Electronic equipment and vehicle

Abstract

The utility model relates to electronic equipment and a vehicle. A heat exchange device is used for forming heat exchange with a part to be subjected to heat exchange and comprises a circuit board, a base and a first heat exchanger; an inner cavity for accommodating the circuit board is formed in the base; the first heat exchanger is used for exchanging heat with the circuit board; a first part of the first heat exchanger is positioned outside the inner cavity; the base is provided with an opening communicating with the inner cavity, and the opening is suitable for containing the first heat exchanger so that the second part of the first heat exchanger can be located in the inner cavity. At least part of the circuit board is located between the cavity wall of the inner cavity and the second part. And the second part of the first heat exchanger is fixedly connected with the base. According to the technical scheme, the second part of the heat exchanger can be used for limiting the circuit board, and the circuit board is closer to or directly contacted with the first heat exchanger relatively, so that a heat transfer path between the first heat exchanger and the circuit board can be shortened, and the first heat exchanger can exchange heat with the circuit board more sufficiently; therefore, the heat exchange effect of the electronic equipment is improved.

Description

Technical Field

[0001] This application relates to the field of first heat exchanger technology, and more particularly to an electronic device and a vehicle. Background Technology

[0002] Air-cooled radiators are used in vehicles due to their simpler structure and easier maintenance compared to liquid-cooled solutions. They are suitable for cooling integrated electronic devices such as domain controllers and cockpit displays. Air-cooled radiators typically consist of a fan and fins.

[0003] In related technologies, the circuit boards of electronic devices are often housed in a protective enclosure, and heat sinks dissipate heat through conduction with the enclosure, followed by cooling via a fan. However, as the number of components on the circuit boards of electronic devices gradually increases, this heat exchange method is becoming increasingly inadequate to meet the high heat dissipation requirements of these devices. Utility Model Content

[0004] This application provides an electronic device and a vehicle that improve the heat exchange effect of the electronic device, thereby at least partially solving the above-mentioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, an electronic device is provided, comprising:

[0006] Circuit board;

[0007] The base has an internal cavity for accommodating the circuit board;

[0008] A first heat exchanger is used to exchange heat with the circuit board, and a first portion of the first heat exchanger is located outside the inner cavity;

[0009] The base is provided with:

[0010] An opening communicating with the inner cavity and adapted to accommodate the first heat exchanger, such that a second portion of the first heat exchanger is located within the inner cavity;

[0011] At least a portion of the circuit board is located between the cavity wall of the inner cavity and the second portion; the second portion of the first heat exchanger is fixedly connected to the base.

[0012] In some embodiments, the second part is provided with: a first connecting hole;

[0013] The base is provided with: a second connecting hole;

[0014] The first connecting hole is directly opposite the second connecting hole along its extending direction.

[0015] In some implementations, the circuit board is provided with a third connection hole;

[0016] The third connecting hole is directly opposite the first connecting hole and the second connecting hole along its extension direction.

[0017] In some implementations, the first heat exchanger includes:

[0018] A thermally conductive layer is disposed on the second portion for conducting heat between the first portion and the circuit board;

[0019] At least a portion of the circuit board is located between the cavity wall of the inner cavity and the heat-conducting layer.

[0020] In some implementations, the thermally conductive layer is configured as a thermally conductive copper layer covering at least a portion of the surface of the circuit board.

[0021] In some implementations, the first heat exchanger further includes:

[0022] A heat pipe, connected to the second portion and at least partially located outside the inner cavity;

[0023] Multiple first heat exchange fins are spaced apart on the first part and are in contact with the heat pipe;

[0024] Wherein, at least a portion of the heat pipe extends along a first linear direction; the surface of the thermally conductive layer near the circuit board is configured as a thermally conductive plane; the first linear direction is arranged parallel to or perpendicular to the thermally conductive plane.

[0025] In some embodiments, the electronic device further includes:

[0026] A fan, adapted to blow air onto the first heat exchanger during operation;

[0027] The fan is disposed on the base and located outside the inner cavity; and the fan is exposed in the gap between at least two of the first heat exchange fins.

