Cache device and cache system
By integrating air-cooled and water-cooled components into the buffer device in the EPD equipment, the problem of insufficient cooling function of the buffer device is solved, the vehicle cooling speed and equipment output are improved, and the space occupation is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LAPLACE RENEWABLE ENERGY TECH CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-05-12
AI Technical Summary
The existing EPD equipment's buffer device lacks cooling functionality, resulting in slow cooling of the process boat and affecting equipment output.
Design a buffer device that integrates an air-cooled component, a first water-cooled component, and a second water-cooled component to form a housing space for accommodating a vehicle, and cools the vehicle through a combination of air cooling and water cooling.
It improved the cooling rate of the vehicle, increased the output of the process equipment, and reduced the space occupation.
Smart Images
Figure CN224234087U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the fields of semiconductor and photovoltaic technology, and in particular to a cache device and cache system. Background Technology
[0002] During silicon wafer processing, cross-sections can occur. Repairing these cross-sections improves the photovoltaic conversion efficiency of the silicon wafer, leading to the development of Edge Passivation Deposition (EPD) equipment. The process involves placing unprocessed boats into the EPD equipment cavity and removing processed boats from the cavity. To streamline the overall process for completing one EPD cycle, several unprocessed boats are pre-stacked in front of the cavity. Once the EPD equipment completes the process on the previous boat, the unprocessed boat can be quickly moved into the cavity; therefore, a space is needed for stacking unprocessed boats. Processed boats, immediately after completing their process and exiting the cavity, are at a high temperature and require cooling.
[0003] However, the buffer devices of existing EPD equipment lack cooling functions, resulting in slow cooling speeds in the process boat and impacting the output of EPD equipment. Utility Model Content
[0004] In view of this, embodiments of the present disclosure provide a caching device and a caching system to solve the problem that the caching device lacks a cooling function.
[0005] In a first aspect, embodiments of this application provide a buffer device, comprising: at least two sets of air-cooled components, arranged opposite each other along a first horizontal direction, with a receiving space formed between the at least two sets of air-cooled components, the receiving space being configured to receive a carrier, and the air-cooled components being configured to supply air to the carrier; at least two sets of first water-cooled components, arranged opposite each other along the first horizontal direction, and the at least two sets of first water-cooled components being respectively located on the side of the at least two sets of air-cooled components away from the receiving space, the first water-cooled components being configured to cool the carrier; a second water-cooled component, disposed below the receiving space, the second water-cooled component being configured to cool the carrier; and a support component, disposed below the receiving space, configured to support the carrier.
[0006] In some embodiments, the air-cooling assembly includes: a plurality of fans arranged in multiple columns along a second horizontal direction and in at least one row along a vertical direction, wherein the orthographic projection of the plurality of fans onto a plane perpendicular to the first horizontal direction covers the receiving space, and the second horizontal direction is perpendicular to the first horizontal direction; and / or, the first water-cooling assembly includes: a water-cooling plate extending along a second horizontal direction, wherein the orthographic projection of the water-cooling plate onto a plane perpendicular to the first horizontal direction covers the receiving space, and the second horizontal direction is perpendicular to the first horizontal direction; and / or, the second water-cooling assembly includes: a water-cooling plate extending along a second horizontal direction, wherein the orthographic projection of the water-cooling plate onto a horizontal plane covers the receiving space in the second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction.
[0007] In some embodiments, the water cooling plate includes: a plurality of water cooling strips arranged in sequence along a vertical direction, the water cooling strips extending along a second horizontal direction, one end of the water cooling strip having a liquid inlet, the other end of the water cooling strip having a liquid outlet, and coolant flowing in from the liquid inlet, flowing along the second horizontal direction, and flowing out from the liquid outlet.
[0008] In some embodiments, the buffer device further includes: a support component having a first guide hole extending in a vertical direction; a first guide member having its top end connected to the water-cooled plate and its bottom end passing through the first guide hole; and a first elastic member fitted onto the first guide member and disposed between the support component and the water-cooled plate, wherein, when the first elastic member is compressed, the upper surface of the water-cooled plate contacts the bottom of the carrier.
