Weight and morphology detection device

Abstract

The utility model discloses a weight and morphology detection device, comprising a detection vertical frame which is provided with a first detection platform and a second detection platform which are vertically spaced; the first detection platform comprises at least one placing table, and a light source and a visual camera which are arranged above the placing table; the second detection platform comprises at least one weighing unit and a sealing cover arranged above the weighing unit, and the detection vertical frame is provided with a sealing lifting assembly connected to the sealing cover; the wafer rotating module comprises an adsorption assembly for keeping and transferring wafers, a rotating assembly connected to the adsorption assembly, a wafer lifting assembly for actuating the rotating assembly to move relative to the first detection platform and the second detection platform, and a wafer translation assembly for actuating the rotating assembly to enter or leave the detection vertical frame; and the rotating assembly transfers the front and back surfaces of the wafer to be attached to the placement table.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection equipment technology, specifically to a weight and morphology inspection device. Background Technology

[0002] As the core basic material for semiconductor manufacturing, wafers are usually made from high-purity single-crystal silicon through processes such as cutting, grinding, and polishing. In the precision manufacturing process, the weight change and surface morphology characteristics of wafers are key process indicators: weighing operations can monitor the increase or decrease of material in the thin film deposition or etching process in real time, while morphology inspection is used to identify defects such as surface particle contamination, scratches, and warping.

[0003] In existing technologies, separate weighing stations and morphology inspection stations are typically set up in wafer manufacturing lines. The weighing unit needs to be equipped with a high-precision balance module, while the morphology inspection requires a separate optical scanning mechanism or laser profilometer. The two sets of equipment are located in different positions on the production line, which increases the space occupancy of the cleanroom. Furthermore, since the transfer distance between the weighing station and the morphology inspection station is relatively long, the risk of dust adhering to the wafer surface increases during the wafer transfer process. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a weight and shape detection device.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a weight and morphology detection device, comprising:

[0006] A testing stand, wherein a first testing platform and a second testing platform are provided with respect to vertical intervals;

[0007] The first detection platform includes at least one placement platform, and a light source and a vision camera disposed above the placement platform;

[0008] The second testing platform includes at least one weighing unit and a sealing cover disposed above the weighing unit. The testing stand is provided with a sealing lifting assembly connected to the sealing cover.

[0009] A wafer rotation module includes an adsorption assembly for holding and transferring wafers, a rotation assembly connected to the adsorption assembly, a wafer lifting assembly that actuates the rotation assembly to move about a first inspection platform and a second inspection platform, and a wafer translation assembly that actuates the rotation assembly to move into or away from the inspection stand, wherein the rotation assembly transfers the front and back sides of the wafer to the placement stage.

[0010] Furthermore, the testing stand is also equipped with an electrostatic discharge module, which extends about the placement platform and is adjustable to face the first testing platform.

[0011] Furthermore, the testing stand includes a first frame disposed above the first testing platform, and an adjustment frame disposed on the first frame. The adjustment frame includes a rotating hole that cooperates with the first frame, and an arc-shaped groove disposed concentrically with the rotating hole. The end of the adjustment frame away from the first frame is fixedly connected to the static electricity removal module.

[0012] Furthermore, there are multiple placement platforms. A translation component is provided above the first detection platform, and a translation frame is provided on the moving end of the translation component. The translation component is arranged in a direction relative to the placement platform, and the light source and vision camera are both provided on the translation frame.

[0013] Furthermore, the translation frame includes a support frame, a first vision mounting block and a second vision mounting block connected to the support frame and the vision camera, and a light source mounting block connected to the support frame and the light source. A horizontal adjustment groove is provided between the first vision mounting block and the second vision mounting block, a first vertical adjustment groove is provided between the first vision mounting block and the support frame, and a second vertical adjustment groove is provided between the light source mounting block and the support frame.

[0014] Furthermore, a sealing frame is provided above the weighing unit, and a through groove is provided on the sealing frame for the weighing part of the weighing unit to extend out, and a sealing plate is provided around the through groove, and the sealing cover abuts against the sealing frame.

[0015] Furthermore, the wafer rotation module also includes an adjustment seat connecting the adsorption component and the rotation component. The rotation component includes a gear and a rack disposed on the adjustment seat, and a linear actuation module that actuates the rack to move linearly back and forth. The gear is axially fixedly connected to the adsorption component.

