Display panel and display device

Abstract

The utility model provides a display panel and a display device. The display panel comprises a display part and an edge part, the edge part is provided with a plurality of first conductive pads and at least two redundant conductive pads, the at least two redundant conductive pads are electrically connected through metal wires, and the metal wires and gate lines in the display part are in the same layer or source and drain lines in the display part are in the same layer. The display device comprises the display panel and a flexible circuit board, and the flexible circuit board comprises a plurality of second conductive pads which are electrically connected with the plurality of first conductive pads. The technical problem of insufficient setting space of the first conductive pad in order to meet the bonding impedance test requirement in the prior art is solved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and display device. Background Technology

[0002] Traditional display panels have multiple first conductive pads on their edges. However, due to the total width of the flexible circuit board to be electrically connected to these first conductive pads and the spacing between adjacent first conductive pads, the number of first conductive pads on the display panel is strictly limited. This limited number of first conductive pads cannot meet the needs of different types of display panels.

[0003] Furthermore, when testing traditional display panels, in order to test the bonding impedance between the first conductive pad on the display panel and the second conductive pad on the flexible circuit board, existing technologies often reserve two first conductive pads on each side (a total of four) of the overall structure composed of multiple first conductive pads (serving as test conductive pads) to test the bonding impedance. This method occupies the space required for the first conductive pads, further exacerbating the problem of insufficient first conductive pads when their number is limited, thus restricting the functionality of the display panel.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of the embodiments of this application is to provide a display panel and display device, which aims to solve the technical problem in the prior art that the space for setting the first conductive pad is insufficient in order to meet the requirements of bonding impedance testing.

[0006] An embodiment of this application provides a display panel, the display panel including: a display portion; and an edge portion, the edge portion being provided with a plurality of first conductive pads and at least two redundant conductive pads, the at least two redundant conductive pads being electrically connected by metal wires, the metal wires being on the same layer as the gate lines in the display portion or on the same layer as the source-drain lines in the display portion.

[0007] In the aforementioned display panel, the redundant conductive pad is disposed between two adjacent first conductive pads.

[0008] In the aforementioned display panel, at least two of the redundant conductive pads include a first redundant conductive pad and a second redundant conductive pad, with at least one of the first conductive pads disposed between the first redundant conductive pad and the second redundant conductive pad.

[0009] In the aforementioned display panel, the surface of the redundant conductive pad is provided with a plurality of protrusions, and the plurality of protrusions are distributed in an array on the surface of the redundant conductive pad.

[0010] In the aforementioned display panel, the height of the protrusion is 5 to 10 micrometers, the diameter is 20 to 50 micrometers, and the spacing between adjacent protrusions is 100 to 200 micrometers.

[0011] In the aforementioned display panel, the top of the protrusion is hemispherical.

[0012] In the aforementioned display panel, each of the redundant conductive pads is provided with multiple connection points that are electrically connected to the metal wires, and the multiple connection points are distributed at different positions on the redundant conductive pads.

[0013] In the aforementioned display panel, multiple connection points are radially distributed in the edge region of the redundant conductive pad.

[0014] In the aforementioned display panel, a connection reinforcement portion is provided at the connection between the metal line and the redundant conductive pad. The thickness of the metal layer of the connection reinforcement portion is 1.5 to 2 times the thickness of the metal line, and the width of the connection reinforcement portion is 1.2 to 1.5 times the width of the metal line.

[0015] An embodiment of this application also provides a display device, the display device including a flexible circuit board and the above-mentioned display panel; the flexible circuit board includes a plurality of second conductive pads, the plurality of second conductive pads being electrically connected to a plurality of first conductive pads.

[0016] The display panel and display device provided in this application satisfy the testing requirements for bonding impedance by setting multiple first conductive pads and at least two redundant conductive pads at the edge, and electrically connecting the at least two redundant conductive pads through metal wires, wherein the metal wires are on the same layer as the gate lines in the display section or on the same layer as the source-drain lines in the display section, while avoiding occupying the setting space of the first conductive pads.