[0009] In some embodiments, the buffer device further includes: at least one temperature sensor disposed adjacent to the accommodating space, the temperature sensor being configured to detect the temperature of the vehicle; and / or at least one first in-situ sensor disposed adjacent to the accommodating space, the first in-situ sensor being configured to detect whether the accommodating space accommodates the vehicle.
[0010] In some embodiments, the first in-situ sensor includes: a diffuse reflection sensor disposed on the side of the air-cooling assembly near the receiving space; and / or a photoelectric through-beam sensor including a transmitter and a receiver, the transmitter and the receiver being disposed on the side of at least two sets of the air-cooling assemblies disposed opposite to each other near the receiving space, the transmitter being near one end of the air-cooling assembly in a second horizontal direction, and the receiver being near the other end of the air-cooling assembly in the second horizontal direction, the second horizontal direction being perpendicular to the first horizontal direction.
[0011] In some embodiments, the support assembly includes: a support base disposed below the receiving space and configured to support the carrier, the support base having a second guide hole extending vertically and a mounting hole extending horizontally, the second guide hole communicating with the mounting hole; a second guide member passing through the second guide hole, the outer surface of the second guide member having a limiting protrusion; a limiting member disposed in the mounting hole and connected to the support base, the limiting member covering a portion of the second guide hole; a second in-situ sensor mounted on the lower surface of the limiting member; and a second elastic member fitted onto the second guide member, the top end of the second elastic member abutting against the limiting protrusion, and the bottom end of the second elastic member abutting against the limiting member; wherein, when the support base supports the carrier, the carrier transmits pressure to the second guide member, causing the second guide member to compress the second elastic member and move downward, so that the second in-situ sensor detects the second guide member.
[0012] Secondly, embodiments of this application provide a caching system, comprising: the caching device described in the first aspect, the caching device being configured to cache and cool a vehicle; and a frame disposed below the caching device and configured to support the caching device.
[0013] In some embodiments, the number of cache devices is multiple, and the multiple cache devices are arranged sequentially along a first horizontal direction; wherein, the cache system further includes: a heat insulation device disposed between adjacent cache devices.
[0014] In some embodiments, the caching system further includes: a temporary storage device disposed adjacent to the caching device, the temporary storage device being configured to cache the carrier carrying an unprocessed product.
[0015] By setting at least two sets of air-cooled components and at least two sets of first water-cooled components and second water-cooled components around the containment space, the sides and bottom of the containment space are equipped with cooling functions. While buffering the carrier, the carrier can be cooled, giving the buffer device the dual functions of buffering and cooling. This improves the cooling speed of the carrier that has been processed, thereby increasing the output of the process equipment.
[0016] In addition, compared to the separate setup of caching and cooling, the caching device of this application integrates caching and cooling functions into one unit, which greatly reduces space occupation. Attached Figure Description
[0017] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.
[0018] Figure 1 The diagram shown is a schematic diagram of the structure of a cache device provided in an embodiment of this disclosure.
[0019] Figure 2 The diagram shown is a schematic diagram of the structure of a caching system provided in an embodiment of this disclosure.
[0020] Figure 3 The diagram shown is a structural schematic of a water-cooled plate provided in an embodiment of this disclosure.
[0021] Figure 4 The diagram shown is a structural schematic of a second water-cooling component, a bearing component, a first guide component, and a first elastic component provided in an embodiment of this disclosure.
[0022] Figure 5 The image shown is an embodiment of this disclosure. Figure 4 The structure shown is a magnified view of a portion of region B.
[0023] Figure 6 The image shown is an embodiment of this disclosure. Figure 2 The diagram shows the structure of the caching system in region A.
[0024] Figure 7 The image shown is a top view of a caching device provided in an embodiment of this disclosure.
[0025] Figure 8 The diagram shows a structural schematic of a support component provided in one embodiment of this disclosure.
[0026] Figure 9 The image shown is an embodiment of this disclosure. Figure 8 The support component shown is a cross-sectional view in the CC direction.
