Riveting type multilayer circuit board structure
By using a riveted multilayer circuit board structure, the pressing process of each pair of core boards with a semi-cured sheet layer, combined with the fastening connection of the riveting components, solves the problem of low production efficiency of multilayer circuit boards and achieves efficient pressing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU YUXINDA TECH CO LTD
- Filing Date
- 2025-05-14
- Publication Date
- 2026-05-12
AI Technical Summary
The current multilayer circuit board manufacturing process requires multiple lamination processes, resulting in low production efficiency.
The system adopts a riveted multilayer circuit board structure, where every two core boards are pressed together with the corresponding prepreg layer. The core boards are fastened together by the riveting components, reducing the number of pressing layers.
It improves the production efficiency of multilayer circuit boards and reduces the difficulty and number of lamination processes.
Smart Images
Figure CN224233896U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the technical field of multilayer circuit boards, and in particular to a riveted multilayer circuit board structure. Background Technology
[0002] Multilayer circuit boards (PCBs) are circuit boards with three or more conductive layers, where adjacent conductive layers are separated by dielectric layers and interconnected by plated vias. PCBs are widely used in communication equipment, computers, consumer electronics, medical equipment, industrial control, and automotive electronics.
[0003] The related multilayer circuit board includes multiple core boards, which are stacked sequentially. A prepreg layer is provided between two adjacent core boards. The multiple core boards and the corresponding prepreg layers are pressed together so that the prepreg layers are pressed and connected to the two adjacent core boards respectively. Each core board is formed with a circuit pattern, and copper plating through holes are formed between two adjacent core boards to connect the two adjacent core boards to each other, such as Chinese Patent No. CN201811562035.9.
[0004] However, because multiple core boards are stacked sequentially and a prepreg layer is placed between two adjacent core boards, the pressing process of multiple core boards and corresponding prepreg layers requires a large number of layers to be pressed each time during the manufacturing process of multilayer circuit boards. This makes the pressing process of multilayer circuit boards more difficult and results in lower production efficiency. Utility Model Content
[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a riveted multilayer circuit board structure with higher production efficiency.
[0006] The purpose of this disclosure is achieved through the following technical solution:
[0007] A riveted multilayer circuit board structure includes:
[0008] Two first core boards are pressed together with a first semi-cured sheet layer to form a first press-fit plate assembly. The first press-fit plate assembly has a plurality of first riveting through holes, which are spaced apart.
[0009] Two second core boards are pressed together with a second semi-cured sheet layer to form a second press-fit plate assembly. The second press-fit plate assembly is stacked with the first press-fit plate assembly. The second press-fit plate assembly has a plurality of second riveting through holes. Each second riveting through hole is connected to a corresponding first riveting through hole to form a riveting through hole. Each second riveting through hole is correspondingly arranged with a corresponding first riveting through hole.
[0010] The riveting assembly includes multiple riveting parts, each riveting part passing through a corresponding riveting through hole, one end of each riveting part being riveted to the first pressing plate assembly, and the other end of each riveting part being riveted to the second pressing plate assembly. Each riveting part is correspondingly provided with a riveting through hole.
[0011] In one embodiment, the riveted multilayer circuit board structure further includes at least two intermediate core boards, with an intermediate semi-cured sheet layer pressed between the two intermediate core boards to form an intermediate press-fit plate assembly; the first press-fit plate assembly, the intermediate press-fit plate assembly, and the second press-fit plate assembly are sequentially stacked, the intermediate press-fit plate assembly has a plurality of intermediate riveting through holes, each intermediate riveting through hole is connected to the corresponding first riveting through hole and the corresponding second riveting through hole to form the riveting through hole, and each riveting part is connected to the intermediate press-fit plate assembly.
[0012] In one embodiment, the number of intermediate core boards is 2n, the number of intermediate semi-cured sheets is n, and the number of intermediate pressing plate assemblies is n, where n is an integer greater than or equal to 1.
[0013] In one embodiment, when n equals 2, the number of intermediate pressing plate assemblies is two, the two intermediate pressing plate assemblies are located between the first pressing plate assembly and the second pressing plate assembly, the two intermediate pressing plate assemblies are stacked, and an intermediate adhesive layer is provided at the connection between the two intermediate pressing plate assemblies, the number of intermediate adhesive layers is n-1.