[0016] Furthermore, the adsorption assembly includes a rotating mounting block fixedly connected to the rotating assembly, and a suction claw disposed on the rotating mounting block. The rotating mounting block is also provided with a negative pressure block for fixing the suction claw on the rotating mounting block. A negative pressure assembly is connected to the negative pressure block, and the suction claw is provided with an adsorption area communicating with the negative pressure assembly. The adsorption area matches the contour of the wafer.

[0017] Furthermore, a sorting and storage rack is provided on one side of the testing stand, and a wafer transport module that moves between the sorting and storage rack and the testing stand. The wafer transport module includes a three-axis transfer assembly and an adsorption assembly arranged on the three-axis transfer assembly. The wafer transport module transports wafers to the first testing platform or the second testing platform, and transports the tested wafers to the sorting and storage rack.

[0018] Furthermore, the light source is configured as a parallel shadowless light source and covers the first detection platform.

[0019] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0020] This invention utilizes a vertically spaced inspection stand to create a first and second inspection platform, achieving a vertical dual-layer inspection platform layout. This integrates weighing and morphology inspection into a single workstation, reducing floor space requirements. Simultaneously, a wafer rotation module is incorporated, using a translation component to drive the wafer to switch between the first and second inspection platforms. The rotation and adsorption components transfer and flip the wafer for inspection, reducing the risk of edge chipping during wafer transport and minimizing the risk of dust adhesion during transport between different inspection stations. This enables parallel multi-wafer inspection, increasing throughput per unit time.

[0021] In addition, the weighing unit and the lifting and moving sealed cover form a closed weighing chamber, which isolates external vibration and airflow disturbance, effectively improving weighing accuracy. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall layout of this utility model;

[0023] Figure 2 This is a schematic diagram of the wafer handling module and inspection stand of this utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the detection stand and wafer rotation module of this utility model;

[0025] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0026] Figure 5 This is a schematic diagram of the structure of the first and second testing platforms of this utility model;

[0027] Figure 6 This is a schematic diagram of the translation component of this utility model;

[0028] Figure 7 This is a schematic diagram of the wafer rotation module of this utility model;

[0029] Figure 8 This is a bottom view of the wafer rotation module of this utility model;

[0030] Figure 9 This is a schematic diagram of the placement platform and weighing unit of this utility model;

[0031] Figure 10 This is a schematic diagram of the sorting and storage rack of this utility model;

[0032] Figure 11 This is a schematic diagram of the wafer handling module of this utility model;

[0033] In the diagram: 1. Inspection stand; 1.1. First stand; 1.2. Second stand;

[0034] 2. First detection platform; 2.1. Placement stage; 2.2. Light source; 2.3. Visual camera;

[0035] 3. Second testing platform; 3.1 Weighing unit; 3.2 Sealing cover; 3.3 Sealing frame; 3.31 Through groove; 3.4 Sealing plate;

[0036] 4. Sealing lifting assembly;

[0037] 5. Wafer rotation module;

[0038] 5.1 Adsorption assembly; 5.11 Rotary mounting block; 5.12 Suction claw; 5.13 Negative pressure block; 5.14 First airway groove; 5.15 Second airway groove; 5.16 Airway hole;

[0039] 5.2 Rotary components; 5.21 Gears; 5.22 Racks; 5.23 Linear actuation modules;

[0040] 5.3 Wafer lifting assembly; 5.31 Linear movement module; 5.32 First moving frame;

[0041] 5.4 Wafer translation assembly; 5.41 Vertical movement module; 5.42 Second moving frame;

[0042] 5.5 Adjusting seat; 5.6 Bearing seat;

[0043] 6. Static electricity elimination module; 6.1. Adjustment bracket; 6.11. Rotary hole; 6.12. Arc-shaped channel;

[0044] 7. Translation Components; 7.1 Translation Frame; 7.2 Support Frame; 7.21 First Vertical Adjustment Slot; 7.22 Second Vertical Adjustment Slot; 7.3 First Vision Mounting Block; 7.31 Horizontal Adjustment Slot; 7.4 Second Vision Mounting Block; 7.5 Translation Unit;

[0045] 8. Sorting and storage racks;

[0046] 9. Wafer handling module; 9.1. Three-axis moving assembly; 9.2. Push cylinder; Detailed Implementation

[0047] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0048] It should be understood that although the terms upper, middle, lower, top, one end, etc., appear in this document to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish the elements from each other for ease of understanding, and are not used to define any directional or sequential restrictions.