[0027] Figure label:
[0028] 1. Buffer system; 2. Accommodation space; 3. Carrier; 10. Buffer device; 20. Frame; 30. Heat insulation device; 40. Temporary storage device; 100. Air-cooled assembly; 110. Fan; 200. First water-cooled assembly; 210. Water-cooling plate; 211. Water-cooling strip; 212. Liquid inlet; 213. Liquid outlet; 300. Second water-cooled assembly; 310. Water-cooling plate; 301. Clearance notch; 400. Support assembly; 410. Support base; 411. Second guide hole; 412. Mounting hole ; 420, Second guide member; 421, Limiting protrusion; 430, Limiting member; 440, Second in-situ sensor; 450, Second elastic member; 510, Bearing assembly; 511, First guide hole; 610, First guide member; 620, First elastic member; 630, Temperature sensor; 640, First in-situ sensor; 641, Diffuse reflection sensor; 642, Photoelectric through-beam sensor; 6421, Transmitter; 6422, Receiver; X, First horizontal direction; Y, Second horizontal direction. Detailed Implementation
[0029] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.
[0030] Figure 1 The diagram shown is a schematic diagram of the structure of a cache device provided in an embodiment of this disclosure. Figure 2 The diagram shown is a schematic diagram of the structure of a caching system provided in an embodiment of this disclosure. Figure 3 The diagram shown is a structural schematic of a water-cooled plate provided in an embodiment of this disclosure. Figures 1 to 3 As shown, a cache device 10 provided in one embodiment of this disclosure includes at least two sets of air-cooled components 100, at least two sets of first water-cooled components 200, second water-cooled components 300, and support components 400.
[0031] At least two sets of air-cooled components 100 are arranged opposite each other along a first horizontal direction X, forming a receiving space 2 between the at least two sets of air-cooled components 100 arranged opposite each other. The receiving space 2 is configured to receive a carrier 3, and the air-cooled components 100 are configured to supply air to the carrier 3. Exemplarily, the air-cooled components 100 are fans, vacuum pumps, etc. Exemplarily, the carrier 3 is a boat structure, a flower basket, etc.
[0032] At least two sets of first water-cooling components 200 are arranged opposite each other along a first horizontal direction X, and the at least two sets of first water-cooling components 200 are respectively located on the side of the at least two sets of air-cooling components 100 away from the receiving space 2. The first water-cooling components 200 are configured to cool the carrier 3. Exemplarily, the first water-cooling component 200 is a water-cooling plate, water-cooling plate, water-cooling bar, etc. Exemplarily, the cooling medium can flow through the at least two sets of first water-cooling components 200 in sequence, that is, the at least two sets of first water-cooling components 200 have only one inlet and one outlet, and adjacent first water-cooling components 200 are connected by pipes. Exemplarily, the cooling medium can flow through one set of first water-cooling components 200 respectively, that is, each set of first water-cooling components 200 has at least one inlet and at least one outlet.
[0033] A second water-cooling assembly 300 is disposed below the accommodating space 2 and is configured to cool the carrier 3. Exemplarily, the second water-cooling assembly 300 is a water-cooling plate, water-cooling plate, water-cooling strip, etc. Exemplarily, each of the second water-cooling assemblies 300 has at least one liquid inlet and at least one liquid outlet.
[0034] The support assembly 400 is disposed below the receiving space 2 and is configured to support the carrier 3. Exemplarily, the support assembly 400 is a support plate, bracket, support block, etc.
[0035] By arranging at least two sets of air-cooled components 100, at least two sets of first water-cooled components 200 and second water-cooled components 300 around the containing space 2, the sides and bottom of the containing space 2 are equipped with cooling functions. While buffering the carrier 3, the carrier 3 can be cooled, giving the buffer device 10 the dual functions of buffering and cooling. This improves the cooling speed of the carrier that has been processed, thereby increasing the output of the process equipment.
[0036] In addition, compared with the separate setup of caching and cooling, the caching device 10 of this application integrates caching and cooling functions into one, which greatly reduces space occupation.