[0014] In one embodiment, when n is greater than or equal to 3, the number of intermediate pressing plate assemblies is multiple, the multiple intermediate pressing plate assemblies are located between the first pressing plate assembly and the second pressing plate assembly, the multiple intermediate pressing plate assemblies are stacked sequentially, and an intermediate adhesive layer is provided at the connection between two adjacent intermediate pressing plate assemblies, the number of intermediate adhesive layers is n-1.
[0015] In one embodiment, each of the intermediate adhesive layers is a yellow glue layer structure.
[0016] In one embodiment, a first adhesive layer is provided at the connection between the first pressing plate assembly and the intermediate pressing plate assembly; a second adhesive layer is provided at the connection between the second pressing plate assembly and the intermediate pressing plate assembly.
[0017] In one embodiment, both the first adhesive layer and the second adhesive layer are yellow glue layer structures.
[0018] In one embodiment, each riveting part is a rivet structure.
[0019] In one embodiment, the diameter of each of the riveted through holes is greater than or equal to 2 mm.
[0020] Compared with the prior art, this disclosure has at least the following advantages:
[0021] 1. A first prepreg layer is pressed and connected between two first core boards to form a first press-fit assembly, so that the two first core boards and the first prepreg layer are pressed together to obtain the first press-fit assembly; similarly, a second prepreg layer is pressed and connected between two second core boards to form a second press-fit assembly, so that the two second core boards and the second prepreg layer are pressed together to obtain the second press-fit assembly, that is, every two core boards are pressed together with the corresponding prepreg layer; the second press-fit assembly and the first press-fit assembly are stacked, each second riveting through hole is connected to the corresponding first riveting through hole to form a riveting through hole, each riveting part is inserted through the corresponding riveting through hole, one end of each riveting part is riveted to the first press-fit assembly, and the other end of each riveting part is riveted to the second press-fit assembly, so that multiple riveting parts work together to make the first press-fit assembly and the second press-fit assembly fit together and be tightly connected, thus completing the processing of the riveted multilayer circuit board structure;
[0022] 2. Because the riveted multilayer circuit board structure uses a pressing process where every two core boards are pressed together with their corresponding prepreg layers, that is, the first pressing plate assembly and the second pressing plate assembly are pressed together separately, the number of layers that need to be pressed together in each pressing process of the first pressing plate assembly is reduced, and the number of layers that need to be pressed together in each pressing process of the second pressing plate assembly is also reduced. Then, through the combined action of multiple riveting parts, the first pressing plate assembly and the second pressing plate assembly are tightly connected. This reduces the number of layers that need to be pressed together in each pressing process of the riveted multilayer circuit board structure, thus reducing the pressing process difficulty of the riveted multilayer circuit board structure using the pressing process where every two core boards are pressed together with their corresponding prepreg layers. Consequently, the production efficiency of the riveted multilayer circuit board structure using the pressing process where every two core boards are pressed together with their corresponding prepreg layers is higher. Attached Figure Description
[0023] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1This is a schematic diagram of a riveted multilayer circuit board structure according to an embodiment;
[0025] Figure 2 for Figure 1 A cross-sectional view along line AA in the riveted multilayer circuit board structure shown;
[0026] Figure 3 A cross-sectional view of the overall structure of a riveted multilayer circuit board structure having two intermediate lamination plate assemblies, as shown in one embodiment;
[0027] Figure 4 A cross-sectional view of the overall structure of a riveted multilayer circuit board structure having three intermediate lamination plate assemblies, as an embodiment;
[0028] Figure 5 for Figure 1 A schematic diagram of the riveted multilayer circuit board structure from another perspective;
[0029] Figure 6 for Figure 1 A schematic diagram of the first lamination plate assembly of the riveted multilayer circuit board structure shown;
[0030] Figure 7 for Figure 1 A schematic diagram of the second lamination plate assembly of the riveted multilayer circuit board structure shown;
[0031] Figure 8 for Figure 1 The diagram shows the structure of the intermediate lamination plate assembly of the riveted multilayer circuit board structure. Detailed Implementation
[0032] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.
