High-reliability pressure sensing intelligent sensor

Abstract

The utility model provides a high-reliability pressure sensing intelligent sensor, and belongs to the technical field of sensors. The intelligent sensor comprises an intelligent sensor body, wherein the intelligent sensor body comprises a pressurizing port, a full-bridge pressure sensing unit, a conditioning chip circuit part PCBA (Printed Circuit Board Assembly), a routing PCB for linking the full-bridge pressure sensing unit to other circuits, a PCB bracket, a flexible circuit board FPC, a conditioning chip circuit part PCBA bracket and a metal shell; the induction port (namely the pressurization port and the metal film on the top of the pressurization port) of a double-neck structure is adopted, the whole seamless inductor is machined by a stainless steel body according to a special machining process, and the pressure resistance and bursting pressure of the seamless inductor are far higher than those of a structure with a welding seam; according to different requirements of users, the conductive rod or the spring can be selected, and the conductive rod is adopted as a connecting part, so that the contact surface needs to be lowered to form concave point contact, and mounting dislocation is avoided; the spring is suitable for most customers with contact points on circuit boards, and can directly meet the requirements of products.

Description

Technical Field

[0001] This utility model relates to the field of sensors, and more specifically, to a highly reliable pressure-sensing intelligent sensor. Background Technology

[0002] This pressure sensor can be used in the Electronic Stability Control (ESC) or OneBox systems of autonomous vehicles. It monitors brake fluid pressure signals from the brake control unit and pressure signals from hydraulic brake-by-wire systems. The pressure sensor is electrically connected to the ECU to provide the brake fluid pressure measurement signal to the system controller. This pressure sensor is also used in automotive air suspension systems, CO2 air conditioning compressor systems, or other pressure measurement applications.

[0003] In existing ESC or OneBox pressure sensor technologies, most hydraulic sensors use two or more stainless steel parts welded together by laser or argon arc welding to create the sensing port. This seam welding method results in relatively poor pressure resistance and burst pressure for the sensing port. In addition, some products require the contact spring to be placed on the circuit board. In this application, the contact point needs to be placed on the plastic bracket of the sensor. During installation, the spring is prone to misalignment, which can lead to poor contact and affect measurement accuracy.

[0004] How to invent a highly reliable pressure-sensing smart sensor to solve these problems has become an urgent issue for those skilled in the art. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a highly reliable pressure-sensing intelligent sensor, aiming to solve the problems mentioned in the background.

[0006] This utility model is implemented as follows:

[0007] This utility model provides a high-reliability pressure-sensing intelligent sensor, including an intelligent sensor body. The intelligent sensor body includes a pressure port, a full-bridge pressure sensing unit, a conditioning chip circuit board (PCBA), a bonding PCB for connecting the full-bridge pressure sensing unit to other circuits, a PCB bracket, a flexible printed circuit board (FPC), a conditioning chip circuit board (PCBA) bracket, and a metal housing. A metal film is provided at the top of the pressure port, and a double-neck structure is provided at the top of the pressure port. The conditioning chip circuit board (PCBA) is fixed on the conditioning chip circuit board (PCBA) bracket. A conductive rod support is provided on the inner side of the top of the frame. A conductive rod is installed inside the conductive rod support. The conductive rod is installed on the support with a step to create a concave point to prevent the contact spring of the client from being misaligned. The bottom end of the conductive rod is provided with a bent foot. The conductive rod is soldered to the conditioning chip circuit part PCBA through the bent foot. The bottom end of the conditioning chip circuit part PCBA support is fixedly connected to the pressure port. The bottom end of the conditioning chip circuit part PCBA is fixed to the pressure port through the conditioning chip circuit part PCBA support. The wire bonding PCB is soldered to the PCB support. The bottom end of the PCB support is fixed to the pressure port.

[0008] Preferably, the full-bridge pressure sensing unit is disposed at the top of the metal film, and the wire bonding PCB is located at the top of the PCB bracket and is fixed by the PCB bracket.