[0017] Specifically, the technical solution of this application utilizes redundant conductive pads for bonding impedance testing, instead of using test conductive pads that occupy the space of the original first conductive pads, as is done in existing technologies. This technical solution allows all the first conductive pads to be used for electrical connection with the second conductive pads of the flexible circuit board, eliminating the need for additional test conductive pads that would occupy the space of the first conductive pads. Furthermore, the redundant conductive pads are electrically connected via metal lines on the same layer as the gate line or the source / drain line, simplifying the manufacturing process, eliminating the need for additional metal layers, and reducing production costs.

[0018] In summary, the technical solution provided in this application solves the problem of insufficient space for the first conductive pad in the prior art due to the need to meet the bonding impedance test requirements. Attached Figure Description

[0019] Figure 1This is a schematic diagram of a display device provided in an embodiment of this application.

[0020] Figure 2 yes Figure 1 The diagram shows the connection relationship between the flexible circuit board and the display panel in the first embodiment of the display device.

[0021] Figure 3 yes Figure 1 A schematic diagram illustrating the connection relationship between the flexible circuit board and the display panel in the second embodiment of the display device shown. Detailed Implementation

[0022] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0023] The terms “first,” “second,” and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms “multiple,” and similar words mean two or more, unless otherwise expressly specified.

[0024] The embodiments of this application can be combined with each other.

[0025] The display device provided in the embodiments of this application may be, for example, an LCD display device, an OLED display device, a Mini-LED display device, or a Micro-LED display device. The embodiments of this application will be described using an OLED display device as an example.

[0026] The display device provided in the embodiments of this application includes a display panel. The display panel includes a gate driving circuit and a plurality of pixels. The gate driving circuit includes multiple cascaded gate driving sub-circuits.

[0027] The display panel includes a display area and a non-display area. The display area has multiple pixels arranged in an array, and the non-display area is located around the periphery of the display area. The display panel also includes multiple gate lines, multiple data lines, multiple light-emitting control signal lines, a light-emitting controller, and a gate driving circuit. The multiple gate lines and multiple light-emitting control signal lines extend along a first direction and are arranged along a second direction, while the multiple data lines extend along the second direction and are arranged along the first direction, with the first direction perpendicular to the second direction. The gate driving circuit is located in the non-display area and is electrically connected to the multiple gate lines. The source driving circuit is electrically connected to the multiple data lines via a flexible circuit board. The timing controller is electrically connected to the gate driving circuit and the source driving circuit.

[0028] The display panel includes an organic light-emitting diode (OLED) array substrate and an encapsulation layer. The OLED array substrate includes a substrate, a buffer layer disposed on the substrate, an active layer disposed on the buffer layer, a gate insulating layer disposed on the active layer, a first metal layer disposed on the gate insulating layer, an interlayer insulating layer disposed on the first metal layer, a second metal layer disposed on the interlayer insulating layer, a planarization layer disposed on the second metal layer, a first electrode layer disposed on the planarization layer, a pixel defining layer disposed on the first electrode layer, an organic light-emitting layer disposed within an opening area defined by the pixel defining layer, and a second electrode layer disposed on the organic light-emitting layer. The first metal layer includes gate lines and a gate electrode. The second metal layer includes data lines, a source electrode, and a drain electrode. The encapsulation layer is hermetically connected to the OLED array substrate.

[0029] Each pixel includes a pixel driving circuit and a light-emitting device. The pixel driving circuit includes at least two transistors and a storage capacitor. One transistor acts as a switching transistor, with its gate electrically connected to a corresponding gate line and its source electrically connected to a corresponding data line. The other transistor acts as a driving transistor, with its gate electrically connected to the drain of the switching transistor, its source electrically connected to a first power supply voltage line, and its drain electrically connected to the anode of the light-emitting device. One end of the storage capacitor is electrically connected to the gate of the driving transistor, and the other end is electrically connected to either the source or drain of the driving transistor. The cathode of the light-emitting device is electrically connected to a second power supply voltage line.