[0028] In some embodiments, the electronic device further includes:

[0029] The second heat exchanger has a plurality of spaced-apart second heat exchange fins located outside the inner cavity;

[0030] The second heat exchanger is detachably mounted on the base;

[0031] In some implementations, the thickness of the first heat exchange fin ranges from 1 to 2 mm; the thickness of the second heat exchange fin ranges from 0.2 mm to 0.5 mm; and / or,

[0032] The spacing between adjacent first heat exchange fins ranges from 4 to 6 mm; the spacing between adjacent second heat exchange fins ranges from 1 to 1.5 mm.

[0033] According to a second aspect of this application, a vehicle is also provided, including the electronic equipment described above.

[0034] In the heat exchange device of this application embodiment, the above technical solution can be used to limit the circuit board by the second part of the heat exchanger. The circuit board is relatively closer to or in direct contact with the first heat exchanger, which can shorten the heat transfer path between the first heat exchanger and the circuit board, so that the first heat exchanger can exchange heat with the circuit board more fully, thereby improving the heat exchange effect of the electronic device.

[0035] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0038] Figure 1 This is a schematic diagram of the overall structure of the first electronic device provided in an exemplary embodiment of this application;

[0039] Figure 2 yes Figure 1 The diagram shows an internal sectional view of the electronic device.

[0040] Figure 3 yes Figure 2 A magnified view of part A in the middle;

[0041] Figure 4 yes Figure 1 A schematic diagram of a portion of the electronic device shown;

[0042] Figure 5 yes Figure 4 Schematic diagram of the structure of the first heat exchanger in the middle;

[0043] Figure 6 This is a schematic diagram of the overall structure of the second electronic device provided in an exemplary embodiment of this application;

[0044] Figure 7 yes Figure 6 The diagram shows an internal sectional view of the electronic device.

[0045] Figure 8 yes Figure 7 Schematic diagram of the structure of the first heat exchanger in the middle;

[0046] Figure 9 yes Figure 7 A schematic diagram of a portion of the electronic device shown;

[0047] Figure 10 yes Figure 9 A magnified view of a section at point B.

[0048] Explanation of reference numerals in the attached figures:

[0049] 100. Electronic device; 110. Circuit board; 110a. Third connection hole; 111. Chip; 120. Base; 120a. Inner cavity; 120b. Opening; 120c. Second connection hole; 121. First housing; 122. Second housing; 130. First heat exchanger; 130a. First part; 130b. Second part; 130c. First connection hole; 131. Base plate; 132. Thermally conductive layer; 132a. Thermally conductive plane; 133. Heat pipe; 134. First heat exchange fin; 140. Fan; 150. Second heat exchanger; 151. Second heat exchange fin. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0051] According to the first aspect of this application, referring to Figures 1 to 10 As shown, this application provides an electronic device 100, which refers to a device equipped with integrated circuits and corresponding electronic components, such as a computer host, server, vehicle domain controller, display in the vehicle cabin, etc., and of course, it can be other specific devices, which are not limited here. The electronic device 100 includes: a circuit board 110, a base 120, and a first heat exchanger 130.

[0052] Among them, reference Figure 2 and Figure 3As shown, the base 120 has an inner cavity 120a for accommodating the circuit board 110, meaning the circuit board 110 is at least partially installed in the inner cavity 120a, so that the base 120 provides protection for the circuit board 110. The aforementioned electronic components are integrated on the circuit board 110. In some specific embodiments, the electronic components on the circuit board 110 may include a control chip 111. Since the control chip 111 and other electronic components generate heat when operating, or the external temperature may affect the normal use of the circuit board 110, it is necessary to control the temperature of the circuit board 110 to ensure stable operation.

[0053] The first heat exchanger 130 is used for heat exchange with the circuit board 110. The heat exchange between the first heat exchanger 130 and the circuit board 110 mentioned in this application can, depending on actual usage requirements, be either cooling the circuit board 110 or heating it, so that the circuit board 110 can be used at a relatively stable temperature. This article mainly uses the cooling of the circuit board 110 by the first heat exchanger 130 as an example to illustrate some of the concepts of this application.