[0009] Preferably, the wire bonding PCB is connected to the signal input terminal of the conditioning chip circuit section PCBA via a flexible printed circuit board (FPC).

[0010] Preferably, there are three conductive rods, and the number of full-bridge pressure sensing units is at least one. The conductive rods can be replaced with springs.

[0011] Preferably, the full-bridge pressure sensing unit is fabricated based on monocrystalline silicon, polycrystalline silicon, or gallium nitride material and SOI process technology, wherein SOI is silicon on an insulating substrate, and this technology introduces a buried oxide layer between the top silicon layer and the back substrate.

[0012] Preferably, the full-bridge pressure sensing unit is directly connected to the wire bonding PCB via a bonding process.

[0013] Preferably, the conditioning chip circuitry PCBA generates and transmits corresponding SENT output signals or other digital output signals.

[0014] Preferably, the SENT output or other digital output signal is connected to the client using three conductive rods or three springs.

[0015] The beneficial effects of this utility model are:

[0016] The application employs a single (or multiple) full-bridge pressure sensing unit to provide highly sensitive signals to the signal conditioning chip, making the output signal of SENT more stable, reliable, and accurate, and providing signal detection, fault analysis, and signal redundancy. An innovative metal diaphragm design significantly improves assembly efficiency, increases production capacity, and reduces manufacturing costs per unit time. This application uses a seamless sensing body with a dual-neck structure (i.e., the pressure port and its top metal film) machined from a single stainless steel body using a special machining process. In the prior art, other hydraulic sensors use two or more separate stainless steel parts welded together by laser or argon arc welding, requiring seam welding to produce similar products. The pressure resistance and burst pressure of the seamlessly machined part in this application far exceed those of structures with welded seams. Generally, seam welded designs are prone to bursting under high pressure, while seamless designs can achieve several times the pressure resistance and burst pressure of seam welded structures.

[0017] Depending on the user's different needs, either a conductive rod or a spring can be selected. For cases where the contact spring needs to be placed on the product circuit board, the position of the contact surface can be controlled to be slightly lower than the plastic bracket by setting a conductive rod, thereby forming a concave contact area on the sensor surface. This provides a precise positioning space for the contact spring on the circuit board and avoids misalignment during installation. Springs are suitable for most customers with contact points on the circuit board and can directly match their product requirements. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of a high-reliability pressure-sensing intelligent sensor provided in Embodiment 1 of this utility model;

[0020] Figure 2 This is a schematic diagram of a high-reliability pressure-sensing intelligent sensor conductive rod and conductive rod support structure provided in Embodiment 1 of this utility model;

[0021] Figure 3 This is a schematic cross-sectional view of a high-reliability pressure-sensing intelligent sensor provided in Embodiment 1 of this utility model;

[0022] Figure 4 This is a schematic diagram of the exploded structure of a high-reliability pressure-sensing intelligent sensor provided in Embodiment 1 of this utility model;

[0023] Figure 5 This is a schematic diagram of the installation position of the pressurization port of a high-reliability pressure sensing intelligent sensor provided in Embodiment 1 of this utility model;

[0024] Figure 6 This is a schematic diagram of the installation position structure of a conductive rod support for a high-reliability pressure-sensing intelligent sensor provided in Embodiment 1 of this utility model;

[0025] Figure 7 This is a schematic diagram of a dual-neck structure of a high-reliability pressure-sensing intelligent sensor provided by this utility model;

[0026] Figure 8 This is a schematic diagram of a high-reliability pressure-sensing intelligent sensor wire bonding PCB and PCB support structure provided by this utility model;

[0027] Figure 9 This is a schematic diagram of the overall structure of a high-reliability pressure-sensing intelligent sensor provided in Embodiment 2 of this utility model;

[0028] Figure 10 This is a schematic diagram of the overall structure of a high-reliability pressure-sensing intelligent sensor provided in Embodiment 2 of this utility model;

[0029] Figure 11 This is a cross-sectional structural diagram of a high-reliability pressure-sensing intelligent sensor provided in Embodiment 2 of this utility model;

[0030] Figure 12 This is a schematic diagram of the exploded structure of a high-reliability pressure sensing smart sensor provided in Embodiment 2 of this utility model.