[0030] The gate driving circuit includes multiple cascaded gate driving sub-circuits, each electrically connected to a gate line. Under the control of the timing controller, the gate driving sub-circuits sequentially output scan signals, scanning each row of pixels in the display area line by line. The source driving circuit, under the control of the timing controller, generates and outputs data signals based on the image data. The timing controller receives and processes externally input image data and timing signals, generates control signals, and transmits the image data to the source driving circuit. The power management chip provides operating voltages to various parts of the display device, including providing a second power supply voltage to the cathode of the light-emitting device, a first power supply voltage to the first power supply line, and a gate driving voltage to the gate driving circuit.

[0031] Embodiments of this application provide a display panel and display device, which aim to solve the technical problem in the prior art where the space for setting the first conductive pad is insufficient in order to meet the requirements of bonding impedance testing.

[0032] like Figure 1 , Figure 2 and Figure 3As shown in the embodiments of this application, the display device includes a display panel 101, a flexible circuit board 102, and a printed circuit board 103. The two ends of the flexible circuit board 102 are bonded to the display panel 101 and the printed circuit board 103, respectively. The display panel 101 includes a display portion and an edge portion. The display portion is used to display images. The edge portion is provided with a plurality of first conductive pads 1011 and at least two redundant conductive pads 1012. The at least two redundant conductive pads 1012 are electrically connected via metal wires 1013, which are on the same layer as the gate lines in the display portion or the source-drain lines in the display portion. The flexible circuit board 102 includes a plurality of second conductive pads 1021, which are electrically connected to a plurality of first conductive pads 1011. The redundant conductive pads 1012 are disposed between two adjacent first conductive pads 1011.

[0033] In embodiments of this application, a plurality of first conductive pads 1011 are used for electrical connection with second conductive pads 1021 of the flexible circuit board 102. Specifically, a plurality of first conductive pads 1011 are disposed on the edge of the display panel 101, and the second conductive pads 1021 are disposed on the flexible circuit board 102. The plurality of first conductive pads 1011 and the plurality of second conductive pads 1021 are in contact in a direction perpendicular to the plane on which the display panel 101 is located, thereby realizing the electrical connection between the display panel 101 and the flexible circuit board 102.

[0034] In embodiments of this application, the redundant conductive pad 1012 is disposed between two adjacent first conductive pads 1011. Specifically, the redundant conductive pad 1012 is disposed between two adjacent first conductive pads 1011 with a large signal voltage difference, and / or disposed on both sides of the power signal line. The redundant conductive pad 1012 is used to avoid interference between adjacent first conductive pads 1011 and improve the reliability of the display panel 101.

[0035] In embodiments of this application, at least two redundant conductive pads 1012 include a first redundant conductive pad and a second redundant conductive pad, with at least one first conductive pad 1011 disposed between the first and second redundant conductive pads. When there is one first conductive pad 1011 disposed between the first and second redundant conductive pads, the impedance of the metal wire 1013 electrically connecting the first and second redundant conductive pads is small and can be ignored during bonding impedance testing. When there are multiple first conductive pads 1011 disposed between the first and second redundant conductive pads, the impedance of the metal wire 1013 electrically connecting the first and second redundant conductive pads is large, and the impedance of the metal wire 1013 needs to be subtracted during bonding impedance testing.

[0036] In embodiments of this application, the metal line 1013 may be a metal line 1013 on the same layer as the gate line in the display section. Specifically, during the manufacturing process of the display panel 101, the metal line 1013 can be formed simultaneously with the gate line. The metal line 1013 and the gate line use the same material and are formed through the same process, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0037] In embodiments of this application, the metal line 1013 may also be a metal line 1013 on the same layer as the source-drain lines in the display section. Specifically, during the manufacturing process of the display panel 101, the metal line 1013 can be formed simultaneously with the source-drain lines. The metal line 1013 and the source-drain lines use the same material and are formed using the same process, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0038] In the embodiments of this application, the redundant conductive pad 1012 is used for bonding impedance testing. Specifically, after the display panel 101 and the flexible circuit board 102 are bonded, bonding impedance testing can be performed using the redundant conductive pad 1012 (the material, shape, etc. of the redundant conductive pad 1012 are the same as those of the first conductive pad 1011) to detect the bonding quality between the first conductive pad 1011 and the second conductive pad 1021.