[0054] The first part 130a of the first heat exchanger 130 is located outside the inner cavity 120a. The first part 130a is suitable for heat exchange with the external environment of the base 120. When the first heat exchanger 130 cools down the circuit board 110, after the circuit board 110 exchanges heat with the first heat exchanger 130, the first heat exchanger 130 dissipates the heat to the outside of the base 120, thereby achieving heat dissipation of the circuit board 110 and making the temperature in the inner cavity 120a relatively stable.

[0055] As a specific plan, refer to Figure 3 As shown, the base 120 is provided with an opening 120b, which communicates with the inner cavity 120a and is adapted to accommodate the first heat exchanger 130, so that the second part 130b of the first heat exchanger 130 is located in the inner cavity 120a. By providing the opening 120b, a part of the first heat exchanger 130 is inside the inner cavity 120a to be closer to the circuit board 110, and another part passes through the opening 120b and is exposed in the inner cavity 120a to facilitate heat dissipation to the outside of the base 120.

[0056] At least a portion of the circuit board 110 is located between the cavity wall of the inner cavity 120a and the second portion 130b, and the second portion 130b is fixedly connected to the base 120. At this time, the second portion 130b of the heat exchanger can be used to limit the circuit board 110, while the circuit board 110 is relatively closer to or in direct contact with the first heat exchanger 130. By adopting the above solution, the heat transfer path between the first heat exchanger 130 and the circuit board 110 can be shortened, so that the first heat exchanger 130 can exchange heat with the circuit board 110 more fully, thereby improving the heat exchange effect of the electronic device 100.

[0057] It is understandable that the chip 111 on the circuit board 110 generates relatively more heat than other parts. Therefore, in practical applications, the chip 111 on the circuit board 110 can be placed between the cavity wall of the second part 130b and the inner cavity 120a. For example, refer to... Figure 2 and Figure 3 As shown in the specific embodiment illustrated, one or more chips 111 on the circuit board 110 are disposed between the second part 130b of the first heat exchanger 130 and the base 120 in the vertical direction shown in the figure, so that the first heat exchanger 130 can fully dissipate heat from the one or more chips 111.

[0058] The first heat exchanger 130 can be integrated into the base 120 using a detachable fixed connection. As a specific embodiment, the second part 130b can be provided with a first connection hole 130c; correspondingly, the base 120 can be provided with a second connection hole 120c. The first connection hole 130c is directly opposite the second connection hole 120c along its extension direction.

[0059] As a specific example, in Figure 2 and Figure 3 In the specific embodiment shown, the first heat exchanger 130 includes a base plate 131, which is disposed in the inner cavity 120a as part of the second portion 130b. A first connecting hole 130c is formed on the base plate 131 and penetrates the base plate 131 in the vertical direction shown in the figure. The base 120 includes a first housing 121 and a second housing 122 that are fixedly connected to each other. The first housing 121 and the second housing 122 together form the aforementioned inner cavity 120a. The first housing 121 is located above the second housing 122 in the vertical direction shown in the figure. An opening 120b is formed on the first housing 121, exposing the first portion 130a of the first heat exchanger 130 above the first housing 121. The second connecting hole 120c is formed on the second housing 122 and penetrates the second housing 122 in the vertical direction. Both the first connecting hole 130c and the second connecting hole 120c extend in the vertical direction.

[0060] The first connecting hole 130c mentioned in this application is directly opposite the second connecting hole 120c along its extending direction. Figure 3 In the specific implementation of the example, the first connecting hole 130c and the second connecting hole 120c are connected vertically, allowing components such as bolts and pins to pass through them. Using this scheme, the first heat exchanger 130 and the base 120 can be detachably fixed at the first connecting hole 130c and the second connecting hole 120c via threaded connections, pin fixation, or other methods. In practical applications, the first heat exchanger 130 can be flexibly selected or replaced according to usage needs to meet the actual heat exchange requirements of the electronic device 100.