[0031] In the diagram: 10. Smart sensor body; 11. Pressure port; 12. Metal film; 13. Full-bridge pressure sensing unit; 14. PCB bracket; 15. Conditioning chip circuit PCBA bracket; 16. Conductive rod; 17. Metal housing; 18. Conductive rod bracket; 19. Double-neck structure; 110. Wire bonding PCB; 111. Flexible printed circuit board (FPC); 112. Conditioning chip circuit PCBA; 113. Bent leg; 161. Spring. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0033] Example 1, refer to Figures 1-8 The system includes a smart sensor body 10, which comprises a pressure port 11, a full-bridge pressure sensing unit 13, a conditioning chip circuit PCBA 112, a bonding PCB 110 for connecting the full-bridge pressure sensing unit 13 to other circuits, a PCB bracket 14, a flexible printed circuit board (FPC) 111, a conditioning chip circuit PCBA bracket 15, and a metal housing 17. A metal film 12 is provided at the top of the pressure port 11, and a double-neck structure 19 is also provided at the top of the pressure port 11. The smart sensor body 10 utilizes the double-neck structure 19 to employ a coaxial double-neck stress relief design and a frequency-shift double-neck stress relief design. During sensor installation, the installation tool presses the sensor onto the installation fixture using impact force. The double-neck structure 19 includes two neck segments and two metal platforms. The impact force is transmitted through the first neck segment to the first metal platform, where most of the stress is eliminated. The stress transmitted through the first neck segment is ultimately completely eliminated by the second neck segment and the second metal platform.

[0034] Furthermore, the conditioning chip circuit PCBA 112 is fixed on the conditioning chip circuit PCBA bracket 15. A conductive rod bracket 18 is provided on the inner top of the conditioning chip circuit PCBA bracket 15. A conductive rod 16 is installed inside the conductive rod bracket 18. The conductive rod 16 is mounted on the bracket with a step difference to create a concave point to prevent misalignment of the contact spring at the client end. A bent leg 113 is provided at the bottom end of the conductive rod 16. The conductive rod 16 is soldered to the conditioning chip circuit PCBA 112 through the bent leg 113. Two of the bent legs... 113 is used to connect the positive and negative terminals of the conditioning chip circuit section PCBA112. The other bent pin 113 is used to output the signal received by the conditioning chip circuit section PCBA112. The bottom end of the conditioning chip circuit section PCBA bracket 15 is fixedly connected to the pressure port 11. The bottom end of the conditioning chip circuit section PCBA112 is fixed to the pressure port 11 through the conditioning chip circuit section PCBA bracket 15. The wire bonding PCB 110 is soldered to the PCB bracket 14. The bottom end of the PCB bracket 14 is fixed to the pressure port 11.

[0035] The full-bridge pressure sensing unit 13 is located at the top of the metal film 12. The wire bonding PCB 110 is located at the top of the PCB support 14 and is fixed by the PCB support 14. The wire bonding PCB 110 is connected to the signal input terminal of the conditioning chip circuit section PCBA 112 through the flexible printed circuit board (FPC) 111. Three conductive rods 16 are provided. The number of full-bridge pressure sensing units 13 is at least one, but can be one or two. Two full-bridge pressure sensing units 13 are connected in parallel. The parallel full-bridge units can be connected by electronic circuits. After their output signals are finely processed, they can be used to calculate the final pressure reading more accurately. Any pressure sensing unit will be affected by temperature and produce errors. If the design of two full-bridge units is... Similarly, they respond to temperature changes in the same way. Therefore, when they are connected in parallel, any resistance changes caused by temperature will occur in both units, and their effects in the circuit can cancel each other out. Ideally, the two parallel units will bear the applied pressure evenly, thus minimizing any errors caused by uneven pressure distribution. Each pressure sensing unit has its own inherent small deviation, which can theoretically cancel each other out by connecting two units in parallel. Since the errors of the two units are usually random and independent, the overall error will be reduced after averaging. In summary, configuring the outputs of the two full-bridge units as a differential signal can improve signal quality. By measuring the voltage difference between the two units, noise and interference can be further reduced.