[0049] like Figure 1-11 As shown, a weight and morphology detection device includes:

[0050] The testing stand 1 has an extension in the vertical direction, and the testing stand 1 is provided with a first testing platform 2 and a second testing platform 3 with respect to the vertical interval;

[0051] The first inspection platform 2 includes at least one placement stage 2.1, and a light source 2.2 and a vision camera 2.3 disposed above the placement stage 2.1. The vision camera 2.3 performs morphological inspection on the wafer on the placement stage 2.1, specifically detecting whether the wafer has edge chipping and whether the wafer string is complete.

[0052] The second testing platform 3 includes at least one weighing unit 3.1 and a sealing cover 3.2 disposed above the weighing unit 3.1. The testing stand 1 is provided with a sealing lifting assembly 4 connected to the sealing cover 3.2. The sealing cover 3.2 covers at least outside the weighing part of the weighing unit 3.1. The sealing cover 3.2 is actuated to rise or fall by the sealing lifting assembly 4.

[0053] The wafer rotation module 5 includes an adsorption component 5.1, a rotation component 5.2 connected to the adsorption component 5.1, a wafer lifting component 5.3 that actuates the rotation component 5.2 to move about the first detection platform 2 and the second detection platform 3, and a wafer translation component 5.4 that actuates the rotation component 5.2 to enter or move away from the detection stand 1. During the detection process, the adsorption component 5.1 is used to hold and transfer the wafer, the rotation component 5.2 is used to drive the wafer to flip, and the rotation component 5.2 transfers the front and back sides of the wafer to the placement stage 2.1 to perform morphology detection on the front and back sides of the wafer, or to perform secondary weighing on the wafer through the flipping action. The wafer lifting component 5.3 and the wafer translation component 5.4 work together to drive the wafer to move about about the first detection platform 2 and the second detection platform 3 by lifting, while the wafer translation component 5.4 drives the wafer to enter or leave the first detection platform 2 and the second detection platform 3.

[0054] Reference Figure 7 As shown, as a further embodiment of the wafer lifting assembly 5.3 and the wafer translation assembly 5.4, the wafer translation assembly 5.4 is configured to move perpendicular to the arrangement direction of the placement stage 2.1. Specifically, it includes a linear movement module 5.31 perpendicular to the arrangement direction of the placement stage 2.1 and a first moving frame 5.32 disposed on the actuating end of the linear movement module 5.31. The moving frame has a vertically extending vertical plane. The wafer lifting assembly 5.3 is disposed on the vertical plane and specifically includes a vertical movement module 5.41 and a second moving frame 5.42 disposed on the actuating end of the vertical movement module 5.41. The rotating assembly 5.2 is disposed on the second moving frame 5.42. The movement of the adsorption assembly 5.1 in the vertical and horizontal directions is realized by the movement of the first moving frame 5.32 and the second moving frame 5.42. The linear movement module 5.31 can be selected as a leverless cylinder, and slide rails and sliders are provided on both sides of the leverless cylinder. The vertical movement module 5.41 can be selected as a linear slide table.

[0055] For wafer inspection, a stable support surface is required, especially for the weighing unit 3.1 in the second inspection platform 3. In this embodiment, the first inspection platform 2 is set above the second inspection platform 3, and a mounting base plate and a marble plate are arranged in sequence at the bottom of the second inspection platform 3. The mounting base plate provides an installation position for the components on the inspection stand 1, and the marble plate is set to provide higher vibration suppression to meet the requirements of wafer weighing and wafer morphology inspection work with low mechanical strength.

[0056] Specifically, static electricity easily accumulates during wafer manufacturing, especially during automated transportation and inspection. If static electricity is present on the wafer surface, it may attract dust particles, affecting the accuracy of inspection and even causing open circuits on the wafer chips. Therefore, this embodiment also provides a static electricity removal module 6 on the inspection stand 1. The static electricity removal module 6 is specifically set on the first inspection platform 2. The static electricity removal module 6 extends about the placement stage 2.1 and is adjustable towards the first inspection platform 2. Preferably, the static electricity removal module 6 is arranged below the light source 2.2 and obliquely towards the first inspection platform 2 to suppress the accumulation of static charge and dust during the inspection process, while protecting the wafer from static electricity damage.