[0033] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0035] like Figures 1 to 8 As shown, a riveted multilayer circuit board structure 10 of one embodiment includes two first core boards 110, two second core boards 210, and a riveting assembly 300; a first semi-cured sheet 120 is pressed and connected between the two first core boards 110 to form a first press-fit assembly 100, the first press-fit assembly 100 having a plurality of first riveting through holes 130 spaced apart; a second semi-cured sheet 220 is pressed and connected between the two second core boards 210 to form a second press-fit assembly 200, the second press-fit assembly 200 and the first press-fit assembly 100 are stacked together, the second press-fit assembly 200... The component 200 has multiple second riveting through holes 230, each second riveting through hole 230 communicating with a corresponding first riveting through hole 130 to form a riveting through hole 131, and each second riveting through hole 230 is correspondingly arranged with the corresponding first riveting through hole 130; the riveting assembly 300 includes multiple riveting parts 310, each riveting part 310 passing through a corresponding riveting through hole 131, one end of each riveting part 310 being riveted to the first pressing plate assembly 100, and the other end of each riveting part 310 being riveted to the second pressing plate assembly 200, and each riveting part 310 being correspondingly arranged with the corresponding riveting through hole 131.
[0036] In this embodiment, each first riveting through hole 130 sequentially penetrates one of the first core plates 110, the first semi-cured sheet 120, and the other first core plate 110, that is, each first riveting through hole 130 is a through-hole structure. Each second riveting through hole 230 sequentially penetrates one of the second core plates 210, the second semi-cured sheet 220, and the other second core plate 210, that is, each second riveting through hole 230 is a through-hole structure.
[0037] In the aforementioned riveted multilayer circuit board structure 10, a first semi-cured sheet 120 is pressed and connected between two first core boards 110 to form a first press-fit assembly 100, such that the two first core boards 110 and the first semi-cured sheet 120 are pressed together to obtain the first press-fit assembly 100. Similarly, a second semi-cured sheet 220 is pressed and connected between two second core boards 210 to form a second press-fit assembly 200, such that the two second core boards 210 and the second semi-cured sheet 220 are pressed together to obtain the second press-fit assembly 200. That is, every two core boards are pressed together with their corresponding semi-cured sheets. Processing; The second pressing plate assembly 200 and the first pressing plate assembly 100 are stacked together. Each second riveting through hole 230 is connected to the corresponding first riveting through hole 130 to form a riveting through hole 131. Each riveting part 310 passes through the corresponding riveting through hole 131. One end of each riveting part 310 is riveted to the first pressing plate assembly 100, and the other end of each riveting part 310 is riveted to the second pressing plate assembly 200, so that multiple riveting parts 310 work together to make the first pressing plate assembly 100 and the second pressing plate assembly 200 fit together and be firmly connected, thus completing the processing of the riveted multilayer circuit board structure 10.
[0038] Because the riveted multilayer circuit board structure 10 uses a pressing process where every two core boards are pressed together with corresponding prepreg layers, i.e., the first pressing plate assembly 100 and the second pressing plate assembly 200 are pressed together separately, the number of layers that need to be pressed together in each pressing process of the first pressing plate assembly 100 is less, and the number of layers that need to be pressed together in each pressing process of the second pressing plate assembly 200 is also less. Then, the first pressing plate assembly 100 and the second pressing plate assembly 200 are bonded and fastened together by the joint action of multiple riveting parts 310. This reduces the number of layers that need to be pressed together in each pressing process of the riveted multilayer circuit board structure 10, thereby reducing the difficulty of the pressing process under the pressing process of every two core boards with corresponding prepreg layers. Consequently, the production efficiency of the riveted multilayer circuit board structure 10 under the pressing process of every two core boards with corresponding prepreg layers is higher.
[0039] like Figures 1 to 8As shown, in one embodiment, the riveted multilayer circuit board structure 10 further includes at least two intermediate core boards 410, with an intermediate semi-cured sheet 420 pressed between the two intermediate core boards 410 to form an intermediate press-fit assembly 400. The first press-fit assembly 100, the intermediate press-fit assembly 400, and the second press-fit assembly 200 are sequentially stacked. The intermediate press-fit assembly 400 has multiple intermediate riveting through holes 430, each of which communicates with a corresponding first riveting through hole 130 and a corresponding second riveting through hole 230 to form a riveting through hole 131. Each riveting part 310 is connected to the intermediate press-fit assembly 400. In this embodiment, each intermediate riveting through hole 430 sequentially passes through one intermediate core board 410, the intermediate semi-cured sheet 420, and the other intermediate core board 410; that is, each intermediate riveting through hole 430 is a through-hole structure.