[0039] In an embodiment of this application, a bonding impedance testing method is provided, comprising: providing a display device, the display device including a display panel 101 and a flexible circuit board 102, the display panel 101 including a display portion and an edge portion, the edge portion being provided with a plurality of first conductive pads 1011 and at least two redundant conductive pads 1012, the at least two redundant conductive pads 1012 being electrically connected by a metal wire 1013, the metal wire 1013 being on the same layer as a gate line in the display portion or on the same layer as a source-drain line in the display portion, the flexible circuit board 102 including a plurality of second conductive pads 1021, the plurality of second conductive pads 1021 being electrically connected to a plurality of first conductive pads 1011; and performing a bonding impedance test through the at least two redundant conductive pads 1012.

[0040] In embodiments of this application, bonding impedance testing using the at least two redundant conductive pads 1012 includes: with the first conductive pad 1011 of the display panel 101 and the second conductive pad 1021 of the flexible circuit board 102 in contact in a direction perpendicular to the display panel 101, two test probes are respectively contacted on one of the redundant conductive pads 1012 and the second conductive pad 1021, the second conductive pad 1021 being in contact with the other redundant conductive pad 1012, and a test instrument electrically connected to the two test probes is used to test the bonding impedance between the first conductive pad 1011 of the display panel 101 and the second conductive pad 1021 of the flexible circuit board 102.

[0041] In embodiments of this application, the at least two redundant conductive pads 1012 include a first redundant conductive pad and a second redundant conductive pad, with a first conductive pad 1011 disposed between the first redundant conductive pad and the second redundant conductive pad. In this case, since the distance between the first redundant conductive pad and the second redundant conductive pad is relatively short, the impedance of the metal wire 1013 electrically connecting them is small and can be ignored; therefore, the measured impedance value is directly the bonding impedance.

[0042] In embodiments of this application, the at least two redundant conductive pads 1012 include a first redundant conductive pad and a second redundant conductive pad, with a plurality of first conductive pads 1011 disposed between the first redundant conductive pad and the second redundant conductive pad. In this case, since the distance between the first redundant conductive pad and the second redundant conductive pad is relatively large, the impedance of the metal wire 1013 electrically connecting them is relatively large and cannot be ignored. Therefore, the measured impedance value includes the bonding impedance and the impedance of the metal wire 1013.

[0043] In embodiments of this application, the bonding impedance test using the at least two redundant conductive pads 1012 further includes subtracting the impedance of the metal wire 1013 from the impedance value to obtain the bonding impedance. Specifically, the bonding impedance value is equal to the measured impedance value minus the impedance of the metal wire 1013. The impedance of the metal wire 1013 can be obtained through theoretical calculation or through actual measurement.

[0044] In embodiments of this application, the redundant conductive pad 1012 is disposed between two adjacent first conductive pads 1011. Specifically, the redundant conductive pad 1012 is disposed between first conductive pads 1011 with a large voltage difference between adjacent signals, and / or disposed on both sides of the power signal line. The placement of the redundant conductive pad 1012 can avoid interference between adjacent signals and improve the reliability of the display panel 101.

[0045] Through the above technical solution, the embodiments of this application utilize the redundant conductive pads 1012 disposed between the first conductive pads 1011 to perform bonding impedance testing, eliminating the need to reserve dedicated first conductive pads 1011 on both sides of the integral formed by the first conductive pads 1011 for testing, thereby saving the space for the first conductive pads 1011 and solving the technical problem in the prior art where the space for the first conductive pads 1011 is insufficient in order to meet the requirements of bonding impedance testing.

[0046] In actual testing, the contact quality between the test probe and the redundant conductive pad 1012 affects the accuracy of the test results. This is especially true when the area of ​​the redundant conductive pad 1012 is small or its surface is oxidized, which can easily lead to poor contact. Such poor contact can cause unstable or excessively high measured impedance values, failing to accurately reflect the actual bonding impedance and thus affecting the assessment of bonding quality.