[0057] In this embodiment, the electrostatic discharge module 6 includes an air ionization component, specifically, positive and negative DC high voltages alternately act on the coupled electrode needles. That is, the DC high voltage source uses an AC implementation method to act on the electrode needles through the coupling device to generate corona discharge, ionizing air molecules and generating a large number of positive and negative polarity air ions. It also includes air nozzles, which are arranged about the length of the first detection platform 2 or about the arrangement direction of the placement stage 2.1, so as to deliver compressed air to the surface of the object with static electricity, neutralize the positive and negative static charges, and achieve the purpose of efficiently and reliably eliminating static electricity on the object surface.

[0058] As an example, the static electricity elimination module 6 can be selected as a gas-source anti-electric shock pulse AC ion bar with model number AP-AB1228, which is a calming and static-dissipating device.

[0059] Reference Figure 3 and Figure 4 As shown, in some other embodiments, the detection stand 1 includes a first frame 1.1 disposed above the first detection platform 2, and an adjustment frame 6.1 disposed on the first frame 1.1. The first frame 1.1 extends vertically on the first detection platform 2, and the adjustment frame 6.1 is rotatably disposed on the first frame 1.1. The adjustment frame 6.1 includes a rotating hole 6.11 that mates with the first frame 1.1, and an arc-shaped channel 6.12 concentrically disposed with the rotating hole 6.11. The end of the adjustment frame 6.1 away from the first frame 1.1 is fixedly connected to the electrostatic discharge module 6. The rotating hole 6.11 and the arc-shaped channel 6.12 are both used to install connecting parts, such as screws, bolts and other threaded connecting parts, between the adjusting frame 6.1 and the first frame 1.1, so that the adjusting frame 6.1 can rotate and adjust around the center of the rotating hole 6.11 and the arc-shaped channel 6.12. The length of the arc-shaped channel 6.12 limits the rotation angle range of the adjusting frame 6.1. After the static discharge module 6 is adjusted to the expected angle, the threaded connecting parts on the rotating hole 6.11 or the arc-shaped channel 6.12 are further engaged to fix the adjusting frame 6.1 on the first frame 1.1.

[0060] Preferably, there are multiple placement platforms 2.1, spaced apart in the horizontal direction, with no limit on the specific number. A translation component 7 is provided above the first detection platform 2, and a translation frame 7.1 is provided on the moving end of the translation component 7. The translation component 7 is arranged in the direction of the placement platform 2.1. The light source 2.2 and the vision camera 2.3 are both provided on the translation frame 7.1. The translation component 7 includes at least a translation unit 7.5 that provides the translation frame 7.1 to move in the horizontal direction. As an example, the translation unit 7.5 can be selected as a leverless cylinder.

[0061] like Figure 6As shown, as a further embodiment of the translation component 7, the translation frame 7.1 includes a vertically extending support frame 7.2, a first vision mounting block 7.3 and a second vision mounting block 7.4 connected to the support frame 7.2 and the vision camera 2.3, and a light source 2.2 mounting block connected to the support frame 7.2 and the light source 2.2.

[0062] The first vision mounting block 7.3 extends horizontally, and a first vertical adjustment groove 7.21 is provided between the first vision mounting block 7.3 and the support frame 7.2. The first vertical adjustment groove 7.21 can be set on the vertical surface of the support frame 7.2. After the vertical position adjustment between the first vision mounting block 7.3 and the support frame 7.2 is completed, it is fastened and fixed by a threaded connector.

[0063] The second vision mounting block 7.4 extends in the same horizontal direction as the first vision mounting block 7.3 and provides a fixed position for the vision camera 2.3. A horizontal adjustment groove 7.31 is provided between the first vision mounting block 7.3 and the second vision mounting block 7.4. The horizontal adjustment groove 7.31 can be set on the first vision mounting block 7.3. After the horizontal position adjustment between the first vision mounting block 7.3 and the second vision mounting block 7.4 is completed, it is fastened and fixed by a threaded connector.

[0064] Among them, a second vertical adjustment groove 7.22 is provided between the light source 2.2 mounting block and the support frame 7.2. The second vertical adjustment groove 7.22 can be set on the vertical surface of the support frame 7.2. After the horizontal position adjustment between the light source 2.2 mounting block and the support frame 7.2 is completed, it is fastened and fixed by threaded connectors.