[0037] In some embodiments, such as Figure 2 As shown, the air-cooling assembly 100 includes a plurality of fans 110. The plurality of fans 110 are arranged in multiple columns along a second horizontal direction Y and in at least one row along a vertical direction. The orthographic projection of the plurality of fans 110 onto a plane perpendicular to the first horizontal direction X covers the accommodating space 2. The second horizontal direction Y is perpendicular to the first horizontal direction X. In other words, the plurality of fans 110 included in one air-cooling assembly 100 cover one side of the vehicle 3 to adequately cool the vehicle 3, further improving the cooling speed.
[0038] For example, such as Figure 2As shown, the buffer unit 10, where the fans 110 are arranged in a vertical row, can be used to house a vehicle 3. For example, as... Figure 2 As shown, the buffer device 10, in which the fans 110 are arranged in two vertical rows, can be used to place two vertically arranged vehicles 3.
[0039] In some embodiments, such as Figure 2 As shown, the first water-cooling assembly 200 includes a water-cooling plate 210. The water-cooling plate 210 extends along a second horizontal direction Y, and its orthographic projection onto a plane perpendicular to the first horizontal direction X covers the receiving space 2. The second horizontal direction Y is perpendicular to the first horizontal direction X. In other words, a water-cooling plate 210 covers one side of the vehicle 3 to adequately cool the vehicle 3, further improving the cooling speed.
[0040] For example, the vertical dimension of the water cooling plate 210 is equal to the vertical dimension of the plurality of fans 110 arranged in at least one row along the vertical direction, such that each fan 110 corresponds to a water cooling plate 210.
[0041] In some embodiments, the second water-cooling assembly 300 includes a water-cooling plate 310. The water-cooling plate 310 extends along a second horizontal direction Y, and its orthographic projection onto a horizontal plane covers the receiving space 2 in the second horizontal direction Y, which is perpendicular to the first horizontal direction X. In other words, a water-cooling plate 310 covers the bottom surface of the carrier 3 in the second horizontal direction Y to adequately cool the carrier 3 and further improve the cooling rate.
[0042] In some embodiments, when the first water-cooling assembly 200 includes a water-cooling plate 210, the water-cooling plate 210 includes a plurality of water-cooling strips 211. The plurality of water-cooling strips 211 are arranged sequentially in a vertical direction, and the water-cooling strips 211 extend in a second horizontal direction Y. One end of the water-cooling strip 211 has a liquid inlet 212, and the other end of the water-cooling strip 211 has a liquid outlet 213.
[0043] The coolant flows in through the inlet 212, flows along the second horizontal direction Y, and flows out through the outlet 213, allowing the coolant to flow simultaneously in each water-cooling bar 211, which can remove more heat and further improve the cooling speed of the water-cooling plate 210 on the vehicle 3.
[0044] Figure 4 The diagram shown is a structural schematic of a second water-cooling component, a bearing component, a first guide component, and a first elastic component provided in an embodiment of this disclosure. Figure 5 The image shown is an embodiment of this disclosure. Figure 4 The diagram shows a partial enlarged view of the structure in region B. In some embodiments, such as... Figure 4 and Figure 5As shown, when the second water-cooling assembly 300 includes a water-cooling plate 310, the buffer device 10 also includes a support assembly 510, a first guide member 610, and a first elastic member 620.
[0045] The support assembly 510 has a first guide hole 511 extending vertically. The top end of the first guide member 610 is connected to the water-cooled plate 310, and the bottom end of the first guide member 610 passes through the first guide hole 511. A first elastic member 620 is fitted onto the first guide member 610 and is disposed between the support assembly 510 and the water-cooled plate 310. When the first elastic member 620 is compressed, the upper surface of the water-cooled plate 310 contacts the bottom of the carrier 3.
[0046] For example, a flange-type oil-free bushing is further provided between the first guide member 610 and the first guide hole 511 to improve the flexibility of the first guide member 610. For example, the top end of the first guide member 610 is connected to the water-cooling plate 310, which can be done indirectly by means of a plate, profile, or the like. For example, a gasket is also connected to the bottom end of the first guide member 610, the diameter of which is larger than the diameter of the first guide member 610, to prevent the first guide member 610 from coming out of the first guide hole 511.