[0040] like Figures 1 to 4 As shown, in one embodiment, the number of intermediate core boards 410 is 2n, the number of intermediate semi-cured sheets 420 is n, and the number of intermediate press-fit assemblies 400 is n, where n is an integer greater than or equal to 1.
[0041] like Figures 1 to 4 As shown, in one embodiment, when n equals 2, the number of intermediate pressing plate assemblies 400 is two. These two intermediate pressing plate assemblies 400 are located between the first pressing plate assembly 100 and the second pressing plate assembly 200, and are stacked. An intermediate adhesive layer 440 is provided at the connection between the two intermediate pressing plate assemblies 400, and the number of intermediate adhesive layers 440 is n-1. In this embodiment, the intermediate adhesive layer 440 at the connection between the two intermediate pressing plate assemblies 400 provides better connection stability.
[0042] like Figures 1 to 4 As shown, in one embodiment, when n is greater than or equal to 3, the number of intermediate pressing plate assemblies 400 is multiple. These multiple intermediate pressing plate assemblies 400 are located between the first pressing plate assembly 100 and the second pressing plate assembly 200, and are sequentially stacked. An intermediate adhesive layer 440 is provided at the connection between adjacent intermediate pressing plate assemblies 400, and the number of intermediate adhesive layers 440 is n-1. In this embodiment, the intermediate adhesive layer 440 at the connection between adjacent intermediate pressing plate assemblies 400 improves the connection stability between them.
[0043] In one embodiment, each intermediate adhesive layer 440 is a yellow glue layer structure, which has good moisture-proof performance, thus making each intermediate adhesive layer 440 have good moisture-proof performance.
[0044] like Figures 1 to 4 As shown, in one embodiment, a first adhesive layer 140 is provided at the connection between the first pressing plate assembly 100 and the intermediate pressing plate assembly 400, so that the connection between the first pressing plate assembly 100 and the intermediate pressing plate assembly 400 has good stability; a second adhesive layer 240 is provided at the connection between the second pressing plate assembly 200 and the intermediate pressing plate assembly 400, so that the connection between the second pressing plate assembly 200 and the intermediate pressing plate assembly 400 has good stability.
[0045] In one embodiment, both the first adhesive layer 140 and the second adhesive layer 240 are yellow adhesive layer structures. In this embodiment, the first adhesive layer 140 has a yellow adhesive layer structure, which makes the first adhesive layer 140 have good moisture-proof performance; the second adhesive layer 240 has a yellow adhesive layer structure, which makes the second adhesive layer 240 have good moisture-proof performance.
[0046] In one embodiment, each riveting part 310 is a rivet structure.
[0047] like Figure 1 and Figure 5 As shown, in one embodiment, the diameter of each riveting through hole 131 is greater than or equal to 2 mm, so that the diameter of each riveting part 310 is larger, so that each riveting part 310 can provide greater riveting pressure, thereby making the structural stability of the riveting type multilayer circuit board structure 10 better.
[0048] Compared with the prior art, this disclosure has at least the following advantages:
[0049] 1. Since a first semi-cured sheet 120 is pressed and connected between two first core boards 110 to form a first pressed board assembly 100, the two first core boards 110 and the first semi-cured sheet 120 are pressed together to obtain the first pressed board assembly 100; similarly, a second semi-cured sheet 220 is pressed and connected between two second core boards 210 to form a second pressed board assembly 200, the two second core boards 210 and the second semi-cured sheet 220 are pressed together to obtain the second pressed board assembly 200, that is, every two core boards are pressed together with the corresponding semi-cured sheet; the second pressing... The board assembly 200 and the first pressing board assembly 100 are stacked together. Each second riveting through hole 230 is connected to the corresponding first riveting through hole 130 to form a riveting through hole 131. Each riveting part 310 passes through the corresponding riveting through hole 131. One end of each riveting part 310 is riveted to the first pressing board assembly 100, and the other end of each riveting part 310 is riveted to the second pressing board assembly 200, so that multiple riveting parts 310 work together to make the first pressing board assembly 100 and the second pressing board assembly 200 fit together and be firmly connected, thus completing the processing of the riveted multilayer circuit board structure 10.