[0061] When the first heat exchanger 130 dissipates heat from the circuit board 110, the stable alignment of the circuit board 110 with the first heat exchanger 130 also contributes to stable heat dissipation. (Refer to...) Figure 3 As shown, in this application, a third connecting hole 110a is provided on the circuit board 110. The third connecting hole 110a is directly opposite the first connecting hole 130c and the second connecting hole 120c along its extension direction. This solution can fix the circuit board 110 between the first heat exchanger 130 and the base 120 when fixing the first heat exchanger 130 and the base 120, and the first heat exchanger 130 and the base 120 have the same mounting reference, ensuring that the first mounting hole and the circuit board 110 are accurately positioned, which is beneficial for using the first heat exchanger 130 to efficiently dissipate heat from areas of high heat generation on the circuit board 110 (e.g., the location where the chip 111 is set on the circuit board 110).

[0062] For at least the purpose of improving the heat dissipation effect of chip 111, the first heat exchanger 130 includes a thermally conductive layer 132. The thermally conductive layer 132 is disposed on the second portion 130b, meaning that at least a portion of the thermally conductive layer 132 is located within the inner cavity 120a. The thermally conductive layer 132 is used to conduct heat between the first portion 130a and the circuit board 110. It is made of a material with a relatively high thermal conductivity, which facilitates faster heat conduction to the circuit board 110, thereby improving the heat exchange effect. At least a portion of the circuit board 110 is located between the cavity wall of the inner cavity 120a and the thermally conductive layer 132. For example, the chip 111 of the circuit board 110 is disposed between the inner wall of the inner cavity 120a and the thermally conductive layer 132. While the circuit board 110 is confined by the first heat exchanger 130 and the base 120, the heat exchange effect is improved by the thermally conductive layer 132.

[0063] In the specific solution, the heat-conducting layer 132 can be directly used as the aforementioned base plate 131.

[0064] As an optional solution, the thermally conductive layer 132 is configured as a thermally conductive copper layer covering at least a portion of the surface of the circuit board 110, and has relatively high thermal conductivity.

[0065] It is understandable that a layer of thermally conductive material such as thermal grease can be further coated between the thermally conductive layer 132 and the circuit board 110 to fill the gap between the thermally conductive layer 132 and the circuit board 110, thereby further improving the heat exchange effect.

[0066] As an example of some specific structures of the first heat exchanger 130, the first heat exchanger 130 further includes a heat pipe 133 and a plurality of first heat exchange fins 134. The heat pipe 133 is connected to the second portion 130b and is at least partially located outside the inner cavity 120a. For example, the heat pipe 133 is connected to the aforementioned base plate 131 by welding or other means. The heat pipe 133 is, for example, a copper pipe, and forms a heat exchange with the second portion 130b to conduct heat out of the inner cavity 120a. The plurality of first heat exchange fins 134 are spaced apart on the first portion 130a and in contact with the heat pipe 133. The first heat exchange fins 134 are disposed on the heat pipe 133, for example, by welding or other means, and form a heat exchange with the heat pipe 133 to diffuse heat to the surrounding area of ​​the heat pipe 133.

[0067] The surface of the heat-conducting layer 132 closest to the circuit board 110 is configured as a heat-conducting plane 132a. Since the surfaces of components such as the chip 111 on the circuit board 110 are often planar, the configuration of the heat-conducting plane 132a facilitates stable heat exchange between the heat-conducting layer 132 and the circuit board 110. At least a portion of the heat pipe 133 extends along a first linear direction, which is parallel or perpendicular to the heat-conducting plane 132a.

[0068] As an optional example, in Figure 2 , Figure 4 and Figure 5 In the specific implementation of the example, the first straight line direction is the left-right direction, that is, the heat pipe 133 extends a distance in the left-right direction. Correspondingly, the first heat exchange fin 134 can be vertically arranged on the part of the heat pipe 133 that extends in the left-right direction. That is, the first heat exchange fin 134 extends in the up-down direction in the position shown in the figure, and the heat conduction plane 132a is arranged perpendicular to the up-down direction. At this time, the first straight line direction is parallel to the heat conduction plane 132a. This arrangement is conducive to the rapid diffusion of the heat of the circuit board 110 to the space above the base 120 in the left-right direction, which is conducive to rapid heat dissipation.