[0047] For example, the load-bearing component 510 and the support component 400 are fixedly disposed relative to each other. For example, both the load-bearing component 510 and the support component 400 are disposed on a bracket or the ground. For example, the first elastic element 620 is a helical spring.
[0048] By setting up the bearing component 510, the first guide member 610 and the first elastic member 620, the water-cooled plate 310 can move in the vertical direction, so that the water-cooled plate 310 can better fit with the bottom of the carrier 3, and further improve the cooling effect.
[0049] Figure 6 The image shown is an embodiment of this disclosure. Figure 2 The diagram shows the structure of the caching system in region A. Figure 7 The image shown is a top view of a caching device provided according to an embodiment of this disclosure. In some embodiments, such as Figure 1 and Figure 6 As shown, the buffer device 10 also includes at least one temperature sensor 630. The at least one temperature sensor 630 is disposed adjacent to the receiving space 2. The temperature sensor 630 is configured to detect the temperature of the carrier 3 so that when the temperature of the carrier 3 drops to a preset temperature, the carrier 3 is removed and then the cooling of the next carrier 3 continues, thereby improving cooling efficiency and thus increasing the output of the process equipment.
[0050] In some embodiments, such as Figure 1As shown, the buffer device 10 also includes at least one first in-situ sensor 640. The at least one first in-situ sensor 640 is disposed adjacent to the accommodating space 2, and the first in-situ sensor 640 is configured to detect whether the accommodating space 2 accommodates the carrier 3.
[0051] In some embodiments, such as Figure 6 As shown, when the buffer device 10 includes a first in-situ sensor 640, the first in-situ sensor 640 includes a diffuse reflection sensor 641. The diffuse reflection sensor 641 is disposed on the side of the air-cooled assembly 100 near the receiving space 2.
[0052] In some embodiments, such as Figure 6 and Figure 7 As shown, when the buffer device 10 includes a first in-situ sensor 640, the first in-situ sensor 640 includes a photoelectric through-beam sensor 642. The photoelectric through-beam sensor 642 includes a transmitter 6421 and a receiver 6422, which are respectively disposed on the side of at least two sets of air-cooling components 100 arranged opposite to each other, near the receiving space 2. The transmitter 6421 is near one end of the air-cooling component 100 in the second horizontal direction Y, and the receiver 6422 is near the other end of the air-cooling component 100 in the second horizontal direction Y. The second horizontal direction Y is perpendicular to the first horizontal direction X.
[0053] For example, such as Figure 6 As shown, when multiple fans 110 are arranged in two vertical rows, the diffuse reflection sensor 641 is positioned adjacent to the lower row of fans 110, and the photoelectric through-beam sensor 642 is positioned adjacent to the upper row of fans 110. Exemplarily, when multiple fans 110 are arranged in multiple vertical rows, the positions of the diffuse reflection sensor 641 and the photoelectric through-beam sensor 642 can be configured according to actual needs. For example, each row of fans 110 can be equipped with either a diffuse reflection sensor 641 or a photoelectric through-beam sensor 642.
[0054] In some embodiments, such as Figure 7 As shown, the second water-cooling component 300 has a clearance notch 301. The support component 400 is disposed at the clearance notch 301 so that both the second water-cooling component 300 and the support component 400 can contact the bottom of the carrier 3.
[0055] Figure 8 The diagram shows a structural schematic of a support component provided in one embodiment of this disclosure. Figure 9 The image shown is an embodiment of this disclosure. Figure 8 The support component shown is a cross-sectional view in the CC direction. Figure 8 and Figure 9As shown, the support assembly 400 includes: a support base 410, a second guide 420, a limiting member 430, a second in-situ sensor 440, and a second elastic member 450.