[0047] To address this issue, in the embodiments of this application, the surface of the redundant conductive pad 1012 is provided with a special test area, which includes multiple protrusions. These protrusions have a height of 5–10 micrometers and a diameter of 20–50 micrometers, and are arranged in an array on the surface of the redundant conductive pad 1012, with a spacing of 100–200 micrometers between adjacent protrusions. The protrusions are made of the same conductive material as the redundant conductive pad 1012 and are formed on the surface of the redundant conductive pad 1012 through photolithography and etching processes. When the test probe contacts the surface of the redundant conductive pad 1012, these protrusions can penetrate any oxide layer or contaminants that may be present on the test probe surface, forming a reliable electrical contact. Simultaneously, the protrusions increase the pressure per unit area at the contact point, further improving the contact quality. The tips of the protrusions are hemispherical, a shape that facilitates penetration of the oxide layer while avoiding excessive wear on the test probe.

[0048] Furthermore, in the embodiments of this application, the area of ​​the redundant conductive pad 1012 used for testing is larger than the area of ​​the first conductive pad 1011. Specifically, the length of the redundant conductive pad 1012 is 1.2 to 1.5 times the length of the first conductive pad 1011, and the width is 1.2 to 1.5 times the width of the first conductive pad 1011. For example, when the length of the first conductive pad 1011 is 100 micrometers and the width is 50 micrometers, the length of the redundant conductive pad 1012 can be 120 micrometers, 125 micrometers, 130 micrometers, 135 micrometers, 140 micrometers, 145 micrometers, or 150 micrometers, and the width can be 60 micrometers, 65 micrometers, 70 micrometers, 75 micrometers, or 75 micrometers. This design ensures that there is a sufficiently large contact area between the redundant conductive pad 1012 and the test probe, ensuring good contact even if there is a slight deviation in the positioning of the test probe. The shape of the redundant conductive pad 1012 can be rectangular, square, or circular, consistent with the shape of the first conductive pad 1011, to ensure consistency in contact characteristics.

[0049] In the embodiments of this application, the surface of the redundant conductive pad 1012 is coated with an anti-oxidation protective layer. This protective layer is made of gold, silver, palladium, or their alloys, and has a thickness of 0.1 to 1 micrometer. For example, the thickness of the protective layer can be 0.1 micrometer, 0.2 micrometer, 0.3 micrometer, 0.4 micrometer, 0.5 micrometer, 0.6 micrometer, 0.7 micrometer, 0.8 micrometer, 0.9 micrometer, or 1 micrometer. This anti-oxidation protective layer effectively prevents oxidation of the surface of the redundant conductive pad 1012, maintaining its surface conductivity, extending its service life, and improving test reliability. The protective layer is formed on the surface of the redundant conductive pad 1012 by methods such as electroplating, vapor deposition, or sputtering, forming a strong bond with the main body of the redundant conductive pad 1012. In one embodiment, the protective layer uses gold material with a thickness of 0.5 micrometers, formed by sputtering. Gold material has excellent conductivity and oxidation resistance, enabling it to maintain good conductivity of the redundant conductive pad 1012 surface for a long time. The protective layer covers the entire surface of the redundant conductive pad 1012, including the surface of the protrusions, ensuring the conductivity of the test contact points.

[0050] During the production process, bonding impedance tests may need to be performed multiple times. Repeated probe contact can cause scratches and damage to the surface of the redundant conductive pad 1012, affecting the accuracy of subsequent tests. This damage mainly manifests as wear, deformation, or peeling of the surface material, leading to increased or unstable contact resistance.

[0051] To address this issue, in the embodiments of this application, each redundant conductive pad 1012 is provided with multiple test points, all of which are electrically connected to the metal wire 1013. The number of test points is 3 to 8, distributed in a ring or line shape on the surface of the redundant conductive pad 1012. The diameter of each test point is 50 to 100 micrometers, and the spacing between test points is 200 to 500 micrometers. Each test point has a conductive path connected to the metal wire 1013, and these conductive paths are collectively connected to the metal wire 1013. The conductive paths are made of the same material as the metal wire 1013, with a width of 5 to 10 micrometers and the same thickness as the metal wire 1013. The conductive paths are connected to the test points on the surface of the redundant conductive pad 1012 through vias. The diameter of the vias is 2 to 5 micrometers, and 3 to 5 vias are provided below each test point to ensure a stable electrical connection.