[0069] As another alternative example, in Figure 7 and Figure 8 In the specific implementation of the example, the first straight line direction is the vertical direction, that is, the heat pipe 133 extends a certain distance in the vertical direction. Correspondingly, the first heat exchange fin 134 can be vertically arranged on the part of the heat pipe 133 that extends in the vertical direction. That is, the first heat exchange fin 134 extends in the left and right direction in the position shown in the figure, and the heat conduction plane 132a is arranged perpendicular to the vertical direction. At this time, the first straight line direction is perpendicular to the heat conduction plane 132a. This arrangement is conducive to the rapid diffusion of the heat of the circuit board 110 to the space above the base 120 in the vertical direction, which is also conducive to rapid heat dissipation.

[0070] In practical applications, the relative orientation of the first straight line direction and the heat-conducting plane 132a can be flexibly selected according to the available space around the electronic device 100.

[0071] The electronic device 100 may further include a fan 140. The fan 140 is adapted to deliver air to the first heat exchanger 130 during operation. The fan 140 delivering air to the first heat exchanger 130 as mentioned in this application refers to the fan 140 generating airflow in the gaps between the plurality of first heat exchange fins 134 through its own operation. The way the airflow is generated may be, for example, by the fan 140 operating to make the airflow flow from the fan 140 to the first heat exchange fins 134, or by the fan 140 operating to create a negative pressure to make the airflow flow from the first heat exchange fins 134 to the fan 140.

[0072] The fan 140 is mounted on the base 120 and located outside the inner cavity 120a. The fan 140 is exposed in the gap between at least two first heat exchange fins 134, so that when the fan 140 is working, it can accelerate the heat dissipation of the first heat exchange fins 134 by forming airflow in the gap between adjacent first heat exchange fins 134, so that the heat of the circuit board 110 can be dissipated relatively continuously from the first heat exchanger 130 to the environment outside the base 120.

[0073] As an optional example, in Figures 1 to 5 In a specific implementation of the example, the fan 140 is positioned above the first heat exchange fin 134 in the left-right direction. At this time, the first heat exchange fin 134 is located between the heat-conducting layer 132 and the fan 140 in the up-down direction. When the fan 140 is working, it dissipates heat from the first heat exchange fin 134 by enhancing air convection.

[0074] As another alternative example, in Figures 6 to 10 In a specific implementation of the example, the fan 140 is located on the left side of the first heat exchange fin 134 in the left-right direction. When the fan 140 is working, it enhances air convection to dissipate heat from the first heat exchange fin 134.

[0075] Different areas of the circuit board 110 may generate different amounts of heat. To accommodate the varying heat dissipation needs of different areas of the circuit board 110, the electronic device 100 may further include a second heat exchanger 150. The second heat exchanger 150 has multiple spaced-apart second heat exchange fins 151 located outside the inner cavity 120a. The second heat exchanger 150 is detachably mounted on the base 120, and the connection between the second heat exchanger 150 and the base 120 can be, for example, a threaded connection or a snap-fit ​​connection. In use, the second heat exchanger 150 can be mounted on the base 120 as needed to achieve more efficient heat exchange over more areas of the circuit board 110. The structure of the second heat exchanger 150 can be similar to that of the aforementioned first heat exchanger 130; that is, the second heat exchanger 150 can also be at least partially inserted into the inner cavity 120a, and structures to enhance thermal conductivity can be provided between the second heat exchanger 150 and the circuit board 110.

[0076] The first heat exchanger 130 and the second heat exchanger 150 can be configured to have different heat exchange capabilities for the circuit board 110 to adapt to the heat exchange requirements of different parts or areas of the circuit board 110. For example, refer to Figure 9 and Figure 10 As shown, the thickness a of the first heat exchange fin 134 ranges from 1 to 2 mm; the thickness b of the second heat exchange fin 151 ranges from 0.2 mm to 0.5 mm; and / or, the distance c between adjacent first heat exchange fins 134 ranges from 4 to 6 mm; the distance d between adjacent second heat exchange fins 151 ranges from 1 to 1.5 mm.