[0056] A support base 410 is disposed below the receiving space 2 and configured to support the carrier 3. The support base 410 has a second guide hole 411 extending vertically and a mounting hole 412 extending horizontally, the second guide hole 411 communicating with the mounting hole 412. A second guide member 420 passes through the second guide hole 411, and a limiting protrusion 421 is located on the outer surface of the second guide member 420. A limiting member 430 is disposed in the mounting hole 412 and connected to the support base 410, the limiting member 430 covering a portion of the second guide hole 411. A second in-situ sensor 440 is mounted on the lower surface of the limiting member 430. A second elastic member 450 is fitted onto the second guide member 420, the top end of the second elastic member 450 abutting against the limiting protrusion 421, and the bottom end of the second elastic member 450 abutting against the limiting member 430.
[0057] With the support base 410 supporting the carrier 3, the carrier 3 transmits pressure to the second guide member 420, causing the second guide member 420 to compress the second elastic member 450 and move downward, so that the second in-situ sensor 440 detects the second guide member 420.
[0058] For example, the second in-situ sensor 440 is a slotted photoelectric sensor. When the second guide 420 moves downward into the sensing slot of the slotted photoelectric sensor, the slotted photoelectric sensor can detect the second guide 420, indicating that the support assembly 400 supports the carrier 3.
[0059] This application also provides a caching system 1. For example... Figure 2 As shown, the caching system 1 includes at least one caching device 10 and a frame 20 as described in the above embodiments.
[0060] The buffer unit 10 is configured to buffer and cool the vehicle 3. The frame 20 is disposed below the buffer unit 10 and is configured to support the buffer unit 10.
[0061] Since the cache system 1 includes a cache device 10, and the cache system 1 has all the technical features and effects of the cache device 10, they will not be described in detail here.
[0062] In some embodiments, the number of buffer devices 10 is multiple, and the multiple buffer devices 10 are arranged sequentially along a first horizontal direction X. The buffer system 1 also includes a heat insulation device 30. The heat insulation device 30 is disposed between adjacent buffer devices 10 to isolate heat between adjacent buffer devices 10 and prevent heat from dissipating to adjacent buffer devices 10. Exemplarily, the heat insulation device 30 is heat-insulating sheet metal.
[0063] In some embodiments, the caching system 1 further includes a temporary storage device 40. The temporary storage device 40 is disposed adjacent to the caching device 10 and is configured to cache a carrier 3 carrying an unprocessed product.
[0064] In practical applications, the carrier 3 carrying the unprocessed product does not need to be cooled since it has not undergone processing. Therefore, it only needs to be placed in the temporary storage device 40. After the carrier 3 carrying the processed product is removed from the processing equipment, the carrier 3 carrying the unprocessed product can be placed into the processing equipment. In other words, the temporary storage device 40 can be used only to buffer the carrier 3 carrying the unprocessed product, while the buffer device 10 can be used to buffer and cool the carrier 3 carrying the processed product.
[0065] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts, nuts, screws, clips, magnets, etc. In some connections where the form of detachable engagement is not explicitly limited, a non-detachable connection can be achieved using welding, bonding, etc.
[0066] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.
[0067] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.
[0068] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.
[0069] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.
[0070] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.
Claims
1. A buffer device, characterized in that, include: At least two sets of air-cooled components are arranged opposite each other along a first horizontal direction, and a receiving space is formed between the at least two sets of air-cooled components arranged opposite each other. The receiving space is configured to receive a vehicle, and the air-cooled components are configured to supply air to the vehicle. At least two sets of first water-cooling components are arranged opposite each other along the first horizontal direction, and the at least two sets of first water-cooling components are respectively located on the side away from the accommodating space of the at least two sets of air-cooling components. The first water-cooling components are configured to cool the vehicle. A second water-cooling component is disposed below the accommodating space, and the second water-cooling component is configured to cool the vehicle; A support component, disposed below the accommodating space, is configured to support the vehicle.