[0050] 2. Because the riveted multilayer circuit board structure 10 uses a pressing process where every two core boards are pressed together with corresponding prepreg layers, that is, the first pressing plate assembly 100 and the second pressing plate assembly 200 are pressed together separately, the number of layers that need to be pressed together by the first pressing plate assembly 100 each time is reduced, and the number of layers that need to be pressed together by the second pressing plate assembly 200 each time is also reduced. Then, the first pressing plate assembly 100 and the second pressing plate assembly 200 are bonded and fastened together by the joint action of multiple riveting parts 310. This reduces the number of layers that need to be pressed together during the manufacturing process of the riveted multilayer circuit board structure 10, thereby reducing the difficulty of the pressing process under the pressing process of every two core boards with corresponding prepreg layers. Consequently, the production efficiency of the riveted multilayer circuit board structure 10 under the pressing process of every two core boards with corresponding prepreg layers is higher.
[0051] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.
Claims
1. A riveted multilayer circuit board structure, characterized in that, include: Two first core boards are pressed together with a first semi-cured sheet layer to form a first press-fit plate assembly. The first press-fit plate assembly has a plurality of first riveting through holes, which are spaced apart. Two second core boards are pressed together with a second semi-cured sheet layer to form a second press-fit plate assembly. The second press-fit plate assembly is stacked with the first press-fit plate assembly. The second press-fit plate assembly has a plurality of second riveting through holes. Each second riveting through hole is connected to a corresponding first riveting through hole to form a riveting through hole. Each second riveting through hole is correspondingly arranged with a corresponding first riveting through hole. The riveting assembly includes multiple riveting parts, each riveting part passing through a corresponding riveting through hole, one end of each riveting part being riveted to the first pressing plate assembly, and the other end of each riveting part being riveted to the second pressing plate assembly. Each riveting part is correspondingly provided with a riveting through hole.
2. The riveted multilayer circuit board structure according to claim 1, characterized in that, The riveted multilayer circuit board structure further includes at least two intermediate core boards, and an intermediate semi-cured sheet layer is pressed and connected between the two intermediate core boards to form an intermediate press board assembly; the first press board assembly, the intermediate press board assembly, and the second press board assembly are stacked sequentially, and the intermediate press board assembly has a plurality of intermediate riveting through holes, each intermediate riveting through hole communicating with the corresponding first riveting through hole and the corresponding second riveting through hole to form the riveting through hole, and each riveting part is connected to the intermediate press board assembly.
3. The riveted multilayer circuit board structure according to claim 2, characterized in that, The number of intermediate core boards is 2n, the number of intermediate semi-cured sheets is n, and the number of intermediate pressing plate assemblies is n, where n is an integer greater than or equal to 1.
4. The riveted multilayer circuit board structure according to claim 3, characterized in that, When n equals 2, the number of intermediate pressing plate assemblies is two, the two intermediate pressing plate assemblies are located between the first pressing plate assembly and the second pressing plate assembly, the two intermediate pressing plate assemblies are stacked, and an intermediate adhesive layer is provided at the connection between the two intermediate pressing plate assemblies, the number of intermediate adhesive layers is n-1.
5. The riveted multilayer circuit board structure according to claim 3, characterized in that, When n is greater than or equal to 3, there are multiple intermediate pressing plate assemblies. These multiple intermediate pressing plate assemblies are located between the first pressing plate assembly and the second pressing plate assembly. The multiple intermediate pressing plate assemblies are stacked sequentially. An intermediate adhesive layer is provided at the connection between two adjacent intermediate pressing plate assemblies. The number of intermediate adhesive layers is n-1.
6. The riveted multilayer circuit board structure according to claim 5, characterized in that, Each of the intermediate adhesive layers is a yellow glue layer structure.
7. The riveted multilayer circuit board structure according to claim 2, characterized in that, A first adhesive layer is provided at the connection between the first pressing plate assembly and the intermediate pressing plate assembly; a second adhesive layer is provided at the connection between the second pressing plate assembly and the intermediate pressing plate assembly.
8. The riveted multilayer circuit board structure according to claim 7, characterized in that, Both the first adhesive layer and the second adhesive layer are yellow glue layer structures.
9. The riveted multilayer circuit board structure according to claim 1, characterized in that, Each riveted section is a rivet structure.
10. The riveted multilayer circuit board structure according to claim 1, characterized in that, The diameter of each of the riveted through holes is greater than or equal to 2 mm.