each of the two gas supply pipes is connected to the output end of the gas pump through a solenoid valve.

8. The constant temperature insulation cabinet as described in claim 7, characterized in that, A dispersion chamber is attached to the underside of the thermoelectric cooler. The dispersion chamber includes a second side plate that is parallel to and adjacent to the vertical plate and a bottom plate that is vertically installed on the side of the second side plate. Two first side plates and multiple isolation plates are arranged in parallel between the bottom plate and the thermoelectric cooler. The two first side plates are located at the ends of the bottom plate.

9. The constant temperature insulation cabinet as described in claim 8, characterized in that, The length of the first side plate is greater than the width of the bottom plate, and the end of the first side plate is connected to the end wall of the lower housing. At the same time, there is a gap between the bottom plate and the end wall of the lower housing. In addition, the upper and lower ends of the second side plate are connected to the semiconductor cooling chip and the bottom wall of the lower housing, respectively. An air inlet is provided on the second side plate opposite the gap between the two isolation plates.

10. The constant temperature insulation cabinet as described in claim 1, characterized in that, Multiple through holes are evenly distributed on the bottom wall of the lower housing; a cabinet door is provided at the opening on the front side of the cabinet, and multiple brackets are distributed vertically on the inner side of the cabinet.

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