[0065] Preferably, the translation component 7 also includes a translation base plate disposed below the translation frame 7.1. A slide rail slider is provided between the translation base plate and the translation frame 7.1, wherein the slide rail is fixedly connected to the translation base plate and the slider is fixedly connected to the bottom of the translation frame 7.1. There are two sets of slide rail sliders, which are arranged in parallel and spaced apart. The translation unit 7.5 is disposed between the two sets of slide rail sliders to ensure the stability of the movement of the translation component 7. In addition, a presence or absence sensor is provided on the slide rail slider near the first detection platform 2. The presence or absence sensor is used to detect whether the adsorption component 5.1 is located on the first detection platform 2 to control the vision camera 2.3.

[0066] In the above embodiments, the light source 2.2 and the vision camera 2.3 on the translation frame 7.1 are finely positioned through the horizontal adjustment slot 7.31 and the vertical adjustment slot to adapt to the shape detection area coverage requirements of wafers of different sizes. The translation unit 7.5 provides the translation frame 7.1 to move in the horizontal direction so that the vision camera 2.3 can be directly facing the wafer on the placement stage 2.1, thereby improving the accuracy of visual inspection.

[0067] Further reference Figure 7 and Figure 8 As a further embodiment of the wafer rotation module 5, the wafer rotation module 5 also includes an adjustment seat 5.5 connecting the adsorption component 5.1 and the rotation component 5.2. The adjustment seat 5.5 is specifically fixed below the first moving frame 5.32. The rotation component 5.2 includes a gear 5.21 and a rack 5.22 disposed on the adjustment seat 5.5, and a linear actuation module 5.23 that actuates the rack 5.22 to move linearly back and forth. The rack 5.22 has a rack 5.22 on the side opposite to the gear 5.21. The mounting plate 5.22 and the rack 5.22 are connected to a slide rail slider between the mounting plate and the adjusting seat 5.5. The mounting plate 5.22 extends horizontally. A linear cylinder is located on one side of the slide rail slider on the adjusting seat 5.5, which is positioned along the length of the rack 5.22 to drive the rack 5.22 to move linearly back and forth. The gear 5.21 is axially fixedly connected to the adsorption assembly 5.1, so that the movement of the rack 5.22 drives the gear 5.21 to rotate, thereby driving the adsorption assembly 5.1 to rotate.

[0068] Among them, a bearing seat 56 is provided between the adsorption component 5.1 and the rotation component 5.2. The bearing seat 5.6 is provided with a rotating shaft connected to the gear 5.21. The rotating shaft is fixedly connected to the adsorption component 5.1.

[0069] As a further embodiment of the adsorption component 5.1, the adsorption component 5.1 includes a rotating mounting block 5.11 fixedly connected to the rotating component 5.2, and a suction claw 5.12 disposed on the rotating mounting block 5.11. The rotating mounting block 5.11 is fixedly connected to the rotating shaft. The suction claw 5.12 is a plate-shaped body with an arc-shaped claw portion at its front end, which extends correspondingly to the outline of the wafer. The rotating mounting block 5.11 is also provided with a negative pressure block 5.13 for fixing the suction claw 5.12 to the rotating mounting block 5.11. A negative pressure component is connected to the negative pressure block 5.13. The suction claw 5.12 is provided with an adsorption area communicating with the negative pressure component. The adsorption area matches the outline of the wafer and forms an arc-shaped first air channel groove 5.14 on the claw portion. The first air channel groove 5.14 constitutes the adsorption area. The suction claw 5.12 is provided with a through air channel hole 5. .16. The upper surface of the suction claw 5.12 is provided with a second air channel groove 5.15 that connects the air channel hole 5.16 and the first air channel groove 5.14. The negative pressure block 5.13 covers the air channel hole 5.16, and the second air channel groove 5.15 is covered with a sealing plate. Thus, the negative pressure block, the air channel hole 5.16, the first air channel groove 5.14 and the second air channel groove 5.15 form a negative pressure channel. Based on the plate-shaped suction claw 5.12, the adsorption of the wafer is realized.