[0052] During testing, different test points can be used sequentially in a preset order to avoid repeated testing of the same location. For example, the first test uses a test point located at the center of the redundant conductive pad 1012, the second test uses a test point located at the edge of the redundant conductive pad 1012, and so on. This rotation method can significantly reduce wear on individual test points and extend the service life of the redundant conductive pad 1012. The order of test point usage can be automatically managed by the control program of the testing equipment, or it can be indicated by markings around the redundant conductive pad 1012 to indicate the test point to be used.

[0053] In the embodiments of this application, the surface of the redundant conductive pad 1012 is coated with a wear-resistant protective layer. This protective layer is composed of hard metal nitrides (such as titanium nitride, chromium nitride) or hard metal carbides (such as tungsten carbide), with a thickness of 0.5–2 micrometers. For example, the thickness of the protective layer can be 0.5 micrometers, 0.8 micrometers, 1.0 micrometers, 1.2 micrometers, 1.5 micrometers, 1.8 micrometers, or 2.0 micrometers. This protective layer has extremely high hardness and wear resistance, effectively resisting repeated contact and scratching of the test probe, protecting the underlying conductive material from damage. Simultaneously, the protective layer has good conductivity and will not affect the accuracy of the test. In one specific embodiment, the protective layer uses titanium nitride material with a thickness of 1.0 micrometer, formed by reactive sputtering. Titanium nitride has a hardness of 1800–2000 HV, far exceeding that of ordinary metal materials, and exhibits excellent wear resistance. The protective layer can cover the entire surface of the redundant conductive pad 1012 or only the test point area.

[0054] Furthermore, in the embodiments of this application, a positioning part and a limiting part are provided around the redundant conductive pad 1012. The positioning part is disposed around the redundant conductive pad 1012 to guide the test probe to accurately position itself to the test point. The limiting part includes a protrusion disposed around the redundant conductive pad 1012, with a height of 20-50 micrometers and a width of 50-100 micrometers, and is made of insulating material. The limiting part is used to control the pressing depth of the test probe, ensuring that the position and pressure of the test probe are consistent each time it contacts, further reducing damage to the redundant conductive pad 1012. The placement of the positioning part and the limiting part makes the testing process more standardized and automated, improving the repeatability and reliability of the test.

[0055] In the prior art, the connection structure between the metal wire 1013 and the redundant conductive pad 1012 may not be stable enough, and poor contact may easily occur due to manufacturing process deviations or external forces, resulting in inaccurate or unstable test results. This connection instability is mainly manifested as increased or broken resistance at the connection point, affecting the stable transmission of the test current.

[0056] To address this issue, in the embodiments of this application, each redundant conductive pad 1012 is provided with multiple connection points electrically connected to the metal wire 1013. These connection points are distributed at different locations on the redundant conductive pad 1012. The number of connection points is 3 to 6, radially distributed along the edge region of the redundant conductive pad 1012. The angular interval between the connection points is 60 to 120 degrees, and the area of ​​each connection point is 100 to 300 square micrometers. Even if a connection point malfunctions due to manufacturing deviation or external force, the other connection points can still ensure the stability of the electrical connection between the redundant conductive pad 1012 and the metal wire 1013. Each connection point is connected to the main metal wire 1013 through an independent branch of the metal wire 1013. These branches are 5 to 10 micrometers wide and 50 to 200 micrometers long, forming redundant electrical connection paths.

[0057] In the embodiments of this application, the metal wire 1013 and the redundant conductive pad 1012 adopt an overlapping connection structure. The metal wire 1013 extends on the redundant conductive pad 1012 to form a fan-shaped or rectangular overlapping area, the area of ​​which accounts for 30% to 50% of the area of ​​the redundant conductive pad 1012. Within the overlapping area, the metal wire 1013 and the redundant conductive pad 1012 are electrically connected through multiple vias, the number of which is 5 to 10, with a diameter of 2 to 5 micrometers, and are evenly distributed within the overlapping area. This large-area overlapping and multi-via connection structure significantly increases the contact area, reduces the contact resistance, and improves the reliability of the connection.