2. The caching device according to claim 1, characterized in that, The air-cooling component includes: Multiple fans are arranged in multiple columns along a second horizontal direction and in at least one row along a vertical direction. The orthographic projection of the multiple fans on a plane perpendicular to the first horizontal direction covers the accommodating space. The second horizontal direction is perpendicular to the first horizontal direction. And / or, The first water-cooling component includes: A water-cooling plate extends along a second horizontal direction, and the orthographic projection of the water-cooling plate on a plane perpendicular to the first horizontal direction covers the receiving space, wherein the second horizontal direction is perpendicular to the first horizontal direction; And / or, The second water-cooling component includes: A water-cooled plate extends along a second horizontal direction, and the orthographic projection of the water-cooled plate on the horizontal plane covers the accommodating space in the second horizontal direction, which is perpendicular to the first horizontal direction.
3. The caching device according to claim 2, characterized in that, When the first water-cooling assembly includes the water-cooling plate, the water-cooling plate includes: Multiple water-cooling strips are arranged in sequence along the vertical direction. The water-cooling strips extend along the second horizontal direction. One end of each water-cooling strip has a liquid inlet, and the other end has a liquid outlet. Coolant flows in through the liquid inlet, flows along the second horizontal direction, and flows out through the liquid outlet.
4. The caching device according to claim 2, characterized in that, When the second water-cooling assembly includes the water-cooling plate, the buffer device further includes: The support component has a first guide hole extending in a vertical direction; The first guide member has its top end connected to the water-cooled plate and its bottom end passing through the first guide hole. A first elastic element is fitted onto the first guide element and disposed between the bearing assembly and the water-cooled plate, wherein, when the first elastic element is compressed, the upper surface of the water-cooled plate contacts the bottom of the carrier.
5. The buffer device according to any one of claims 1 to 4, characterized in that, Also includes: At least one temperature sensor is disposed adjacent to the accommodating space, and the temperature sensor is configured to detect the temperature of the vehicle; And / or, At least one first in-situ sensor is disposed adjacent to the accommodating space, the first in-situ sensor being configured to detect whether the accommodating space accommodates the vehicle.
6. The caching device according to claim 5, characterized in that, When the buffer device includes the first in-situ sensor, the first in-situ sensor includes: A diffuse reflection sensor is disposed on the side of the air-cooled assembly near the receiving space; And / or, A photoelectric through-beam sensor includes a transmitter and a receiver. The transmitter and the receiver are respectively disposed on the side of at least two sets of air-cooling components that are arranged opposite each other, close to the accommodating space. The transmitter is close to one end of the air-cooling component in a second horizontal direction, and the receiver is close to the other end of the air-cooling component in the second horizontal direction. The second horizontal direction is perpendicular to the first horizontal direction.
7. The buffer device according to any one of claims 1 to 4, characterized in that, The support components include: A support base, disposed below the receiving space, is configured to support the carrier. The support base has a second guide hole extending in a vertical direction and a mounting hole extending in a horizontal direction, the second guide hole communicating with the mounting hole. The second guide member passes through the second guide hole, and the outer surface of the second guide member has a limit protrusion. A limiting member is disposed in the mounting hole and connected to the support base, the limiting member covering part of the second guide hole; A second in-situ sensor is mounted on the lower surface of the limiting member; The second elastic element is fitted onto the second guide element, with the top end of the second elastic element abutting against the limiting protrusion and the bottom end of the second elastic element abutting against the limiting element. When the support base supports the carrier, the carrier transmits pressure to the second guide member, causing the second guide member to compress the second elastic member and move downward, so that the second in-situ sensor detects the second guide member.
8. A caching system, characterized in that, include: At least one buffer device according to any one of claims 1 to 7, the buffer device being configured to buffer and cool the vehicle; The frame, located below the cache device, is configured to support the cache device.
9. The caching system according to claim 8, characterized in that, The number of cache devices is multiple, and the multiple cache devices are arranged sequentially along a first horizontal direction; The caching system further includes: A heat insulation device is disposed between adjacent buffer devices.
10. The caching system according to claim 8, characterized in that, Also includes: A temporary storage device is disposed adjacent to the buffer device, the temporary storage device being configured to buffer the carrier carrying unprocessed products.