[0070] In this embodiment, the adsorption component 5.1 of the wafer rotation module 5 uses a negative pressure block 5.13 to match the wafer contour, effectively avoiding edge stress concentration; the synergistic effect of the sealing cover 3.2 and the electrostatic elimination module reduces the dust adhesion rate on the wafer surface during the inspection process.

[0071] In the above embodiments, the negative pressure component can be a vacuum pump component commonly used by those skilled in the art, and will not be described in detail here.

[0072] like Figure 9 As shown, as a further embodiment of the second testing platform 3, the second testing platform 3 is provided with a second frame 1.2, and the first testing platform 2 is clamped on the second frame 1.2, so that a space is created between the first frame 1.1 and the second frame to arrange the weighing unit 3.1 and the sealing cover 3.2. The sealing lifting assembly 4 is specifically arranged on the first frame 1.1, and the sealing lifting assembly 4 can be selected as a vertically arranged linear cylinder. The sealing cover 3.2 is arranged on the actuating end of the linear cylinder. A sealing frame 3.3 is provided above the weighing unit 3.1, and the sealing frame 3.3 covers the weighing unit 3.1. On the outside of the weighing unit 3.1, the sealing frame 3.3 is provided with a through groove 3.31 for the weighing part of the weighing unit 3.1 to extend out, and a sealing plate 3.4 is provided around the through groove 3.31. The sealing cover 3.2 abuts against the sealing frame 3.3. The sealing cover 3.2 and the periphery of the sealing frame 3.3 abut against each other to form a seal in the weighing space. The sealing plate 3.4 is provided to ensure the sealing of the through groove 3.31. After the sealing frame 3.3 is installed, the weighing part extends out of the through groove 3.31, and then the sealing plate 3.4 is installed and fixed.

[0073] In other embodiments, the mating surfaces of the sealing frame 3.3 and the sealing cover 3.2 of the weighing unit 3.1 are provided with elastic seals to ensure airtightness during the weighing process and prevent airflow interference with high-precision weighing. Of course, a negative pressure component can also be connected to the sealing frame 3.3 or the sealing cover 3.2 to further reduce internal airflow interference.

[0074] like Figure 10 and Figure 11 As shown, in order to further reduce the transfer distance of wafers to the first inspection platform 2 and the second inspection platform 3, a sorting and storage rack 8 is also provided on one side of the inspection stand 1, and a wafer handling module 9 that moves between the sorting and storage rack 8 and the inspection stand 1. The sorting and storage rack 8 is equipped with a test basket area, a qualified basket area, and a non-qualified basket area. The basket refers to a small carrier that holds multiple wafers. By setting the sorting and storage rack 8 on one side of the inspection platform, a closed-loop inspection and sorting system is formed, reducing manual intervention and effectively reducing the wafer transfer path, thereby reducing the risk of damage and dust adhesion.

[0075] Specifically, the wafer transport module 9 includes a three-axis transfer assembly and an adsorption assembly 5.1 arranged on the three-axis transfer assembly. The wafer transport module 9 transports wafers to the first inspection platform 2 or the second inspection platform 3, and transports the inspected wafers to the sorting and storage rack 8. The adsorption assembly 5.1 has the same structure as the adsorption assembly 5.1 in the wafer rotation module 5, and will not be described in detail here. The only difference is that the wafer transport module 9 also has a push cylinder 9.2 connected to the adsorption assembly 5.1, which is positioned towards the sorting and storage rack 8.

[0076] Specifically, the light source 2.2 is set as a parallel shadowless light source 2.2 and covers the first detection platform 2. The parallel shadowless light uniformly covers the surface, so that the defect contour presents high contrast in the imaging of the vision camera 2.3, improving the defect recognition accuracy. The uniformity of light intensity of the parallel shadowless light source 2.2 avoids the difference in detection sensitivity in different areas of the same wafer due to uneven illumination.

[0077] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A weight and morphology detection device, characterized in that, include: The testing stand (1) is provided with a first testing platform (2) and a second testing platform (3) with respect to vertical intervals. The first detection platform (2) includes at least one placement stage (2.1), and a light source (2.2) and a vision camera (2.3) disposed above the placement stage (2.1); The second testing platform (3) includes at least one weighing unit (3.1) and a sealing cover (3.2) disposed above the weighing unit (3.1). The testing stand (1) is provided with a sealing lifting assembly (4) connected to the sealing cover (3.2). The wafer rotation module (5) includes an adsorption assembly (5.1) for holding and transferring wafers, a rotation assembly (5.2) connected to the adsorption assembly (5.1), a wafer lifting assembly (5.3) for actuating the rotation assembly (5.2) to move about a first detection platform (2) and a second detection platform (3), and a wafer translation assembly (5.4) for actuating the rotation assembly (5.2) to move into or away from the detection stand (1), wherein the rotation assembly (5.2) transfers the front and back sides of the wafer to the placement stage (2.1).