[0036] It should be noted that the full-bridge pressure sensing unit 13 is fabricated based on single-crystal silicon, polycrystalline silicon, or gallium nitride materials and SOI process technology. SOI stands for Silicon on Insulating Substrate. This technology introduces a buried oxide layer between the top silicon layer and the back substrate, effectively reducing interference between electronic components and improving the reliability and performance of the sensor. By using materials such as single-crystal silicon, polycrystalline silicon, or gallium nitride, combined with SOI process, the performance of the sensor can be customized according to different application requirements, such as sensitivity, temperature range, and chemical resistance. The selection of these materials provides the sensor with the ability to work in harsh environments. The full-bridge pressure sensing unit 13 is directly connected to the wire bonding PCB 110 through a bonding process. The conditioning chip circuit part PCBA 112 generates and transmits the corresponding SENT output signal or other digital output signal. The SENT output or other digital output signal is connected to the client through three conductive rods 16. The sensor can be optimized according to load, vibration, and installation requirements, thereby improving its performance and reliability in various environments.

[0037] In this embodiment, two full-bridge pressure sensing units 13 based on monocrystalline silicon, polycrystalline silicon, or gallium nitride materials and SOI technology are used at the front end of the sensor. At the same time, through a unique metal sensing diaphragm (metal thin film 12) design, the two full-bridge pressure sensing units 13 are directly connected to the wire bonding PCB 110. This structure reduces the overall assembly process difficulty, and together with the innovative metal diaphragm (metal thin film 12) design, the assembly efficiency is greatly improved, thereby increasing production capacity.

[0038] Here, this application uses a double-neck structure 19 with the sensing port (i.e., the pressure port 11 and the metal film 12 on top of it) as a whole seamless sensing body machined from a single stainless steel body using a special machining process. In the prior art, other hydraulic sensors use two or more separate stainless steel parts welded by laser or argon arc welding. Only by using seam welding can similar products be made. The pressure resistance and burst pressure of the integral seamless machined parts in this application are far greater than those of structures with welded seams. Generally speaking, seam welded designs are prone to bursting under high pressure, while seamless designs can achieve several times the pressure resistance and burst pressure of seam welded structures.

[0039] This intelligent sensor reduces the overall size and expands the applicable scenarios. During operation, the SENT output signal comes from two full-bridge pressure sensing units 13. The two full-bridge pressure sensing units 13 provide a highly sensitive signal conditioning chip, making the output signal of SENT more stable and reliable. The sensor is compatible with SAE J2716 Apr2016, allowing up to 64 slow-speed channel signals to be provided to the ECU regarding the sensor's operating status, thus improving the signal transmission rate. It complies with ISO 26262AS ILC and the latest SAE J2716 standard. At the same time, it adopts a coaxial dual-neck stress relief design and a frequency-shift dual-neck stress relief design, thereby maintaining its technological leadership.

[0040] In this embodiment, a conductive rod 16 is used. This design is mainly suitable for situations where the contact spring needs to be placed on the product circuit board. In such applications, there are special requirements for the setting of the contact point. It needs to be precisely set on the plastic bracket of the sensor. In this way, the position of the contact surface can be controlled to be slightly lower than the plastic bracket, thereby forming a concave contact area on the sensor surface. This carefully designed concave contact area has important practical significance, as it can provide a precise positioning space for the contact spring on the circuit board.