[0077] For heat exchangers, the thickness of the fins and the spacing between adjacent fins affect the rate at which heat on the fins exchanges with the external environment. Therefore, by limiting the above-mentioned size range, the first heat exchanger 130 and the second heat exchanger 150 can have different heat exchange capabilities. For example, the second heat exchanger 150 can be placed near the part of the circuit board 110 with relatively low heat generation, while the first heat exchanger 130 can be placed near the part of the circuit board 110 with relatively high heat generation, such as the part with the chip 111, thereby meeting the differentiated heat dissipation needs of different areas of the circuit board 110.

[0078] It is understandable that different processing techniques can be used in practical applications to obtain heat exchange fins with different thicknesses and spacings. Generally, the processing cost of heat exchange fins with thinner thickness and smaller spacing is relatively high, but the heat exchange effect is also better. Therefore, by setting the first heat exchanger 130 and the second heat exchanger 150, the different heat dissipation requirements on the circuit board 110 are adapted to, while the overall production cost of the electronic device 100 is controlled.

[0079] According to a second aspect of this application, a vehicle 10 is also provided, including the aforementioned electronic device 100. The vehicle 10 possesses all the beneficial effects of the aforementioned electronic device 100, which will not be elaborated further herein.

[0080] As an example, the vehicle 1 can be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this application does not make any specific limitations in this regard.

[0081] It should be noted that the descriptions of the first linear direction, left-right direction, and up-down direction in this application are intended to define the relative positional relationships of the base, first heat exchange fins, heat pipes, fans, and other structures related to these directions, and are not the only limitation on these directions themselves.

[0082] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0083] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0084] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0085] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. An electronic device, characterized in that, include: Circuit board; The base has an internal cavity for accommodating the circuit board; A first heat exchanger is used to exchange heat with the circuit board, and a first portion of the first heat exchanger is located outside the inner cavity; The base is provided with: An opening communicating with the inner cavity and adapted to accommodate the first heat exchanger, such that a second portion of the first heat exchanger is located within the inner cavity; At least a portion of the circuit board is located between the cavity wall of the inner cavity and the second portion; the second portion of the first heat exchanger is fixedly connected to the base.

2. The electronic device according to claim 1, characterized in that, The second part is provided with: a first connecting hole; The base is provided with: a second connecting hole; The first connecting hole is directly opposite the second connecting hole along its extending direction.

3. The electronic device according to claim 2, characterized in that, The circuit board is provided with: a third connection hole; The third connecting hole is directly opposite the first connecting hole and the second connecting hole along its extension direction.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The first heat exchanger includes: A thermally conductive layer is disposed on the second portion for conducting heat between the first portion and the circuit board; At least a portion of the circuit board is located between the cavity wall of the inner cavity and the heat-conducting layer.

5. The electronic device according to claim 4, characterized in that, The thermally conductive layer is configured as a thermally conductive copper layer covering at least a portion of the surface of the circuit board.

6. The electronic device according to claim 4, characterized in that, The first heat exchanger also includes: A heat pipe, connected to the second portion and at least partially located outside the inner cavity; Multiple first heat exchange fins are spaced apart on the first part and are in contact with the heat pipe; Wherein, at least a portion of the heat pipe extends along a first linear direction; the surface of the thermally conductive layer near the circuit board is configured as a thermally conductive plane; the first linear direction is arranged parallel to or perpendicular to the thermally conductive plane.

7. The electronic device according to claim 6, characterized in that, The electronic device also includes: A fan, adapted to blow air onto the first heat exchanger during operation; The fan is disposed on the base and located outside the inner cavity; and the fan is exposed in the gap between at least two of the first heat exchange fins.

8. The electronic device according to claim 6, characterized in that, The electronic device also includes: The second heat exchanger has a plurality of spaced-apart second heat exchange fins located outside the inner cavity; The second heat exchanger is detachably mounted on the base.

9. The electronic device according to claim 8, characterized in that, The thickness of the first heat exchange fin ranges from 1 to 2 mm; the thickness of the second heat exchange fin ranges from 0.2 mm to 0.5 mm; and / or, The spacing between adjacent first heat exchange fins ranges from 4 to 6 mm; the spacing between adjacent second heat exchange fins ranges from 1 to 1.5 mm.

10. A vehicle, characterized in that, Includes the electronic device as described in any one of claims 1 to 9.

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