2. The weight and morphology detection device according to claim 1, characterized in that: The testing stand (1) is also provided with an electrostatic discharge module (6), which extends about the placement platform (2.1) and is adjustable to face the first testing platform (2).

3. The weight and morphology detection device according to claim 1, characterized in that: The testing stand (1) includes a first frame (1.1) disposed above the first testing platform (2) and an adjustment frame (6.1) disposed on the first frame (1.1). The adjustment frame (6.1) includes a rotating hole (6.11) that cooperates with the first frame (1.1) and an arc-shaped channel (6.12) concentrically disposed with the rotating hole (6.11). The end of the adjustment frame (6.1) away from the first frame (1.1) is fixedly connected to the static discharge module (6).

4. The weight and morphology detection device according to claim 1, characterized in that: The number of the placement platform (2.1) is multiple. The first detection platform (2) is provided with a translation component (7) and a translation frame (7.1) set on the moving end of the translation component (7). The translation component (7) is arranged in the direction of the placement platform (2.1). The light source (2.2) and the vision camera (2.3) are both set on the translation frame (7.1).

5. The weight and morphology detection device according to claim 4, characterized in that: The translation frame (7.1) includes a support frame (7.2), a first vision mounting block (7.3) and a second vision mounting block (7.4) connected to the support frame (7.2) and the vision camera (2.3), and a light source (2.2) mounting block connected to the support frame (7.2) and the light source (2.2). A horizontal adjustment groove (7.31) is provided between the first vision mounting block (7.3) and the second vision mounting block (7.4), a first vertical adjustment groove (7.21) is provided between the first vision mounting block (7.3) and the support frame (7.2), and a second vertical adjustment groove (7.22) is provided between the light source (2.2) mounting block and the support frame (7.2).

6. The weight and morphology detection device according to claim 1, characterized in that: A sealing frame (3.3) is provided above the weighing unit (3.1). The sealing frame (3.3) is provided with a through groove (3.31) for the weighing part of the weighing unit (3.1) to extend out. A sealing plate (3.4) is provided around the through groove (3.31). The sealing cover (3.2) abuts against the sealing frame (3.3).

7. The weight and morphology detection device according to claim 1, characterized in that: The wafer rotation module (5) further includes an adjustment seat (5.5) connecting the adsorption component (5.1) and the rotation component (5.2). The rotation component (5.2) includes a gear (5.21) and a rack (5.22) disposed on the adjustment seat (5.5), and a linear actuation module (5.23) for actuating the rack (5.22) to move linearly back and forth. The gear (5.21) is axially fixedly connected to the adsorption component (5.1).

8. The weight and morphology detection device according to claim 1, characterized in that: The adsorption assembly (5.1) includes a rotating mounting block (5.11) fixedly connected to the rotating assembly (5.2), and a suction claw (5.12) disposed on the rotating mounting block (5.11). The rotating mounting block (5.11) is also provided with a negative pressure block (5.13) for fixing the suction claw (5.12) on the rotating mounting block (5.11). A negative pressure assembly is connected to the negative pressure block (5.13). The suction claw (5.12) is provided with an adsorption area communicating with the negative pressure assembly. The adsorption area matches the contour of the wafer.

9. The weight and morphology detection device according to claim 1, characterized in that: The testing stand (1) is also provided with a sorting and storage rack (8) on one side, and a wafer transport module (9) that moves between the sorting and storage rack (8) and the testing stand (1). The wafer transport module (9) includes a three-axis transfer assembly and an adsorption assembly (5.1) arranged on the three-axis transfer assembly. The wafer transport module (9) transports wafers to the first testing platform (2) or the second testing platform (3), and transports the tested wafers to the sorting and storage rack (8).

10. The weight and morphology detection device according to claim 1, characterized in that: The light source (2.2) is set as a parallel shadowless light source (2.2) and covers the first detection platform (2).

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