[0041] In the actual product installation process, the accurate positioning of the contact spring is crucial. If the contact spring is misaligned during installation, it is very likely to cause poor contact. The concave contact design formed by the conductive rod 16 can effectively avoid this situation. The contact spring can be stably placed in the concave point, ensuring that a good contact state is maintained during the installation process and subsequent product operation, thereby ensuring the stable operation of the entire circuit system.

[0042] Example 2, refer to Figures 9-12 The conductive rod 16 can be replaced with a spring 161.

[0043] In this embodiment, Figure 9 The spring 161 is used in this product. In actual product applications, most users have already set the contact points on their product circuit boards. For these users, they prefer to choose a sensor product that can directly match the existing circuit board contact points. The design of using the spring 161 as the connecting component perfectly meets the needs of these users.

[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," "join," and "fix" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A high-reliability pressure-sensing smart sensor, comprising a smart sensor body (10), characterized in that, The intelligent sensor body (10) includes a pressure port (11), a full-bridge pressure sensing unit (13), a conditioning chip circuit board (PCBA) (112), a bonding PCB (110) for connecting the full-bridge pressure sensing unit (13) to other circuits, a PCB bracket (14), a flexible printed circuit board (FPC) (111), a conditioning chip circuit board (PCBA) bracket (15), and a metal shell (17). The top of the pressure port (11) is provided with a metal film (12), and the top of the pressure port (11) is provided with a double-neck structure (19). The conditioning chip circuit board (PCBA) (112) is fixed on the conditioning chip circuit board (PCBA) bracket (15). A conductive rod bracket (18) is provided on the inner side of the top of the conditioning chip circuit board (PCBA) bracket (15), and a conductive rod is installed inside the conductive rod bracket (18). (16) The conductive rod (16) is mounted on the conductive rod bracket (18) to retain a step to generate a concave point. The bottom end of the conductive rod (16) is provided with a bent foot (113). The conductive rod (16) is welded to the conditioning chip circuit part PCBA (112) through the bent foot (113). The bottom end of the conditioning chip circuit part PCBA bracket (15) is fixedly connected to the pressure port (11). The bottom end of the conditioning chip circuit part PCBA (112) is fixed to the pressure port (11) through the conditioning chip circuit part PCBA bracket (15). The wire bonding PCB (110) is welded to the PCB bracket (14). The bottom end of the PCB bracket (14) is fixed to the pressure port (11). The pressure port (11) and the metal film (12) on its top are made into a seamless sensor by machining a stainless steel body.

2. The high-reliability pressure-sensing intelligent sensor according to claim 1, characterized in that, The full-bridge pressure sensing unit (13) is located at the top of the metal film (12), and the wire bonding PCB (110) is located at the top of the PCB bracket (14) and is fixed by the PCB bracket (14).

3. The high-reliability pressure-sensing intelligent sensor according to claim 1, characterized in that, The wire bonding PCB (110) is connected to the signal input terminal of the conditioning chip circuit section PCBA (112) via a flexible circuit board (FPC) (111).

4. The high-reliability pressure-sensing intelligent sensor according to claim 1, characterized in that, There are three conductive rods (16) and at least one full-bridge pressure sensing unit (13).

5. A high-reliability pressure-sensing intelligent sensor according to claim 1, characterized in that, The full-bridge pressure sensing unit (13) is fabricated based on single-crystal silicon, polycrystalline silicon or gallium nitride material and SOI process technology, wherein SOI is silicon on an insulating substrate, and this technology introduces a buried oxide layer between the top silicon and the back substrate.

6. The high-reliability pressure-sensing intelligent sensor according to claim 1, characterized in that, The full-bridge pressure sensing unit (13) is directly connected to the wire bonding PCB (110) by bonding process.

7. A high-reliability pressure-sensing intelligent sensor according to claim 1, characterized in that, The conditioning chip circuit section PCBA (112) generates and transmits the corresponding SENT output signal or other digital output signal.

8. A high-reliability pressure-sensing intelligent sensor according to claim 7, characterized in that, The SENT output or other digital output signals are connected to the client using three conductive rods (16).

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