[0058] Furthermore, in the embodiments of this application, a connection reinforcement portion is designed at the connection between the metal line 1013 and the redundant conductive pad 1012. The thickness of the metal layer of this connection reinforcement portion is 1.5 to 2 times the thickness of the metal line 1013, and the width is 1.2 to 1.5 times the width of the metal line 1013. For example, when the thickness of the metal line 1013 is 0.5 micrometers and the width is 10 micrometers, the thickness of the connection reinforcement portion can be 0.75 micrometers, 0.8 micrometers, 0.9 micrometers, or 1.0 micrometers, and the width can be 12 micrometers, 13 micrometers, 14 micrometers, or 15 micrometers. The connection reinforcement portion adopts a trapezoidal transition structure, gradually transitioning from the width of the metal line 1013 to the maximum thickness and width, and then gradually transitioning back to the width of the metal line 1013, avoiding abrupt changes in thickness and width. This structure of the connection reinforcement portion significantly enhances the mechanical strength of the connection, effectively preventing breakage or peeling caused by external forces. The connection reinforcement portion and the metal line 1013 are made of the same material and formed by adding photolithography and deposition process steps. In one specific embodiment, the length of the connecting reinforcement is 100 to 300 micrometers, covering the entire connection area between the metal wire 1013 and the redundant conductive pad 1012, as well as a portion of the metal wire 1013 on both sides.

[0059] In another embodiment of this application, the metal wire 1013 is designed with a stress-relieving section at the connection point. This structure includes a curved or serpentine path of the metal wire 1013, with a length 1.3 to 1.8 times the straight connection length and a bending radius 3 to 5 times the width of the metal wire 1013. This curved structure can undergo minor deformation during thermal expansion or mechanical deformation, absorbing and dispersing stress, preventing connection failure due to stress concentration, and significantly extending the service life of the connection. The stress-relieving section is located near the connection point between the metal wire 1013 and the redundant conductive pad 1012, at a distance of 50 to 200 micrometers from the connection point, ensuring that stress is not directly transmitted to the connection point.

[0060] The embodiments of this application have been described in detail above. The content of this specification should not be construed as limiting the scope of protection of this application.

Claims

1. A display panel, characterized in that, The display panel includes: Display unit; and The edge portion is provided with a plurality of first conductive pads and at least two redundant conductive pads. The at least two redundant conductive pads are electrically connected by metal wires. The metal wires are on the same layer as the gate lines in the display portion or on the same layer as the source-drain lines in the display portion.

2. The display panel according to claim 1, characterized in that, The redundant conductive pad is disposed between two adjacent first conductive pads.

3. The display panel according to claim 1, characterized in that, The at least two redundant conductive pads include a first redundant conductive pad and a second redundant conductive pad, with at least one of the first conductive pads disposed between the first redundant conductive pad and the second redundant conductive pad.

4. The display panel according to claim 1, characterized in that, The surface of the redundant conductive pad is provided with a plurality of protrusions, which are distributed in an array on the surface of the redundant conductive pad.

5. The display panel according to claim 4, characterized in that, The height of the protrusion is 5 to 10 micrometers, the diameter is 20 to 50 micrometers, and the distance between adjacent protrusions is 100 to 200 micrometers.

6. The display panel according to claim 4, characterized in that, The top of the protrusion is hemispherical.

7. The display panel according to claim 1, characterized in that, Each of the redundant conductive pads is provided with multiple connection points that are electrically connected to the metal wire, and the multiple connection points are distributed at different positions on the redundant conductive pads.

8. The display panel according to claim 7, characterized in that, The multiple connection points are radially distributed in the edge region of the redundant conductive pad.

9. The display panel according to claim 1, characterized in that, A connection reinforcement portion is provided at the connection between the metal wire and the redundant conductive pad. The thickness of the metal layer of the connection reinforcement portion is 1.5 to 2 times the thickness of the metal wire, and the width of the connection reinforcement portion is 1.2 to 1.5 times the width of the metal wire.

10. A display device, characterized in that, The display device includes a flexible circuit board and a display panel as described in any one of claims 1 to 9; The flexible circuit board includes a plurality of second conductive pads, which are electrically connected to a plurality of first conductive pads.

Images